Part Number Example CDR31 thru CDR35 MILITARY DESIGNATION MIL-PRF

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Part Number Example CDR31 thru CDR35 MILITARY DESIGNATION MIL-PRF

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MIL-PRF-55681/Chips
Part Number Example CDR31 thru CDR35
MILITARY DESIGNATION MIL-PRF-55681
Part Number Example
(example)
CDR31
Style Voltage-temperature Limits
Capacitance Rated Voltage Capacitance Tolerance Termination Finish Failure Rate
NOTE: Contact factory availability Termination Tolerance Options Specific Part Numbers.
Style: CDR31, CDR32, CDR33, CDR34, CDR35 Voltage Temperature Limits: ppm/°C without voltage; ppm/°C with rated voltage from -55°C +125°C ±15% without voltage; -25% with rated voltage from -55°C +125°C Capacitance: digit figures followed multiplier (number zeros added) e.g., Rated Voltage: 50V, 100V Capacitance Tolerance: 10%,
Termination Finish: Palladium Silver Silver Nickel Gold Solder-coated 100%
Base Metallization/Barrier Metal/Solder Coated* Base Metallization/Barrier Metal/Tinned (Tin Tin/ Lead Alloy)
*Solder shall have melting point 200°C less. Failure Rate Level: 1.0%, .1%, .01%, .001% Packaging: Bulk standard packaging. Tape reel RS481 available upon request.
CROSS REFERENCE: AVX/MIL-PRF-55681/CDR31 THRU CDR35
MIL-PRF-55681 (Metric Sizes) CDR31 CDR32 CDR33 CDR34 CDR35 Style 0805 1206 1210 1812 1825 Length (mm) 2.00 3.20 3.20 4.50 4.50 Width (mm) 1.25 1.60 2.50 3.20 6.40 Thickness Max. (mm) Min. (mm) Termination Band Max. (mm) Min. (mm)
MIL-PRF-55681/Chips
Military Part Number Identification CDR31
CDR31 MIL-PRF-55681/7
Military Type Designation Capacitance Rated temperature WVDC Capacitance voltagetolerance temperature limits Military Type Designation Capacitance Rated temperature WVDC Capacitance voltagetolerance temperature limits
Style 0805/CDR31 (BP)
B,C,D B,C,D B,C,D B,C,D B,C,D B,C,D B,C,D B,C,D B,C,D B,C,D B,C,D B,C,D B,C,D B,C,D F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K
Style 0805/CDR31 (BP) cont'd
F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K
Style 0805/CDR31 (BX)
1,000 1,200 1,500 1,800 2,200 2,700 3,300 3,900 4,700 5,600 6,800 8,200 10,000 12,000 15,000 18,000
appropriate failure rate appropriate termination finish Capacitance Tolerance complete part number will include additional symbols indicate capacitance tolerance, termination failure rate level.
appropriate failure rate appropriate termination finish Capacitance Tolerance
MIL-PRF-55681/Chips
Military Part Number Identification CDR32
CDR32 MIL-PRF-55681/8
Military Type Designation Capacitance Rated temperature WVDC Capacitance voltagetolerance temperature limits Military Type Designation Capacitance Rated temperature WVDC Capacitance voltagetolerance temperature limits
Style 1206/CDR32 (BP)
B,C,D B,C,D B,C,D B,C,D B,C,D B,C,D B,C,D B,C,D B,C,D B,C,D B,C,D B,C,D B,C,D B,C,D F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K
Style 1206/CDR32 (BP) cont'd
1,000 1,100 1,200 1,300 1,500 1,600 1,800 2,000 2,200 F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K
Style 1206/CDR32 (BX)
5,600 6,800 8,200 10,000 12,000 15,000 18,000 22,000 27,000 33,000 39,000
appropriate failure rate appropriate termination finish Capacitance Tolerance
appropriate failure rate appropriate termination finish Capacitance Tolerance complete part number will include additional symbols indicate capacitance tolerance, termination failure rate level.
