MC9RS08KA8 MC9RS08KA8 Series Covers: MC9RS08KA8 Feature
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Document Number: MC9RS08KA8 Rev. 1/2008
MC9RS08KA8
MC9RS08KA8 Series
Covers: MC9RS08KA8
Features: 8-Bit RS08 Central Processor Unit (CPU) across temperature range -40°C 85°C Subset HC08 instruction with added BGND instruction On-Chip Memory flash read/program/erase over full operating voltage temperature; flash byte random-access memory (RAM); byte Security circuitry prevent unauthorized access flash contents Power-Saving Modes Wait stop Wakeup from power-saving modes using real-time interrupt (RTI), KBI, ACMP Clock Source Options Oscillator (XOSC) Loop-Control Pierce oscillator; crystal ceramic resonator range 31.25 39.0625 Internal Clock Source (ICS) Internal clock source module containing frequency-locked-loop (FLL) controlled internal external reference; precision trimming internal reference allows 0.2% resolution deviation over temperature voltage; supports frequencies System Protection Watchdog computer operating properly (COP) reset with option from dedicated internal clock source clock Low-Voltage detection with reset interrupt Illegal opcode detection with reset Illegal address detection with reset Flash block protection Development Support
20-Pin W-SOIC Case 751D
16-Pin W-SOIC Case 751G
20-Pin PDIP Case 738C
16-Pin PDIP Case
Single-Wire background debug interface Breakpoint capability allow single breakpoint setting during in-circuit debugging Peripherals 12-channel, 10-bit resolution; conversion time; automatic compare function; operation stop; fully functional from (8-channels available 16-pin package) 2-channel; selectable input capture, output compare, buffered edge- center-aligned each channel Inter-Integrated circuit module capable operation kbps with maximum loading; capable higher baudrates with reduced loading MTIM1 MTIM2 8-bit modulo timers Keyboard interrupts with rising falling edge detect; eight ports 16-pin 20-pin packages ACMP Analog comparator: full rail-to-rail supply operation; option compare fixed internal bandgap reference voltage; operate stop mode Input/Output 14/18 GPIOs including output only input only Hysteresis configurable pullup device input pins; configurable slew rate drive strength output pins Package Options 16-pin, 20-pin SOIC PDIP
This document contains information product under development. Freescale reserves right change discontinue this product without notice. Freescale Semiconductor, Inc., 2008. rights reserved. Preliminary-Subject Change Without Notice
Table Contents
Block Diagram Assignments Electrical Characteristics Introduction Parameter Classification Absolute Maximum Ratings Thermal Characteristics Protection Latch-Up Immunity Characteristics Supply Current Characteristics External Oscillator (XOSC) Characteristics Characteristics 3.9.1 Control Timing 3.9.2 TPM/MTIM Module Timing 3.10 Analog Comparator (ACMP) Electrical 3.11 Internal Clock Source Characteristics 3.12 Characteristics 3.13 Flash Specifications. 3.14 Performance 3.14.1 Radiated Emissions 3.14.2 Conducted Transient Susceptibility Ordering Information Mechanical Drawings
Revision History
provide most up-to-date information, revision documents World Wide will most current. Your printed copy earlier revision. verify have latest information available, refer
http://freescale.com/
following revision history table summarizes changes contained this document.
Revision
Date 1/22/2008 Initial public release
Description Changes
Related Documentation
Find most current versions documents http://www.freescale.com
Reference Manual (MC9RS08KA8RM) Contains extensive product information including modes operation, memory, resets interrupts, register definition, port pins, CPU, module information.
