Programmable Synchronous DC-DC Controller Voltage Microprocessors

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Programmable Synchronous DC-DC Controller Voltage Microprocessors

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RC5051
Programmable Synchronous DC-DC Controller Voltage Microprocessors
Programmable output from 1.3V 3.5V using integrated 5-bit efficiency typical Adjustable operation from 80KHz 1MHz Integrated Power Good Enable functions Overvoltage protection Overcurrent protection Drives N-channel MOSFETs SOIC package Meets Intel Pentium specifications using minimum number external components
Description
RC5051 synchronous mode DC-DC controller which provides accurate, programmable output voltage Pentium applications. RC5051 uses 5-bit converter program output voltage from 1.3V 3.5V. RC5051 uses high level integration deliver load currents excess from source with minimal external circuitry. Synchronous-mode operation offers optimum efficiency over entire specified output voltage range, internal oscillator programmed from 80KHz 1MHz additional flexibility choosing external components. on-board precision reference achieves tight tolerance voltage regulation without expensive external components. RC5051 also offers integrated functions including Power Good, Output Enable, over-voltage protection current limiting.
Applications
Power supply Pentium® Pentium processor Programmable step-down power supply
Block Diagram
+12V RC5051
DIGITAL CONTROL
VREF
5-BIT
1.24V REFERENCE
POWER GOOD
PWRGD
65-5051-01
VID0 VID2 VID4 VID1 VID3
ENABLE
Pentium registered trademark Intel Corporation.
Rev. 1.0.3
PRELIMINARY INFORMATION describes products that full production time printing. Specifications based design goals limited characterization. They change without notice. Contact Fairchild Semiconductor current information.
RC5051
PRODUCT SPECIFICATION
Assignments
CEXT ENABLE PWRGD VCCA VCCP VID4 LODRV GNDP
VID0 VID1 VID2 VID3 VREF GNDA GNDD VCCQP HIDRV GNDP
RC5051
65-5051-02
Definitions
Number Name CEXT Function Description Oscillator Capacitor Connection. Connecting external capacitor this sets internal oscillator frequency. Layout this critical system performance. Application Information details. Output Enable. logic this will disable output. internal pull-up resistor allows either open collector compatibility. Power Good Flag. open collector output that will logic output voltage within ±12% nominal output voltage setpoint. High Side Current Feedback. Pins used inputs current feedback control loop. Layout these traces critical system performance. Application Information details. Voltage Feedback. used input voltage feedback control loop side current feedback input. Application Information details regarding correct layout. Analog VCC. Connect system supply decouple with 0.1mF ceramic capacitor. Power side driver. Connect system supply place ceramic capacitor decoupling local charge storage. VID4 Input. logic this open collector/TTL input will enable VID3-VID0 inputs output from 2.1V 3.5V, logic will output from 1.3V 2.05V, shown Table Pullup resistors internal controller. Side Driver. Connect this gate N-channel MOSFET synchronous operation. trace from this MOSFET gate should 0.5". Power Ground. Return high currents flowing pins (VCCP VCCQP). Connect impedance ground. High Side Driver. Connect this gate N-channel MOSFET. trace from this MOSFET gate should 0.5". Power VCC. high side driver. VCCQP must connected voltage least VCCA VGS,ON (MOSFET), place ceramic capacitor decoupling local charge storage. Application Information details Digital Ground. Return path digital logic. Connect impedance system ground plane minimize ground loops. Analog Ground. Return path power analog circuitry. This should connected impedance system ground plane minimize ground loops. Reference Voltage Test point. This provides access output should decoupled ground using 0.1mF capacitor. load should connected.
ENABLE PWRGD
VCCA VCCP VID4
LODRV GNDP HIDRV VCCQP
17-20
GNDD GNDA VREF
VID0-VID3 Voltage Identification Code Inputs. These open collector/TTL compatible inputs will program output voltage over ranges specified Table Pull-up resistors internal controller.
