Cautions Keep safety first your circuit designs! Renesas Technolo

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Cautions Keep safety first your circuit designs! Renesas Technolo

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Cautions
Keep safety first your circuit designs! Renesas Technology Corporation puts maximum effort into making semiconductor products better more reliable, there always possibility that trouble occur with them. Trouble with semiconductors lead personal injury, fire property damage. Remember give consideration safety when making your circuit designs, with appropriate measures such placement substitutive, auxiliary circuits, (ii) nonflammable material (iii) prevention against malfunction mishap. Notes regarding these materials These materials intended reference assist customers selection Renesas Technology Corporation product best suited customer's application; they convey license under intellectual property rights, other rights, belonging Renesas Technology Corporation third party. Renesas Technology Corporation assumes responsibility damage, infringement third-party's rights, originating product data, diagrams, charts, programs, algorithms, circuit application examples contained these materials. information contained these materials, including product data, diagrams, charts, programs algorithms represents information products time publication these materials, subject change Renesas Technology Corporation without notice product improvements other reasons. therefore recommended that customers contact Renesas Technology Corporation authorized Renesas Technology Corporation product distributor latest product information before purchasing product listed herein. information described here contain technical inaccuracies typographical errors. Renesas Technology Corporation assumes responsibility damage, liability, other loss rising from these inaccuracies errors. Please also attention information published Renesas Technology Corporation various means, including Renesas Technology Corporation Semiconductor home page (http://www.renesas.com). When using information contained these materials, including product data, diagrams, charts, programs, algorithms, please sure evaluate information total system before making final decision applicability information products. Renesas Technology Corporation assumes responsibility damage, liability other loss resulting from information contained herein. Renesas Technology Corporation semiconductors designed manufactured device system that used under circumstances which human life potentially stake. Please contact Renesas Technology Corporation authorized Renesas Technology Corporation product distributor when considering product contained herein specific purposes, such apparatus systems transportation, vehicular, medical, aerospace, nuclear, undersea repeater use. prior written approval Renesas Technology Corporation necessary reprint reproduce whole part these materials. these products technologies subject Japanese export control restrictions, they must exported under license from Japanese government cannot imported into country other than approved destination. diversion reexport contrary export control laws regulations Japan and/or country destination prohibited. Please contact Renesas Technology Corporation further details these materials products contained therein.
HD151TS303RP
Spread Spectrum Clock Solution
ADE-205-656E Rev. Oct. 2002 Description
HD151TS303 high-performance Spread Spectrum Clock modulator. suitable solution.
Features
Supports operation. (Designed MHz) clock frequency with spread spectrum modulation @3.3 copy reference clock @3.3 Programmable spread spectrum modulation (±0.25%, ±0.5%, ±1.5% central spread modulation spread spectrum disable mode.) SOP-8pin
Specifications
Supply voltages V±0.165 70°C operating range Clock output duty cycle 50±5% Cycle cycle jitter ±250 typ. Ordering Information
Package Type SOP-8 (JEDEC) Package Code FP-8DC Package Abbreviation Taping Abbreviation (Quantity) (2,500 Reel)
Part Name HD151TS303RPEL
Note: Please consult sales office above package availability.
HD151TS303RP
Block Diagram
CLKOUT(48MHz typ.) XOUT Modulator SEL0 Synthesizer SSCCLKOUT(24MHz typ.)
R=100
Mode Control
SEL1
R=100
Arrangement
SSCCLKOUT
SEL1
CLKOUT
SEL0
XOUT
(Top view)
Rev.5, Oct. 2002, page
HD151TS303RP
Function Table
SEL1 Spread Percentage +0.5% ±1.5% ±0.25%
Note: ±1.5% selected default internal pull-up down resistors.
Clock Frequency Table
(MHz) SSCCLKOUT (MHz)
CLKOUT (MHz) 48*2 24*2
12*1
Notes: With spread spectrum modulation. Without spread spectrum modulation.
