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iP2004 SYNCHRONOUS BUCK POWER BLOCK iP2004 fully optimized s
Top Searches for this datasheetData Sheet PD60322 iP2004 SYNCHRONOUS BUCK POWER BLOCK iP2004 fully optimized solution high current synchronous buck multiphase applications. Board space design time greatly reduced because most components required each phase typical discrete-based multiphase circuit integrated into single 7.7mm 7.7mm 2.2mm power block. only additional components required complete multiphase converter controller, output inductors, input output capacitors. Package Description iP2004 iP2004TR Interface Connection Standard Quantity 2000 Orientation Figure Features Multiphase building block derating TPCB Optimized power loss Bias supply range 4.5V 6.0V Operation 1.5MHz Over temperature protection Bi-directional Current flow Under Voltage Lockout interface 7.7mm 7.7mm 2.2mm package Applications High frequency, Multi-phase Converters Duty-Ratio, High Current Microprocessor Power Supplies High Frequency Profile DC-DC Converters Typical Application Enable Sync Track1 Track2 Vref VOUT Comp1 Comp2 PGOOD1 PGOOD2 5V_sns Ph_En1 PWM1 OCSet1 ENABLE PGND PGND VSWS1 VSWS2 VOUT Ph_En2 PWM2 OCSet1 iP2004 IR3623 ENABLE PGND PGND VSWS1 VSWS2 VSW2 iP2004 Page www.irf.com 12/22/2007 Data Sheet PD60322 iP2004 Absolute Maximum Ratings PGND -0.5V PGND -0.5V 6.5V PGND -0.5V 0.5V (Note ENABLE PGND -0.5V 0.5V (Note Storage Temperature Block Temperature (Note Rating. Class (500V) Class (200V) Rating. CAUTION: Stresses above those listed "Absolute Maximum Ratings" cause permanent damage device. This stress only rating operation device these other conditions above those listed "Recommended Operating Conditions" section this specification implied. Recommended Operating Conditions PARAMETER Supply Voltage (VDD) Input Voltage (VIN) Output Voltage (VOUT) Output Current (IOUT) Switching Frequency (FSW) Time Duty Cycle Minimum Time Block Temperature 13.2 1500 Units Conditions 5.0V, Electrical Specifications These specifications apply TBLK 5.0V, unless otherwise specified. PARAMETER Ploss Units Conditions 12V, 5.0V, VOUT 1.3V, IOUT 40A, 1MHz, LOUT 0.3uH, (Note Power Block Losses Quiescent Current 12V, ENABLE Page www.irf.com 12/22/2007 Data Sheet PD60322 iP2004 PARAMETER Supply Current (Stand Supply Current (Operating) 5.0V, ENABLE 12V, VDD= ABLE 5.0V, 1MHz, Units Conditions Power-On Reset (POR) Rising Hysterisis Rising Falling ENABLE INPUT Logic Level Threshold (VIL) Logic Level High Threshold (VIH) Threshold Hysterisis Weak pull-down current Rising Propagation Delay (TPDH) Falling Propagation Delay (TPDL) Schmitt Trigger Input 6.0V INPUT Logic Level Threshold (VIL) Logic Level High Threshold (VIH) Threshold Hysterisis Weak pull-down current Rising Propagation Delay (TPDH) Falling Propagation Delay (TPDL) Schmitt Trigger Input 6.0V (Note Notes: Must exceed 6.5V. Guaranteed design, tested production. Measurement made with 10µF (TDK C3225X5R1C106KT equivalent) ceramic capacitors across PGND pins (see Figure TPDH TPDL associated with rise fall times. Does affect Power Loss (see Figure 10). Block Temperature defined temperature within package. Page www.irf.com 12/22/2007 Data Sheet PD60322 iP2004 Power Loss Curve Power Loss(W) 5.0V 1.3V 1MHz 300nH Maximum Output Current(A) Typical Figure 1Power Loss versus Output Current Curve Case Temperature Output Current Safe Operating Area 5.0V 1.3V 1MHz 300nH Temperature Figure Safe Operating Area (SOA) versus CASE temperatures (See page details) Page www.irf.com 12/22/2007 Data Sheet PD60322 iP2004 Typical Performance Curves 1.40 5.0V 1.35 1.3V 1.30 1MHz 300nH 1.20 1.25 12.0V 5.0V IOUT 1MHz 300nH 1.15 1.30 Temp Adjustment Power Loss (Normalized) 1.20 1.15 Power Loss (Normalized) 1.25 Temp Adjustment 1.10 1.10 1.05 1.05 1.00 1.00 0.95 0.95 -1.2 -1.2 0.90 -2.4 0.90 -2.4 Input Voltage Output Voltage Figure