SHEET SHEET STATUS SHEETS PMIC SHEET PREPARED Steve Duncan CHECKE

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SHEET SHEET STATUS SHEETS PMIC SHEET PREPARED Steve Duncan CHECKE

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REVISIONS DESCRIPTION Added device types Made changes tables Added device type Added case outline Redrew entire document. Changes accordance with 5962-R154-96. Update drawing current requirements MIL-PRF-38534. DATE (YR-MO-DA) 93-04-15 96-04-22 96-06-24 05-08-17 APPROVED Cottongim Cottongim Kendall Cottongim Raymond Monnin
SHEET SHEET STATUS SHEETS PMIC
SHEET PREPARED Steve Duncan CHECKED Michael Jones
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS POST OFFICE 3990 COLUMBUS, OHIO 43218-3990 http://www.dscc.dla.mil
THIS DRAWING AVAILABLE DEPARTMENTS AGENCIES DEPARTMENT DEFENSE AMSC
APPROVED Kendall Cottongim
MICROCIRCUIT, HYBRID, MEMORY, 512K 8-BIT, ELECTRICALLY ERASABLE PROGRAMMABLE READ ONLY MEMORY
DRAWING APPROVAL DATE 93-01-22 REVISION LEVEL SIZE SHEET CAGE CODE
67268
5962-93091
5962-E483-05
DSCC FORM 2233
SCOPE Scope. This drawing documents five product assurance classes defined paragraph 1.2.3 MIL-PRF-38534. choice case outlines lead finishes which available reflected Part Identifying Number (PIN). When available, choice radiation hardness assurance levels reflected PIN. PIN. shall shown following example: 5962 Federal stock class designator designator (see 1.2.1) Drawing number 1.2.1 Radiation hardness assurance (RHA) designator. marked devices shall meet MIL-PRF-38534 specified levels shall marked with appropriate designator. dash indicates non-RHA device. 1.2.2 Device type(s). device type(s) identify circuit function follows: Device type Generic number WE-512K8-150CQ, AS8E512K8CW-150/HQ WE-512K8-300CQ, AS8E512K8CW-300/HQ WE-512K8-250CQ, AS8E512K8CW-250/HQ WE-512K8-200CQ, AS8E512K8CW-200/HQ WE-512K8-200CQ Circuit function EEPROM, 512K 8-bit EEPROM, 512K 8-bit EEPROM, 512K 8-bit EEPROM, 512K 8-bit EEPROM, 512K 8-bit Access time 93091 Device type (see 1.2.2) Device class designator (see 1.2.3) Case outline (see 1.2.4) Lead finish (see 1.2.5)
1.2.3 Device class designator. This device class designator shall single letter identifying product assurance level. levels defined requirements MIL-PRF-38534 require Certification well qualification (Class Listing (Class product assurance levels follows: Device class Device performance documentation Highest reliability class available. This level intended space applications. Standard military quality class level. This level intended applications where non-space high reliability devices required. Reduced testing version standard military quality class. This level uses Class screening In-Process Inspections with possible limited temperature range, manufacturer specified incoming flow, manufacturer guarantees (but test) periodic conformance inspections (Group Designates devices which based upon other classes with exception(s) taken requirements that class. These exception(s) must specified device acquisition document; therefore acquisition document should reviewed ensure that exception(s) taken will adversely affect system performance. Manufacturer specified quality class. Quality level defined manufacturers internal, certified flow. This product have limited temperature range.
