W-CDMA Upconverter Driver with Power Control +6dBm Output Power w
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W-CDMA Upconverter Driver with Power Control
+6dBm Output Power with -46dBc ACPR Ultra-Miniature UCSP Package Upconverter Gain-Control Range: 35dB Automatic Dynamic Current Control 12mA Quiescent Supply Current On-Chip Buffer with Disable Out-of-Band Noise Power Band: -144dBm/Hz +6dBm POUT Interstage Bandpass Filter Required
MAX2383
MAX2383 upconverter driver designed emerging ARIB (Japan) ETSI-UMTS (Europe) W-CDMA applications. includes upconversion mixer with variable gain control, buffer, variable-gain driver output power control. MAX2383 designed support IMT-2000 frequency band. includes differential input port, input port, driver input/output ports. upconverter mixer incorporates with over 30dB gain control. provides automatic throttle-back driver mixer current output power reduced. main signal path buffer shutdown independently. on-chip buffer kept while main transmitter path being turned minimize pulling during gated-transmission. MAX2383 specified +2.7V +3.0V single supply housed ultra-miniature UCSPpackage optimum cost- space-reduction best performance. targeted 2270MHz 2580MHz frequency range. fabricated using advanced high-frequency bipolar process. mixer driver linearity have been optimized provide excellent performance 1920MHz 1980MHz band, while drawing minimal current. mixer's performance optimized -10dBm ±3dB drive buffer input port. port configured driven either singleended differentially. MAX2383 achieves excellent noise image suppression without interstage bandpass filter, thereby saving valuable board space, cost, supply current. downconverter mixer companion ICs, MAX2387/MAX2388/MAX2389 data sheet.
Ordering Information
PART MAX2383EBC TEMP. RANGE -40°C +85°C PIN-PACKAGE UCSP
ACTUAL SIZE UCSP 1.5mm
Block Diagram
VIEW
Applications
Japanese Cellular Phones (ARIB) European Cellular Phones (UMTS) Chinese Cellular Phones (TD-SCDMA) Phones
Configuration appears data sheet. Typical Operating Circuit appears data sheet. UCSP trademark Maxim Integrated Products, Inc.
LO_EN
DROUT
DRVR
MAX2383
LO-/ SHDN
DRIN
IFIN-
IFIN+
RFOUT
Maxim Integrated Products
pricing, delivery, ordering information, please contact Maxim/Dallas Direct! 1-888-629-4642, visit Maxim's website www.maxim-ic.com.
W-CDMA Upconverter Driver with Power Control MAX2383
ABSOLUTE MAXIMUM RATINGS
VCC, RFOUT .-0.3V +6.0V Signals .+1.0V Peak SHDN, LO_EN, .-0.3V (VCC 0.3V) Digital Input Current ±10mA Continuous Power Dissipation +70°C) 12-Pin UCSP (derate 80mW/°C above +70°C) 628mW Operating Temperature Range .-40°C +85°C Junction Temperature .+150°C Storage Temperature Range .-65°C +160°C Lead Temperature (Bump Reflow) .+235°C
Stresses beyond those listed under "Absolute Maximum Ratings" cause permanent damage device. These stress ratings only, functional operation device these other conditions beyond those indicated operational sections specifications implied. Exposure absolute maximum rating conditions extended periods affect device reliability.
ELECTRICAL CHARACTERISTICS
(VCC +2.7V +3.0V, SHDN +1.5V, -40°C +85°C. Typical values +2.85V, +25°C, unless otherwise noted.)
PARAMETER Supply Voltage Operating Supply Current Shutdown Supply Current Buffer Current Digital Input Logic High Digital Input Logic Input Logic High Current Input Logic Current Recommended Gain-Control Voltage Gain-Control Input Bias Current SYMBOL 0.5V 2.0V PDROUT +6dBm, 2.0V -35dBm, 1.4V SHDN 0.5V, LO_EN 0.5V, 0.5V SHDN 0.5V, LO_EN 1.5V, CONDITIONS 2.85 UNITS
ELECTRICAL CHARACTERISTICS
(MAX2383 Kit; +2.7V +3.0V; SHDN LO_EN +1.5V; source impedance (differential), input level -16dBm (differential); input level -10dBm, differential drive from source impedance; mixer upconverter driver cascaded directly through interstage matching network; DROUT drives load impedance; 2.0V; 380MHz, 1920MHz 1980MHz, 2300MHz 2360MHz; -40°C +85°C. Typical values +2.85V, +25°C, unless otherwise noted.) (Note
PARAMETER Frequency Frequency Range Frequency Range Output Power (meets ACPR specifications) Power Gain SYMBOL PDROUT (Note (Note High-side case (Note 2.0V 2.0V limit limit 1920 2270-2580 19.5 CONDITIONS 200-600 1980 UNITS
CASCADED PERFORMANCE (measured from input DROUT driver output))
W-CDMA Upconverter Driver with Power Control
ELECTRICAL CHARACTERISTICS (continued)
(MAX2383 Kit; +2.7V +3.0V; SHDN LO_EN +1.5V; source impedance (differential), input level -16dBm (differential); input level -10dBm, differential drive from source impedance; mixer upconverter driver cascaded directly through interstage matching network; DROUT drives load impedance; 2.0V; 380MHz, 1920MHz 1980MHz, 2300MHz 2360MHz; -40°C +85°C. Typical values +2.85V, +25°C, unless otherwise noted.) (Note
PARAMETER Gain-Control Range Adjacent Channel Power Ratio Alternate Channel Power Ratio Out-of-Band Noise Power Band In-Band Noise Power In-Band Noise Power Recommended Input Level ACPR1 ACPR2 SYMBOL CONDITIONS 0.5V 2.0V, -35dBm 2.0V (5MHz offset 3.84MHz 2.0V (10MHz offset 3.84MHz 2.0V, PDROUT +6dBm (TX: 1980MHz; 2110MHz) 2.0V, PDROUT +6dBm 0.5V, PDROUT -35dBm Differential -144 -139 -147 -140 -135 UNITS dBm/ dBm/ dBm/
MAX2383
Note Minimum maximum values guaranteed design characterization over temperature supply voltages. Note Operation outside this frequency range possible, been verified.