Normalized Power Loss Input Voltage 1.06 12.0V 1.3V 1MHz 300nH Figure Normalized Power Loss Output Voltage 1.12 12.0V 5.0V 1.04 1.10 1.3V IOUT 1MHz 1.08 Temperature Adjustment Power Loss (Normalized) Power Loss (Normalized) 1.02 Temp Adjustment 1.06 1.00 1.04 0.98 -0.5 1.02 0.96 -1.0 1.00 0.94 -1.5 0.98 -0.5 0.92 4.50 4.75 5.00 5.25 5.50 5.75 -2.0 6.00 0.96 0.10 0.20 0.30 0.40 0.50 0.60 0.70 -0.9 0.80 Drive Voltage Output Inductor (µH) Figure Normalized Power Loss versus Drive Voltage 1.30 1.25 1.20 1.15 12.0V 5.0V 1.3V IOUT 300nH Figure Normalized Power Loss Inductance 12.0V 5.0V 1.3V IOUT 300nH Average Supply Current (mA) Temp Adjustment Power Loss (Normalized) 1.10 1.05 1.00 0.95 0.90 0.85 0.80 0.75 0.70 1000 1125 1250 1375 -1.2 -2.4 -3.6 -4.7 -5.9 -7.1 1500 1000 1100 1200 1300 1400 1500 Switching Frequency (kHz) Switching Frequency (kHz) Figure Normalized Power Loss Switching Frequency Figure supply current Frequency Page www.irf.com 12/22/2007 Data Sheet PD60322 iP2004 Average Average Average Average POUT VOUT Average IOUT Average PLOSS (PIN PDD) POUT Average Current Average Voltage Average Input Current Average Input Voltage VSWS1 VSWS2 ENABLE PGND PGND Average Output Current Averaging Circuit iP2004 Average Output Voltage tPDH tPDL Figure Power Loss Test Circuit Figure Timing Diagram Applying Safe Operating Area (SOA) Curve graph incorporates power loss thermal resistance information that allows solve maximum current capability simplified graphical manner. incorporates ability solve thermal problems where heat drawn through printed circuit board case. Please refer International Rectifier Application Note AN1047 further details using this curve your thermal environment. Procedure Calculate (based estimated Power Loss) measure Case temperature device Board temperature near device (1mm from edge). Draw line from Case Temperature axis Temperature axis. Draw vertical line from axis intercept curve. Draw horizontal line from intersection vertical line with curve Y-axis (Output Current). point which horizontal line meets Y-axis continuous current. Case Temperature Output Current Safe Operating Area 5.0V 1.3V 1MHz 300nH Temperature Figure Example, Continuous current TPCB TCASE Page www.irf.com 12/22/2007 Data Sheet PD60322 iP2004 Calculating Power Loss Different Operating Conditions calculate Power Loss given operation conditions, following procedure should followed: Power Loss Procedure Determine maximum current each iP2004 obtain maximum power loss from Figure Normalized curves page obtain power loss values that match operating conditions Application maximum power loss under Application conditions then product power loss from Figure normalized values. calculate Safe Operating Area (SOA) given operating conditions, following procedure should followed: Procedure Determine maximum CASE temperature maximum operating current each iP2004 Normalized curves page obtain temperature adjustments that match operating conditions Application Then, temperature adjustments axis intercept Figure Design Example Operating Conditions: Output Current Switching Freq 750kHz Input Voltage Inductor 0.2µH Output Voltage 3.3V Drive Voltage (VDD) 5.5V Calculating Maximum Power Loss: (Figure (Figure (Figure (Figure (Figure (Figure Maximum power loss 8.0W Normalized power loss input voltage 0.98 Normalized power loss output voltage 1.23 Normalized power loss drive voltage (VDD) 0.96 Normalized power loss output inductor 1.03 Normalized power loss switch frequency 0.91 Calculated Maximum Power Loss 8.0W 0.98 1.23 0.96 1.03 0.91 8.68W Page www.irf.com 12/22/2007 Data Sheet PD60322 iP2004 Calculating Temperature: (Figure (Figure (Figure (Figure (Figure temperature adjustment input voltage temperature adjustment output voltage temperature adjustment drive voltage (VDD) -0.8 temperature adjustment output inductor temperature adjustment switch frequency -1.9 axis