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2.7V 6.0V Single Supply CMOS Amps Single-Supply: 2.7V 6.0V Rail-t
Top Searches for this datasheetMCP601/1R/2/3/4 2.7V 6.0V Single Supply CMOS Amps Single-Supply: 2.7V 6.0V Rail-to-Rail Output Input Range Includes Ground Gain Bandwidth Product: (typical) Unity-Gain Stable Quiescent Current: µA/amplifier (typical) Chip Select (CS): MCP603 only Temperature Ranges: Industrial: -40°C +85°C Extended: -40°C +125°C Available Single, Dual, Quad Description Microchip Technology Inc. MCP601/1R/2/3/4 family low-power operational amplifiers amps) offered single (MCP601), single with Chip Select (CS) (MCP603), dual (MCP602), quad (MCP604) configurations. These amps utilize advanced CMOS technology that provides bias current, highspeed operation, high open-loop gain, rail-to-rail output swing. This product offering operates with single supply voltage that 2.7V, while drawing (typical) quiescent current amplifier. addition, common mode input voltage range goes 0.3V below ground, making these amplifiers ideal single-supply operation. These devices appropriate power, battery operated circuits quiescent current, convert driver amplifiers because their wide bandwidth anti-aliasing filters virtue their input bias current. MCP601, MCP602, MCP603 available standard 8-lead PDIP, SOIC, TSSOP packages. MCP601 MCP601R also available standard 5-lead SOT-23 package, while MCP603 available standard 6-lead SOT-23 package. MCP604 offered standard 14-lead PDIP, SOIC, TSSOP packages. MCP601/1R/2/3/4 family available Industrial Extended temperature ranges power supply range 2.7V 6.0V. Typical Applications Portable Equipment Converter Driver Photo Diode Pre-amp Analog Filters Data Acquisition Notebooks PDAs Sensor Interface Available Tools SPICE Macro Models FilterLab® Software MindiSimulation Tool MAPS (Microchip Advanced Part Selector) Analog Demonstration Evaluation Boards Application Notes Package Types MCP601 PDIP, SOIC, TSSOP VIN- VIN+ VOUT MCP602 PDIP, SOIC, TSSOP VOUTA VINA- VINA+ VOUTB VINB- VINB+ MCP603 PDIP, SOIC, TSSOP VIN- VIN+ VOUT MCP604 PDIP, SOIC, TSSOP VOUTA VINA- VINA+ VINB+ VINB- VOUTB VOUTD VIND- VIND+ VINC+ VINC- VOUTC MCP601 SOT23-5 VOUT VIN+ VIN- VOUT VIN+ MCP601R SOT23-5 VIN- VOUT VIN+ MCP603 SOT23-6 VIN- 2007 Microchip Technology Inc. DS21314G-page MCP601/1R/2/3/4 ELECTRICAL CHARACTERISTICS Notice: Stresses above those listed under "Absolute Maximum Ratings" cause permanent damage device. This stress rating only functional operation device those other conditions above those indicated operational listings this specification implied. Exposure maximum rating conditions extended periods affect device reliability. Section 4.1.2 "Input Voltage Current Limits". Absolute Maximum Ratings .7.0V Current Input Pins Analog Inputs (VIN+, VIN-) 1.0V 1.0V Other Inputs Outputs 0.3V 0.3V Difference Input Voltage |VDD VSS| Output Short Circuit Current .Continuous Current Output Supply Pins .±30 Storage Temperature.-65°C +150°C Maximum Junction Temperature (TJ) .+150°C Protection Pins (HBM; 200V CHARACTERISTICS Electrical Specifications: Unless otherwise specified, +25°C, +2.7V +5.5V, GND, VDD/2, VOUT VDD/2, VDD/2, tied low. (Refer Figure Figure 1-3). Parameters Input Offset Input Offset Voltage Industrial Temperature Extended Temperature Input Offset Temperature Drift Power Supply Rejection Input Current Impedance Input Bias Current Industrial Temperature Extended Temperature Input Offset Current Common Mode Input Impedance Differential Input Impedance Common Mode Common Mode Input Range Common Mode Rejection Ratio Open-loop Gain Open-loop Gain (large signal) VOS/TA PSRR ZDIFF VCMR CMRR Output Maximum Output Voltage Swing Linear Output Voltage Swing Output Short Circuit Current -4.5 ±0.7 ±2.5 1013||6 1013||3 +4.5 5000 Units µV/°C Conditions -40°C +85°C (Note -40°C +125°C (Note -40°C +125°C 2.7V 5.5V +85°C (Note +125°C (Note ||pF ||pF 5.0V, -0.3V 3.8V VOUT 0.1V 0.1V VOUT 0.1V 0.1V Output overdrive 0.5V Output overdrive 0.5V 5.5V 2.7V VOL, VOL, VOUT VOUT Power Supply Supply Voltage (Note Quiescent Current Amplifier Note These specifications tested either SOT-23 TSSOP packages with date codes older than YYWW 0408. these cases, minimum maximum values design characterization only. parts with date codes November 2007 later have been screened ensure operation VDD=6.0V. However, other minimum maximum specifications measured 1.4V and/or 5.5V. DS21314G-page 2007 Microchip Technology Inc. MCP601/1R/2/3/4 CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, +25°C, +2.7V +5.5V, GND, VDD/2, VOUT VDD/2, VDD/2, tied low. (Refer Figure Figure 1-3). Parameters