PRODUCT SPECIFICATION
RC5051
Absolute Maximum Ratings
Supply Voltages, VCCA, VCCP, VCCQP Supply Voltage VCCQP, Charge Pump (VIN+VCCA) Voltage Identification Code Inputs, VID4-VID0 Junction Temperature, Storage Temperature Lead Soldering Temperature, seconds 150°C 150°C 300°C
Operating Conditions
Parameter Supply Voltage, VCCA, VCCP Input Logic HIGH Input Logic Ambient Operating Temp Output Driver Supply, VCCQP PWRGD threshold Conditions Min. 4.75 Typ. Max. 5.25 Units %VOUT %VOUT
Logic High Logic
Electrical Specifications
(VCCA VOUT 2.8V, fosc KHz, +25°C using circuit Figure unless otherwise noted) denotes specifications which apply over full operating temperature range. Parameter Output Voltage Output Current Initial Voltage Setpoint Output Temperature Drift Load Regulation Line Regulation Output Ripple Total Output Variation Steady State1 Total Output Variation Transient2 Short Circuit Detect Threshold Efficiency Output Driver Rise Fall Time Output Driver Deadtime Output Driver Deadtime Turn-on Response Time Oscillator Range Oscillator Frequency Duty Cycle Conditions Table ILOAD 0.8A, VOUT 2.8V VOUT 2.0V 70°C VOUT 2.8V VOUT 2.0V ILOAD 0.8A 14.2A 4.75V 5.25V 20MHz ILOAD 14.2A VOUT 2.8V VOUT 2.0V ILOAD 14.2A, VOUT 2.8V VOUT 2.0V ILOAD 14.2A, VOUT 2.8V Figure Figure Figure ILOAD 14.2A CEXT 2.740 1.940 2.670 1.900 Min. 2.797 2.000 2.825 2.020 2.900 2.060 2.930 2.100 Typ. Max. 2.853 2.040 Units mVpk nsec %/fOSC nsec msec
1000
Notes: Steady Date Voltage Regulation includes Initial Voltage Setpoint, Load Regulation, Output Ripple Output Temperature Drift measured converter's output capacitors. measured converter's output capacitors. motherboard applications, layout should exhibit more than 0.5mW trace resistance between converter's output capacitors CPU.
RC5051
PRODUCT SPECIFICATION
Table Output Voltage Programming Codes
VID4 VID3 VID2 VID1 VID0 VOUT 1.30V 1.35V 1.40V 1.45V 1.50V 1.55V 1.60V 1.65V 1.70V 1.75V 1.80V 1.85V 1.90V 1.95V 2.00V 2.05V 2.1V 2.2V 2.3V 2.4V 2.5V 2.6V 2.7V 2.8V 2.9V 3.0V 3.1V 3.2V 3.3V 3.4V 3.5V
Note: processor tied GND. processor open.
PRODUCT SPECIFICATION
RC5051
Typical Operating Characteristics
(VCCA, VCCD fOSC KHz, +25°C using circuit Figure unless otherwise noted)
Efficiency Output Current
88.0 86.0 2.83 2.82 2.81 2.80 2.79 2.78 2.77 2.76 2.75 2.74 2.73
Load Regulation, VOUT
Efficiency
84.0 80.0 78.0 76.0 74.0 72.0 70.0 14.5 VOUT 2.0V VOUT 2.8V
VOUT
82.0
14.5
Output Current Output Voltage Output Current, RSENSE
1250 1050
Output Current
Oscillator Frequency CEXT
Frequency (KHz)
VOUT
Output Current
CEXT (pf)
Output Programming, VID4
Output Programming, VID4
VOUT
1.30
VOUT
1.40 1.50 1.60 1.70 1.80 1.90 2.00
Point
Point
65-5050-03
RC5051
PRODUCT SPECIFICATION
Typical Operating Characteristics (continued)
Output Ripple, 2.8V 14.2A Transient Response, 14.2A 0.8A
2.10V
VOUT (20mV/div)
VOUT (50mV/div)
2.00V
1.90V
Time (1µs/division)
Time (1µs/division)
Transient Response, 0.8A 14.2A
2.10V
VOUT (50mV/div)
2.00V
1.90V
Time (1µs/division)
Switching Waveforms, Load
Output Startup, System Power-up
HIDRV
LODRV
Time (1µs/division)
(1V/div
2V/div
VOUT (1V/div)
5V/div
Time (2ms/division)
65-5051-12
PRODUCT SPECIFICATION
RC5051
Typical Operating Characteristics (continued)
Output Startup from Enable 3.18
VOUT (1V/div)
VREF Tempco
3.17 3.16 VREF 3.15 3.14 3.13 3.12 3.11
Time (2ms/division)
ENABLE (1V/div)
Temperature
Application Circuit
+12V 0.1mF 2.5mH CIN* 0.1mF 1N4735A 0.1mF
2.3µH 1N5820 SENSE* COUT*
VREF 0.1mF
RC5051 CEXT 100pF
VID4 VID3 VID2 VID1 VID0 0.1mF ENABLE 0.1mF PWRGD
*Refer Table values RSENSE, COUT, CIN.