MIL-PRF-55681/Chips
Military Part Number Identification CDR33/34/35
CDR33/34/35 MIL-PRF-55681/9/10/11
Military Type Designation Capacitance Rated temperature WVDC Capacitance voltagetolerance temperature limits Military Type Designation Capacitance Rated temperature WVDC Capacitance voltagetolerance temperature limits
Style 1210/CDR33 (BP)
1,100 1,200 1,300 1,500 1,600 1,800 2,000 2,200 2,400 2,700 3,000 3,300 F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K
Style 1812/CDR34 (BX)
33,000 39,000 47,000 56,000 100,000 120,000 150,000 180,000
Style 1825/CDR35 (BP)
5,100 5,600 6,200 6,800 7,500 8,200 9,100 10,000 11,000 12,000 13,000 15,000 16,000 18,000 20,000 22,000 F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K
Style 1210/CDR33 (BX)
18,000 22,000 27,000 39,000 47,000 56,000 68,000 82,000 100,000
Style 1812/CDR34 (BP)
2,400 2,700 3,000 3,300 3,600 3,900 4,300 4,700 5,100 5,600 6,200 6,800 7,500 8,200 9,100 10,000 F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K F,J,K
Style 1825/CDR35 (BX)
68,000 82,000 100,000 120,000 150,000 180,000 220,000 270,000 330,000 390,000 470,000
appropriate failure rate appropriate failure rate appropriate termination finish appropriate termination finish Capacitance Tolerance Capacitance Tolerance complete part number will include additional symbols indicate capacitance tolerance, termination failure rate level.
Packaging Chip Components
Automatic Insertion Packaging
TAPE REEL QUANTITIES
tape reel specifications compliance with RS481.
Paper Embossed Carrier Embossed Only Paper Only Qty. Reel/7" Reel Qty. Reel/13" Reel 0201, 0306, 0402, 0603 2,000, 3,000 4,000, 10,000, 15,000
Contact factory exact quantity
12mm
0612, 0508, 0805, 1206, 1210 1808 1812, 1825 2220, 2225 500, 1,000
Contact factory exact quantity
3,000 10,000
5,000, 10,000, 50,000
Contact factory exact quantity
4,000
REEL DIMENSIONS
Tape Size(1)
Max.
Min.
Min.
Min.
-0.0 8.40 +1.5 (0.331 +0.059 -0.0
Max. 14.4 (0.567)
7.90 Min. (0.311) 10.9 Max. (0.429) 11.9 Min. (0.469) 15.4 Max. (0.607)
(12.992) 12mm
(0.059)
13.0 +0.50 -0.20 (0.512 +0.020 -0.008
20.2 (0.795)
50.0 (1.969)
-0.0 12.4 +2.0 -0.0 (0.488 +0.079
18.4 (0.724)
Metric dimensions will govern. English measurements rounded reference only. tape sizes 16mm 24mm (used with chip size 3640) consult RS-481 latest revision.
Embossed Carrier Configuration
12mm Tape Only
DEFORMATION BETWEEN EMBOSSMENTS COVER TAPE PITCHES CUMULATIVE TOLERANCE TAPE ±0.2mm (±0.008) EMBOSSMENT
Chip Orientation
CENTER LINES CAVITY
MAX. CAVITY SIZE NOTE
COMPONENTS 2.00 1.20 LARGER (0.079 0.047)
TAPE READER REFERENCE ONLY INCLUDING DRAFT CONCENTRIC AROUND
User Direction Feed
12mm Embossed Tape Metric Dimensions Will Govern
CONSTANT DIMENSIONS
Tape Size 12mm 1.50 (0.059
+0.10 -0.0 +0.004 -0.0
Min. 0.60 (0.024)
Max. 0.60 (0.024)
0.10 (0.004) Max.
1.75 0.10 0.10 0.05 (0.069 0.004) (0.157 0.004) (0.079 0.002)
VARIABLE DIMENSIONS
Tape Size Max. 4.35 (0.171) 8.20 (0.323) 4.35 (0.171) 8.20 (0.323) Min. 1.00 (0.039) 1.50 (0.059) 1.00 (0.039) 1.50 (0.059) Min. 6.25 (0.246) 10.25 (0.404) 6.25 (0.246) 10.25 (0.404) Note 3.50 0.05 4.00 0.10 (0.138 0.002) (0.157 0.004) 5.50 0.05 4.00 0.10 (0.217 0.002) (0.157 0.004) 3.50 0.05 2.00 0.10 (0.138 0.002) (0.079 0.004) 5.50 0.05 8.00 0.10 (0.217 0.002) (0.315 0.004) Min. Note 25.0 (0.984) 30.0 (1.181) 25.0 (0.984) 30.0 (1.181) Max. 8.30 (0.327) 12.3 (0.484) 8.30 (0.327) 12.3 (0.484)
2.50 Max. (0.098) 6.50 Max. (0.256) 2.50 Max. (0.098) 6.50 Max. (0.256)
Note
12mm Pitch 12mm Double Pitch
Note
Note
Note
NOTES: cavity defined shall configured provide following: Surround component with sufficient clearance such that: component does protrude beyond sealing plane cover tape. component removed from cavity vertical direction without mechanical restriction, after cover tape been removed. rotation component limited maximum (see Sketches lateral movement component restricted 0.5mm maximum (see Sketch
Tape with without components shall pass around radius without damage. code labeling required) shall side reel opposite round sprocket holes. Refer EIA-556. dimension reference dimension tape feeder clearance only. 2.0mm, tape properly index tape feeders.
