SP0501BACT product silicon structure tailored protection offered

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SP0501BACT product silicon structure tailored protection offered

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Avalanche Diode Chip Scale Package
SP0501BACT
product silicon structure tailored protection offered standard 0402 size. single channel Chip Scale device used help protect sensitive digital analog input circuits data, signal, control lines with voltage levels 5VDC. bipolar device ideal protection where signals present. state-of-the-art device designed suppress other transient over-voltage events meet International Electrotechnical Compatability (EMC transient immunity stantards 61000-4-2 Electrosatic Discharge Requirements). monolithic silicon device comprised specially designed structures transient voltage suppression (TVS). size shape these structures been tailored transient protection. capacitance clamp voltage ideal high speed signal line protection.
Ordering Information
Part Number SP0501BACT Diode Channels Bumps Package Size mils (mm) 40x20 0.5) Quantity Reel 3500
Schematic
SP0501BAC
Applications
Cell phone handsets Personal Digital Assistants (PDA) Portable handheld equipment (Laptop, Palmtop computers) Computer port, keyboard (USB1.1) Set-Top (Audio Video ports)
Features
Single channel suppressor 0402 device size Capability 61000-4-2, Direct Discharge .30kV (Level 61000-4-2, Discharge .30kV (Level 883D (Method 3015.7).30kV Signal line protection applications 5VDC Fast response time input capacitance .30pF Typical clamp voltage (8kV test) .13V Typical input leakage .1nA 3.3V Typical Operating temperature range .-40°C 85°C
PCMCIA cards
DIODE ARRAYS
Avalanche Diode Chip Scale Package
SP0501BACT
Electrical Specifications 25°C Unless Otherwise Specified
PARAMETER Reverse Standoff Voltage Reverse Standoff Leakage Current Signal Clamp Voltage Positive Negative Clamp Voltage during MIL-STD 833D (Method 3015.7) Test Level IEC-61000-4-2, Contact discharge MIL-STD-883D Method 3015 (HBM) Capacitance Turn on/off Time Temperature Range Operating Storage 1Mhz 10mA 10mA -9.2 TEST CONDITIONS 10µA 5.5V ±5.9 TYPICAL UNITS
Typical Device Capacitance Voltage
Outline Drawing
0.076 (.003")
(.04") 0.076 (.003")
0.36 (.014")
(.02")
0.36 (.014") 0.076 (.003")
0.15 (.006") NOTE** Metal Bump: 63/37 (Sn/Pb) alloy
Voltage Across Device
Avalanche Diode Chip Scale Package
SP0501BACT
Printed Circuit Board Recommendations
Size Shape Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening Solder Flux Ratio Solder Paste Type Board Trace Finish mils (0.356 0.152mm) Rectangle Solder Mask Defined Pads (NSMD) mils (0.457 0.254mm) mils (0.152mm) mils (0356 0.152mm) 50/50 Clean Organic Solderable Preservative (OSP) (Enteck: Plus 106A)
mils mils
Solder stencil opening/PCB land Solder Mask Opening
DIODE ARRAYS
mils mils mils
mils
mils
Typical Solder Reflow Thermal Profile (No-Clean Flux)
Temperature (oC)
Time

SP0501BACT product silicon structure tailored protection offered

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