ACT2x6HRSMX ACT2x6HRSMX miniature surface mount Watch Crystal cyl

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ACT2x6HRSMX ACT2x6HRSMX miniature surface mount Watch Crystal cyl

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ACT2x6HRSMX
ACT2x6HRSMX miniature surface mount Watch Crystal cylindrical package offering high vibration shock resistance together with high stability. This device very suitable many real time applications including portable equipment/hand held units applications that require close packing density components, also re-flow soldered 260°C.
Specification
Parameter Nominal Frequency Frequency Tolerance @25°C Frequency Temperature Temp Operating Range Turnover Temperature Temperature Coefficient Temp Storage Range Equivalent Series Resistance Quality Factor Load Capacitance Shunt Capacitance Capacitance Ratio Motional Capacitance Drive Level Insulation Resistance Aging Reflow temperature Symbol f/fo f/fo Topr Tstg C0/1 Tmax Specification 32.768KHz ±10ppm ±100ppm Please refer plot page +85°C 25°C ±5°C -0.037ppm Typical +125°C Typical 12.5pF standard 12.5pF available 1.4pf Typical Typical 0.003pF Typical 500M 100VDC ±5ppm First year, 25±3°C 260°C seconds Options Please specify
Please specify
3ppm available Refer page
Tape Reel Dimensions
Solder Footprint
Lead finish SnCu
Please note that parameters necessarily specified same device Customer specify Frequency Tolerance, Load Capacitance line with ongoing policy product evolvement improvement, above specification subject change without notice
ISO9001:2000 Registered
quotations further information please contact Business Centre, Molly Millars Lane, Wokingham, Berkshire, RG41 2EY, Issue: Date: 10/10/06
http://www.actcrystals.com
#REF!
ACT2x6HRSMX
Soldering ACT2X6HRSMX Reflow oven should emulate maximum reflow profiles temperatures times shown diagram below. Note just important conform times specified temperatures. Pre-heat should exceed 217°C rate heating from 25°C 217°C should limited 4deg C/sec Peak soldering temperature should exceed 260°C. Time peak temperature should exceed seconds. Total reflow time should exceed minutes. Should required solder PCB, then area volume solder should kept absolute minimum, trials should conducted determine re-flow process satisfactory Wash Processes Watch Crystals Ultrasonic cleaning should avoided.
line with ongoing policy product evolvement improvement, above specification subject change without notice
ISO9001:2000 Registered quotations further information please contact Business Centre, Molly Millars Lane, Wokingham, Berkshire, RG41 2EY,
http://www.actcrystals.com
Issue: Date: 10/10/06

ACT2x6HRSMX ACT2x6HRSMX miniature surface mount Watch Crystal cyl

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