View, Sketch Component Lateral Movements 0.50mm (0.020) Maximum
0.50mm (0.020) Maximum
Paper Carrier Configuration
12mm Tape Only
PITCHES CUMULATIVE TOLERANCE TAPE ±0.20mm (±0.008) BOTTOM COVER TAPE COVER TAPE CAVITY SIZE NOTE CENTER LINES CAVITY User Direction Feed
12mm Paper Tape Metric Dimensions Will Govern
CONSTANT DIMENSIONS
Tape Size 12mm 1.50 (0.059
+0.10 -0.0 +0.004 -0.0
0.10 (0.004) Max.
Min. 0.75 (0.030) Min.
Min. 25.0 (0.984) Note Min.
1.75 0.10 4.00 0.10 2.00 0.05 (0.069 0.004) (0.157 0.004) (0.079 0.002)
VARIABLE DIMENSIONS
Tape Size Note 4.00 0.10 (0.157 0.004) 4.00 0.010 (0.157 0.004) 2.00 0.05 (0.079 0.002) Min. 6.25 (0.246) 10.25 (0.404) 6.25 (0.246) 3.50 0.05 (0.138 0.002) 5.50 0.05 (0.217 0.002) 3.50 0.05 (0.138 0.002) 8.00 +0.30 -0.10 -0.004 (0.315 +0.012 12.0 0.30 (0.472 0.012)
-0.10 8.00 +0.30 (0.315 +0.012 -0.004
Note
12mm Pitch 12mm Double Pitch
1.10mm (0.043) Max. Paper Base Tape 1.60mm (0.063) Max. Non-Paper Base Compositions
8.00 0.10 (0.315 0.004)
10.25 (0.404)
5.50 0.05 (0.217 0.002)
12.0 0.30 (0.472 0.012)
NOTES: cavity defined shall configured provide sufficient clearance surrounding component that: component does protrude beyond either surface carrier tape; component removed from cavity vertical direction without mechanical restriction after cover tape been removed; rotation component limited maximum (see Sketches lateral movement component restricted 0.5mm maximum (see Sketch
Tape with without components shall pass around radius without damage. code labeling required) shall side reel opposite sprocket holes. Refer EIA-556. 2.0mm, tape properly index tape feeders.
View, Sketch Component Lateral 0.50mm (0.020) Maximum
0.50mm (0.020) Maximum
Code Labeling Standard
code labeling available follows latest version EIA-556
Bulk Case Packaging
BENEFITS
Easier handling Smaller packaging volume
(1/20 packaging)
BULK FEEDER
Easier inventory control Flexibility Recyclable
Case
Cassette Gate
CASE DIMENSIONS
Shutter Slider 12mm 36mm Expanded Drawing 110mm Attachment Base
Shooter
Mounter Head Chips
CASE QUANTITIES
Part Size Qty. (pcs cassette) 0402 80,000 0603 15,000 0805 10,000 (T=.023") 8,000 (T=.031") 6,000 (T=.043") 1206 5,000 (T=.023") 4,000 (T=.032") 3,000 (T=.044")
Basic Capacitor Formulas
Capacitance (farads) English: .224 .0884 Metric: Energy stored capacitors (Joules, watt sec) III. Linear charge capacitor (Amperes) Total Impedance capacitor (ohms) Capacitive Reactance (ohms) Inductive Reactance (ohms) VII. Phase Angles: Ideal Capacitors: Current leads voltage Ideal Inductors: Current lags voltage Ideal Resistors: Current phase with voltage VIII. Dissipation Factor (loss angle) E.S.R. (E.S.R.) Power Factor P.F. Sine (loss angle) (phase angle) P.F. (when less than 10%) D.F.= Quality Factor (dimensionless) Cotan (loss angle) D.F. Equivalent Series Resistance (ohms) E.S.R. (D.F.) (Xc) (D.F.) XII. Power Loss (watts) Power Loss fCV2) (D.F.) XIII. (Kilowatts) fCV2 XIV. Temperature Characteristic (ppm/°C) T.C. Drift C.D.