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990
SIZE
REVISION LEVEL
5962-93091
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DSCC FORM 2234
1.2.4 Case outline(s). case outline(s) designated MIL-STD-1835 follows: Outline letter Descriptive designator figure figure Terminals Package style Dual-in-line, dual cavity Dual-in-line, single cavity
1.2.5 Lead finish. lead finish shall specified MIL-PRF-38534. Absolute maximum ratings. Supply voltage range Input voltage range Power dissipation (PD) Storage temperature range. Lead temperature (soldering, seconds). Thermal resistance, junction-to-case (JC) Data retention Endurance Recommended operating conditions. Supply voltage range. Input voltage range (VIL). Input high voltage range (VIH). Output voltage, high minimum (VOH) Output voltage, maximum (VOL) Case operating temperature range (TC) APPLICABLE DOCUMENTS Government specification, standards, handbooks. following specification, standards, handbooks form part this drawing extent specified herein. Unless otherwise specified, issues these documents those cited solicitation contract. DEPARTMENT DEFENSE SPECIFICATION MIL-PRF-38534 Hybrid Microcircuits, General Specification for. DEPARTMENT DEFENSE STANDARDS MIL-STD-883 Test Method Standard Microcircuits. MIL-STD-1835 Interface Standard Electronic Component Case Outlines. DEPARTMENT DEFENSE HANDBOOKS MIL-HDBK-103 List Standard Microcircuit Drawings. MIL-HDBK-780 Standard Microcircuit Drawings. (Copies these documents available online http://assist.daps.dla.mil from Standardization Document Order Desk, Robbins Avenue, Building Philadelphia, 19111-5094.) Order precedence. event conflict between text this drawing references cited herein, text this drawing takes precedence. Nothing this document, however, supersedes applicable laws regulations unless specific exemption been obtained. +4.5 +5.5 -0.3 +0.8 +2.2 +2.4 +0.45 -55°C +125°C -0.6 +6.25 -0.6 +6.25 -65°C +150°C +300°C 28°C/W years minimum 10,000 cycles minimum
Stresses above absolute maximum ratings cause permanent damage device. Extended operation maximum levels degrade performance affect reliability.
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990
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REQUIREMENTS Item requirements. individual item performance requirements device classes shall accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 include performance tests herein designated device manufacturer's Quality Management (QM) plan designated applicable device class. manufacturer eliminate, modify optimize tests inspections herein, however performance requirements defined MIL-PRF-38534 shall applicable device class. addition, modification plan shall affect form, fit, function device applicable device class. Design, construction, physical dimensions. design, construction, physical dimensions shall specified MIL-PRF-38534 herein. 3.2.1 Case outline(s). case outline(s) shall accordance with 1.2.4 herein figure 3.2.2 Terminal connections. terminal connections shall specified figure 3.2.3 Truth table(s). truth table(s) shall specified figure 3.2.4 Timing diagram(s). timing diagram(s) shall specified figures 3.2.5 Block diagram. block diagram shall specified figure Electrical performance characteristics. Unless otherwise specified herein, electrical performance characteristics specified table shall apply over full specified operating temperature range. Electrical test requirements. electrical test requirements shall subgroups specified table electrical tests each subgroup defined table Marking device(s). Marking device(s) shall accordance with MIL-PRF-38534. device shall marked with listed herein. addition, manufacturer's vendor similar also marked. Data. addition general performance requirements MIL-PRF-38534, manufacturer device described herein shall maintain electrical test data (variables format) from initial quality conformance inspection group sample, each device type listed herein. Also, data should include summary parameters manually tested, those which, any, guaranteed. This data shall maintained under document revision level control manufacturer made available preparing activity (DSCC-VA) upon request. Certificate compliance. certificate compliance shall required from manufacturer order supply this drawing. certificate compliance (original copy) submitted DSCC-VA shall affirm that manufacturer's product meets performance requirements MIL-PRF-38534 herein. Certificate conformance. certificate conformance required MIL-PRF-38534 shall provided with each microcircuits delivered this drawing. Programming procedure. programming procedure shall specified manufacturer shall available upon request. 3.10 Endurance. reprogrammability test shall completed part vendor's reliability monitors. This reprogrammability test shall done initial characterization after design process changes which affect reprogrammability device. methods procedures vendor specific, shall guarantee number program/erase cycles listed section herein over full military temperature range. vendor's procedure shall kept under document control shall made available upon request acquiring preparing activity. 3.11 Data retention. data retention stress test shall completed part vendor's reliability monitors. This test shall done initial characterization after design process change which affect data retention. methods procedures vendor specific, shall guarantee number years listed section herein over full military temperature range. vendor's procedure shall kept under document control shall made available upon request acquiring preparing activity.
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990
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TABLE Electrical performance characteristics.
Test
Symbol
Conditions -55°C +125°C +4.5 +5.5 unless otherwise specified
Group subgroups
Device type
Limits
Unit
PARAMETERS Supply current VIL, VIH, through open, inputs through change VCC, through open, inputs through change VOUT VCC, 1,2,3
Standby current
1,2,3
Input leakage current Output leakage current Input voltage Input high voltage Output voltage Output high voltage FUNCTIONAL TESTING Functional tests sense write inhibit Power delay write inhibit DYNAMIC CHARACTERISTICS Input capacitance Output capacitance
1,2,3 1,2,3 1,2,3 1,2,3
+4.5 -400 +4.5
1,2,3 1,2,3
0.45
4.3.1c VSENS VPOD 4.3.1c 4.3.1c
7,8A,8B 7,8A,8B 7,8A,8B
COUT
VOUT
footnotes table.
