High accuracy, high-resolution voltage outputs channel matching 12-bit
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High Performance, 12-Bit, 12-Channel Decimating, DecDriver® AD8387
High accuracy, high-resolution voltage outputs channel matching 12-bit input resolution Laser-trimmed outputs Fast settling, high voltage drive settling time 0.25% into load Slew rate Outputs within supply rails High update rates Fast, clock Programmable video reference (brightness) full-scale (contrast) output levels Flexible logic reverses polarity video signal reverses loading order data selects frame/row column/dot inversion selects single dual data mode Output short-circuit protection logic, analog supplies Available 80-lead, TQFP E-pad
DBA(0:11)
FUNCTIONAL BLOCK DIAGRAM
TWO-STAGE LATCH TWO-STAGE LATCH VID0
DBB(0:11)
VID1
BIAS THERMAL SWITCH G-MODE SWITCH
TWO-STAGE LATCH TWO-STAGE LATCH
VID10
VID11
SEQUENCE CONTROL SCALING CONTROL
05653-001
AD8387
Figure
APPLICATIONS
microdisplay driver
GENERAL DESCRIPTION
AD8387 DecDriver provides dual, fast latched, 12-bit decimating input, which drives high voltage outputs. Twelvebit input words loaded into separate high speed, bipolar DACs sequentially. Flexible digital input format allows more than AD8387 used parallel higher resolution displays. output signal adjusted reference, signal inversion, contrast maximum flexibility. AD8387 fabricated ADI's fast bipolar, XFCB process, providing fast input logic, bipolar DACs with trimmed accuracy fast settling, high voltage, precision drive amplifiers same chip. AD8387 dissipates 1.34 nominal static power. AD8387 offered 80-lead TQFP E-pad package operates over commercial temperature range +85°C.
CHANNEL MATCHING (mV)
CODE
NORMAL PROJECTOR OPERATING TEMPERATURE RANGE
CODE 2048
CODE 4095
05653-015
INTERNAL AMBIENT TEMPERATURE (°C)
Figure Channel Matching Temperature
Rev.
Information furnished Analog Devices believed accurate reliable. However, responsibility assumed Analog Devices use, infringements patents other rights third parties that result from use. Specifications subject change without notice. license granted implication otherwise under patent patent rights Analog Devices. Trademarks registered trademarks property their respective owners.
Technology Way, P.O. 9106, Norwood, 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 2005 Analog Devices, Inc. rights reserved.
AD8387 TABLE CONTENTS
Features Applications. Functional Block Diagram General Description Revision History Specifications. Absolute Maximum Ratings. Exposed Paddle. Overload Protection. Maximum Power Dissipation Operating Temperature Range Caution. Configuration Function Descriptions. Typical Performance Characteristics Timing Diagrams. Single Data Configuration, Dual Data Configuration, HIGH. Functional Description Reference Control Input Description. Theory Operation Transfer Function Analog Output Voltage. Accuracy Applications. Optimized Reliability with Thermal Switch Initial Power-Up After Assembly Repair. Power-Up During Normal Operation Power Supply Sequencing Power-On Sequence. Power-Off Sequence. Grounded Output Mode During Power-Off Design Optimized Thermal Performance Thermal Design Thermal Structure Design AD8387 Design Recommendations Outline Dimensions Ordering Guide
REVISION HISTORY
10/05-Revision Initial Version
Rev. Page
AD8387 SPECIFICATIONS
25°C, AVCC 15.5 DVCC 0°C, 75°C still air, unless otherwise noted. Table
Parameter VIDEO PERFORMANCE VDE-Differential Error Voltage Conditions ,VFS code code 1024 code 2048 code 3072 code 4095 code range 4095 code code 1024 code 2048 code 3072 code 4095 code range 4095 code code 1024 code 2048 code 3072 code 4095 code range 4095 code code 1024 code 2048 code 3072 code 4095 code range 4095 VIDx step, Unit
-5.5 -4.4 -3.6 -2.8 -2.1 -6.0 -2.5 -2.5 -2.5 -2.5 -2.5 -3.5
-0.8 -0.5 -0.3 -0.3 +0.2