65-5051-03
Figure Application Circuit Pentium Processors
RC5051
PRODUCT SPECIFICATION
Table RC5051 Application Bill Materials Intel Pentium Processors
Reference C1-3, C6-C8 C4-5 Cext COUT Q1-2 R2-3 RSENSE Manufacturer Part Panasonic ECU-V1H104ZFX Panasonic ECU-V1C105ZFX Panasonic ECU-V1H101JCG Sanyo 10MV1200GX Sanyo 6MV1500GX Motorola 1N4735A Motorola 1N5820 Skynet 320-6110 Fairchild FDP6030L FDB6030L Fairchild RC10-XX* Fairchild RC5051M Quantity Description 100nF, Capacitor 1mF, Capacitor 100pF Capacitor 1200mF, Electrolytic 1500mF, 6.3V Electrolytic 6.2V Zener Diode Schottky Diode 2.5mH, Inductor 2.3mH, inductor N-Channel MOSFET (TO-220 TO-263) 4.7W 10KW CuNi Alloy Wire Resistor DC/DC Controller Note RDS(ON) 20mW 4.5V Note IRMS 44mW Requirements/Comments
Table Notes: Inductor recommended isolate input supply from noise generated MOSFET switching, comply with Intel dl/dt requirements. omitted desired. 14.2A designs using FDP6030L MOSFETs, heatsinks with thermal resistance 20°C/W should used. details spreadsheet MOSFET selections, refer Applications Bulletin AB-8.
PRODUCT SPECIFICATION
RC5051
Table Recommended Values CPU-based Applications
Output Current COUT Maximum ESR* 6.1mW
Application 300MHz Motherboard Intel Pentium Motherboard 400MHz Intel Pentium Motherboard
1200mF, Sanyo 10MV1200GX 1200mF, Sanyo 10MV1200GX 1200mF, Sanyo 10MV1200GX
COUT* 1500mF, 6.3V Sanyo 6MV1500GX 1500mF, 6.3V Sanyo 6MV1500GX 1500mF, 6.3V Sanyo 6MV1500GX
RSENSE 5.8mW
14.2A
6.8mW
5.2mW
12.6A
6.3mW
5.8mW
Output capacitance requirements depend critically layout processor type. Consult Application Bulletin AB-14 details
Test Circuit
+12V VCCQP 0.1µF VCCA HIDRV 3000pF tDT1 3000pF tDT2 HIDRV
VCCP LODRV
LODRV
GNDA GNDD GNDP
65-5051-05
Figure Output Drive Test Circuit Timing Diagram
RC5051
PRODUCT SPECIFICATION
Application Information
RC5051 Controller
RC5051 programmable synchronous DC-DC controller When designed around appropriate external components, RC5051 configured deliver more than output current, appropriate Klamath Deschutes other processors. RC5051 functions fixed frequency step down regulator.
VCCQP, which supplied from external source through series resistor from charge-pump circuit powered from available. LODRV driver power supply pin, VCCP, which supplied from either source. resulting voltages sufficient provide gate source drive external MOSFETs required order achieve RDS,ON.
Internal Voltage Reference
reference included RC5051 precision bandgap voltage reference. internal resistors precisely trimmed provide near zero temperature coefficient (TC). Based reference output from integrated 5-bit DAC. monitors voltage identification pins, VID0-VID4. When VID4 logic HIGH, scales reference voltage from 2.0V 3.5V 100mV increments. When VID4 pulled LOW, scales reference from 1.30V 2.05V 50mV increments. codes available, including those below 1.80V. guaranteed stable operation under loading conditions, 0.1mF decoupling capacitance should connected VREF pin. load should connected VREF.