MC9RS08KA8 Series, Rev. Preliminary-Subject Change Without Notice Freescale Semiconductor
Block Diagram
Block Diagram
RS08 CORE MODULE(IIC) ANALOG COMPARATOR (ACMP) 10-BIT ANALOG-TO-DIGITAL CONVERTER (ADC) KEYBOARD INTERRUPT 16-BIT TIMER/PWM MODULE (TPM) 8-BIT TIMER (MTIM1 MTIM2) PORT PORT PTA5/TCLK/RESET/VPP PTA4/ACMPO/BKGD/MS PTA3/KBIP3/SCL/ADP3 PTA2/KBIP2/SDA/ADP2 PTA1/KBIP1/TPMCH1/ADP1/ACMP- PTA0/KBIP0/TPMCH0/ADP0/ACMP+ PTB7/SCL/EXTAL PTB6/SDA/XTAL PTB5/TPMCH1 PTB4/TPMCH0 PTB3/KBIP7/ADP7 PTB2/KBIP6/ADP6 PTB1/KBIP5/ADP5 PTB0/KBIP4/ADP4 PTC3/ADP11 PORT PTC2/ADP10 PTC1/ADP9 PTC0/ADP8
block diagram, Figure shows structure MC9RS08KA8 MCU.
RS08 SYSTEM CONTROL RESETS INTERRUPTS MODES OPERATION POWER MANAGEMENT WAKEUP USER FLASH (MC9RS08KA8 8192 BYTES) (MC9RS08KA4 4096 BYTES) USER (MC9RS08KA8 BYTES) (MC9RS08KA4 BYTES) 20-MHz INTERNAL CLOCK SOURCE (ICS) LOW-POWER OSCILLATOR 31.25 39.0625 (XOSC) VOLTAGE REGULATOR
Figure MC9RS08KA8 Series Block Diagram
Assignments
This section shows assignments packages available MC9RS08KA8 series.
MC9RS08KA8 Series, Rev. Freescale Semiconductor Preliminary-Subject Change Without Notice
Assignments
Table Availability Package Pin-Count
Number
Lowest Port PTA5 PTA4 ACMPO
Priority
Highest RESET
TCLK BKGD
PTB7 PTB6 PTB5 PTB4 PTC3 PTC2 PTC1 PTC0 PTB3 PTB2 PTB1 PTB0 PTA3 PTA2 PTA1 PTA0
SCL1
EXTAL XTAL
TPMCH1
TPMCH02 ADP11 ADP10 ADP9 ADP8 KBIP7 KBIP6 KBIP5 KBIP4 KBIP3 KBIP2 KBIP1 KBIP0 SCL1 SDA1 TPMCH1 TPMCH0
ADP7 ADP6 ADP5 ADP4 ADP3 ADP2 ADP1 ADP0 ACMP- ACMP+
pins remapped PTA3 PTA2 pins remapped PTA0 PTA1
PTA5/TCLK/RESET/VPP PTA4/ACMPO/BKGD/MS PTB7/SCL/EXTAL PTB6/SDA/XTAL PTB5/TPMCH1 PTB4/TPMCH0 PTC3/ADP11 PTC2/ADP10
PTA0/KBIP0/TPMCH0/ADP0/ACMP+ PTA1/KBIP1/TPMCH1/ADP1/ACMP- PTA2/KBIP2/SDA/ADP2 PTA3/KBIP3/SCL/ADP3 PTB0/KBIP4/ADP4 PTB1/KBIP5/ADP5 PTB2/KBIP6/ADP6 PTB3/KBIP7/ADP7 PTC0/ADP8 PTC1/ADP9
Figure MC9RS08KA8 Series 20-Pin PDIP/SOIC Package
MC9RS08KA8 Series, Rev. Preliminary-Subject Change Without Notice Freescale Semiconductor
Electrical Characteristics
PTA5/TCLK/RESET/VPP PTA4/ACMPO/BKGD/MS PTB7/SCL/EXTAL PTB6/SDA/XTAL PTB5/TPMCH1 PTB4/TPMCH0
PTA0/KBIP0/TPMCH0/ADP0/ACMP+ PTA1/KBIP1/TPMCH1/ADP1/ACMP- PTA2/KBIP2/SDA/ADP2 PTA3/KBIP3/SCL/ADP3 PTB0/KBIP4/ADP4 PTB1/KBIP5/ADP5 PTB2/KBIP6/ADP6 PTB3/KBIP7/ADP7
Figure MC9RS08KA8 Series 16-Pin PDIP/SOIC Package
Electrical Characteristics
Introduction
This chapter contains electrical timing specifications MC9RS08KA8 series microcontrollers available time publication.