+5.0 +3.6 +3.3 +2.8 +2.1 +6.0 +2.5 +2.5 +2.5 +2.5 +2.5 +3.5
VCME-Common-Mode Error Voltage
-0.3 -0.3 -0.3 -0.3 -0.3
VDE-VDE Channel Matching
V-Channel Matching
-0.2
VIDEO OUTPUT DYNAMIC PERFORMANCE Data Switching Settling Time 0.25% Data Switching Settling Time Data Switching Slew Rate Data Feedthrough All-Hostile Crosstalk Amplitude Glitch Duration Transition Glitch Energy Invert Switching Settling Time 0.25% Invert Switching Settling Time Invert Switching Slew Rate Invert Switching Overshoot
nV-s
Code 2047 2048 VIDx step,
Rev. Page
AD8387
Parameter VIDEO OUTPUT CHARACTERISTICS Output Voltage Swing Output Voltage-Grounded Mode Data Switching Delay: Data Switching Delay Skew: Switching Delay: Switching Delay Skew: Output Current Output Resistance REFERENCE INPUTS Range Range Range1 Input Resistance Input Current Input Current RESOLUTION DIGITAL INPUT CHARACTERISTICS Frequency Data Setup Time: Setup Time: Data Hold Time: Hold Time: High Time: Time: High Time: Time: POWER SUPPLIES DVCC, Operating Range DVCC, Quiescent Current AVCC, Operating Range AVCC, Quiescent Current OPERATING TEMPERATURE Ambient Temperature Range, Ambient Temperature Range,
Conditions AVCC VOH, AGND VIDx step VIDx step
0.06 15.7 16.2
0.150
Unit Bits
5.25 AVCC 2.75 2.75
Binary Coding input duty cycle HIGH
0.05 0.05 -0.6 -1.3 -1.2 1.65
HIGH HIGH
Still air, airflow,
differential error voltage, VCME common-mode error voltage, matching between outputs, maximum deviation between outputs, full-scale output voltage (VRH VRL). Accuracy section. Guaranteed monotonic characterization four sigma limits. Measured outputs differentially DBx(0:11) driven held LOW. Measured outputs differentially others transitioning Measured both states INV. Measured from rising edge output change. Measurement made both states INV. Measured from transition output change. Operation elevated ambient temperature requires thermally optimized additional thermal management, such airflow across surface AD8387.
Rev. Page
AD8387 ABSOLUTE MAXIMUM RATINGS
Table
Parameter Supply Voltages AVCCx AGNDx DVCC DGND Input Voltages Maximum Digital Input Voltage Minimum Digital Input Voltage Maximum Analog Input Voltage Minimum Analog Input Voltage Internal Power Dissipation1 TQFP E-Pad 25°C Operating Temperature Range Storage Temperature Range Lead Temperature Range (Soldering sec)
Rating DVCC DGND AVCC AGND 4.38 85°C -65°C +125°C 300°C
When HIGH, output current limiter, well thermal switch, enabled. thermal switch debiases output amplifier when junction temperature reaches internally trip point. event extended shortcircuit between video output power supply rail, output amplifier current continues switch between typical with period determined thermal time constant hysteresis thermal trip point. thermal switch, when enabled, provides long-term protection from accidental shorts during assembly process limiting average junction temperature safe level.
MAXIMUM POWER DISSIPATION
maximum power that AD8387 safely dissipate limited junction temperature. maximum safe junction temperature plastic encapsulated devices, determined glass transition temperature plastic, approximately 150°C. Exceeding this limit temporarily cause shift parametric performance change stresses exerted package. Exceeding junction temperature 150°C extended period result device failure.
80-lead TQFP E-Pad: 28.5°C/W (still air) [JEDEC Standard, 4-layer still air] 12.2°C/W 14.6°C/W 12.0°C/W 0.3°C/W.
Stresses above those listed under Absolute Maximum Ratings cause permanent damage device. This stress rating only; functional operation device these other conditions above those indicated operational section this specification implied. Exposure absolute maximum ratings extended periods reduce device reliability.
OPERATING TEMPERATURE RANGE
ensure operation within specified operating temperature range, necessary limit maximum power dissipation follows.