Main Control Loop
Refer RC5051 Block Diagram page RC5051 implements "summing mode control", which different from both classical voltage-mode current-mode control. provides superior performance either allowing large converter bandwidth over wide range output loads. control loop regulator contains main sections: analog control block digital control block. analog section consists signal conditioning amplifiers feeding into comparators which provide inputs digital control block. signal conditioning section accepts inputs from (current feedback) (voltage feedback) pins sets controlling signal paths. first, voltage control path, amplifies difference between signal reference voltage from presents output summing amplifier inputs. second, current control path, takes difference between pins presents resulting signal another input summing amplifier. These signals then summed together with slope compensation input from oscillator. This output then presented comparator, which provides main control signal digital control block. digital control block takes analog comparator inputs main clock signal from oscillator provide appropriate pulses HIDRV LODRV output pins. These outputs control external power MOSFETs. digital block utilizes high speed Schottky transistor logic, allowing RC5051 operate clock speeds high 1MHz. There additional comparators analog control section whose function point which RC5051 enters pulse skipping mode during light loads, well point which current limit comparator disables output drive signals external power MOSFETs.
Power Good (PWRGD)
RC5051 Power Good function designed accordance with Pentium DC-DC converter specifications provides continuous voltage monitor pin. circuit compares signal VREF voltage outputs active-low interrupt signal should power supply voltage deviate more than ±12% nominal setpoint. Power Good flag provides other control function RC5051.
Output Enable (ENABLE)
RC5051 will accept open collector/TTL signal controlling output voltage. state disables output voltage. When disabled, PWRGD output state. enable required circuit, this left open.
Over-Voltage Protection
RC5051 constantly monitors output voltage protection against over voltage conditions. voltage exceeds selected program voltage, over-voltage condition assumed RC5051 disables output drive signal external MOSFETs. DCDC converter returns normal operation after fault been removed.
High Current Output Drivers
RC5051 contains identical high current output drivers that utilize high speed bipolar transistors pushpull configuration. drivers' power ground separated from chip's power ground switching noise immunity. HIDRV driver power supply pin,
Over-Current Protection
Current sense implemented RC5051 reduce duty cycle output drive signal MOSFETs when over-current condition detected. voltage drop created output current flowing across sense resistor presented internal comparator. When voltage
PRODUCT SPECIFICATION
RC5051
developed across sense resistor exceeds 120mV comparator threshold voltage, RC5051 reduces output duty cycle help protect power devices. DC-DC converter returns normal operation after fault been removed.
MOSFET Gate Bias
high side MOSFET gate driver biased methods-Charge Pump Gate Bias. charge pump method advantage requiring only input voltage converter, method will realize increased efficiency providing increased high side MOSFETs.
Method Charge Pump (Bootstrap)
Oscillator
RC5051 oscillator section uses fixed current capacitor charging configuration. external capacitor (CEXT) used oscillator frequency between 80KHz 1MHz. This scheme allows maximum flexibility choosing external components. general, higher operating frequency decreases peak ripple current flowing output inductor, thus allowing smaller inductor value. addition, operation higher frequencies decreases amount energy storage that must provided bulk output capacitors during load transients faster loop response controller. Unfortunately, efficiency losses switching MOSFETs increase operating frequency increased. Thus, efficiency optimized lower frequencies. operating frequency 300KHz typical choice which optimizes efficiency minimizes component size while maintaining excellent regulation transient performance under operating conditions.
Figure shows charge pump provide gate bias high side MOSFET when +12V unavailable. Capacitor charge pump used boost voltage RC5051 output driver. When MOSFET switches off, source MOSFET approximately because MOSFET (The Schottky conducts only very short time, relevent this discussion.) charged through Schottky diode approximately 4.5V. When MOSFET turns voltage source MOSFET equal capacitor voltage follows, hence provides voltage VCCQP equal almost 10V. Schottky diode required provide charge path when MOSFET off, reverses biases when VCCQP goes 10V. charge pump capacitor (CP) needs high high frequency capacitor. ceramic capacitor recommended here.
HIDRV PWM/PFM Control LODRV GNDP
65-5051-06
Design Considerations Component Selection
Additional information design component selection found Fairchild Semiconductor's Application Note
VCCQP
COUT
MOSFET Selection
This application requires N-channel Logic Level Enhancement Mode Field Effect Transistors. Desired characteristics follows: Static Drain-Source On-Resistance, RDS,ON 20mW (lower better) gate drive voltage, 4.5V rated Power package with Thermal Resistance Drain-Source voltage rating 15V. on-resistance (RDS,ON) primary parameter MOSFET selection. on-resistance determines power dissipation within MOSFET therefore significantly affects efficiency DC-DC Converter. details spreadsheet MOSFET selection, refer Applications Bulletin AB-8
Figure Charge Pump Configuration Method Gate Bias
Figure illustrates source used bias VCCQP. resistor used limit transient current into VCCQP capacitor used filter VCCQP supply. This method provides higher gate bias voltage (VGS) high side MOSFET than charge pump method, therefore reduces RDS,ON resulting power loss within MOSFET. designs where efficiency primary concern, gate bias method recommended. 6.2V Zener diode, used clamp voltage VCCQP maximum ensure that absolute maximum voltage will exceeded.