Frequency Response Gain Bandwidth Product Phase Margin Step Response Slew Rate Settling Time (0.01%) Noise Input Noise Voltage Input Noise Voltage Density Input Noise Current Density µVP-P nV/Hz nV/Hz fA/Hz tsettle V/µs V/V, 3.8V step GBWP Units Conditions MCP603 CHIP SELECT (CS) CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, +25°C, +2.7V +5.5V, GND, VDD/2, VOUT VDD/2, VDD/2, tied low. (Refer Figure Figure 1-3). Parameters Specifications Logic Threshold, Input Current, High Specifications Logic Threshold, High Input Current, High Shutdown current Amplifier Output Leakage Shutdown Timing Amplifier Output Turn-on Time High Amplifier Output High-Z Time Hysteresis tOFF VHYST 0.2VDD, 0.8VDD, V/V, load. 5.0V ICSH IQ_SHDN IO_SHDN -2.0 -0.7 ICSL -1.0 0.2VDD Units Conditions VOUT Hi-Z (typical) tOFF Output Active Hi-Z (typical) -230 (typical) (typical) -700 (typical) (typical) Current FIGURE 1-1: Timing Diagram. MCP603 Chip Select (CS) 2007 Microchip Technology Inc. DS21314G-page MCP601/1R/2/3/4 TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, +2.7V +5.5V GND. Parameters Temperature Ranges Specified Temperature Range Operating Temperature Range Storage Temperature Range Thermal Package Resistances Thermal Resistance, 5L-SOT23 Thermal Resistance, 6L-SOT23 Thermal Resistance, 8L-PDIP Thermal Resistance, 8L-SOIC Thermal Resistance, 8L-TSSOP Thermal Resistance, 14L-PDIP Thermal Resistance, 14L-SOIC Thermal Resistance, 14L-TSSOP Note: °C/W °C/W °C/W °C/W °C/W °C/W °C/W °C/W +125 +125 +150 Industrial temperature parts Extended temperature parts Note Units Conditions Industrial temperature parts operate over this extended range, with reduced performance. Extended temperature specs apply Industrial temperature parts. case, internal Junction temperature (TJ) must exceed absolute maximum specification 150°C. Test Circuits test circuits used tests shown Figure Figure 1-2. bypass capacitors laid according rules discussed Section "Supply Bypass". VOUT VDD/2 MCP60X FIGURE 1-2: Test Circuit Most Non-Inverting Gain Conditions. VOUT VDD/2 MCP60X FIGURE 1-3: Test Circuit Most Inverting Gain Conditions. DS21314G-page 2007 Microchip Technology Inc. MCP601/1R/2/3/4 Note: TYPICAL PERFORMANCE CURVES graphs tables provided following this note statistical summary based limited number samples provided informational purposes only. performance characteristics listed herein tested guaranteed. some graphs tables, data presented outside specified operating range (e.g., outside specified power supply range) therefore outside warranted range. Note: Unless otherwise indicated, +25°C, +2.7V +5.5V, GND, VDD/2, VOUT VDD/2, VDD/2, tied low. Open-Loop Gain (dB) Gain Phase Open-Loop Phase -120 -150 -180 -210 Quiescent Current Amplifier (µA) -40°C +25°C +85°C +125°C -240 1.E+ 1.E+ 1.E- 1.E+ 1.E+ 1.E+ 1.E+ 1.E+ 100k 1.E+ Frequency (Hz) Supply Voltage FIGURE 2-1: Frequency. Open-Loop Gain, Phase FIGURE 2-4: Supply Voltage. Quiescent Current Amplifier (µA) Quiescent Current 5.0V Falling Edge 5.5V Slew Rate (V/µs) Rising Edge 2.7V Ambient Temperature (°C) Ambient Temperature (°C) FIGURE 2-2: Slew Rate Temperature. FIGURE 2-5: Temperature. 1.E+04 Quiescent Current GBWP Ambient Temperature (°C) FIGURE 2-3: Gain Bandwidth Product, Phase Margin Temperature. FIGURE 2-6: Frequency. Input Noise Voltage Density (V/Hz) Gain Bandwidth Product (MHz) Phase Margin, 1.E+03 100n 1.E+02 1.E+01 100k 1.E- 1.E+0 1.E+0 1.E+0 1.E+0 1.E+0 1.E+0 1.E+0 Frequency (Hz) Input Noise Voltage Density 2007 Microchip Technology Inc. DS21314G-page MCP601/1R/2/3/4 Note: Unless otherwise indicated, +25°C, +2.7V +5.5V, GND, VDD/2, VOUT VDD/2, VDD/2, tied low. Percentage Occurrences -2.0 -1.6 -1.2 -0.8 -0.4 Input Offset Voltage (mV) Percentage Occurrences Input Offset Voltage Drift (µV/°C) 1200 Samples 1200 Samples +125°C FIGURE 2-7: -0.1 -0.2 -0.3 -0.4 -0.5 Input Offset Voltage. FIGURE 2-10: CMRR, PSRR (dB) Input Offset Voltage Drift. Input Offset Voltage (mV) 5.5V 2.7V PSRR CMRR Ambient Temperature (°C) Ambient Temperature (°C) FIGURE 2-8: Temperature. -100 -200 Input Offset Voltage FIGURE 2-11: Temperature. -100 -200 CMRR, PSRR Input Offset Voltage (µV) Input Offset Voltage (µV) 2.7V -40°C +25°C +85°C 5.5V -40°C +25°C +85°C +125°C +125°C -0.4 -0.2 -0.5 Common Mode Input Voltage Common Mode Input Voltage FIGURE 2-9: Input Offset Voltage Common Mode Input Voltage with 2.7V. FIGURE 2-12: Input Offset Voltage Common Mode Input Voltage with 5.5V. DS21314G-page 2007 Microchip Technology Inc. MCP601/1R/2/3/4 Note: Unless otherwise indicated, +25°C, +2.7V +5.5V, GND, VDD/2, VOUT VDD/2, VDD/2, tied low. Channel-to-Channel Separation (dB) 1.E+03 100k 1.E+04 1.E+05 Frequency (Hz) 1.E+06 CMRR, PSRR (dB) 5.0V 100k 1.E+00 1.E+01 1.E+02 1.E+03 1.E+04 1.E+05 1.E+06 Frequency (Hz) CMRR Load Input Referred PSRR+ PSRR- FIGURE 2-13: Channel-to-Channel Separation Frequency. 