500LFM 200LFM
EXPOSED PADDLE
ensure optimized thermal performance, exposed paddle must thermally connected external plane, such AVCC GND, described Applications section.
MAXIMUM POWER DISSIPATION
STILL
OVERLOAD PROTECTION
AD8387 overload protection circuit consists output current limiter thermal switch. When LOW, thermal switch disabled output current limiter enabled. maximum current output internally limited average. event momentary short-circuit between video output power supply rail (VCC AGND), output current limit sufficiently provide temporary protection.
QUIESCENT
05653-002
THERMAL SWITCH ENABLED DISABLED
AMBIENT TEMPERATURE (°C)
Figure Maximum Power Dissipation Temperature, AD8387 4-Layer JEDEC with Thermally Optimized Landing Pattern Described Applications Section
CAUTION
(electrostatic discharge) sensitive device. Electrostatic charges high 4000 readily accumulate human body test equipment discharge without detection. Although this product features proprietary protection circuitry, permanent damage occur devices subjected high energy electrostatic discharges. Therefore, proper precautions recommended avoid performance degradation loss functionality.
Rev. Page
AD8387 CONFIGURATION FUNCTION DESCRIPTIONS
AVCC0,
AGNDD
AGNDD
AVCCD
AVCCD
DGND2
AGND0
DVCC2
DBA4
DBA3
DBA2
BBA1
DBA0
DBA5 DBA6 DBA7 DBA8 DBA9 DBA10 DBA11 DVCC1
VID0
VID1 AGND1, VID2 AVCC2, VID3 AGND3, VID4 AVCC4, VID5 AGND5, VID6 AVCC6, VID7 AGND7, VID8 AVCC8, VID9 AGND9, VID10 AVCC10,
AD8387
VIEW (Not Scale)
DGND1 DBB11 DBB10 DBB9 DBB8 DBB7 DBB6 DBB5
AGND11
DGND3
DVCC3
AGNDB
AGNDB
AVCCB
AVCCB
VID11
DBB4
DBB3
DBB2
DBB1
DBB0
TSTA
CONNECT
Figure 80-Lead TQFP E-Pad Configuration
Rev. Page
05653-004
AD8387
Table 80-Lead TQFP E-Pad Configurations
Mnemonic DBA(0:11) DBB(0:11) DVCCx DGNDx AGNDx Function Data Input Data Input Transfer/Start Sequence Digital Power Supplies Digital Ground Clock Data Mode Switch Right/Left Select Invert Mode Switch Invert Output Mode Switch Thermal Switch Analog Ground Description 12-Bit Data Input Even Channels. VID(0, 10), DBA11. 12-Bit Data Input Channels. VID(1, 11), DBB11. Simultaneously initiates data loading sequence transfers data loaded previously, outputs. Digital Power Supplies. These pins normally connected digital ground plane. Clock Input. Selects Single Buss Dual Buss Operating Modes. Selects Left Direction Right Direction Operating Mode. Enables Disables Column Inversion. Changes Polarity Analog Output Signals. Enables Disables Grounded Mode. Enables Disables Long-Term Output Protection. Analog Supply Returns.
AVCCx
Analog Power Supplies
Analog Power Supplies.
TSTA VID0 VID11
Bypass Test Analog Outputs
capacitor connected between AGND ensures optimum settling time. Connect This AGND. Connect. internal connection. These pins connected directly analog inputs panel.
Video Center Reference Full-Scale Reference
This Voltage Sets Video Center Voltage. video outputs above this reference while HIGH below this reference while LOW. Twice voltage applied between sets full-scale video output voltage.