intercept adjustment -0.5 Assuming TPCB TCASE following example shows current adjusted increase Case Temperature Output Current Safe Operating Area 5.0V 1.3V 1MHz 300nH Temperature Draw line from Case Temperature axis Temperature axis. Draw vertical line from axis intercept curve. Draw horizontal line from intersection vertical line with curve Y-axis (Output Current). point which horizontal line meets Y-axis continuous current. Draw vertical line from axis adding subtracting adjustment temperature from original intercept point. Draw horizontal line from intersection vertical line with curve Y-axis (Output Current). point which horizontal line meets Y-axis continuous current. adjustment indicates part still allowed continuous current 30A. Page www.irf.com 12/22/2007 Data Sheet PD60322 iP2004 Internal Block Diagram VSWS1 VSWS2 ENABLE PGND MOSFET Driver with dead time control PGND Figure Internal Block Diagram Number Name ENABLE Connect. This electrical connection When logic level high, internal circuitry device enabled. When logic level low, Control Synchronous FETs turned off. level input MOSFET drivers. When HIGH, Control Sync off. When LOW, Sync Control off. Supply voltage internal circuitry. Voltage Switching Node connection output inductor. Power Ground Input voltage pin. Connect input capacitors close this pin. Floating pin. Externally connect VSWS2 only. Floating pin. Externally short VSWS1 only. PGND VSWS1 VSWS2 Page www.irf.com 12/22/2007 Data Sheet PD60322 iP2004 Package Pinout Diagram VSWS1 VSWS2 ENABLE PGND PGND Figure Side Transparent View Page www.irf.com 12/22/2007 Data Sheet PD60322 iP2004 Recommended Layout Figure copper Solder-mask layer layout Page www.irf.com 12/22/2007 Data Sheet PD60322 iP2004 Figure Bottom Component Placement (Topside, Transparent view down) Layout Guidelines following guidelines recommended reduce parasitic values optimize overall performance. pads iP2004 footprint design need Solder-mask defined (see Figure 14). Also refer International Rectifier application notes AN1028 AN1029 further footprint design guidance. Place many vias around Power pads (VIN, VSW, PGND) both electrical optimal thermal performance. Vias between different power pads overlap opening solder mask edge without need plug hole. Vias with 13mil drill hole 25mil capture were used this example. minimum 10µF, X5R, ceramic capacitors iP2004 needed greater than operation. This will result lowest loss input capacitor ESR. Placement ceramic input capacitors critical optimize switching performance. cases where there heatsink case iP2004, place ceramic capacitors right underneath iP2004 footprint (see Bottom Component Layer). cases where there heatsink, bottom layer moved locations (respectively) component layer (see Component Layer). both cases, need placed right underneath iP2004 footprint. Dedicate least layer PGND only Duplicate Power Nodes multiple layers (refer AN1029). Page www.irf.com 12/22/2007 Data Sheet PD60322 iP2004 Mechanical Outline Drawing 0.15 [.006] 7.65 [0.301] NOTES: DIMENSIONING TOLERANCING ASME Y14.5M-1994. DIMENSIONS SHOWN MILLIMETERS [INCHES]. CONTROLLING DIMENSION: MILLIMETER 7.65 [0.301] CORNER PRIMARY DATUM (SEATING PLANE) DEFINED SOLDER RESIST OPENING DRAWING SCALE. 0.15 [.006] VIEW 7.319 6.303 5.795 0.334 4.779 4.132 0.322 1.858 0.07 [.0027] 2.21 [.087] CORNER 2.379 2.010 3.459 3.865 6.583 5.821 7.345 5.300 5.021 2.54 0.762 1.016 BOTTOM VIEW SIDE VIEW VSWS1 VSWS2 PGND PGND ENABLE BOTTOM VIEW ELECTRICAL Figure Mechanical Outline Drawing Page www.irf.com 12/22/2007 Data Sheet PD60322 iP2004 Recommended Solder Paste Stencil Design Figure Solder Paste Stencil Design Tape Reel Information Figure Tape Reel Information Page www.irf.com 12/22/2007 Data Sheet PD60322 iP2004 Part Marking Figure Part Marking Data specifications subject change without notice. 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