1000 Input Bias Offset Currents (pA) FIGURE 2-16: Frequency. 1000 Input Bias Offset Currents (pA) CMRR, PSRR 5.5V 4.3V +125°C 5.5V max. VCMR 4.3V +85°C IOS, +125°C IOS, +85°C Ambient Temperature (°C) Common Mode Input Voltage FIGURE 2-14: Input Bias Current, Input Offset Current Ambient Temperature. Open-Loop Gain (dB) 1.E+02 2.7V 5.5V FIGURE 2-17: Input Bias Current, Input Offset Current Common Mode Input Voltage. Open-Loop Gain (dB) Power Supply Voltage 1.E+03 1.E+04 1.E+05 100k Load Resistance FIGURE 2-15: Load Resistance. Open-Loop Gain FIGURE 2-18: Supply Voltage. Open-Loop Gain 2007 Microchip Technology Inc. DS21314G-page MCP601/1R/2/3/4 Note: Unless otherwise indicated, +25°C, +2.7V +5.5V, GND, VDD/2, VOUT VDD/2, VDD/2, tied low. Gain Bandwidth Product (MHz) 1.E+02 1.E+03 1.E+04 Load Resistance GBWP 5.0V Phase Margin, 100k 1.E+05 Open-Loop Gain (dB) 5.5V 2.7V Ambient Temperature (°C) FIGURE 2-19: Gain Bandwidth Product, Phase Margin Load Resistance. 1,000 Output Headroom (mV); FIGURE 2-22: Temperature. 1000 Output Headroom (mV); Open-Loop Gain 5.5V tied VDD/2 0.01 Output Current Magnitude (mA) Ambient Temperature (°C) FIGURE 2-20: Output Voltage Headroom Output Current. Maximum Output Voltage Swing FIGURE 2-23: Temperature. Output Voltage Headroom Output Short Circuit Current Magnitude (mA) 5.5V 2.7V -40°C +25°C +85°C +125°C 1.E+04 100k 1.E+05 Frequency (Hz) 1.E+06 Supply Voltage FIGURE 2-21: Maximum Output Voltage Swing Frequency. FIGURE 2-24: Output Short-Circuit Current Supply Voltage. DS21314G-page 2007 Microchip Technology Inc. MCP601/1R/2/3/4 Note: Unless otherwise indicated, +25°C, +2.7V +5.5V, GND, VDD/2, VOUT VDD/2, VDD/2, tied low. Output Voltage Time µs/div) Output Voltage Time µs/div) 5.0V 5.0V FIGURE 2-25: Pulse Response. Large Signal Non-Inverting FIGURE 2-28: Response. Large Signal Inverting Pulse Output Voltage mV/div) Time µs/div) Output Voltage mV/div) 5.0V 5.0V Time µs/div) FIGURE 2-26: Pulse Response. -0.5 Small Signal Non-Inverting FIGURE 2-29: Response. Small Signal Inverting Pulse Quiescent Current through (µA) 5.0V 2.5V VOUT Active -100 -200 -300 -400 -500 -600 -700 VOUT High-Z Time µs/div) -800 5.5V Output Voltage, Chip Select Voltage Chip Select Voltage FIGURE 2-27: (MCP603). Chip Select Timing FIGURE 2-30: Quiescent Current Through Chip Select Voltage (MCP603). 2007 Microchip Technology Inc. DS21314G-page MCP601/1R/2/3/4 Note: Unless otherwise indicated, +25°C, +2.7V +5.5V, GND, VDD/2, VOUT VDD/2, VDD/2, tied low. Chip Select Current (µA) Chip Select Voltage Input Output Voltages +5.0V 5.5V VOUT Time µs/div) FIGURE 2-31: Chip Select Input Current Chip Select Voltage. FIGURE 2-33: MCP601/1R/2/3/4 family amps shows phase reversal under input overdrive. 1.E-02 1.E-03 100µ 1.E-04 1.E-05 1.E-06 100n 1.E-07 1.E-08 1.E-09 100p 1.E-10 1.E-11 1.E-12 Internal Chip Select Switch Output Voltage Amplifier Input Current Magnitude 5.0V Amplifier Hi-Z Chip Select Voltage +125°C +85°C +25°C -40°C -1.0 -0.9 -0.8 -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1 Input Voltage FIGURE 2-32: Internal Switch. Hysteresis Chip Select's FIGURE 2-34: Measured Input Current Input Voltage (below VSS). DS21314G-page 2007 Microchip Technology Inc. MCP601/1R/2/3/4 DESCRIPTIONS FUNCTION TABLE SINGLE AMPS MCP601R SOT-23-5 (Note MCP603 SOT-23-6 PDIP, SOIC, TSSOP Symbol VOUT VIN- VIN+ Description Analog Output Inverting Input Non-inverting Input Positive Power Supply Negative Power Supply Chip Select Internal Connection Descriptions pins listed Table (single amps) Table (dual quad amps). TABLE 3-1: MCP601 PDIP, SOIC, TSSOP Note SOT-23-5 MCP601R only available 5-pin SOT-23 package. TABLE 3-2: MCP602 PDIP, SOIC, TSSOP FUNCTION TABLE DUAL QUAD AMPS MCP604 PDIP, SOIC, TSSOP Symbol VOUTA VINA- VINA+ VINB+ VINB- VOUTB VOUTC VINC- VINC+ VIND+ VIND- VOUTD Description Analog Output Inverting Input Non-inverting Input Positive Power Supply Non-inverting Input Inverting Input Analog Output Analog Output Inverting Input Non-inverting Input Negative Power Supply Non-inverting Input Inverting Input Analog Output Analog Outputs Power Supply Pins output pins low-impedance voltage sources. Analog Inputs positive power supply (VDD) 2.5V 6.0V higher than negative power supply (VSS). normal operation, other pins voltages between VDD. Typically, these parts used single (positive) supply configuration. this case, connected ground connected supply. will need bypass capacitors. non-inverting inverting inputs highimpedance CMOS inputs with bias currents. Chip Select Digital Input This CMOS, Schmitt-triggered input that places part into power mode operation. 