XVI. Reliability Ceramic Capacitors
XVII. Capacitors Series (current same) Two: XVIII. Capacitors Parallel (voltage same) XIX. Aging Rate A.R. Number:
Decibels
C/decade time
METRIC PREFIXES
Pico Nano Micro Milli Deci Deca Kilo Mega Giga Tera 10-12 10-9 10-6 10-3 10-1 10+1 10+3 10+6 10+9 10+12
SYMBOLS
Dielectric Constant Area Dielectric thickness Voltage time Series Resistance frequency Inductance Loss angle Test life Test voltage Operating voltage Test temperature Operating temperature
Phase angle exponent effect voltage temp. Operating life
General Description
Basic Construction multilayer ceramic (MLC) capacitor monolithic block ceramic containing sets offset, interleaved planar electrodes that extend opposite surfaces ceramic dielectric. This simple structure requires considerable amount sophistication, both material manufacture, produce quality quantities needed today's electronic equipment.
Ceramic Layer
Electrode Terminations
Terminated Edge
Terminated Edge
Margin
Electrodes
Multilayer Ceramic Capacitor Figure
Formulations Multilayer ceramic capacitors available both Class Class formulations. Temperature compensating formulation Class temperature stable general application formulations classified Class Class Class capacitors temperature compensating capacitors usually made from mixtures titanates where barium titanate normally major part mix. They have predictable temperature coefficients general, have aging characteristic. Thus they most stable capacitor available. most popular Class multilayer ceramic capacitors (NP0) temperature compensating capacitors (negative-positive ppm/°C).
Class Class capacitors typically based chemistry barium titanate provide wide range capacitance values temperature stability. most commonly used Class dielectrics Y5V. provides intermediate capacitance values which vary only ±15% over temperature range -55°C 125°C. finds applications where stability over wide temperature range required. provides highest capacitance values used applications where limited temperature changes expected. capacitance value vary from -82% over -30°C 85°C temperature range. Class capacitors vary capacitance value under influence temperature, operating voltage (both DC), frequency. additional information performance changes with operating conditions, consult AVX's software, SpiCap.
General Description
Table Temperature Stable General Application Codes CODE Percent Capacity Change Over Temperature Range RS198 Code Temperature Range -55°C +125°C -55°C +105°C -55°C +85°C -30°C +85°C +10°C +85°C Percent Capacity Change ±3.3% ±4.7% ±7.5% ±10% ±15% ±22% +22%, -33% +22%, +22%, -82%
Effects Voltage Variations voltage have little effect Class dielectric does affect capacitance dissipation factor Class dielectrics. application voltage reduces both capacitance dissipation factor while application voltage within reasonable range tends increase both capacitance dissipation factor readings. high enough voltage applied, eventually will reduce capacitance just voltage will. Figure shows effects voltage.
Cap. Change A.C. Volts
Capacitance Change Percent 12.5 37.5 Volts
EXAMPLE capacitor desired with capacitance value 25°C increase more than 7.5% decrease more than 7.5% from -30°C +85°C. Code will Y5F.
Figure
CODE Symbol Symbol Temperature Range -55°C +85°C -55°C +125°C -55°C +150°C Cap. Change Zero Volts +15%, -15% +22%, -22% +22%, -56% +15%, -15% +30%, -70% +20%, -20% Cap. Change Rated Volts
Capacitor specifications specify voltage which measure (normally VAC) application wrong voltage cause spurious readings. Figure gives voltage coefficient dissipation factor various voltages kilohertz. Applications different frequencies will affect percentage changes versus voltages.
D.F. A.C. Measurement Volts
10.0 Dissipation Factor Percent Curve Rated Capacitor Curve Rated Capacitor Curve Rated Capacitor Measurement Volts Curve Curve Curve
+15%, -40% +22%, -56% +22%, -66% +15%, -25% +30%, -80% +20%, -30%
Temperature characteristic specified combining range change symbols, example Specification slash sheets indicate characteristic applicable given style capacitor.
specifying capacitance change with temperature Class materials, expresses capacitance change over operating temperature range symbol code. first symbol represents cold temperature temperature range, second represents upper limit operating temperature range third symbol represents capacitance change allowed over operating temperature range. Table provides detailed explanation system.
Figure
Typical effect application voltage shown Figure voltage coefficient more pronounced higher dielectrics. These figures shown room temperature conditions. combination characteristic known voltage temperature limits which shows effects rated voltage over operating temperature range shown Figure military characteristic.