Parameter Classification
Table Parameter Classifications
Those parameters guaranteed during production testing each individual device. Those parameters achieved design characterization measuring statistically relevant sample size across process variations. Those parameters achieved design characterization small sample size from typical devices under typical conditions unless otherwise noted. values shown typical column within this category. Those parameters derived mainly from simulations.
electrical parameters shown this supplement guaranteed various methods. give customer better understanding following classification used parameters tagged accordingly tables where appropriate:
NOTE classification shown column labeled parameter tables where appropriate.
Absolute Maximum Ratings
Absolute maximum ratings stress ratings only, functional operation maxima guaranteed. Stress beyond limits specified Table affect device reliability cause permanent damage device. functional operating conditions, refer remaining tables this chapter.
MC9RS08KA8 Series, Rev. Freescale Semiconductor Preliminary-Subject Change Without Notice
Electrical Characteristics
This device contains circuitry protecting against damage high static voltage electrical fields; however, advised that normal precautions taken avoid application voltages higher than maximum-rated voltages this high-impedance circuit. Reliability operation enhanced unused inputs tied appropriate logic voltage level (for instance, VDD) programmable pull-up resistor associated with enabled. Table Absolute Maximum Ratings
Rating Supply voltage Maximum current into Digital input voltage Instantaneous maximum current Single limit (applies port pins)1, Storage temperature range
Symbol Tstg
Value -0.3 -0.3
Unit
Input must current limited value specified. determine value required current-limiting resistor, calculate resistance values positive (VDD) negative (VSS) clamp voltages, then larger resistance values. functional non-supply pins internally clamped except RESET/VPP which internally clamped only. Power supply must maintain regulation within operating range during instantaneous operating maximum current conditions. positive injection current (VIn VDD) greater than IDD, injection current flow could result external power supply going regulation. Ensure external load will shunt current greater than maximum injection current. This will greatest risk when consuming power. Examples are: system clock present, clock rate very which would reduce overall power consumption.
Thermal Characteristics
This section provides information about operating temperature range, power dissipation, package thermal resistance. Power dissipation pins usually small compared power dissipation on-chip logic voltage regulator circuits user-determined rather than being controlled design. order take PI/O into account power calculations, determine difference between actual voltage multiply current each pin. Except cases unusually high current (heavy loads), difference between voltage will very small. Table Thermal Characteristics
Rating Operating temperature range (packaged) Maximum junction temperature Thermal resistance 16-pin PDIP Thermal resistance 16-pin SOIC Thermal resistance 20-pin PDIP Thermal resistance 20-pin SOIC TJMAX Symbol Value °C/W °C/W °C/W °C/W Unit
average chip-junction temperature (TJ) obtained from: where: Ambient temperature,
MC9RS08KA8 Series, Rev. Preliminary-Subject Change Without Notice Freescale Semiconductor
Eqn.
Electrical Characteristics
Package thermal resistance, junction-to-ambient,
Pint PI/O Pint VDD, Watts chip internal power PI/O Power dissipation input output pins user determined most applications, PI/O Pint neglected. approximate relationship between PI/O neglected) 273°C) Solving Equation Equation gives: 273°C) (PD)2 Eqn. Eqn.
