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µPA2754GR SWITCHING N-CHANNEL POWER DESCRIPTION µPA2754
Top Searches for this datasheetFIELD EFFECT TRANSISTOR µPA2754GR SWITCHING N-CHANNEL POWER DESCRIPTION µPA2754GR Dual N-channel Field Effect Transistor designed Li-ion battery protection circuit power management application. PACKAGE DRAWING (Unit: Source Gate Drain Source Gate Drain ±0.3 +0.10 -0.05 FEATURES Dual chip type on-state resistance RDS(on)1 14.5 MAX. (VGS RDS(on)2 15.0 MAX. (VGS RDS(on)4 18.6 MAX. (VGS Ciss: Ciss 1940 TYP. (VDS Built-in protection diode Small surface mount package (Power SOP8) 5.37 MAX. 1.44 MAX. 0.15 0.05 MIN. ±0.2 0.10 ORDERING INFORMATION PART NUMBER PACKAGE Power SOP8 1.27 0.78 MAX. 0.40 +0.10 -0.05 0.12 µPA2754GR ABSOLUTE MAXIMUM RATINGS 25°C, terminals connected.) Drain Source Voltage (VGS Gate Source Voltage (VDS Drain Current (DC) Note2 Note1 Note2 VDSS VGSS ID(DC) ID(pulse) Tstg +150 12.1 Gate Protection Diode Source Gate Drain EQUIVALENT CIRCUIT (1/2 circuit) Drain Current (pulse) Total Power Dissipation units) Total Power Dissipation unit) Channel Temperature Storage Temperature Single Avalanche Current Single Avalanche Energy Note3 Note3 Note2 Body Diode Notes Duty cycle 25°C, Mounted ceramic substrate 2000 Starting 25°C, Remark diode connected between gate source transistor serves protector against ESD. When this device actually used, additional protection circuit externally required voltage exceeding rated voltage applied this device. information this document subject change without notice. Before using this document, please confirm that this latest version. products and/or types available every country. Please check with Electronics sales representative availability additional information. Document G15816EJ1V0DS00 (1st edition) Date Published January 2003 CP(K) Printed Japan 2001 µPA2754GR ELECTRICAL CHARACTERISTICS 25°C, terminals connected.) CHARACTERISTICS Zero Gate Voltage Drain Current Gate Leakage Current Gate Cut-off Voltage Note Note SYMBOL IDSS IGSS VGS(off) RDS(on)1 RDS(on)2 RDS(on)3 RDS(on)4 TEST CONDITIONS MIN. TYP. MAX. UNIT 11.5 11.8 12.7 13.9 1940 Forward Transfer Admittance Drain Source On-state Resistance Note 14.5 15.0 16.9 18.6 Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Total Gate Charge Gate Source Charge Gate Drain Charge Body Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge Ciss Coss Crss td(on) td(off) VF(S-D) di/dt A/µs 0.81 Note Pulsed: Duty Cycle TEST CIRCUIT AVALANCHE CAPABILITY D.U.T. TEST CIRCUIT SWITCHING TIME D.U.T. Wave Form BVDSS Duty Cycle Wave Form td(on) td(off) toff Starting TEST CIRCUIT GATE CHARGE D.U.T. Data Sheet G15816EJ1V0DS µPA2754GR TYPICAL CHARACTERISTICS 25°C, terminals connected.) DERATING FACTOR FORWARD BIAS SAFE OPERATING AREA Percentage Rated Power TOTAL POWER DISSIPATION AMBIENT TEMPERATURE Total Power Dissipation Mounted ceramic substrate 2000 units unit Ambient Temperature Ambient Temperature FORWARD BIAS SAFE OPERATING AREA 1000 DS(on) Limited D(pulse) Drain Current D(DC) Power Dissipation Limited unit, Single pulse Mounted ceramic substrate 2000 0.01 Drain Source Voltage TRANSIENT THERMAL RESISTANCE PULSE WIDTH 1000 rth(t) Transient Thermal Resistance °C/W Rth(ch-A) 73.5°C/W unit, Single pulse Mounted ceramic substrate 2000 Pulse Width Data Sheet G15816EJ1V0DS µPA2754GR DRAIN CURRENT DRAIN SOURCE VOLTAGE Pulsed FORWARD TRANSFER CHARACTERISTICS Pulsed Drain Current Drain Current 150°C 75°C 25°C -25°C 0.01 0.001 Drain Source Voltage Gate Source Voltage GATE CUT-OFF VOLTAGE CHANNEL TEMPERATURE Forward Transfer Admittance FORWARD TRANSFER ADMITTANCE DRAIN CURRENT Pulsed -25°C 25°C 75°C 125°C VGS(off) Gate Cut-off Voltage 0.01 Channel Temperature Drain Current RDS(on) Drain Source On-state Resistance RDS(on) Drain Source On-state Resistance DRAIN SOURCE ON-STATE RESISTANCE DRAIN CURRENT Pulsed DRAIN SOURCE ON-STATE RESISTANCE GATE SOURCE VOLTAGE Pulsed 1000 Drain Current Gate Source Voltage Data Sheet G15816EJ1V0DS µPA2754GR RDS(on) Drain Source On-state Resistance DRAIN SOURCE ON-STATE RESISTANCE CHANNEL TEMPERATURE Pulsed CAPACITANCE DRAIN SOURCE VOLTAGE 10000 Ciss, Coss, Crss Capacitance 1000 0.01 Channel Temperature Drain Source Voltage SWITCHING CHARACTERISTICS 1000 DYNAMIC INPUT/OUTPUT CHARACTERISTICS Drain Source Voltage d(off) td(on) Drain Current Gate Charge SOURCE DRAIN DIODE FORWARD VOLTAGE Pulsed REVERSE RECOVERY TIME DIODE FORWARD CURRENT 1000 di/dt A/µs Reverse Recovery Time Diode Forward Current 0.01 VF(S-D) Source Drain Voltage Diode Forward Current Data Sheet G15816EJ1V0DS Gate Source Voltage td(on), td(off), Switching Time µPA2754GR SINGLE AVALANCHE CURRENT INDUCTIVE LOAD SINGLE AVALANCHE ENERGY DERATING FACTOR Single Avalanche Current Energy Derating Factor 12.1 Starting 25°C 0.01 Inductive Load Starting Starting Channel Temperature Data Sheet G15816EJ1V0DS µPA2754GR information this document current January, 2003. information subject change without notice. actual design-in, refer latest publications Electronics data sheets data books, etc., most up-to-date specifications Electronics products. products and/or types available every country. 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