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990
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DSCC FORM 2234
TABLE Electrical performance characteristics Continued.
Test
Symbol
Conditions -55°C +125°C +4.5 +5.5 unless otherwise specified
Group subgroups
Device type
Limits
Unit
READ CYCLE TIMING CHARACTERISTICS Read cycle time figure 9,10,11 04,05 04,05 04,05
Address access time
tACC
figure
9,10,11
Chip select access time
tACS
figure
9,10,11
Output hold from address change Output enable output valid
figure
9,10,11
figure
9,10,11
01,04,05
BYTE WRITE TIMING CHARACTERISTICS Address setup time Write pulse width figure figure figure Chip select setup time Address hold time Data valid write Output enable setup time Data hold time Output enable hold time footnotes table. tOES tOEH figure figure figure figure figure figure 9,10,11 9,10,11 9,10,11 9,10,11 9,10,11 9,10,11 9,10,11 9,10,11 01-04
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990
SIZE
REVISION LEVEL
5962-93091
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DSCC FORM 2234
TABLE Electrical performance characteristics Continued.
Test
Symbol
Conditions -55°C +125°C +4.5 +5.5 unless otherwise specified
Group subgroups
Device type
Limits
Unit
BYTE WRITE TIMING CHARACTERISTICS Continued. Chip select hold time tCSH figure 9,10,11
Write pulse width high
tWPH
figure
9,10,11
PAGE MODE WRITE TIMING CHARACTERISTICS Data setup time Data hold time Write pulse width Byte load cycle time Write pulse width high Write cycle time tBLC tWPH figure figure figure figure figure figure 9,10,11 9,10,11 9,10,11 9,10,11 9,10,11 9,10,11
DATA POLLING TIMING CHARACTERISTICS Data hold time figure 9,10,11
Output enable hold time
tOEH
figure
9,10,11
Output enable output delay Write recovery time footnotes table.
figure figure
9,10,11 9,10,11
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990
SIZE
REVISION LEVEL
5962-93091
SHEET
DSCC FORM 2234
TABLE Electrical performance characteristics Continued.
Test
Symbol
Conditions -55°C +125°C +4.5 +5.5 unless otherwise specified
Group subgroups
Device type
Limits
Unit
CHIP ERASE CHARACTERISTICS Setup time Pulse width Chip erase voltage Hold time figure figure figure 7,8A,8B 7,8A,8B 7,8A,8B 7,8A,8B 11.4 12.6
Unless otherwise specified; test conditions follows: Input pulse levels: Input rise fall times: Input output timing reference levels: Parameters shall tested part device characterization after design process changes. Parameters shall guaranteed limits specified table lots specifically tested. must remain valid through pulse. controlled. controlled. Data addresses following sequence.
STANDARD MICROCIRCUIT DRAWING
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Case outline
Symbol
Inches 1.654 .580 .235 .016 .045 .015 .008 .590 1.686 .600 .275 .020 .055 .060 .012 .610
Millimeters 42.01 14.73 5.97 0.41 1.14 0.38 0.20 14.99 42.82 15.24 6.99 0.51 1.40 1.52 0.30 15.49
.100 TYP. .125 MIN.
2.54 TYP. 3.18 MIN.
.085 TYP.
2.16 TYP.
FIGURE Case outline(s).
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990
SIZE
REVISION LEVEL
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DSCC FORM 2234
Case outline
Symbol
Inches 1.654 .580 .161 .016 1.492 .027 .009 .590 1.686 .600 .181 .020 1.508 .047 .012 .610
Millimeters 42.01 14.73 4.10 0.41 38.02 0.69 0.23 14.99 42.82 15.24 4.60 0.51 38.30 1.14 0.30 15.49
.100 TYP. .125 MIN.
2.54 TYP. 3.18 MIN.
NOTE: U.S. government preferred system measurement metric These case outlines were designed using inch-pound units measurement. case problems involving conflicts between metric inch-pound units, inch-pound units shall rule.
FIGURE Case outline(s) Continued.