Typical Operating Characteristics
(MAX2383 Kit; +2.85V; SHDN LO_EN VCC, 2.0V; source impedance (differential), input level -16dBm (differential); input level -10dBm, differential drive from source impedance; mixer upconverter driver cascaded through interstage matching network; DROUT drives load impedance; 380MHz, 1950 MHz, 2330MHz; +25°C.)
TOTAL SUPPLY CURRENT GAIN-CONTROL VOLTAGE
MAX2383 toc01
TOTAL SUPPLY CURRENT TEMPERATURE
MAX2383 toc02
CONVERSION POWER GAIN GAIN-CONTROL VOLTAGE
CONVERSION POWER GAIN (dB) +85°C +25°C -40°C
MAX2383 toc03
TOTAL SUPPLY CURRENT (mA) -40°C +85°C +25°C
TOTAL SUPPLY CURRENT (mA) SHDN HIGH, LO_EN HIGH SHDN LOW, LO_EN HIGH
TEMPERATURE (°C)
W-CDMA Upconverter Driver with Power Control MAX2383
Typical Operating Characteristics (continued)
(MAX2383 Kit; +2.85V; SHDN LO_EN VCC, 2.0V; source impedance (differential), input level -16dBm (differential); input level -10dBm, differential drive from source impedance; mixer upconverter driver cascaded through interstage matching network; DROUT drives load impedance; 380MHz, 1950 MHz, 2330MHz; +25°C.)
CONVERSION POWER GAIN FREQUENCY
MAX2383 toc04
CONVERSION POWER GAIN INPUT LEVEL
MAX2383 toc05
PDROUT TEMPERATURE
ACPR -46dBc TEMPERATURE (°C) ACPR -49dBc
MAX2383 toc06
21.0 CONVERSION POWER GAIN (dB) 20.5 20.0 19.5 19.0 18.5 18.0 1920
21.0 CONVERSION POWER GAIN (dB) 20.5 20.0 19.5 19.0 18.5 18.0
1930
1940
1950
1960
1970
1980
PLOIN (dBm)
FREQUENCY (MHz)
PDROUT (dBm)
ACPR1 ACPR2 PDROUT
MAX2383 toc07
BAND NOISE POWER TEMPERATURE
MAX2383 toc08
INBAND NOISE POWER GAIN-CONTROL VOLTAGE
MAX2383 toc09
ACPR ACPR2 (dBc) ACPR1 1.5V ACPR2 1.7V ACPR2 ACPR1 ACPR1 1.7V
-144 -145 NOISE POWER (dBm/Hz) -146 -147 -148 -149 -150 1980MHz, NOISE MEASURED 2110MHz PDROUT +6dBm
-136 -138 NOISE POWER (dBm/Hz) -140 -142 -144 -146 -148 -150 1980MHz, NOISE MEASURED 1960MHz
PDROUT (dBm)
TEMPERATURE (°C)
LEAKAGE GAIN-CONTROL VOLTAGE
MAX2383 toc10
IMAGE SUPPRESSION FREQUENCY
IMAGE SUPPRESSION (dBc)
MAX2383 toc11
OUTPUT RETURN LOSS FREQUENCY
MAX2383 toc12
LEAKAGE (dBm) -7dBm -10dBm
1.4V 1920 1.7V
OUTPUT RETURN LOSS (dB)
1920
1930
1940
1950
1960
1970
1980
1930
1940
1950
1960
1970
1980
FREQUENCY (MHz)
FREQUENCY (MHz)
W-CDMA Upconverter Driver with Power Control
Description
NAME LO_EN /LO+ DROUT SHDN/ LOGC DRIN IFINIFIN+ RFOUT FUNCTION Buffer Enable Pin. When LOW, buffer shuts off. Also noninverting input port. ACcoupled GND, when driven single-ended. Power-Supply Pin. Bypass with 330pF capacitor close possible. Driver Output Pin. Externally matched Ground Reference Shutdown Pin. When LOW, entire part shuts off, except buffer. Also inverting input port. AC-coupled GND, when driven single-ended. Power Control Input (0.5V 2.0V control voltage) Driver Input (interstage node). externally matched Inverting Input (400 differential nominal impedance between IFIN+ IFIN-) Noninverting Input (400 differential nominal impedance between IFIN+ IFIN-) Upconverter Output Port (interstage node). externally matched Ground Reference
MAX2383
Detailed Description
Variable-Gain Mixer
MAX2383 contains double-balanced Gilbert cell mixer merged with gain-control circuit, followed mixer buffer. mixer driven differentially ports. input mixer conditioned through low-noise, inductively loaded buffer. mixer differential output driven through on-chip balun into single-ended common emitter amplifier, which drives output (RFOUT). mixer buffer singleended in/out common emitter stage with inductive degeneration external inductive load. Additionally, these circuits biased from "VCS" generators, designed produce low-noise constant degeneration voltage user's current source. These bias circuits also provide control required selectively power-down circuit also provide gain control current throttle-back.