Rev. Page
AD8387 TYPICAL PERFORMANCE CHARACTERISTICS
CHANNEL MATCHING (mV)
CODE AMBIENT TEMPERATURE (°C) CODE 4095
05653-019
CHANNEL MATCHING (mV)
1024 1536 2048 2560 3072 3584 INPUT CODE
05653-016
CODE 2048
4096
Figure Channel Matching Code 25°C
Figure Channel Matching Codes 2048, 4095
(mV)
1024 1536 2048 2560 3072 3584 INPUT CODE
05653-018
VCME (mV)
-0.5
-1.5 -2.5 -3.5 1024 1536 2048 2560 3072 3584 INPUT CODE
4096
4096
Figure Code
Figure VCME Code
(LSB)
(LSB)
-0.2 -0.4 -0.6
05653-017
-0.2 -0.4 -0.6 -0.8 -1.0 1024 1536 2048 2560 3072 3584 INPUT CODE
05653-020
-0.8 -1.0 1024 1536 2048 2560 3072 3584 INPUT CODE
4096
4096
Figure Code 25°C,
Figure Code 25°C,
Rev. Page
05653-021
AD8387 TIMING DIAGRAMS
SINGLE DATA CONFIGURATION,
D(0:11)
DBA(0:11) DBB(0:11) VID0 VID1 VID2
12-CHANNEL CHANNEL CHANNEL CHANNEL CHANNEL CHANNEL CHANNEL CHANNEL CHANNEL CHANNEL CHANNEL CHANNEL
05653-005
PIXEL
REFERENCES
AD8387
VID3 VID4 VID5 VID6 VID7 VID8 VID9 VID10 VID11
IMAGE PROCESSOR
CHANNEL
Figure AD8387 Single Data System
LEFT PIXEL PIXEL
RIGHT
D(0:11)
D(0:11)
INPUTS
INPUTS
VID0 VID1 VID2 VID3 VID4
OUTPUTS
OUTPUTS
VID0 VID1 VID2 VID3 VID4 VID5
VID5
VID6 VID7 VID8 VID9 VID10 VID11
VID6 VID7 VID8 VID9 VID10 VID11
05653-006
Figure AD8387 Single Data Configuration Scanning Left-to-Right Right-to-Left
Rev. Page
AD8387
DUAL DATA CONFIGURATION, HIGH
DA(0:11) DB(0:11) PIXEL IMAGE PROCESSOR REFERENCES DVCC DBB(0:11) VID0 VID1 VID2 VID3 VID4 VID5 VID6 VID7 VID8 VID9 VID10 VID11 CHANNEL CHANNEL CHANNEL CHANNEL CHANNEL CHANNEL CHANNEL CHANNEL CHANNEL CHANNEL CHANNEL CHANNEL
05653-007
DBA(0:11)
12-CHANNEL
AD8387
Figure AD8387 Dual Data System
LEFT PIXEL PIXEL
RIGHT
DBA(0:11) DBB(0:11)
INPUTS
INPUTS
DBA(0:11) DBB(0:11)
VID0 VID1 VID2 VID3 VID4
OUTPUTS
OUTPUTS
VID0 VID1 VID2 VID3 VID4 VID5
VID5
VID6 VID7 VID8 VID9 VID10 VID11
VID6 VID7 VID8 VID9 VID10 VID11
05653-008
Figure AD8387 Dual Data Configuration Scanning Left-to-Right Right-to-Left
Rev. Page
AD8387
DB(0:11)
05653-009
Figure Input Timing (DSW LOW)
DB(0:11) VID(0:11)
PIXELS
05653-010
PIXELS -12, -11, -10,
VRL-VFS
Figure Output Timing (DSW LOW)
Table
Parameter Data Setup Time: Setup Time: Data Hold Time: Hold Time: High Time: Time: High Time: Time: Data Switching Delay: Data Switching Delay Skew: Invert Switching Delay: Invert Switching Delay Skew: Conditions Unit
HIGH HIGH VIDx step
15.7 16.2
Rev. Page
AD8387 FUNCTIONAL DESCRIPTION
AD8387 system building block designed directly drive columns microdisplays type popularized projection systems. channels precision, 12-bit DACs loaded from dual, high speed, 12-bit wide input. Precision current feedback amplifiers, providing well damped pulse response fast voltage settling into large capacitive loads, buffer outputs. Laser trimming wafer level ensures absolute output errors tight channel-to-channel matching. Tight part-to-part matching high resolution systems guaranteed external voltage references.
Right/Left Control-Input Data Loading
facilitate image mirroring, direction loading sequence control. loading sequence begins Channel proceeds Channel when control held LOW. begins Channel proceeds Channel when control held HIGH. Control-Thermal Switch Control When this input HIGH, thermal switch enabled. When left unconnected, thermal switch disabled. internal, pull-down resistor disables thermal switch when this left unconnected.