General Description
Typical Cap. Change D.C. Volts
Capacitance Change Percent Percent Rated Volts 100% Capacitance Change Percent +1.5 -1.5
tends de-age capacitors re-reading capacitance after hours allowed military specifications after dielectric strength tests have been performed.
Typical Curve Aging Rate
-3.0 -4.5
Figure
Typical Cap. Change Temperature
Capacitance Change Percent 0VDC +105 +125
-6.0 -7.5 1000 10,000 100,000 Hours
Characteristic (NP0) X7R,
Max. Aging Rate %/Decade None
Figure
Temperature Degrees Centigrade
Figure
Effects Time Class ceramic capacitors change capacitance dissipation factor with time well temperature, voltage frequency. This change with time known aging. Aging caused gradual re-alignment crystalline structure ceramic produces exponential loss capacitance decrease dissipation factor versus time. typical curve aging rate semistable ceramics shown Figure Class ceramic capacitor that been sitting shelf period time, heated above curie point, (125°C hours 150°C hour will suffice) part will de-age return initial capacitance dissipation factor readings. Because capacitance changes rapidly, immediately after de-aging, basic capacitance measurements normally referred time period sometime after de-aging process. Various manufacturers different time bases most popular twenty-four hours after "last heat." Change aging curve caused application voltage other stresses. possible changes capacitance de-aging heating unit explain capacitance changes allowed after test, such temperature cycling, moisture resistance, etc., specs. application high voltages such dielectric withstanding voltages also
Effects Frequency Frequency affects capacitance impedance characteristics capacitors. This effect much more pronounced high dielectric constant ceramic formulation than formulations. AVX's SpiCap software generates impedance, ESR, series inductance, series resonant frequency capacitance functions frequency, temperature bias standard chip sizes styles. available free from downloaded free from website: www.avx.com.
General Description
Effects Mechanical Stress High dielectric ceramic capacitors exhibit some level piezoelectric reactions under mechanical stress. general statement, piezoelectric output higher, higher dielectric constant ceramic. desirable investigate this effect before using high dielectrics coupling capacitors extremely level applications. Reliability Historically ceramic capacitors have been most reliable types capacitors today. approximate formula reliability ceramic capacitor
Energy Stored energy which stored capacitor given formula:
1/2CV2
energy joules (watts-sec) applied voltage capacitance farads Potential Change capacitor reactive component which reacts against change potential across This shown equation linear charge capacitor:
where operating life test life test voltage operating voltage
ideal
where
test temperature operating temperature text
Historically ceramic capacitors exponent been considered exponent temperature effects typically tends about capacitor component which capable storing electrical energy. consists conductive plates (electrodes) separated insulating material which called dielectric. typical formula determining capacitance
.224
capacitance (picofarads) dielectric constant (Vacuum area square inches separation between plates inches (thickness dielectric) .224 conversion constant (.0884 metric system Capacitance standard unit capacitance farad. capacitor capacitance farad when coulomb charges volt. farad very large unit most capacitors have values micro (10-6), nano (10-9) pico (10-12) farad level. Dielectric Constant formula capacitance given above dielectric constant vacuum arbitrarily chosen number Dielectric constants other materials then compared dielectric constant vacuum. Dielectric Thickness Capacitance indirectly proportional separation between electrodes. Lower voltage requirements mean thinner dielectrics greater capacitance volume. Area Capacitance directly proportional area electrodes. Since other variables equation usually performance desired, area easiest parameter modify obtain specific capacitance within material group.
Current Capacitance dV/dt Slope voltage transition across capacitor Thus infinite current would required instantly change potential across capacitor. amount current capacitor "sink" determined above equation. Equivalent Circuit capacitor, practical device, exhibits only capacitance also resistance inductance. simplified schematic equivalent circuit Capacitance Inductance Parallel Resistance Series Resistance
Reactance Since insulation resistance (Rp) normally very high, total impedance capacitor where Total Impedance
Series Resistance Capacitive Reactance Inductive Reactance
variation capacitor's impedance with frequency determines effectiveness many applications. Phase Angle Power Factor Dissipation Factor often confused since they both measures loss capacitor under application often almost identical value. "perfect" capacitor current capacitor will lead voltage 90°.