2007 Microchip Technology Inc. DS21314G-page MCP601/1R/2/3/4 APPLICATIONS INFORMATION (minimum expected (minimum expected MCP60X MCP601/1R/2/3/4 family amps fabricated Microchip's state-of-the-art CMOS process. They unity-gain stable suitable wide range general purpose applications. 4.1.1 Inputs PHASE REVERSAL MCP601/1R/2/3/4 designed prevent phase reversal when input pins exceed supply voltages. Figure 2-34 shows input voltage exceeding supply voltage without phase reversal. 4.1.2 INPUT VOLTAGE CURRENT LIMITS protection inputs depicted shown Figure 4-1. This structure chosen protect input transistors, minimize input bias current (IB). input diodes clamp inputs when they more than diode drop below VSS. They also clamp voltages that above VDD; their breakdown voltage high enough allow normal operation, enough bypass quick events within specified limits. FIGURE 4-2: Inputs. Protecting Analog also possible connect diodes left resistors this case, current through diodes needs limited some other mechanism. resistors then serve in-rush current limiters; current into input pins (VIN+ VIN-) should very small. significant amount current flow inputs when common mode voltage (VCM) below ground (VSS); Figure 2-34. Applications that high impedance need limit useable voltage range. Bond 4.1.3 VIN+ Bond Input Stage Bond VIN- NORMAL OPERATION Bond Common Mode Input Voltage Range (VCMR) includes ground single-supply systems (VSS), does include VDD. This means that amplifier input behaves linearly long Common Mode Input Voltage (VCM) kept within specified VCMR limits (VSS-0.3V VDD-1.2V +25°C). Figure shows unity gain buffer. Since VOUT same voltage inverting input, VOUT must kept below VDD-1.2V correct operation. FIGURE 4-1: Structures. Simplified Analog Input order prevent damage and/or improper operation these amps, circuit they must limit currents voltages VIN+ VIN- pins (see Absolute Maximum Ratings beginning Section "Electrical Characteristics"). Figure shows recommended approach protecting these inputs. internal diodes prevent input pins (VIN+ VIN-) from going below ground, resistors limit possible current drawn input pins. Diodes prevent input pins (VIN+ VIN-) from going above VDD, dump currents onto VDD. When implemented shown, resistors also limit current through MCP60X VOUT FIGURE 4-3: Unity Gain Buffer Limited VOUT Range. DS21314G-page 2007 Microchip Technology Inc. MCP601/1R/2/3/4 Rail-to-Rail Output MCP60X RISO VOUT There specifications that describe output swing capability MCP601/1R/2/3/4 family amps. first specification (Maximum Output Voltage Swing) defines absolute maximum swing that achieved under specified load conditions. instance, output voltage swings within negative rail with load VDD/2. Figure 2-33 shows output voltage limited when input goes beyond linear region operation. second specification that describes output swing capability these amplifiers Linear Output Voltage Swing. This specification defines maximum output swing that achieved while amplifier still operating linear region. verify linear operation this range, large signal Open-Loop Gain (AOL)) measured points inside supply rails. measurement must exceed specified gains specification table. FIGURE 4-4: Output resistor RISO stabilizes large capacitive loads. Figure gives recommended RISO values different capacitive loads gains. x-axis normalized load capacitance (CL/GN) order make easier interpret plot arbitrary gains. circuit's noise gain. non-inverting gains, gain equal. inverting gains, |Gain| (e.g., gives V/V). Recommended RISO MCP603 Chip Select MCP603 single amplifier with Chip Select (CS). When pulled high, supply current drops -0.7 (typ.), which pulled through VSS. When this happens, amplifier output into high-impedance state. Pulling enables amplifier. internal (typical) pull-down resistor connected VSS, will left floating. Figure Chip Select timing diagram shows output voltage, supply currents, current response pulse. Figure 2-27 shows measured output voltage response pulse. 