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2SK2724 DESCRIPTION This product N-Channel Field Effect Tran
Top Searches for this datasheetFIELD EFFECT POWER TRANSISTORS 2SK2724 DESCRIPTION This product N-Channel Field Effect Transistor designed high current switching applications. PACKAGE DIMENSIONS millimeter) ±0.2 ±0.2 ±0.2 10.0 ±0.3 FEATURES On-Resistance ±0.1 ±0.2 12.0 ±0.2 13.5 MIN. RDS(on)1 Max. (VGS RDS(on)2 Max. (VGS Ciss Ciss Typ. Built-in Protection Diode Isolated TO-220 package 15.0 ±0.3 ±0.1 2.54 ±0.2 ±0.2 2.54 ±0.1 0.65 ±0.1 Gate Drain Source ABSOLUTE MAXIMUM RATINGS Drain Source Voltage Gate Source Voltage Drain Current (DC) Drain Current (Pulse)* Total Power Dissipation Total Power Dissipation Channel Temperature Storage Temperature duty cycle VDSS VGSS ID(DC) ID(pulse) Tstg ±140 +150 MP-45F (ISOLATED TO-220) Drain Body Diode Gate Gate Protection Diode Source diode connected between gate source transistor serves protector against ESD. When this device actually used, additional protection circuit externally required voltage exceeding rated voltage applied this device. information this document subject change without notice. Document D10515EJ1V0DS00 (1st edition) Date Published April 1996 Printed Japan 1996 2SK2724 ELECTRICAL CHARACTERISTICS CHARACTERISTIC Drain Source On-State Resistance SYMBOL RDS(on)1 RDS(on)2 Gate Source Cutoff Voltage Forward Transfer Admittance Drain Leakage Current Gate Source Leakage Current Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Total Gate Charge Gate Source Charge Gate Drain Charge Body Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge VGS(off) |yfs| IDSS IGSS Ciss Coss Crss td(on) td(off) VF(S-D) di/dt A/µs VGS(on) TEST CONDITION MIN. TYP. MAX. UNIT Test Circuit Switching Time Test Circuit Gate Charge D.U.T. Wave Form Wave Form VGS(on) D.U.T. td(on) td(off) toff Duty Cycle 2SK2724 DERATING FACTOR FORWARD BIAS SAFE OPERATING AREA TOTAL POWER DISSIPATION CASE TEMPERATURE Percentage Rated Power Total Power Dissipation Case Temperature Case Temperature DRAIN CURRENT DRAIN SOURCE VOLTAGE Pulsed FORWARD BIAS SAFE OPERATING AREA Drain Current ID(DC) Drain Current ID(pulse) Single Pulse atio Drain Source Voltage Drain Source Voltage FORWARD TRANSFER CHARACTERISTICS Pulsed Drain Current Gate Source Voltage 2SK2724 TRANSIENT THERMAL RESISTANCE PULSE WIDTH rth(t) Transient Thermal Resistance °C/W Rth(ch-a) 62.5 °C/W Rth(ch-c) °C/W 0.01 Single Pulse 0.001 Pulse Width RDS(on) Drain Source On-State Resistance FORWARD TRANSFER ADMITTANCE DRAIN CURRENT |yfs| Forward Transfer Admittance DRAIN SOURCE ON-STATE RESISTANCE GATE SOURCE VOLTAGE Pulsed Pulsed Drain Current RDS(on) Drain Source On-State Resistance Gate Source Voltage GATE SOURCE CUTOFF VOLTAGE CHANNEL TEMPERATURE DRAIN SOURCE ON-STATE RESISTANCE DRAIN CURRENT VGS(off) Gate Source Cutoff Voltage Pulsed Channel Temperature Drain Current 2SK2724 SOURCE DRAIN DIODE FORWARD VOLTAGE Pulsed RDS(on) Drain Source On-State Resistance DRAIN SOURCE ON-STATE RESISTANCE CHANNEL TEMPERATURE Diode Forward Current Channel Temperature Source Drain Voltage CAPACITANCE DRAIN SOURCE VOLTAGE SWITCHING CHARACTERISTICS td(on), td(off), Switching Time Ciss, Coss, Crss Capacitance Ciss Coss td(off) td(on) Crss VGS(on) Drain Source Voltage Drain Current REVERSE RECOVERY TIME DRAIN CURRENT 1000 di/dt DYNAMIC INPUT/OUTPUT CHARACTERISTICS Gate Charge Drain Source Voltage Diode Current Gate Source Voltage Reverse Recovery time 2SK2724 REFERENCE Document Name semiconductor device reliability/quality control system. Quality grade semiconductor devices. Semiconductor device mounting technology manual. Semiconductor device package manual. Guide quality assurance semiconductor devices. Semiconductor selection guide. Power features application switching power supply. Application circuits using Power FET. Safe operating area Power FET. Document TEI-1202 IEI-1209 C10535E C10943X MEI-1202 X10679E TEA-1034 TEA-1035 TEA-1037 2SK2724 [MEMO] 2SK2724 part this document copied reproduced form means without prior written consent Corporation. Corporation assumes responsibility errors which appear this document. Corporation does assume liability infringement patents, copyrights other intellectual property rights third parties arising from device described herein other liability arising from such device. license, either express, implied otherwise, granted under patents, copyrights other intellectual property rights Corporation others. While Corporation been making continuous effort enhance reliability semiconductor devices, possibility defects cannot eliminated entirely. minimize risks damage injury persons property arising from defect semiconductor device, customer must incorporate sufficient safety measures design, such redundancy, fire-containment, anti-failure features. devices classified into following three quality grades: "Standard", "Special", "Specific". Specific quality grade applies only devices developed based customer designated "quality assurance program" specific application. recommended applications device depend quality grade, indicated below. Customers must check quality grade each device before using particular application. Standard: Computers, office equipment, communications equipment, test measurement equipment, audio visual equipment, home electronic appliances, machine tools, personal electronic equipment industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment medical equipment (not specifically designed life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems medical equipment life support, etc. quality grade devices "Standard" unless otherwise specified NEC's Data Sheets Data Books. customers intend devices applications other than those specified Standard quality grade, they should contact Sales Representative advance. 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