General Description
(Ideal) (Actual) Loss Angle
Phase Angle
practice current leads voltage some other phase angle series resistance complement this angle called loss angle and: Power Factor (P.F.) Sine Dissipation Factor (D.F.) small values sine essentially equal which common interchangeability terms industry. Equivalent Series Resistance term E.S.R. Equivalent Series Resistance combines losses both series parallel capacitor given frequency that equivalent circuit reduced simple series connection.
seen current microprocessors high A/ns, 10A/ns. A/ns, 100pH parasitic inductance cause voltage spike 30mV. While this does sound very drastic, with microprocessors decreasing current rate, this fairly large percentage. Another important, often overlooked, reason knowing parasitic inductance calculation resonant frequency. This important high frequency, bypass capacitors, resonant point will give most signal attenuation. resonant frequency calculated from simple equation: fres Insulation Resistance Insulation Resistance resistance measured across terminals capacitor consists principally parallel resistance shown equivalent circuit. capacitance values hence area dielectric increases, I.R. decreases hence product often specified farads more commonly megohm-microfarads. Leakage current determined dividing rated voltage (Ohm's Law). Dielectric Strength Dielectric Strength expression ability material withstand electrical stress. Although dielectric strength ordinarily expressed volts, actually dependent thickness dielectric thus also more generically function volts/mil. Dielectric Absorption capacitor does discharge instantaneously upon application short circuit, drains gradually after capacitance proper been discharged. common practice measure dielectric absorption determining "reappearing voltage" which appears across capacitor some point time after been fully discharged under short circuit conditions. Corona Corona ionization other vapors which causes them conduct current. especially prevalent high voltage units occur with voltages well where high voltage gradients occur. energy discharged degrades performance capacitor time cause catastrophic failures.
E.S.R.
Dissipation Factor DF/PF capacitor tells what percent apparent power input will turn heat capacitor. Dissipation Factor E.S.R. (E.S.R.) watts loss are: Watts loss fCV2 (D.F.) Very values dissipation factor expressed their reciprocal convenience. These called Quality factor capacitors. Parasitic Inductance parasitic inductance capacitors becoming more more important decoupling today's high speed digital systems. relationship between inductance ripple voltage induced voltage line seen from simple inductance equation:
Surface Mounting Guide
Chip Capacitors
REFLOW SOLDERING
Dimensions millimeters (inches)
Case Size 0201 0402 0603 0805 1206 1210 1808 1812 1825 2220 2225
0.85 (0.033) 1.70 (0.067) 2.30 (0.091) 3.00 (0.118) 4.00 (0.157) 4.00 (0.157) 5.60 (0.220) 5.60 (0.220) 5.60 (0.220) 6.60 (0.260) 6.60 (0.260)
0.30 (0.012) 0.60 (0.024) 0.80 (0.031) 1.00 (0.039) 1.00 (0.039) 1.00 (0.039) 1.00 (0.039) 1.00 (0.039) 1.00 (0.039) 1.00 (0.039) 1.00 (0.039)
0.25 (0.010) 0.50 (0.020) 0.70 (0.028) 1.00 (0.039) 2.00 (0.079) 2.00 (0.079) 3.60 (0.142) 3.60 (0.142) 3.60 (0.142) 4.60 (0.181) 4.60 (0.181)
0.30 (0.014) 0.60 (0.024) 0.80 (0.031) 1.00 (0.039) 1.00 (0.039) 1.00 (0.039) 1.00 (0.039) 1.00 (0.039) 1.00 (0.039) 1.00 (0.039) 1.00 (0.039)
0.35 (0.014) 0.50 (0.020) 0.75 (0.030) 1.25 (0.049) 1.60 (0.063) 2.50 (0.098) 2.00 (0.079) 3.00 (0.118) 6.35 (0.250) 5.00 (0.197) 6.35 (0.250)
Component Design
Component pads should designed achieve good solder filets minimize component movement during reflow soldering. designs given below most common sizes multilayer ceramic capacitors both wave reflow soldering. basis these designs width equal component width. permissible decrease this component width advisable below this. overlap 0.5mm beneath component. extension 0.5mm beyond components reflow 1.0mm wave soldering.
WAVE SOLDERING
Case Size 0603 0805 1206
3.10 (0.12) 4.00 (0.15) 5.00 (0.19)
1.20 (0.05) 1.50 (0.06) 1.50 (0.06)
0.70 (0.03) 1.00 (0.04) 2.00 (0.09)
1.20 (0.05) 1.50 (0.06) 1.50 (0.06)
0.75 (0.03) 1.25 (0.05) 1.60 (0.06)
Dimensions millimeters (inches)
Component Spacing
wave soldering components, must spaced sufficiently apart avoid bridging shadowing (inability solder penetrate properly into small spaces). This less important reflow soldering sufficient space must allowed enable rework should required.
