DESCRIPTION ABLEBOND® 8200C bleed attach adhesive designed small mediu

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DESCRIPTION ABLEBOND® 8200C bleed attach adhesive designed small mediu

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ELECTRICALLY CONDUCTIVE ATTACH ADHESIVE
DESCRIPTION ABLEBOND® 8200C bleed attach adhesive designed small medium sized dies across variety leadframes including PPF, This electrically conductive adhesive offers improved JEDEC performance type packages. FEATURES HIgh electrical conductivity Excellent adhesion silver pre-plated leadframe Oven snap curable ABLEBOND 8200C adhesive version RP-751 series that provides improved silver pre-plated leadframe.
ABLEBOND® 8200C
Typical Uncured Properties Filler Type Viscosity Thixotropic Index Work Life Est. Storage Life Cure Process Data Weight Loss Cure Recommended Cure Condition Snap Cure Profile Physiochemical Properties Post Cure Ionics Chloride Sodium Potassium
8200C Silver 11,500 hours year 8200C
Test Description
Test Method ATM-0018 ATM-0089 ATM-0087 ATM-0068 Test Method ATM-0031
Brookfield CP51 Viscosity 0.5/Viscosity increase viscosity
Test Description glass slide
minutes ramp minutes Zone Number Flow 8200C Time Temp liters/minute Test Description Teflon flask sample 20-40 mesh water hours Thermogravimetric Analysis Test Method ATM-0007 ATM-0073
Weight Loss
Typical properties intended specification limits. need write specification, Standard Release Specification. This Pilot product that been converted high volume manufacturing being monitored process stability. During this monitoring period, certain properties adjusted slightly. 02/06 Page
8200C
Physiochemical Properties Post Cure Glass Transition Temperature Coefficient Thermal Expansion 8200C Below Above Dynamic Tensile Modulus Moisture Absorption Saturation Thermal/Electrical PropertiesPost Cure Volume Resistivity Thermal Conductivity Mechanical PropertiesPost Cure Shear Strength (kgf/die) Temperature Chip Warpage Chip Size Test Description Dynamic mechanical thermal analysis expansion mode Dynamic mechanical thermal analysis using 0.5mm thick sample Test Method ATM-0112 ATM-0055
4630 (670,000 psi) 1170 (170,000 psi) (110,000 psi)
ATM-0112
0.20% 8200C 0.00017 ohm-cm W/mK 8200C 19.1 Chip Size 7.6x7.6mm (300 mil)
Dynamic vapor sorption after exposure Test Description 4-point probe Laser Flash Test Description (120 mil) SPCLF Warpage 0.38mm (15mil) thick 0.2mm Ag/Cu 10.9
ATM-0093 Test Method ATM-0020 ATM-0116 Test Method ATM-0052
ATM-0059
Chip Warpage
Post Attach Cure Post Mold Bake
ATM-0059
APPLICATION GUIDELINES SHIPMENT This Ablestik product packed shipped -80°C. Inside every shipment Ablestik's products small packet containing ABLECUBE. This small blue cube which retains shape -40°C. ABLECUBE exposed temperatures higher than -40°C, cube will melt. Please check state ABLECUBE ensure integrity shipment. ABLECUBE melted upon Receiving Inspection, place entire shipment -40°C freezer contact your Ablestik Customer Service Sales Representative.
UNPACKING Transfer syringes from -40°C freezer without delays. Freeze-thaw voids will form syringes syringes repeatedly thawed refrozen. STORAGE This Ablestik product must stored -40°C. shelf life material only valid when material been stored specified storage condition. Incorrect storage conditions will degrade performance material both handling (e.g. dispensing screen printing) final cured properties.
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8200C
THAWING Allow container reach room temperature before use. After removing from freezer, syringes stand vertically while thawing. Refer Syringe Thaw Time chart thaw time recommendation. open container before contents reach ambient temperature. moisture that collects thawed container should removed prior opening container. re-freeze. Once thawed room temperature, adhesive should re-frozen. ADHESIVE APPLICATION Thawed adhesive should immediately placed dispense equipment use. adhesive transferred final dispensing reservoir, care must exercised avoid entrapment contaminants and/or into adhesive. Adhesive must completely used within product's recommended work life hours. Apply enough adhesive achieve 25-50 (1-2 mil) bondline thickness, dispensed with approximately filleting sides die. Alternate dispense amounts used depending application requirements. Star cross shaped dispense patterns will yield fewer bondline voids than matrix style dispense pattern. Contact Ablestik Technical Service Department detailed recommendation adhesive application, including dispensing. CURE This adhesive cured in-line ovens. recommended oven cure temperature this adhesive 175°C. AVAILABILITY ABLEBOND® adhesives packaged syringes jars customer specification. Available package sizes range from 30cc ounce pound. details, refer Ablestik Standard Package Data contact your Customer Service Representative.
CAUTION: This product cause skin irritation sensitive persons. Avoid skin contact. contact does occur, wash area immediately with soap water. Please refer Material Safety Data Sheet more details.
20021 Susana Road, Rancho Dominguez, 90221 (310) 764-4600 (310) 764-2545 Customer Service (310) 764-1783
technical contact nearest you, visit www.ablestik.com
information given recommendations made herein believed accurate guarantee their accuracy made. every case recommend that purchasers before using product conduct their tests determine whether product suitable their particular purposes under their operating conditions. representative ours authority waive change foregoing provisions but, subject such provisions, engineers available assist purchasers adapting products their needs. Nothing contained herein shall construed imply nonexistence relevant patents constitute permission, inducement recommendation practice invention covered patent, without authority from owner this patent. These materials designed manufactured implantation human body. Approval from such part product implanted human body been sought received. also expect purchasers products accordance with guiding principles American Chemistry Council's Responsible Care® program.
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DESCRIPTION ABLEBOND® 8200C bleed attach adhesive designed small mediu

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