where constant pertaining particular part. determined from Equation measuring equilibrium) known Using this value values obtained solving equations iteratively value
Protection Latch-Up Immunity
Although damage from electrostatic discharge (ESD) much less common these devices than early CMOS circuits, normal handling precautions must used avoid exposure static discharge. Qualification tests performed ensure that these devices withstand exposure reasonable levels static without suffering permanent damage. testing conformity with AEC-Q100 Stress Test Qualification Automotive Grade Integrated Circuits. During device qualification stresses were performed human body model (HBM), machine model (MM) charge device model (CDM). device defined failure after exposure pulses device longer meets device specification. Complete parametric functional testing performed applicable device specification room temperature followed temperature, unless specified otherwise device specification. Table Latch-up Test Conditions Model
Human Body
Description
Series resistance Storage capacitance Number pulses Series resistance
Symbol
Value
1500 -2.5
Unit
Machine
Storage capacitance Number pulses Minimum input voltage limit
Latch-up Maximum input voltage limit
MC9RS08KA8 Series, Rev. Freescale Semiconductor Preliminary-Subject Change Without Notice
Electrical Characteristics
Table Latch-Up Protection Characteristics
Rating1
Human body model (HBM) Machine model (MM) Charge device model (CDM) Latch-up current 85°C (applies pins except PTC3/ADP11) Latch-up current 85°C (applies PTC3/ADP11)
Symbol
VHBM VCDM ILAT
±2000 ±200 ±500 ±1002 ±753
Unit
ILAT
Parameter achieved design characterization small sample size from typical devices under typical conditions unless otherwise noted. These pins meet JESD78A Class (section 1.2) Level (section 1.3) requirement ±100mA. This meets JESD78A Class (section 1.2) Level (section 1.3) characterization ±75mA. This only present package types.
Characteristics
Table Characteristics
(Temperature Range 85°C Ambient) Parameter Symbol VRAM VLVD VPOR1 Vhys1 |IIn| |IOZ| 0.81 1.80 1.88 0.70 0.85 0.06 Typical 1.86 1.94 0.025 0.025 1.95 2.03 0.30 0.30 Unit
This section includes information about power supply requirements, characteristics, power supply current various operating modes.
Supply voltage (run, wait stop modes.) fBus <10MHz Minimum retention supply voltage applied Low-voltage Detection threshold (VDD falling) (VDD rising) Power RESET (POR) voltage Input high voltage (VDD 2.3V) (all digital inputs) Input high voltage (1.8 (all digital inputs) Input voltage (VDD (all digital inputs) Input voltage (1.8 (all digital inputs) Input hysteresis (all digital inputs) Input leakage current (per pin) VSS, input only pins High impedance (off-state) leakage current (per pin) VSS, input/output Internal pullup resistors2(all port pins) Internal pulldown resistors2(all port pins except PTA5) PTA5 Internal pulldown resistor
MC9RS08KA8 Series, Rev. Preliminary-Subject Change Without Notice Freescale Semiconductor
Electrical Characteristics
Table Characteristics
(Temperature Range 85°C Ambient) Parameter Output high voltage Drive (PTxDSn ILoad ILoad ILoad Output high voltage High Drive (PTxDSn ILoad ILoad ILoad Maximum total port pins Output voltage Drive (PTxDSn ILoad ILoad ILoad Output voltage High Drive (PTxDSn ILoad ILoad ILoad Maximum total port pins injection VSS, Single limit Total limit, includes stressed pins Input capacitance (all non-supply pins)
Symbol
Typical
Unit
|IOHT| IOLT
current3,
This parameter characterized tested each device. Measurement condition pull resistors: pullup pulldown. functional non-supply pins internally clamped except RESET/VPP which internally clamped only. Input must current limited value specified. determine value required current-limiting resistor, calculate resistance values positive negative clamp voltages, then larger values. Input must current limited value specified. determine value required current-limiting resistor, calculate resistance values positive negative clamp voltages, then larger values. This parameter characterized tested each device.