Descriptions
name CLKOUT SSCCLKOUT XOUT SEL0 SEL1 Type Ground Power Output Output Input Output Input Input Description Power supplies pin. Normally Normally reference clock output. Spread spectrum modulated clock output. This outputs frequency input frequency. Oscillator input. Oscillator output. mode select pin. LVCMOS level input. Pull-up internal resistor. (100 mode select pin. LVCMOS level input. Pull-down internal resistor (100
Rev.5, Oct. 2002, page
HD151TS303RP
Absolute Maximum Ratings
Item Supply voltage Input voltage Output voltage
Symbol
Ratings -0.5 -0.5 -0.5 VDD+0.5
Unit
Conditions
Input clamp current Output clamp current Continuous output current Maximum power dissipation 55°C still air) Storage temperature Notes:
Tstg
+150
Stresses beyond those listed under "absolute maximum ratings" cause permanent damage device. These stress ratings only, functional operation device these other conditions beyond those indicated under "recommended operating conditions" implied. Exposure absolute maximum rated conditions extended periods affect device reliability. input output negative voltage ratings exceeded input output clamp current ratings observed.
Recommended Operating Conditions
Item Supply voltage input signal voltage High level input voltage level input voltage Operating temperature Input clock duty cycle Symbol 3.135 -0.3 -0.3 3.465 VDD+0.3 VDD+0.3 Unit Conditions
Rev.5, Oct. 2002, page
HD151TS303RP
Electrical Characteristics
70°C, V±5%
Item Input voltage Input high voltage Input current Symbol ±100 Unit 3.465 3.465 3.465 3.465 SEL0, SEL1 pins SEL0, SEL1 MHz, Test Conditions
Input slew rate Input capacitance Operating current
Electrical Characteristics Clock Output Clock Output
70°C, V±5%
Item Output voltage
Symbol
Unit
Test Conditions
Output current* Note:
Parameters target design. 100% tested production.
Rev.5, Oct. 2002, page
HD151TS303RP
Electrical Characteristics Clock Output Clock Output
25°C,
Item Cycle cycle jitter
Symbol tCCS
Unit Test Conditions Notes SSCCLKOUT, Fig1, SSCCLKOUT, Fig1, SSCCLKOUT, Fig1, CLKOUT, Fig1, SSCCLKOUT, SSCCLKOUT, SSCCLKOUT, CLKOUT, CLKOUT, V/ns CLKOUT SSCCLKOUT 24MHz SSCOFF SEL1:0 SSC= ±0.25% SEL1:0 SSC= ±1.5% SEL1:0 SSCOFF SEL1:0 SSC= ±0.25% SEL1:0 SSC= ±1.5% SEL1:0
Output frequency
23.8 23.7 23.4 23.8 47.3
24.2 24.3 24.6 24.2 48.7
Slew rate*1 Clock duty cycle Output impedance
Spread spectrum modulation frequency Input clock frequency Stabilization time
*1,3
Notes: Parameters target design. 100% tested production. Cycle cycle jitter output frequency included spread spectrum modulation. Stabilization time time required integrated circuit obtain phase lock input signal after power
Rev.5, Oct. 2002, page
HD151TS303RP
SSCCLKOUT CLKOUT) tcycle tcycle
(tcycle (tcycle n+1)
Figure Cycle cycle jitter
Rev.5, Oct. 2002, page
HD151TS303RP
Application Information Recommended Circuit Configuration
power supply circuit optimal performance application system should refer Fig. decoupling important both reduce Jitter radiation. decoupling capacitor should placed close possible, otherwise increased trace inductance will negate decoupling capability. decoupling capacitor shown should tantalum type.
SSCCLKOUT SEL1 SEL0 CLKOUT
TS300 Series
(Crystal Reference input) XOUT (Crystal connection)
Notes:
High frequency supply decoupling capacitor. (0.1 recommended) frequency supply decoupling capacitor. tantalum type recommended) Match value line impedance. Reference value)
Figure Recommended circuit configuration
Rev.5, Oct. 2002, page
HD151TS303RP
Example Board Layout Configuration
(+3.3 Supply)
SSCCLKOUT
CLKOUT
Crystal connection Reference input Note:
Crystal connection connection
plane Match value line impedance. Reference value) Ferrite bead.