STANDARD MICROCIRCUIT DRAWING
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Device types Case outlines Terminal number
Terminal connection
FIGURE Terminal connections.
A0-A18 Stable Stable
MODE Standby Read Write Disable Write inhibit Write inhibit
DATA High Data Data High High Z/Data High Z/Data
DEVICE CURRENT Standby Active Active Active Active Active
NOTES: High Logic Level Logic Level care (either High Low) High High Impedance state FIGURE Truth table.
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FIGURE Read cycle timing diagram.
controlled
FIGURE Write cycle timing diagram.
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990
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DSCC FORM 2234
NOTES: write cycle initiated when high pulsed when low. address latched falling edge whichever occurs first. either case, address setup requirement applies falling edge inclusion address decoder device. inclusion address decoder device, write control timings will vary. When utilizing controlled write operation, hold timings must extended propagation delay address decoder. controlled write operation, must minimum accommodate additional setup time required. delay required from previous write operation next must minimum
controlled
FIGURE Write cycle timing diagram Continued.
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NOTES: used select four separate blocks within device. through used specify page address must same throughout single page mode write. through used address specific bytes within page. Parameter write cycle time which will begin after last byte been loaded. write cycle initiated when high pulsed when low. address latched falling edge whichever occurs last. either case, address setup requirement applies falling edge inclusion address decoder device, (See figure delay required from previous write operation next must minimum
FIGURE Page mode write timing diagram.
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990
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DSCC FORM 2234
FIGURE Data polling timing diagram.
Device type only.
FIGURE Chip erase waveforms.
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FIGURE Block diagram.
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990
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DSCC FORM 2234
VERIFICATION Sampling inspection. Sampling inspection procedures shall accordance with MIL-PRF-38534 modified device manufacturer's Quality Management (QM) plan. modification plan shall affect form, fit, function described herein. Screening. Screening shall accordance with MIL-PRF-38534. following additional criteria shall apply: Burn-in test, method 1015 MIL-STD-883. Test condition test circuit shall maintained manufacturer under document revision level control shall made available either DSCC-VA acquiring activity upon request. Also, test circuit shall specify inputs, outputs, biases, power dissipation, applicable, accordance with intent specified method 1015 MIL-STD-883. specified accordance with table method 1015 MIL-STD-883. Prior burn-in devices shall programmed with data pattern entire memory array. resulting pattern shall verified before after burn-in. Devices having bits proper state after burn-in shall constitute device failure shall delivered.
Interim final electrical test parameters shall specified table herein, except interim electrical parameter tests prior burn-in optional discretion manufacturer.
Conformance periodic inspections. Conformance inspection (CI) periodic inspection (PI) shall accordance with MIL-PRF-38534 specified herein. 4.3.1 Group inspection (CI). Group inspection shall accordance with MIL-PRF-38534 follows: Tests shall specified table herein. Subgroups shall omitted. Subgroups shall include verification truth table figure following data patterns shall verified during subgroups memory cell locations. memory cell locations. Checkerboard pattern entire memory array. Checkerboard compliment entire memory array.
4.3.2 Group inspection (PI). Group inspection shall accordance with MIL-PRF-38534. 4.3.3 Group inspection (PI). Group inspection shall accordance with MIL-PRF-38534 follows: End-point electrical parameters shall specified table herein. devices requiring end-point electrical testing shall programmed with checkerboard pattern alternate rows hex. Steady-state life test, method 1005 MIL-STD-883. Test condition test circuit shall maintained manufacturer under document revision level control shall made available either DSCC-VA acquiring activity upon request. Also, test circuit shall specify inputs, outputs, biases, power dissipation, applicable, accordance with intent specified method 1005 MIL-STD-883. specified accordance with table method 1005 MIL-STD-883. Test duration: 1,000 hours, except permitted method 1005 MIL-STD-883. checkerboard data pattern shall verified after burn-in part end-point electrical testing.