MC9RS08KA8 Series, Rev. Freescale Semiconductor Preliminary-Subject Change Without Notice
Electrical Characteristics
VDD-VOH (High Drive)
(mA) VDD-VOH -40C
Figure Typical VDD-VOH (High Drive)
VDD-VOH (Low Drive)
(mA) VDD-VOH -40C
Figure Typical VDD-VOH (Low Drive)
MC9RS08KA8 Series, Rev. Preliminary-Subject Change Without Notice Freescale Semiconductor
Electrical Characteristics
VDD-VOH (High Drive)
(mA) VDD-VOH -40C
Figure Typical VDD-VOH (High Drive)
VDD-VOH (Low Drive)
(mA) VDD-VOH -40C
Figure Typical VDD-VOH (Low Drive)
MC9RS08KA8 Series, Rev. Freescale Semiconductor Preliminary-Subject Change Without Notice
Electrical Characteristics
VDD-VOH (High Drive)
VDD-VOH
(mA)
-40C
Figure Typical VDD-VOH (High Drive)
VDD-VOH (Low Drive)
-1.4 -1.2 -0.8 -0.6 -0.4 -0.2 VDD-VOH
(mA)
-40C
Figure Typical VDD-VOH (Low Drive)
MC9RS08KA8 Series, Rev. Preliminary-Subject Change Without Notice Freescale Semiconductor
Electrical Characteristics
(High Drive)
(mA)
-40C
Figure Typical VDD-VOL (High Drive)
(Low Drive)
IOL(mA) -40C
Figure Typical VDD-VOL (Low Drive)
MC9RS08KA8 Series, Rev. Freescale Semiconductor Preliminary-Subject Change Without Notice
Electrical Characteristics
(High Drive)
(mA) -40C
Figure Typical VDD-VOL (High Drive)
(Low Drive)
(mA) -40C
Figure Typical VDD-VOL (Low Drive)
MC9RS08KA8 Series, Rev. Preliminary-Subject Change Without Notice Freescale Semiconductor
Electrical Characteristics
(High Drive)
(mA) -40C
Figure Typical VDD-VOL (High Drive)
(Low Drive)
VOL(V)
IOL(mA)
-40C
Figure Typical VDD-VOL (Low Drive)
Supply Current Characteristics
Table Supply Current Characteristics
Parameter Symbol Typical1 Max2 Temp. (°C)
supply current3 measured (fBus MHz)
RIDD10
1.80
MC9RS08KA8 Series, Rev. Freescale Semiconductor Preliminary-Subject Change Without Notice
Electrical Characteristics
Table Supply Current Characteristics (continued)
Parameter Symbol supply current3 measured (fBus 1.25 MHz) RIDD1 1.80 Stop mode supply current SIDD 1.80 adder from stop4 1.80 ACMP adder from stop (ACME 1.80 adder from stop with clock source enabled5 1.80 adder from stop with external clock source reference enabled 1.80 adder from stop (LVDE=1 LVDSE=1) 1.80
Typical1 0.42 0.42 18.5 17.5
Max2
Temp. (°C)
Typicals measured 25°C. Maximum value measured nominal voltage times tolerance. Values given here preliminary estimates prior completing characterization. include loads port pins. Required asynchronous clock enabled.
MC9RS08KA8 Series, Rev. Preliminary-Subject Change Without Notice Freescale Semiconductor
Electrical Characteristics
Most customers expected find that auto-wakeup from stop used instead higher current wait mode. Wait mode typical with fBus MHz.
mode
3.00 2.50 2.00 1.50 1.00 0.50 0.00 1.25
Figure Typical Mode
MC9RS08KA8 Series, Rev. Freescale Semiconductor Preliminary-Subject Change Without Notice
Electrical Characteristics
External Oscillator (XOSC) Characteristics
Table Oscillator Electrical Specifications (Temperature Range 125°C Ambient)
Rating Oscillator crystal resonator (EREFS ERCLKEN range (RANGE High range (RANGE mode High range (RANGE FBELP mode High range (RANGE FBELP mode Load capacitors Feedback resistor range kHz) High range MHz) Series resistor range, gain (RANGE range, high gain (RANGE High range, gain (RANGE High range, high gain (RANGE Crystal start-up time range, gain (RANGE range, high gain (RANGE High range, gain (RANGE High range, high gain (RANGE Square wave input clock frequency (EREFS ERCLKEN mode FBELP mode Symbol fhi-hgo fhi-lp Typical1 Unit
38.4
crystal resonator manufacturer's recommendation.