REFERENCE CONTROL INPUT DESCRIPTION
Data Transfer/Start Sequence Control-Input Data Loading, Data Transfer
valid initiated when held HIGH during rising edge. Data transferred outputs loading sequence initiated next rising edge, immediately following valid XFR. During loading sequence, 12-bit words loaded sequentially into internal channels. When AD8387 configured single data (DSW LOW), data loaded both rising falling edges CLK. When configured dual data (DSW HIGH), data loaded rising edges only.
Control-Output Mode Switch
When this input HIGH, video outputs operate normally. When left open, video outputs forced AGND. This function operates when AVCC power requires DVCC power
Control Control-Analog Output Inversion
When LOW, analog outputs' transfer function below VRL, while held LOW, above VRL, while held HIGH. With HIGH, analog outputs' transfer function above VID(0, below VID(1, 11), while held HIGH. Conversely, analog outputs' transfer function below VID(0, above VID(1, 11), while held LOW. VRH, Inputs-Full-Scale Video Reference Inputs times difference between (analog input voltages) sets full-scale output voltage. (VRH VRL)
Control-Data Mode Switch
When this input HIGH, AD8387 dual data mode. Data loaded from both DBA(0:11) DBB(0:11) rising edge simultaneously. does change active edge dual data mode. When LOW, AD8387 single data mode. Data loaded rising edge from DBA(0:11) falling edge from DBB(0:11) when LOW. With HIGH, data loaded falling edge from DBA(0:11) rising edge from DBB(0:11).
Rev. Page
AD8387 THEORY OPERATION
TRANSFER FUNCTION ANALOG OUTPUT VOLTAGE
DecDriver regions operation where video output voltages either above below reference voltage VRL. transfer function defines video output voltage function digital input code VOUTN(n) VIDx(n) n/4095), HIGH VOUTP(n) VIDx(n) n/4095), where input code. (VRH VRL) number internal limits define usable range video output voltages, VIDx, shown Figure
VIDx VOLTS AVCC (VRL VFS) 1.3V
ACCURACY
best correlate transfer function errors image artifacts, overall accuracy DecDriver defined three parameters, VCME, VDE. VDE, differential error voltage, measures difference between value channel ideal value that channel. defining expression
VOUTN(n) VOUTP(n) VDE(n) 4095 VCME, common-mode error voltage, measures bias channel. defining expression VCME(n) VOUTN VOUTP(n)
measures maximum mismatch between channels. defining equation max{VDE(n)(0 11)} min{VDE(n)(0 11)}
VOUTN
5.25V
AVCC 5.25V
measures maximum mismatch between channels. defining expression V(n) max{VN(n), VP(n)} where: VN(n) max{VOUTN(n)(0 11)} min{VOUTN(n)(0 11)}
VOUTP
5.25V (AVCC
(VRL VFS) AGND INPUT CODE VIDx INPUT CODE 4095
1.3V
05653-011
INTERNAL LIMITS USABLE VOLTAGE RANGES
VP(n) max{VOUTP(n)(0 11)} min{VOUTP(n)(0 11)}
Figure AD8387 Transfer Function Usable Voltage Ranges
Rev. Page
AD8387 APPLICATIONS
OPTIMIZED RELIABILITY WITH THERMAL SWITCH
While internal current limiters provide short-term protection against temporary shorts outputs, thermal switch provides protection against persistent shorts lasting several seconds. optimize reliability with thermal switch, following sequence operations recommended.
POWER-OFF SEQUENCE
Turn input signals Turn Turn Turn AVCC Turn DVCC
INITIAL POWER-UP AFTER ASSEMBLY REPAIR
Grounded output mode disabled, thermal switch enabled. Ensure that HIGH that HIGH upon initial power-up that they remain unchanged throughout this procedure. initial power-up sequence follows: Execute initial power-up. Identify shorts outputs. Power down, repair shorts, repeat initial power-up sequence until proper system functionality verified. Disable thermal switch.