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DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990
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TABLE Electrical test requirements. MIL-PRF-38534 test requirements Subgroups accordance with MIL-PRF-38534, group test table) applicable
Interim electrical parameters Final electrical parameters Group test requirements Group end-point electrical parameters End-point electrical parameters radiation hardness assurance (RHA) devices applies subgroup
4.3.4 Group inspection (PI). Group inspection shall accordance with MIL-PRF-38534. 4.3.5 Radiation Hardness Assurance (RHA) inspection. inspection currently applicable this drawing. PACKAGING Packaging requirements. requirements packaging shall accordance with MIL-PRF-38534. NOTES Intended use. Microcircuits conforming this drawing intended Government microcircuit applications (original equipment), design applications, logistics purposes. Replaceability. Microcircuits covered this drawing will replace same generic device covered contractorprepared specification drawing. Configuration control SMD's. proposed changes existing SMD's will coordinated specified MIL-PRF38534. Record users. Military industrial users shall inform Defense Supply Center Columbus (DSCC) when system application requires configuration control applicable SMD. DSCC will maintain record users this list will used coordination distribution changes drawings. Users drawings covering microelectronic devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544. Comments. Comments this drawing should directed DSCC-VA, Post Office 3990, Columbus, Ohio 432183990, telephone (614) 692-1081. Sources supply. Sources supply listed MIL-HDBK-103 QML-38534. vendors listed MIL-HDBK-103 QML-38534 have submitted certificate compliance (see herein) DSCC-VA have agreed this drawing.
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990
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5962-93091
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DSCC FORM 2234
STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 05-08-17 Approved sources supply 5962-93091 listed below immediate acquisition information only shall added MIL-HDBK-103 QML-38534 during next revisions. MIL-HDBK-103 QML-38534 will revised include addition deletion sources. vendors listed below have agreed this drawing certificate compliance been submitted accepted DSCC-VA. This information bulletin superseded next dated revisions MIL-HDBK-103 QML-38534. DSCC maintains online database current sources supply Standard microcircuit drawing 5962-9309101HXA 5962-9309101HXC 5962-9309101HYA 5962-9309101HYC 5962-9309101HYA 5962-9309101HYC 5962-9309102HXA 5962-9309102HXC 5962-9309102HYA 5962-9309102HYC 5962-9309102HYA 5962-9309102HYC 5962-9309103HXA 5962-9309103HXC 5962-9309103HYA 5962-9309103HYC 5962-9309103HYA 5962-9309103HYC 5962-9309104HXA 5962-9309104HXC 5962-9309104HYA 5962-9309104HYC Vendor CAGE number 54230 54230 54230 54230 0EU86 0EU86 54230 54230 54230 54230 0EU86 0EU86 54230 54230 54230 54230 0EU86 0EU86 54230 54230 54230 54230 Vendor similar WE-512K8-150CQ WE-512K8-150CQ WE-512K8-150CQ WE-512K8-150CQ AS8E512K8CW-150/HQ AS8E512K8CW-150/HQ WE-512K8-300CQ WE-512K8-300CQ WE-512K8-300CQ WE-512K8-300CQ AS8E512K8CW-300/HQ AS8E512K8CW-300/HQ WE-512K8-250CQ WE-512K8-250CQ WE-512K8-250CQ WE-512K8-250CQ AS8E512K8CW-250/HQ AS8E512K8CW-250/HQ WE-512K8-200CQ WE-512K8-200CQ WE-512K8-200CQ WE-512K8-200CQ
lead finish shown each representing hermetic package most readily available from manufacturer listed that part. desired lead finish listed contact Vendor determine availability. Caution. this number item acquisition. Items acquired this number satisfy performance requirements this drawing. Case outline device type longer available recommended design. Case outline substituted case outline
STANDARD MICROCIRCUIT DRAWING BULLETIN Continued. DATE: 05-08-17
Standard microcircuit drawing 5962-9309104HYA 5962-9309104HYC 5962-9309105HYA 5962-9309105HYC
Vendor CAGE number 0EU86 0EU86 54230 54230
Vendor similar AS8E512K8CW-200/HQ AS8E512K8CW-200/HQ WE-512K8-200CQ WE-512K8-200CQ
lead finish shown each representing hermetic package most readily available from manufacturer listed that part. desired lead finish listed contact Vendor determine availability. Caution. this number item acquisition. Items acquired this number satisfy performance requirements this drawing. Case outline device type longer available recommended design. Case outline substituted case outline
Vendor CAGE number 0EU86
Vendor name address Austin Semiconductor Incorporated 8701 Cross Park Drive Austin, 78754-4566 White Electronics Designs Corporation 3601 East University Drive Phoenix, 85034
54230
information contained herein disseminated convenience only Government assumes liability whatsoever inaccuracies information bulletin.

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