Preheat Soldering
rate preheat should exceed 4°C/second prevent thermal shock. better maximum figure about 2°C/second. capacitors size 1206 below, with maximum thickness 1.25mm, generally permissible allow temperature differential from preheat soldering 150°C. other cases this differential should exceed 100°C. further specific application process advice, please consult AVX.
Cleaning
1.5mm (0.06) (0.04)
(0.04)
Care should taken ensure that capacitors thoroughly cleaned flux residues especially space beneath capacitor. Such residues otherwise become conductive effectively offer resistance bypass capacitor. Ultrasonic cleaning permissible, recommended conditions being Watts/litre 20-45 kHz, with process cycle minutes vapor rinse, minutes immersion ultrasonic solvent bath finally minutes vapor rinse.
Surface Mounting Guide
Recommended Soldering Profiles
REFLOW SOLDER PROFILES
RoHS compliant products utilize termination finishes (e.g.Sn SnAg) that compatible with Pb-Free soldering systems fully reverse compatible with SnPb soldering systems. recommended SnPb profile shown comparison; Pb-Free soldering, IPC/JEDECJ-STD020C referenced. upper line chart shows maximum envelope which products qualified (typically reflow cycles max). center line gives recommended profile optimum wettability soldering Pb-Free Systems.
Component Temperature
Recommended Reflow Profiles
Maximum Reflow Profile With Care
Recommended Pb-Free Reflow Profile Recommended SnPb Reflow Profile
Preheat Preheat
Reflow Cool Down Cool Down Reflow
Preheat
Reflow
Cool Down
Time secs
Preheat:
pre-heat stabilizes part reduces temperature differential prior reflow. initial ramp rapid, from that point recommended allow ceramic parts heat uniformly plastic encapsulated parts stabilize through glass transition temperature body
Wetting Force Sec. (higher better)
0.40 0.30 0.20
[mN]
0.10 0.00 -0.10
SnPb Sn60Pb40 Sn60Pb40 Sn-Sn3.5Ag0.7Cu Sn-Sn2.5Ag1Bi0.5Cu Sn-Sn0.7Cu
Reflow:
reflow phase, maximum recommended time 40secs. Time peak reflow 10secs max.; optimum reflow achieved (see wetting balance chart opposite) products qualified max. Please reference individual product datasheets maximum limits
-0.20 -0.30 -0.40
Temperature Solder
Cool Down:
Cool down should forced recommended. slow cool down will result finer grain structure reflow solder solder fillet.
IMPORTANT NOTE: Typical Pb-Free reflow solders have more dull grainy appearance compared traditional SnPb. Elevating reflow temperature will change this, extending cool down help improve visual appearance joint.
WAVE SOLDER PROFILES
wave solder, there change recommended wave profile; standard Pb-Free (SnCu/SnCuAg) systems operate same recommended SnPb systems.
Recommended Soldering Profiles
Component Temperature
Preheat:
This more important wave solder; higher temperature preheat will reduce thermal shock parts that immersed (please consult individual product data sheets parts that suited wave solder). parts should ideally heated from bottom-Side prior wave. (Pin through hole) parts topside should separately heated.
Wave
Preheat
Cool Down
Wave
Wave
Wave:
recommended optimum solderability.
Preheat
Preheat
Cool Down
Cool Down
Cool Down:
with reflow solder, cool down should forced recommended. knives wave should heated.
Time seconds
Surface Mounting Guide
Chip Capacitors
APPLICATION NOTES
Storage
Good solderability maintained least twelve months, provided components stored their received" packaging less than 40°C Wave
Preheat Natural Cooling
Solderability
Terminations well soldered after immersion 60/40 tin/lead solder bath seconds.
Solder Temp.
230°C 250°C
Leaching
Terminations will resist leaching least immersion times conditions shown below. Termination Type Nickel Barrier Solder Solder Tin/Lead/Silver Temp. 60/40/0 Immersion Time Seconds
sec.
Recommended Soldering Profiles
Reflow
220°C 250°C Preheat Natural Cooling
(Preheat chips before soldering) T/maximum 150°C
Lead-Free Wave Soldering
recommended peak temperature lead-free wave soldering 250°C-260°C seconds. other parameters profile remains same above. following should noted customers changing from lead based systems lead free pastes. visual standards used evaluation solder joints will need modified lead free joints bright with tin-lead pastes fillet large. Lead-free solder pastes allow same self alignment lead containing systems. Standard mounting pads acceptable, machine need modified.