100p Normalized Load Capacitance; FIGURE 4-5: Recommended RISO values capacitive loads. Once have selected RISO your circuit, doublecheck resulting frequency response peaking step response overshoot your circuit. Evaluation bench simulations with MCP601/1R/2/3/4 SPICE macro model very helpful. Modify RISO's value until response reasonable. Capacitive Loads Driving large capacitive loads cause stability problems voltage feedback amps. load capacitance increases, feedback loop's phase margin decreases closed-loop bandwidth reduced. This produces gain peaking frequency response with overshoot ringing step response. When driving large capacitive loads with these amps (e.g., when +1), small series resistor output (RISO Figure 4-4) improves feedback loop's phase margin (stability) making output load resistive higher frequencies. bandwidth will generally lower than bandwidth with capacitive load. Supply Bypass With this family amps, power supply (VDD single-supply) should have local bypass capacitor (i.e., 0.01 within good highfrequency performance. also needs bulk capacitor (i.e., larger) within provide large, slow currents. This bulk capacitor shared with nearby analog parts. 2007 Microchip Technology Inc. DS21314G-page MCP601/1R/2/3/4 Unused Amps unused quad package (MCP604) should configured shown Figure 4-6. These circuits prevent output from toggling causing crosstalk. Circuits sets minimum noise gain. resistor divider produces desired reference voltage within output voltage range amp; buffers that reference voltage. Circuit uses minimum number components operates comparator, draw more current. MCP604 VREF MCP604 Connect guard ring non-inverting input (VIN+) inverting gain amplifiers transimpedance amplifiers (converts current voltage, such photo detectors). This biases guard ring same reference voltage (e.g., VDD/2 ground). 4.8.1 Typical Applications ANALOG FILTERS Figure Figure show low-pass, secondorder, Butterworth filters with cutoff frequency filter Figure non-inverting gain V/V, filter Figure inverting gain V/V. MCP60X VOUT FIGURE 4-6: Unused Amps. FIGURE 4-8: Sallen-Key Filter. Surface Leakage Second-Order, Low-Pass applications where input bias current critical, printed circuit board (PCB) surface leakage effects need considered. Surface leakage caused humidity, dust other contamination board. Under humidity conditions, typical resistance between nearby traces 1012. difference would cause current flow. This greater than MCP601/1R/2/3/4 family's bias current +25°C typical). easiest reduce surface leakage guard ring around sensitive pins traces). guard ring biased same voltage sensitive pin. example this type layout shown Figure 4-7. Guard Ring VIN- VIN+ 1.00 VDD/2 VOUT MCP60X FIGURE 4-9: Second-Order, Low-Pass Multiple-Feedback Filter. MCP601/1R/2/3/4 family amps have input bias current, which allows designer select larger resistor values smaller capacitor values these filters. This helps produce compact layout. These filters, others, designed using Microchip's Design Aids; Section "FilterLab® Software" Section "MindiSimulatior Tool". FIGURE 4-7: Example Guard Ring layout. Connect guard ring inverting input (VIN-) non-inverting gain amplifiers, including unity-gain buffers. This biases guard ring common mode input voltage. DS21314G-page 2007 Microchip Technology Inc. MCP601/1R/2/3/4 4.8.2 INSTRUMENTATION AMPLIFIER CIRCUITS 4.8.3 PHOTO DETECTION Instrumentation amplifiers have differential input that subtracts input voltage from another rejects common mode signals. These amplifiers also provide single-ended output voltage. three-op instrumentation amplifier illustrated Figure 4-10. advantage this approach unitygain operation, while disadvantage that common mode input range reduced R2/RG gets larger. MCP601/1R/2/3/4 amps used easily convert signal from sensor that produces output current (such photo diode) into voltage transimpedance amplifier). This implemented with single resistor (R2) feedback loop amplifiers shown Figure 4-12 Figure 4-13. optional capacitor (C2) sometimes provides stability these circuits. photodiode configured Photovoltaic mode zero voltage potential placed across (Figure 4-12). this mode, light sensitivity linearity maximized, making best suited precision applications. amplifier specifications this application are: input bias current, noise, common mode input voltage range (including ground), rail-to-rail output. MCP60X MCP60X VOUT MCP60X VREF Light VOUT MCP60X VOUT FIGURE 4-10: Three-Op Instrumentation Amplifier. two-op instrumentation amplifier shown Figure 4-11. While power consumption lower than three-op version, main drawbacks that common mode range reduced with higher gains must configured gains higher. VREF FIGURE 4-12: Photovoltaic Mode Detector. VOUT MCP60X contrast, photodiode that configured Photoconductive mode reverse bias voltage across photo-sensing element (Figure 4-13). This decreases diode capacitance, which facilitates high-speed operation (e.g., high-speed digital communications). design trade-off increased diode leakage current linearity errors. needs have