µPA602T N-CHANNEL (6-PIN CIRCUITS) µPA602T mini-mold device

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µPA602T N-CHANNEL (6-PIN CIRCUITS) µPA602T mini-mold device

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FIELD EFFECT TRANSISTOR
µPA602T
N-CHANNEL (6-PIN CIRCUITS)
µPA602T mini-mold device provided with circuits. achieves high-density mounting saves mounting costs.
PACKAGE DIMENSIONS millimeters)
0.65 +0.1 -0.15
0.32 +0.1 -0.05 0.16 +0.1 -0.06
FEATURES
circuits package same size SC-59 Complement µPA603T Automatic mounting supported
±0.2
0.95
0.95
±0.2
CONNECTION (Top view)
ABSOLUTE MAXIMUM RATINGS
PARAMETER Drain Source Voltage Gate Source Voltage Drain Current (DC) Drain Current (pulse) Total Power Dissipation Channel Temperature Storage Temperature SYMBOL VDSS VGSS ID(DC) ID(pulse)* Tstg RATINGS (Total) +150 UNIT
Duty Cycle
Document G11249EJ1V0DS00 (1st edition) Date Published June 1996 Printed Japan
1996
µPA602T
ELECTRICAL CHARACTERISTICS
PARAMETER Drain Cut-off Current Gate Leakage Current Gate Cut-off Voltage Forward Transfer Admittance Drain Source On-State Resistance Drain Source On-State Resistance Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time SYMBOL IDSS IGSS VGS(off) |yfs| RDS(on)1 RDS(on)2 Ciss Coss Crss td(on) td(off) VGS(on) TEST CONDITIONS MIN. TYP. MAX. ±1.0 UNIT
Marking:
SWITCHING TIME MEASUREMENT CIRCUIT CONDITIONS (RESISTANCE LOADED)
Gate voltage waveform VGS(on)
Drain current waveform Duty Cycle
td(on)
td(off) toff
µPA602T
TYPICAL CHARACTERISTICS
DERATING FACTOR FORWARD BIAS SAFE OPERATING AREA Free Total Power Dissipation Derating Factor
TOTAL POWER DISSIPATION AMBIENT TEMPERATURE
Case Temperature
Ambient Temperature
DRAIN CURRENT DRAIN SOURCE VOLTAGE Pulsed measurement Drain Current Drain Current
TRANSFER CHARACTERISTICS Pulsed measurement
Drain Source Voltage
Gate Source Voltage
GATE SOURCE CUT-OFF VOLTAGE CHANNEL TEMPERATURE VGS(off) Gate Cut-off Voltage |yfs| Forward Transfer Admittance
FORWARD TRANSFER ADMITTANCE DRAIN CURRENT
Channel Temperature
Drain Current
µPA602T
DRAIN SOURCE ON-STATE RESISTANCE GATE SOURCE VOLTAGE Pulsed measurement DRAIN SOURCE ON-STATE RESISTANCE DRAIN CURRENT Pulsed measurement
RDS(on) Drain Source On-State Resistance
RDS(on) Drain Source On-State Resistance
Drain Current
Gate Source Voltage
RDS(on) Drain Source On-State Resistance
DRAIN SOURCE ON-STATE RESISTANCE CHANNEL TEMPERATURE Pulsed measurement Ciss, Coss, Crss Capacitance
CAPACITANCE DARIN SOURCE VOLTAGE
Ciss Coss Crss
Channel Temperature
Drain Source Voltage
SWITCHING CHARACTERISTICS td(on), td(off), Switching Time td(off) Source Drain Current
SOURCE DRAIN DIODE FORWARD VOLTAGE
td(on) Drain Current
Source Drain Voltage
µPA602T
REFERENCE
Document Name semiconductor device reliability/quality control system Quality grade semiconductor devices Semiconductor device mounting technology manual Guide quality assurance semiconductor devices Semiconductor selection guide Document TEI-1202 IEI-1209 C10535E MEI-1202 X10679E
µPA602T
part this document copied reproduced form means without prior written consent Corporation. Corporation assumes responsibility errors which appear this document. Corporation does assume liability infringement patents, copyrights other intellectual property rights third parties arising from device described herein other liability arising from such device. license, either express, implied otherwise, granted under patents, copyrights other intellectual property rights Corporation others. While Corporation been making continuous effort enhance reliability semiconductor devices, possibility defects cannot eliminated entirely. minimize risks damage injury persons property arising from defect semiconductor device, customer must incorporate sufficient safety measures design, such redundancy, fire-containment, anti-failure features. devices classified into following three quality grades: "Standard", "Special", "Specific". Specific quality grade applies only devices developed based customer designated "quality assurance program" specific application. recommended applications device depend quality grade, indicated below. Customers must check quality grade each device before using particular application. Standard: Computers, office equipment, communications equipment, test measurement equipment, audio visual equipment, home electronic appliances, machine tools, personal electronic equipment industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment medical equipment (not specifically designed life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems medical equipment life support, etc. quality grade devices "Standard" unless otherwise specified NEC's Data Sheets Data Books. customers intend devices applications other than those specified Standard quality grade, they should contact Sales Representative advance. Anti-radioactive design implemented this product.
94.11

µPA602T N-CHANNEL (6-PIN CIRCUITS) µPA602T mini-mold device

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