RC5051
PRODUCT SPECIFICATION
+12V
capable running high switching frequencies provides significant cost savings newer systems that typically high supply current.
RC5051 Short Circuit Current Characteristics
VCCQP HIDRV PWM/PFM Control LODRV GNDP
65-5051-07
COUT
Figure Gate Bias Configuration
Inductor Selection
Choosing value inductor tradeoff between allowable ripple voltage required transient response. system designer choose value within allowed minimum maximum range order either minimize ripple maximize transient performance. first order equation (close approximation) minimum inductance ripple
RC5051 short circuit current characteristic includes hysteresis function that prevents DC-DC converter from oscillating event short circuit. Figure shows typical characteristic DC-DC converter circuit with sense resistor. converter exhibits normal load regulation characteristic until voltage across resistor exceeds internal short circuit threshold 120mV 17.5A 6.8mW). this point, internal comparator trips signals controller reduce converter's duty cycle approximately 20%. This causes drastic reduction output voltage load regulation collapses into short circuit control mode. With 40mW output short, voltage reduced 40mW 600mV. output voltage does return nominal value until output current reduced value within safe operating range DC-DC converter.
Output Voltage Output Current RSENSE
65-5051-08
where: Input Power Supply Vout Output Voltage DC/DC converter switching frequency Equivalent series resistance output capacitors parallel Vripple Maximum peak peak output ripple voltage budget. first order equation maximum allowed inductance where: total output capacitance Maximum minimum load transient current output voltage tolerance budget allocated load transient Maximum duty cycle DC/DC converter (usually 95%). Some margin should maintained away from both Lmin Lmax. Adding margin increasing almost always adds expense since variables predetermined system performance except which must increased increase Adding margin decreasing either done purchasing capacitors with lower increasing DC/DC converter switching frequency. RC5051
Output Current Figure RC5051 Short Circuit Characteristic
Schottky Diode Selection
application circuit Figure shows Schottky diode, which used free-wheeling diode assure that body-diode does conduct when upper MOSFET turning lower MOSFET turning undesirable this diode conduct because high forward voltage drop long reverse recovery time degrades efficiency, Schottky provides shunt path current. Since this time duration very short, selection criterion diode that forward voltage Schottky output current should less than forward voltage MOSFET's body diode.
Output Filter Capacitors
output bulk capacitors converter help determine output ripple voltage transient response. already been seen section selecting inductor that helps minimum inductance, capacitance value helps maximum inductance. most converters, however, number capacitors required
PRODUCT SPECIFICATION
RC5051
determined transient response output ripple voltage, these determined capacitance value. That order achieve necessary meet transient ripple requirements, capacitance value required already very large. most commonly used choice output bulk capacitors aluminum electrolytics, because their cost ESR. only type aluminum capacitor used should those that have rated 100kHz. Consult Application Bulletin AB-14 detailed information output capacitor selection. output capacitance should also include number small value ceramic capacitors placed close possible processor; 0.1mF 0.01mF recommended values.
RSENSE RDROOP
COUT
65-5051-14
Figure Droop Resistor
Layout Guidelines
Placement MOSFETs relative RC5051 critical. Place MOSFETs such that trace length HIDRV LODRV pins RC5051 gates minimized. long lead length these pins will cause high amounts ringing inductance trace gate capacitance FET. This noise radiates throughout board, and, because switching such high voltage frequency, very difficult suppress. general, noisy switching lines should kept away from quiet analog section RC5051. That traces that connect pins (LODRV, HIDRV VCCQP) should kept away from traces that connect pins through Place 0.1mF decoupling capacitors close RC5051 pins possible. Extra lead length these reduces their ability suppress noise. Each should have appropriate plane. This helps provide isolation between pins. Surround CEXT timing capacitor with ground trace. sure place ground power plane underneath capacitor further noise isolation, order provide additional shielding oscillator (pin from noise PCB. addition, place this capacitor close possible. Place MOSFETs, inductor, Schottky close together possible same reasons first bullet above. Place input bulk capacitors close drains high side MOSFETs possible. addition, placement 0.1mF decoupling right drain each high side MOSFET helps suppress some high frequency switching noise input DC-DC converter. Place output bulk capacitors close possible optimize their ability supply instantaneous current load event current transient. Additional space between output capacitors will allow parasitic resistance board traces degrade DC-DC converter's performance under severe load transient conditions, causing higher voltage deviation. more detailed information regarding capacitor placement, refer Application Bulletin AB-5.