wide Gain Bandwidth Product (GBWP). VBIAS VOUT MCP60X Light MCP60X VOUT VBIAS FIGURE 4-11: Two-Op Instrumentation Amplifier. Both instrumentation amplifiers should bulk bypass capacitor least CMRR these amplifiers will both CMRR resistor matching. FIGURE 4-13: Detector. Photoconductive Mode 2007 Microchip Technology Inc. DS21314G-page MCP601/1R/2/3/4 DESIGN AIDS Microchip provides basic design tools needed MCP601/1R/2/3/4 family amps. Analog Demonstration Evaluation Boards SPICE Macro Model latest SPICE macro model MCP601/1R/2/ amps available Microchip site www.microchip.com. This model intended initial design tool that works well amp's linear region operation over temperature range. model file information capabilities. Bench testing very important part design cannot replaced with simulations. Also, simulation results using this macro model need validated comparing them data sheet specifications characteristic curves. Microchip offers broad spectrum Analog Demonstration Evaluation Boards that designed help achieve faster time market. complete listing these boards their corresponding user's guides technical information, visit Microchip site www.microchip.com/ analogtools. boards that especially useful are: SOIC8EV: 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board SOIC14EV: 14-Pin SOIC/TSSOP/DIP Evaluation Board Application Notes FilterLab® Software Microchip's FilterLab® software innovative software tool that simplifies analog active filter (using amps) design. Available cost from Microchip site www.microchip.com/filterlab, FilterLab design tool provides full schematic diagrams filter circuit with component values. also outputs filter circuit SPICE format, which used with macro model simulate actual filter performance. following Microchip Application Notes available Microchip site www.microchip. com/ appnotes recommended supplemental reference resources. ADN003: "Select Right Operational Amplifier your Filtering Circuits", DS21821 AN722: "Operational Amplifier Topologies Specifications", DS00722 AN723: "Operational Amplifier Specifications Applications", DS00723 AN884: "Driving Capacitive Loads With Amps", DS00884 AN990: "Analog Sensor Conditioning Circuits Overview", DS00990 These application notes others listed design guide: "Signal Chain Design Guide", DS21825 MindiSimulatior Tool Microchip's Mindisimulator tool aids design various circuits useful active filter, amplifier power-management applications. free online simulation tool available from Microchip site www.microchip.com/mindi. This interactive simulator enables designers quickly generate circuit diagrams, simulate circuits. Circuits developed using Mindi simulation tool downloaded personal computer workstation. MAPS (Microchip Advanced Part Selector) MAPS software tool that helps semiconductor professionals efficiently identify Microchip devices that particular design requirement. Available cost from Microchip website www.microchip.com/ maps, MAPS overall selection tool Microchip's product portfolio that includes Analog, Memory, MCUs DSCs. Using this tool define filter sort features parametric search devices export side-by-side technical comparasion reports. Helpful links also provided Datasheets, Purchase, Sampling Microchip parts. DS21314G-page 2007 Microchip Technology Inc. MCP601/1R/2/3/4 PACKAGING INFORMATION Package Marking Information 5-Lead SOT-23 (MCP601 MCP601R only) I-Temp Code E-Temp Code Example: Device XXNN MCP601 MCP601R SANN SJNN SLNN SMNN SJ25 6-Lead SOT-23 (MCP603 only) I-Temp Code AENN E-Temp Code AUNN Example: Device XXNN MCP603 AU25 Legend: XX.X Note: Customer-specific information Year code (last digit calendar year) Year code (last digits calendar year) Week code (week January week `01') Alphanumeric traceability code Pb-free JEDEC designator Matte (Sn) This package Pb-free. Pb-free JEDEC designator found outer packaging this package. event full Microchip part number cannot marked line, will carried over next line, thus limiting number available characters customer-specific information. 2007 Microchip Technology Inc. DS21314G-page MCP601/1R/2/3/4 Package Marking Information (Continued) 8-Lead PDIP (300 mil) XXXXXXXX XXXXXNNN YYWW Example: MCP601 I/P256 0722 MCP601 0722 8-Lead SOIC (150 mil) Example: MCP601 I/SN0722 MCP601E 0722 XXXXXXXX XXXXYYWW 8-Lead TSSOP Example: XXXX XYWW I722 DS21314G-page 2007 Microchip Technology Inc. MCP601/1R/2/3/4 Package Marking Information (Continued) 14-Lead PDIP (300 mil) (MCP604) Example: XXXXXXXXXXXXXX XXXXXXXXXXXXXX YYWWNNN MCP604-I/P 0722256 MCP604 0722256 14-Lead SOIC (150 mil) (MCP604) Example: XXXXXXXXXX XXXXXXXXXX YYWWNNN MCP604ISL 0722256 MCP604 E/SL^^ 0722256 14-Lead TSSOP (MCP604) Example: XXXXXXXX YYWW 604E 0722 2007 Microchip Technology Inc. 