turn whole when both pins pulled LOW. LO_EN helps reduce pulling gated-transmission mode providing means keep buffer while upconverter driver turn off. avoid loading buffer, connect isolation resistor between LO_EN/LO+ LO_EN logic input, isolation resistor between SHDN/LO- SHDN logic input.
Differential Inputs
MAX2383 differential input port interfacing differential filters. pins should ACcoupled ports. typical frequency 380MHz, device operate from 200MHz 600MHz. differential impedance between inputs approximately parallel with 1.0pF.
Interstage Matching
mixer buffer drives following driver through interstage matching network connected between mixer's RFOUT driver's input (DRIN). This off-chip matching network, which consists series inductors parallel capacitor, designed achieve better than 25dBc image suppression with current consumption penalty. quality factor this off-chip resonant circuit determines image suppression level usable bandwidth from point view passband gain flatness.
Driver
buffer single-ended in/out common emitter stage with inductive degeneration external inductive load.
Applications Information
Buffer Inputs
external interfaced either differentially single-ended differential buffer. Those pins also function control inputs device. Hence, they DC-coupled chip-control circuitry, AC-coupled port. SHDN LO_EN
Driver Output
driver output, DROUT, open-collector output that requires external inductor proper biasing. output matching components chosen
W-CDMA Upconverter Driver with Power Control MAX2383
optimum linearity return loss. important tune interstage matching network components along with driver output matching components, achieve desired cascaded ACPR performance from whole device.
Configuration
VIEW
Layout Issues
best performance, attention power-supply issues well layout signal lines. used layout example. Ground connections followed supply bypass most important.
LO_EN
DROUT
SHDN
MAX2383
DRIN
Power-Supply SHDN Bypassing
Bypass with 330pF capacitor close possible pin. separate vias ground plane each bypass capacitors minimize trace length reduce inductance. three separate vias ground plane each ground pin.
IFINIFIN+ RFOUT
Power-Supply Layout
minimize coupling between different sections ideal power-supply layout star configuration with large decoupling capacitor central node. traces branch from this central node, each going separate node board. each trace bypass capacitor that frequency operation. This arrangement provides local decoupling each pin. high frequencies, signal leaking supply sees relatively high impedance (formed trace inductance) central node, even higher impedance other supply pin, well impedance ground through bypass capacitor.
UCSP Reliability
chip-scale package (UCSP) represents unique package that greatly reduces board space compared other packages. UCSP reliability integrally linked user's assembly methods, circuit board material, usage environment. user should closely review these areas when considering UCSP. This form factor perform equally packaged product through traditional mechanical reliability tests. Performance through Operating Life Test Moisture Resistance remains uncompromised primarily determined wafer-fabrication process. Mechanical stress performance greater consideration UCSP. UCSP solder joint contact integrity must considered since package attached through direct solder contact user's board. Testing done characterize UCSP reliability performance shows that capable performing reliably through environmental stresses. Results environmental stress tests additional usage data recommendations detailed UCSP application note, which found Maxim's website, www.maxim-ic.com.
Impedance-Matching Network Layout
DROUT interstage matching networks very sensitive layout-related parasitic. minimize parasitic inductance, keep traces short place components close possible chip. minimize parasitic capacitance, minimize area plane.
Chip Information
TRANSISTOR COUNT:
W-CDMA Upconverter Driver with Power Control
Typical Operating Circuit
POUT
MAX2383
LO_EN LO_EN DROUT DRVR
MAX2383
LOSHDN
DRIN
SHDN IFINC2 IFIN+ RFOUT
FILTER
CASCADED; INTERSTAGE FILTER REQUIRED
W-CDMA Upconverter Driver with Power Control MAX2383
Package Information
Maxim cannot assume responsibility circuitry other than circuitry entirely embodied Maxim product. circuit patent licenses implied. Maxim reserves right change circuitry specifications without notice time.
_Maxim Integrated Products, Gabriel Drive, Sunnyvale, 94086 408-737-7600 2001 Maxim Integrated Products Printed registered trademark Maxim Integrated Products.
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