CSTL-LP CSTL-HGO CSTH-LP
CSTH-HGO
0.03125
fextal
Typical data characterized 25°C recommended value. input clock source must divided using RDIV within range 31.25 39.0625 kHz. This parameter characterized tested each device. Proper board layout procedures must followed achieve specifications. crystal.
EXTAL XTAL
Crystal Resonator
Characteristics
This section describes timing characteristics each peripheral system.
MC9RS08KA8 Series, Rev. Preliminary-Subject Change Without Notice Freescale Semiconductor
Electrical Characteristics
3.9.1
Control Timing
Table Control Timing
Parameter frequency (tcyc 1/fBus) Real time interrupt internal oscillator period External RESET pulse width pulse width
Symbol fBus tRTI textrst tKBIPW tKBIPWS
tcyc
Typical 1000
1300
Unit
pulse width
stop1
Port rise fall time (load Slew rate control disabled (PTxSE Slew rate control enabled (PTxSE
tRise, tFall
This shortest pulse guaranteed pass through input filter circuitry. Shorter pulses recognized. This minimum pulse width that guaranteed pass through synchronization circuitry. Shorter pulses recognized. stop mode, synchronizer bypassed shorter pulses recognized that case. Timing shown with respect levels. Temperature range -40°C 85°C.
textrst RESET
Figure Reset Timing
tKBIPWS tKBIPW (rising high level)
(falling level) tKBIPW tKBIPWS
Figure Pulse Width
MC9RS08KA8 Series, Rev. Freescale Semiconductor Preliminary-Subject Change Without Notice
Electrical Characteristics
3.9.2
TPM/MTIM Module Timing
Synchronizer circuits determine shortest input pulses that recognized fastest clock that used optional external source timer counter. These synchronizers operate from current rate clock. Table Input Timing
Rating External clock frequency External clock period External clock high time External clock time Input capture pulse width Symbol fTPMext tTPMext tclkh tclkl tICPW fBus/4 Unit tcyc tcyc tcyc tcyc
tTCLK tclkh
TCLK tclkl
Figure Timer External Clock
tICPW TPMCHn
TPMCHn tICPW
Figure Timer Input Capture Pulse
3.10
Analog Comparator (ACMP) Electrical
Table Analog Comparator Electrical Specifications
Characteristic Supply voltage Supply current (active) Analog input voltage1 Analog input offset voltage1 Analog Comparator hysteresis1 Analog source impedance1 Analog input leakage current Analog Comparator initialization delay Analog Comparator bandgap reference voltage Symbol IDDAC VAIN VAIO IALKG tAINIT 1.80 Typical 1.208 15.0 Unit
These data characterized production tested.
MC9RS08KA8 Series, Rev. Preliminary-Subject Change Without Notice Freescale Semiconductor
Electrical Characteristics
3.11
Internal Clock Source Characteristics
Table Internal Clock Source Specifications
Characteristic Average internal reference frequency untrimmed Average internal reference frequency trimmed output frequency range untrimmed output frequency range trimmed Resolution trimmed output frequency fixed voltage temperature Total deviation trimmed output frequency over voltage temperature acquisition time2,3 Stop recovery time (FLL wakeup previous acquired frequency) IREFSTEN=0 IREFSTEN=1 Symbol fint_ut fint_t fdco_ut fdco_t fdco_res_t fdco_t tacquire 31.25 12.8 Typical1 31.25 39.06 41.66 39.0625 21.33 Unit %fdco %fdco
t_wakeup
Data typical column characterized 25°C typical recommended value. This parameter characterized tested each device. This specification applies time reference source reference divider changed, trim value changed changing from disabled (FBILP) enabled (FEI, FBI).