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MCP601/1R/2/3/4 /HDG 3ODVWLF 7KLQ 6KULQN 6PDOO 2XWOLQH %RG\ >76623@ 1RWH PRVW FXUUHQW SDFNDJH GUDZLQJV SOHDVH 0LFURFKLS 3DFNDJLQJ 6SHFLILFDWLRQ ORFDWHG KWWSZZZPLFURFKLSFRPSDFNDJLQJ NOTE 8QLWV 'LPHQVLRQ /LPLWV 1XPEHU 3LQV 3LWFK 2YHUDOO +HLJKW 0ROGHG 3DFNDJH 7KLFNQHVV 6WDQGRII 2YHUDOO :LGWK 0ROGHG 3DFNDJH :LGWK 0ROGHG 3DFNDJH /HQJWK )RRW /HQJWK )RRWSULQW )RRW $QJOH /HDG 7KLFNQHVV 0,//,0(7(56 /HDG :LGWK 1RWHV YLVXDO LQGH[ IHDWXUH YDU\ PXVW ORFDWHG ZLWKLQ KDWFKHG DUHD 'LPHQVLRQV LQFOXGH PROG IODVK SURWUXVLRQV 0ROG IODVK SURWUXVLRQV VKDOO H[FHHG VLGH 'LPHQVLRQLQJ WROHUDQFLQJ $60( %DVLF 'LPHQVLRQ 7KHRUHWLFDOO\ H[DFW YDOXH VKRZQ ZLWKRXW WROHUDQFHV 5HIHUHQFH 'LPHQVLRQ XVXDOO\ ZLWKRXW WROHUDQFH LQIRUPDWLRQ SXUSRVHV RQO\ 0LFURFKLS 7HFKQRORJ\ 'UDZLQJ 2007 Microchip Technology Inc. DS21314G-page MCP601/1R/2/3/4 NOTES: DS21314G-page 2007 Microchip Technology Inc. MCP601/1R/2/3/4 APPENDIX REVISION HISTORY Revision (December 2007) Updated Figure 2-15 Figure 2-19. Updated Table Table 3-2. Updated notes Section "Electrical Characteristics". Expanded Analog Input Absolute Maximum Voltage Range (applies retroactively). Expanded operating maximum 6.0V. Added Figure 2-34. Added Section 4.1.1 "Phase Reversal", Section 4.1.2 "Input Voltage Current Limits", Section 4.1.3 "Normal Operation". Corrected Section "Packaging Information". Revision (February 2004) Undocumented changes. Revision (September 2003) Undocumented changes. Revision (April 2000) Undocumented changes. Revision (July 1999) Undocumented changes. Revision (June 1999) Undocumented changes. Revision (March 1999) Original Release this Document. 2007 Microchip Technology Inc. DS21314G-page MCP601/1R/2/3/4 NOTES: DS21314G-page 2007 Microchip Technology Inc. MCP601/1R/2/3/4 PRODUCT IDENTIFICATION SYSTEM order obtain information, e.g., pricing delivery, refer factory listed sales office. PART Device Temperature Range Package Examples: MCP601-I/P: Single Amp, Industrial Temperature, lead PDIP package. MCP601-E/SN: Single Amp, Extended Temperature, lead SOIC package. MCP601T-E/ST: Tape Reel, Extended Temperature, Single Amp, lead TSSOP package MCP601RT-I/OT: Tape Reel, Industrial Temperature, Single Amp, Rotated lead SOT-23 package. MCP601RT-E/OT:Tape Reel, Extended Temperature, Single Amp, Rotated, lead SOT-23 package. MCP602-I/SN: Dual Amp, Industrial Temperature, lead SOIC package. MCP602-E/P: Dual Amp, Extended Temperature, lead PDIP package. MCP602T-E/ST: Tape Reel, Extended Temperature, Dual Amp, lead TSSOP package. Industrial Temperature, Single with Chip Select, lead SOIC package. MCP603-E/P: Extended Temperature, Single with Chip Select, lead PDIP package. MCP603T-E/ST: Tape Reel, Extended Temperature, Single with Chip Select lead TSSOP package. MCP603T-I/SN: Tape Reel, Industrial Temperature, Single with Chip Select, lead SOIC package. MCP604-I/P: Industrial Temperature, Quad Amp, lead PDIP package. MCP604-E/SL: Extended Temperature, Quad Amp, lead SOIC package. MCP604T-E/ST: Tape Reel, Extended Temperature, Quad Amp, lead TSSOP package. MCP603-I/SN: Device MCP601 MCP601T Single Single (Tape Reel SOT-23, SOIC TSSOP) MCP601RT Single (Tape Reel SOT-23-5) MCP602 Dual MCP602T Dual (Tape Reel SOIC TSSOP) MCP603 Single with Chip Select MCP603T Single with Chip Select (Tape Reel SOT-23, SOIC TSSOP) MCP604 Quad MCP604T Quad (Tape Reel SOIC TSSOP) -40° +85° -40° +125° Temperature Range Package Plastic SOT-23, 5-lead (MCP601 only) Plastic SOT-23, 6-lead (MCP603 only) Plastic (300 body), lead Plastic SOIC (3.90 body), lead Plastic SOIC (3.90 body), lead Plastic TSSOP (4.4 body), lead 2007 Microchip Technology Inc. DS21314G-page MCP601/1R/2/3/4 NOTES: DS21314G-page 2007 Microchip Technology Inc. Note following details code protection feature Microchip devices: Microchip products meet specification contained their particular Microchip Data Sheet. Microchip believes that family products most secure families kind market today, when used intended manner under normal conditions. There dishonest possibly illegal methods used breach code protection feature. these methods, knowledge, require using Microchip products manner outside operating specifications contained Microchip's Data Sheets. Most likely, person doing engaged theft intellectual property. Microchip willing work with customer concerned about integrity their code. Neither Microchip other semiconductor manufacturer guarantee security their code. Code protection does mean that guaranteeing product "unbreakable." Code protection