GROUNDED OUTPUT MODE DURING POWER-OFF
Certain applications require that video outputs held near AGND during power-down. following power-off sequence ensures that outputs near ground during power-off that Absolute Maximum Ratings violated. Enable grounded output mode: Turn input signals Turn Turn Turn AVCC Turn DVCC
POWER-UP DURING NORMAL OPERATION
Grounded output mode disabled, thermal switch disabled. HIGH, outputs into normal operating mode with thermal switch disabled.
DESIGN OPTIMIZED THERMAL PERFORMANCE
Although maximum safe operating junction temperature higher, AD8387 100% tested junction temperature 125°C. Consequently, maximum guaranteed operating junction temperature 125°C. limit maximum junction temperature below guaranteed maximum, package conjunction with must effectively conduct heat away from junction. AD8387 package designed provide enhanced thermal characteristics through exposed paddle bottom surface package. take full advantage this feature, exposed paddle must direct thermal contact with PCB, which then serves heat sink. thermally effective must incorporate thermal pads thermal structure. thermal surface provides solderable contact surface surface PCB. thermal bottom layer provides surface direct contact with ambient. thermal structure provides thermal path inner bottom layers remove heat.
POWER SUPPLY SEQUENCING
indicated under Absolute Maximum Ratings, voltage input cannot exceed supply voltage more than Power-on power-off sequencing required comply with absolute maximum ratings. Failure comply with Absolute Maximum Ratings result functional failure damage internal diodes. Damaged diodes cause temporary parametric failures, which result image artifacts. Damaged diodes cannot provide full protection, reducing reliability.
POWER-ON SEQUENCE
Turn AVCC Turn Turn Turn DVCC Disable thermal switch: Turn input signals
Rev. Page
AD8387
THERMAL DESIGN
minimize thermal performance degradation production PCBs, contact area between thermal should maximized. Therefore, size thermal layer should match exposed paddle. second thermal same size should placed bottom side PCB. least thermal should direct thermal contact with external plane, such AVCC GND.
16mm
6.5mm
6.5mm
THERMAL STRUCTURE DESIGN
Effective heat transfer from inner bottom layers requires thermal vias incorporated into thermal design. Thermal performance increases logarithmically with number vias. Near optimum thermal performance production PCBs attained only when tightly spaced thermal vias placed full extent thermal pad.
05653-012
16mm
Figure Land Pattern-Top Layer
6.5mm
6.5mm
Thermal Thermal Connections
thermal solder side connected plane. thermal spokes recommended when connecting thermal pads structure plane.
Solder Masking
Solder masking holes layer plugs holes, inhibiting solder flow into holes. minimize formation solder voids solder flowing into holes (solder wicking), diameter should made small, optional solder mask used. optimize thermal coverage when using solder mask, diameter should more than larger than hole diameter. Pads customer's design rules.
Thermal Holes-Circular mask, centered holes. Diameter mask should larger than hole diameter.
Figure Land Pattern-Bottom Layer
Figure Solder Mask-Top Layer
Solder Mask-Bottom Layer
This customer's design rules.
AD8387 DESIGN RECOMMENDATIONS
Table Land Pattern Dimensions
Size 0.25 Pitch Thermal Size Thermal Structure 0.25 0.35 holes grid
Rev. Page
05653-013
05653-014
AD8387 OUTLINE DIMENSIONS
14.20 14.00 13.80 0.75 0.60 0.45 1.20
12.20 12.00 11.80
VIEW
(PINS DOWN)
EXPOSED
6.00
1.05 1.00 0.95
BOTTOM VIEW
(PINS
0.15 0.05
SEATING PLANE
0.20 0.09 3.5° 0.08 COPLANARITY
VIEW
0.50 LEAD PITCH
0.27 0.22 0.17
VIEW
ROTATED
COMPLIANT JEDEC STANDARDS MS-026-ADD-HD
Figure 80-Lead Thin Quad Flat Package, Exposed [TQFP_EP] (SV-80-1) Dimensions shown millimeters
ORDERING GUIDE
Model AD8387JSVZ AD8387-EB
Temperature Range 85°C
Package Description 80-Lead TQFP Evaluation Board
Package Option SV-80-1
Pb-free part.
2005 Analog Devices, Inc. rights reserved. Trademarks registered trademarks property their respective owners. D05653-0-10/05(0)
Rev. Page
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