Figure Example Board Layout
Rev.5, Oct. 2002, page
HD151TS303RP
Example TS300 Solution IC's Application
Spread Spectrum Modulated Clock XOUT TS30X CLKOUT Ref. Clock CMOS level ref. Clock ASIC XTAL Memory Graphics System Cont.
Ref. Clock Input Example
Spread Spectrum Modulated Clock XTAL XOUT TS30X CLKOUT ASIC Memory Graphics System Cont.
System
System
XTAL Ref. Clock Input Example
Rev.5, Oct. 2002, page
HD151TS303RP
Package Dimensions
July, 2002
Unit:
4.90
3.95
*0.22 0.03 0.20 0.03
1.75
0.75
6.10 0.30
0.10
1.08
0.67
0.14 0.04
0.11
1.27
0.60 0.20
*0.42 0.08 0.40 0.06
0.15 0.25
*Dimension including plating thickness Base material dimension Hitachi Code JEDEC JEITA Mass (reference value) FP-8DC Conforms 0.085
Rev.5, Oct. 2002, page
HD151TS303RP
Disclaimer
Hitachi neither warrants grants licenses rights Hitachi's third party's patent, copyright, trademark, other intellectual property rights information contained this document. Hitachi bears responsibility problems that arise with third party's rights, including intellectual property rights, connection with information contained this document. Products product specifications subject change without notice. Confirm that have received latest product standards specifications before final design, purchase use. Hitachi makes every attempt ensure that products high quality reliability. However, contact Hitachi's sales office before using product application that demands especially high quality reliability where failure malfunction directly threaten human life cause risk bodily injury, such aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment medical equipment life support. Design your application that product used within ranges guaranteed Hitachi particularly maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions other characteristics. Hitachi bears responsibility failure damage when used beyond guaranteed ranges. Even within guaranteed ranges, consider normally foreseeable failure rates failure modes semiconductor devices employ systemic measures such failsafes, that equipment incorporating Hitachi product does cause bodily injury, fire other consequential damage operation Hitachi product. This product designed radiation resistant. permitted reproduce duplicate, form, whole part this document without written approval from Hitachi. Contact Hitachi's sales office questions regarding this document Hitachi semiconductor products.
Sales offices
Hitachi, Ltd.
Semiconductor Integrated Circuits Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: (03) 3270-2111 Fax: (03) 3270-5109
further information write
Hitachi Semiconductor (America) Inc. East Tasman Drive Jose,CA 95134 Tel: (408) 433-1990 Fax: <1>(408) 433-0223 Hitachi Europe Ltd. Electronic Components Group Whitebrook Park Lower Cookham Road Maidenhead Berkshire 8YA, United Kingdom Tel: <44> (1628) 585000 Fax: <44> (1628) 778322 Hitachi Europe GmbH Electronic Components Group Dornacher D-85622 Feldkirchen Postfach 201, D-85619 Feldkirchen Germany Tel: <49> (89) 9180-0 Fax: <49> (89) Hitachi Asia Ltd. Hitachi Tower Collyer Quay #20-00 Singapore 049318 <65>-6538-6533/6538-8577 <65>-6538-6933/6538-3877 Hitachi Asia Ltd. (Taipei Branch Office) 4/F, 167, North Road Hung-Kuo Building Taipei (105), Taiwan <886>-(2)-2718-3666 <886>-(2)-2718-8180 Telex 23222 HAS-TP Hitachi Asia (Hong Kong) Ltd. Group (Electronic Components) 7/F., North Tower World Finance Centre, Harbour City, Canton Road Tsim Tsui, Kowloon Hong Kong <852>-2735-9218 <852>-2730-0281
Copyright Hitachi, Ltd., 2002. rights reserved. Printed Japan.
Colophon
Rev.5, Oct. 2002, page

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