constantly evolving. Microchip committed continuously improving code protection features products. Attempts break Microchip's code protection feature violation Digital Millennium Copyright Act. such acts allow unauthorized access your software other copyrighted work, have right relief under that Act. Information contained this publication regarding device applications like provided only your convenience superseded updates. your responsibility ensure that your application meets with your specifications. MICROCHIP MAKES REPRESENTATIONS WARRANTIES KIND WHETHER EXPRESS IMPLIED, WRITTEN ORAL, STATUTORY OTHERWISE, RELATED INFORMATION, INCLUDING LIMITED CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY FITNESS PURPOSE. Microchip disclaims liability arising from this information use. Microchip devices life support and/or safety applications entirely buyer's risk, buyer agrees defend, indemnify hold harmless Microchip from damages, claims, suits, expenses resulting from such use. licenses conveyed, implicitly otherwise, under Microchip intellectual property rights. Trademarks Microchip name logo, Microchip logo, Accuron, dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC, PICmicro, PICSTART, MATE, rfPIC SmartShunt registered trademarks Microchip Technology Incorporated U.S.A. other countries. AmpLab, FilterLab, Linear Active Thermistor, Migratable Memory, MXDEV, MXLAB, SEEVAL, SmartSensor Embedded Control Solutions Company registered trademarks Microchip Technology Incorporated U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock ZENA trademarks Microchip Technology Incorporated U.S.A. other countries. SQTP service mark Microchip Technology Incorporated U.S.A. other trademarks mentioned herein property their respective companies. 2007, Microchip Technology Incorporated, Printed U.S.A., Rights Reserved. Printed recycled paper. Microchip received ISO/TS-16949:2002 certification worldwide headquarters, design wafer fabrication facilities Chandler Tempe, Arizona; Gresham, Oregon design centers California India. Company's quality system processes procedures PIC® MCUs dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory analog products. addition, Microchip's quality system design manufacture development systems 9001:2000 certified. 2007 Microchip Technology Inc. DS21314G-page WORLDWIDE SALES SERVICE AMERICAS Corporate Office 2355 West Chandler Blvd. Chandler, 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Address: www.microchip.com Atlanta Duluth, Tel: 678-957-9614 Fax: 678-957-1455 Boston Westborough, Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, Tel: 765-864-8360 Fax: 765-864-8387 Angeles Mission Viejo, Tel: 949-462-9523 Fax: 949-462-9608 Santa Clara Santa Clara, Tel: 408-961-6444 Fax: 408-961-6445 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509 ASIA/PACIFIC Asia Pacific Office Suites 3707-14, 37th Floor Tower Gateway Harbour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 Australia Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China Beijing Tel: 86-10-8528-2100 Fax: 86-10-8528-2104 China Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 China Fuzhou Tel: 86-591-8750-3506 Fax: 86-591-8750-3521 China Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 China Nanjing Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 China Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 China Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 China Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 China Shenzhen Tel: 86-755-8203-2660 Fax: 86-755-8203-1760 China Shunde Tel: 86-757-2839-5507 Fax: 86-757-2839-5571 China Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 China Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 ASIA/PACIFIC India Bangalore Tel: 91-80-4182-8400 Fax: 91-80-4182-8422 India Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 India Pune Tel: 91-20-2566-1512 Fax: 91-20-2566-1513 Japan Yokohama Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Korea Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 Korea Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 82-2-558-5934 Malaysia Kuala Lumpur Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 Malaysia Penang Tel: 60-4-227-8870 Fax: 60-4-227-4068 Philippines Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan Hsin Tel: 886-3-572-9526 Fax: 886-3-572-6459 Taiwan Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Thailand Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 EUROPE Austria Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820 10/05/07 DS21314G-page 2007 Microchip Technology Inc. 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