Input Filter
DC-DC converter design include input inductor between system supply converter input shown Figure This inductor serves isolate supply from noise switching portion DC-DC converter, limit inrush current into input capacitors during power value 2.5mH recommended. necessary have some aluminum electrolytic capacitors input converter. These capacitors deliver current when high side MOSFET switches Figure shows 1000mF, exact number required will vary with speed type processor. speed Klamath Deschutes, capacitors should rated take ripple current. Capacitor ripple current rating function temperature, manufacturer should contacted find ripple current rating expected operational temperature. details design input filter, refer Applications Bulletin AB-15.
2.5µH 0.1µF 1000µF, Electrolytic
65-5051-09
Figure Input Filter
Droop Resistor
Figure shows converter using "droop resistor", function droop resistor improve transient response converter, potentially reducing number output capacitors required. operation, droop resistor causes output voltage slightly lower heavy load current than otherwise would When load transitions from heavy light current, output swing farther without exceeding limits, because started from lower voltage, thus reducing capacitor requirements.
RC5051
PRODUCT SPECIFICATION
traces that from RC5051 (pin (pin pins should together next each other Kelvin connected sense resistor. Running these lines together rejects some common mode noise that presented RC5051 feedback input. Try, much possible, noisy switching signals (HIDRV, LODRV VCCQP) layer, inner layers power ground only. layer being used route noisy switching signals, bottom layer route analog sensing sign IFB. Board Layout Checklist available from Fairchild Applications. Application Bulletin AB-11.
RC5051 Evaluation Board
Fairchild Semiconductor provides evaluation board verify system level performance RC5051. serves guide performance expectations when using supplied external components layout. Please call marketing department 650-968-9211 7833 evaluation board.
Additional Information
additional information contact Fairchild Semiconductor's Analog Mixed Signal Products Group Marketing Department 650-968-9211 7833.
Motherboard Sample Layout Gerber File
reference design motherboard implementation RC5051 along with PCAD layout Gerber file silk screen obtained from marketing department 650-968-9211 7833.
PRODUCT SPECIFICATION
RC5051
Mechanical Dimensions Lead SOIC
Symbol Inches Min. Max. Millimeters Min. Max. Notes: Notes Dimensioning tolerancing ANSI Y14.5M-1982. include mold flash. Mold flash protrusions shall exceed .010 inch (0.25mm). length terminal soldering substrate. Terminal numbers shown reference only. dimension does include solder finish thickness. Symbol maximum number terminals.
.093 .104 .004 .012 .013 .020 .009 .013 .496 .512 .291 .299 .050 .394 .010 .016 .004 .419 .029 .050
2.35 2.65 0.10 0.30 0.33 0.51 0.23 0.32 12.60 13.00 7.40 7.60 1.27 10.00 0.25 0.40 0.10 10.65 0.75 1.27
SEATING PLANE LEAD COPLANARITY
RC5051
PRODUCT SPECIFICATION
Ordering Information
Product Number RC5051M Package SOIC
LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS AUTHORIZED CRITICAL COMPONENTS LIFE SUPPORT DEVICES SYSTEMS WITHOUT EXPRESS WRITTEN APPROVAL PRESIDENT FAIRCHILD SEMICONDUCTOR CORPORATION. used herein: Life support devices systems devices systems which, intended surgical implant into body, support sustain life, whose failure perform when properly used accordance with instructions provided labeling, reasonably expected result significant injury user.
www.fairchildsemi.com 6/4/98 0.0m Stock#DS30005051 1998 Fairchild Semiconductor Corporation
critical component component life support device system whose failure perform reasonably expected cause failure life support device system, affect safety effectiveness.

Programmable Synchronous DC-DC Controller Voltage Microprocessors

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