3.12
Characteristics
Table Volt 10-bit Operating Conditions
Characteristic Input voltage Accuracy Input capacitance Input resistance mode fADCK 4MHz fADCK 4MHz mode (all valid fADCK) Conditions Symb VADIN CADIN RADIN Min. fADCK Typical Max. Unit
Analog source resistance external
conversion clock frequency
High Speed (ADLPC=0) Power (ADLPC=1)
MC9RS08KA8 Series, Rev. Freescale Semiconductor Preliminary-Subject Change Without Notice
Electrical Characteristics
SIMPLIFIED INPUT EQUIVALENT CIRCUIT VADIN leakage input protection
ZADIN SIMPLIFIED CHANNEL SELECT CIRCUIT RADIN
ENGINE
RADIN INPUT
RADIN
INPUT
RADIN CADIN
INPUT
Figure Input Impedance Equivalency Diagram Table 10-bit Characteristics
Characteristic Supply current ADLPC ADLSMP ADCO Supply current ADLPC ADLSMP ADCO Supply current ADLPC ADLSMP ADCO Supply current ADLPC ADLSMP ADCO Supply current asynchronous clock source Stop, reset, module High speed (ADLPC power (ADLPC
Conditions
Symb
Typical1
Unit
IDDAD
IDDAD
IDDAD
IDDAD
0.582
IDDAD fADACK
0.011
MC9RS08KA8 Series, Rev. Preliminary-Subject Change Without Notice Freescale Semiconductor
Electrical Characteristics
Table 10-bit Characteristics (continued)
Characteristic Conversion time (including sample time) Conditions Short sample (ADLSMP=0) Long sample (ADLSMP=1) Short sample (ADLSMP=0) Sample time Long sample (ADLSMP=1) mode Total unadjusted error mode mode Differential non-linearity mode ETUE tADS tADC Symb Typical1 23.5 ±0.5 ±0.5 ±0.3 ±2.5 ±1.0 ±1.0 ±0.5 Unit ADCK cycles ADCK cycles LSB2
LSB2
Monotonicity No-Missing-Codes guaranteed mode Integral non-linearity mode mode Zero-scale error mode Full-Scale error VADIN VDDA mode mode mode Quantization error mode Input leakage error leakage3
±0.5 ±0.3 ±0.5 ±0.5 ±0.5 ±0.5 ±0.2 ±0.1
±1.0 ±0.5 ±1.5 ±0.5 ±1.5 ±0.5 ±0.5 ±0.5 ±2.5
LSB2
LSB2
LSB2
LSB2
mode mode
LSB2
Typical values assume Temp fADCK=1.0 unless otherwise stated. Typical values reference only tested production. REFH VREFL)/2 Based input leakage current. Refer electrical.
3.13
Flash Specifications
Table Flash Characteristics
Characteristic Symbol IVPP_prog IVPP_erase 11.8 Typical1 12.2 Unit
This section provides details about program/erase times program-erase endurance flash memory. detailed information about program/erase operations, reference manual.
Supply voltage program/erase Program/Erase voltage current Program Mass erase
MC9RS08KA8 Series, Rev. Freescale Semiconductor Preliminary-Subject Change Without Notice
Electrical Characteristics
Table Flash Characteristics (continued)
Characteristic Supply voltage read operation fBus Byte program time Mass erase time Cumulative program time2 Total cumulative time (total applied device) HVEN program setup time PGM/MASS HVEN setup time HVEN hold time HVEN hold time MASS PGM/MASS setup time HVEN hold time rise time3 Recovery time Program/erase endurance -40°C 85°C Data retention
Symbol VRead tprog thv_total tpgs tnvs tnvh tnvh1 tvps tvph tvrs trcv
1000
Typical1
Unit hours cycles
tD_ret
years
Typicals measured 25°C. cumulative high voltage programming time same before next erase. Same address programmed more than twice before next erase. Fast rise time potentially trigger protection structure, which result over current flowing into cause permanent damage pad. External filtering power source recommended. example filter shown Figure
Figure Example Filtering
MC9RS08KA8 Series, Rev. Preliminary-Subject Change Without Notice Freescale Semiconductor
Electrical Characteristics
tprog WRITE DATA1 tpgs
Data Next Data
tnvs HVEN VPP2 tnvh trcv
tvps
tvph
Next
Data applies programming multiple bytes single row, refer MC9RS08KA8 Series Reference Manua must valid operating voltage before voltage applied removed from pin.