Solder Temp.
General
1min 1min sec. (Minimize soldering time)
Lead-Free Reflow Profile
Temperature
Surface mounting chip multilayer ceramic capacitors designed soldering printed circuit boards other substrates. construction components such that they will withstand time/temperature profiles used both wave reflow soldering methods.
Handling
Chip multilayer ceramic capacitors should handled with care avoid damage contamination from perspiration skin oils. tweezers vacuum pick strongly recommended individual components. Bulk handling should ensure that abrasion mechanical shock minimized. Taped reeled components provides ideal medium direct presentation placement machine. mechanical shock should minimized during handling chip multilayer ceramic capacitors.
Time
Pre-heating: 150°C ±15°C 60-90s Max. Peak Gradient 2.5°C/s Peak Temperature: 245°C ±5°C Time >230°C: Max.
Preheat
important avoid possibility thermal shock during soldering carefully controlled preheat therefore required. rate preheat should exceed 4°C/second target figure 2°C/second recommended. Although 80°C 120°C temperature differential preferred,
Surface Mounting Guide
Chip Capacitors
recent developments allow temperature differential between component surface soldering temperature 150°C (Maximum) capacitors 1210 size below with maximum thickness 1.25mm. user cautioned that risk thermal shock increases chip size temperature differential increases.
POST SOLDER HANDLING
Once components soldered board, bending flexure applies stresses soldered joints components. leaded devices, stresses absorbed compliancy metal leads generally don't result problems unless stress large enough fracture soldered connection. Ceramic capacitors more susceptible such stress because they don't have compliant leads brittle nature. most frequent failure mode resistance short circuit. second failure mode significant loss capacitance severing contact between sets internal electrodes. Cracks caused mechanical flexure very easily identified generally take following general forms:
Soldering
Mildly activated rosin fluxes preferred. minimum amount solder give good joint should used. Excessive solder lead damage from stresses caused difference coefficients expansion between solder, chip substrate. terminations suitable wave reflow soldering systems. hand soldering cannot avoided, preferred technique utilization soldering tools.
Cooling
Natural cooling preferred, this minimizes stresses within soldered joint. When forced cooling used, cooling rate should exceed 4°C/second. Quenching recommended used, maximum temperature differentials should observed according preheat conditions above.
Cleaning
Flux residues hygroscopic acidic must removed. capacitors acceptable with solvents described specifications MIL-STD202 EIA-RS-198. Alcohol based solvents acceptable properly controlled water cleaning systems also acceptable. Many other solvents have been proven successful, most solvents that acceptable other components circuit assemblies equally acceptable with ceramic capacitors.
Type Angled crack between bottom device solder joint.
Type Fracture from device bottom device.
Mechanical cracks often hidden underneath termination difficult externally. However, termination falls during removal process from PCB, this indication that cause failure excessive mechanical stress board warping.
Surface Mounting Guide
Chip Capacitors
COMMON CAUSES MECHANICAL CRACKING
most common source mechanical stress board depanelization equipment, such manual breakapart, vcutters shear presses. Improperly aligned dull cutters cause torqueing resulting flex stresses being transmitted components near board edge. Another common source flexural stress contact during parametric testing when test points probed. allowed flex during test cycle, nearby ceramic capacitors broken. third common source board board connections vertical connectors where cables other PCBs connected PCB. board supported during plug/unplug cycle, flex cause damage nearby components. Special care should also taken when handling large (>6" side) PCBs since they more easily flex warp than smaller boards.
REWORKING MLCs
Thermal shock common MLCs that manually attached reworked with soldering iron. strongly recommends that reworking MLCs done with reflow rather than soldering irons. practically impossible cause thermal shock ceramic capacitors when using reflow. However direct contact soldering iron often causes thermal cracks that fail later date. rework soldering iron absolutely necessary, recommended that wattage iron less than watts temperature Rework should performed applying solder iron directly contacting part ceramic capacitor.
Solder
Solder
Preferred Method Direct Part Contact
Poor Method Direct Contact with Part
BOARD DESIGN
avoid many handling problems, recommends that MLCs located least away from nearest edge board. However when this possible, recommends that panel routed along line, adjacent where located.
Stress Relief MLCs
Routed Line Relieves Stress

Part Number Example CDR31 thru CDR35 MILITARY DESIGNATION MIL-PRF

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