Figure Flash Program Timing
trcv MASS tnvs HVEN VPP1
tnvh1
tvps
tvph
must valid operating voltage before voltage applied removed from pin.
Figure Flash Mass Erase Timing
MC9RS08KA8 Series, Rev. Freescale Semiconductor Preliminary-Subject Change Without Notice
Electrical Characteristics
3.14
Performance
Electromagnetic compatibility (EMC) performance highly dependant environment which resides. Board design layout, circuit topology choices, location characteristics external components well software operation play significant role performance. system designer should consult Freescale applications notes such AN2321, AN1050, AN1263, AN2764, AN1259 advice guidance specifically targeted optimizing performance.
3.14.1
Radiated Emissions
Microcontroller radiated emissions measured from using TEM/GTEM Cell method accordance with 61967-2 J1752/3 standards. measurement performed with microcontroller installed custom evaluation board while running specialized test software. radiated emissions from microcontroller measured cell package orientations (North East). maximum radiated emissions tested configuration orientations less than equal reported emissions levels. Table Radiated Emissions, Electric Field
Parameter Symbol Conditions Frequency 0.15 Radiated emissions, electric field VRE_TEM 25oC package type 1000 Level Level
fOSC/fBUS
Level1 (Max)
Unit
crystal
Data based qualification test results.
3.14.2
Conducted Transient Susceptibility
Microcontroller transient conducted susceptibility measured accordance with internal Freescale test method. measurement performed with microcontroller installed custom evaluation board running specialized test software designed compliance with test method. conducted susceptibility determined injecting transient susceptibility signal each microcontroller. transient waveform injection methodology based 61000-4-4 (EFT/B). transient voltage required cause performance degradation tested configuration greater than equal reported levels unless otherwise indicated footnotes below Table
MC9RS08KA8 Series, Rev. Preliminary-Subject Change Without Notice Freescale Semiconductor
Electrical Characteristics
Table Conducted Susceptibility, EFT/B
Parameter Symbol Conditions fOSC/fBUS Result Conducted susceptibility, electrical fast transient/burst (EFT/B) 25°C package type crystal
Amplitude1 (Min)
Unit
VCS_EFT
Data based qualification test results. tested production.
susceptibility performance classification described Table Table Susceptibility Performance Classification
Result failure Self-recovering failure Soft failure Performance Criteria performs designed during after exposure. does perform designed during exposure. returns automatically normal operation after exposure removed. does perform designed during exposure. does return normal operation until exposure removed RESET asserted. does perform designed during exposure. does return normal operation until exposure removed power cycled. does perform designed during after exposure. cannot returned proper operation physical damage other permanent performance degradation.
Hard failure
Damage
MC9RS08KA8 Series, Rev. Freescale Semiconductor Preliminary-Subject Change Without Notice
Ordering Information
Ordering Information
Table Device Numbering System
Memory Device Number Flash Type PDIP MC9RS08KA8 MC9RS08KA4 bytes bytes bytes bytes W-SOIC PDIP W-SOIC Designator Document 98ASB42431B 98ASB42567B 98ASB42899B 98ASB42343B Package
This section contains ordering numbers MC9RS08KA8 series devices. below example device numbering system.
RS08 Status Fully qualified) Memory Flash-Based) Core Family Package designator (See Table Temperature range -40°C 85°C) Approximate memory size
Mechanical Drawings
16-pin PDIP (plastic dual in-line pin) 16-pin W-SOIC (wide body small outline integrated circuit) 20-pin PDIP (plastic dual in-line pin) 20-pin W-SOIC (wide body small outline integrated circuit)
This following pages contain mechanical specifications MC9RS08KA8 Series package options.
MC9RS08KA8 Series, Rev. Preliminary-Subject Change Without Notice Freescale Semiconductor
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Document Number: MC9RS08KA8
Rev. 1/2008
Preliminary-Subject Change Without Notice
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