µPD168101 MONOLITHIC QUAD H-BRIDGE DRIVER CIRCUIT DESCRIPTIO

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µPD168101 MONOLITHIC QUAD H-BRIDGE DRIVER CIRCUIT DESCRIPTIO

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INTEGRATED CIRCUIT
µPD168101
MONOLITHIC QUAD H-BRIDGE DRIVER CIRCUIT
DESCRIPTION
µPD168101 monolithic quad H-bridge driver which uses power MOSFETs output stages. using process, this driver substantially improved voltage loss output stage power consumption compared with conventional driver circuits using bipolar transistors. eliminating charge pump circuit, current during power-OFF drastically decreased. addition, low-voltage malfunction prevention circuit also provided that prevents from malfunctioning when supply voltage drops. package, 24-pin plastic TSSOP adopted enable creation compact, slim application sets. This driver drive stepping motor same time, ideal driving stepping motors lens camera. best lens drive drivers, such digital camera video camera. Moreover, since input terminals respectively owned bridge circuit, maximum four loads, such motor, driven simultaneously.
FEATURES
Four bridge circuits employing power MOSFETs current consumption eliminating charge pump current when power-OFF: MAX. current: MAX. Input logic frequency: power supply Minimum operating supply voltage: voltage malfunction prevention circuit 24-pin plastic TSSOP (5.72 (225))
ORDERING INFORMATION
Part Number Package 24-pin plastic TSSOP (5.72 (225))
µPD168101MA-6A5
information this document subject change without notice. Before using this document, please confirm that this latest version.
devices/types available every country. Please check with local representative availability additional information.
Document S14846EJ1V0DS00 (1st edition) Date Published April 2001 CP(K) Printed Japan
2001
µPD168101
ABSOLUTE MAXIMUM RATINGS 25°C)
When mounted glass epoxy board copper foil)
Parameter Control block supply voltage Input voltage Output terminal voltage Output current IM(pulse) Power consumption Peak junction temperature Storage temperature range TCH(MAX) Tstg VOUT IM(DC) Duty Symbol Condition Rating -0.5 +6.0 -0.5 +6.0 -0.5 ±0.35 ±0.7 +150 Unit A/ch A/ch
RECOMMENDED OPERATING CONDITIONS
When mounted glass epoxy board copper foil)
Parameter Control block supply voltage Output current Operating frequency Operating temperature range Peak junction temperature IM(DC) TCH(MAX) terminal -0.25 +0.25 Symbol Condition MIN. TYP. MAX. Unit
Data Sheet S14846EJ1V0DS
µPD168101
CHARACTERISTICS (Unless otherwise specified, 25°C)
Parameter state current terminal current time standby terminal current time operation High level input current level input current Input pull down resistance High level input voltage level input voltage H-bridge resistance voltage malfunction prevention circuit operating voltage bridge output turn-on time bridge output turn-on time bridge output turn-off time bridge output rise time bridge output fall time Symbol IM(OFF) Condition control terminal terminal control terminal MIN. TYP. MAX. Unit
IDD(ST)
RIND VDDS1 VDDS2 tON1 tON2 tOFF Figure tON1: turn-on time from control tON2: turn-on time operation 0.25 Upper lower -10°C +85°C -10°C +85°C 0.65 0.07 -1.0 -0.3
0.06
VDD+0.3
Remarks thermal shutdown circuit (TSD), junction temperature operates above 150°C. time over thermal detection, current supply stopped making output terminals into high impedance. addition, thermal shutdown circuit does operate time standby. voltage malfunction operation prevention circuit operates, voltage power supply (VDD) becomes less than output terminals high impedance time UVLO operation.
Data Sheet S14846EJ1V0DS
µPD168101
Figure Switching time condition Low-level
100% VIN1 OUT1AOUT1B Hi-Z Hi-Z tOFF
High-level
100% VIN1 tOFF OUT1BOUT1A brake OUT1BOUT1A
FUNCTION TABLE
logic each channel follows Channel
OUT1A OUT1B
Channel
OUT2A OUT2B
Channel
OUT3A OUT3B
Channel
OUT4A OUT4B
High-level, Low-level, High impedance When control low-level, becomes stand-by state current consumption reduced.
Data Sheet S14846EJ1V0DS
µPD168101
CONNECTION
OUT1A PGND OUT2A OUT3A PGND OUT4A OUT1B PGND OUT2B VM23 OUT3B PGND OUT4B
name OUT1A PGND OUT2A OUT3A PGND OUT4A OUT4B PGND OUT3B VM23 OUT2B PGND OUT1B
function Output block supply voltage input terminal Output terminal Ground terminal Output terminal Output terminal Ground terminal Output terminal Output block supply voltage input terminal Control terminal (channel Control terminal (channel Control terminal (channel Control terminal (channel Control terminal (channel Control terminal (channel Control terminal (channel Control terminal (channel Output terminal Ground terminal Output terminal Output block supply voltage input terminal Output terminal Ground terminal Output terminal Control block supply voltage input terminal
Data Sheet S14846EJ1V0DS
µPD168101
BLOCK DIAGRAM
UVLO
Control circuit H-bridge
PGND
VM2, PGND Control circuit H-bridge
Control circuit H-bridge
PGND
PGND Control circuit H-bridge
Cautions terminal which more than should connect only terminal terminals. Pull down resistance connected input terminal. It's necessary that input terminal connected when isn't used. motor part power supply terminals VM1, VM23, separated inside, impress individually different power supply. motor part power supply terminal output which used should impress voltage recommended operation condition, should connect GND. addition, voltage impressed terminal even when input open, terminal current µAMAX) flow time standby.
Data Sheet S14846EJ1V0DS
µPD168101
TYPICAL CHARACTERISTICS
characteristics
Total power dissipation current IDD, IDD(ST) (mA)
IDD, IDD(ST) characteristics
25°C
178°C/W
IDD(ST)
Ambient temperature (°C)
Control block supply voltage
characteristics
state current IM(OFF)
IIH, characteristics
25°C
Input current
25°C
Output block supply voltage
Control block supply voltage
RIND characteristics
Input pull-down resistance RIND
VIH, characteristics
25°C
Input voltage VIH,
25°C
VIH,
Control block supply voltage
Control block supply voltage
Data Sheet S14846EJ1V0DS
µPD168101
Detect voltage voltage characteristics
characteristics
H-bridge resistance
25°C 0.25
25°C
(LH)
Detect voltage VDDS
(HL)
Output block supply voltage
Output block supply voltage
characteristics
tON1, tON2, tOFF characteristics
H-bridge output turn-on time tON1, tON2 H-birdge output turn-off time tOFF (µs)
25°C tON1 tON2
H-bridge resistance
0.25
tOFF
Ambient temperature (°C)
Output block supply voltage
characteristics
H-bridge output rise time H-bridge output fall time
25°C
Output block supply voltage
Data Sheet S14846EJ1V0DS
STANDARD CONNECTION EXAMPLE
This circuit diagram example connection, thing aiming mass production.
DC/DC CONVERTER
Battery bridge UVLO bridge PGND Control circuit Level Shift circuit bridge PGND bridge PGND PGND VM2,
Data Sheet S14846EJ1V0DS
Motor
Motor
µPD168101
µPD168101
PACKAGE DIMENSION
24-PIN PLASTIC TSSOP (5.72 (225))
detail lead
NOTE Each lead centerline located within 0.10 true position (T.P.) maximum material condition.
ITEM
MILLIMETERS 6.65±0.10 6.5±0.1 0.575 (T.P.) 0.22±0.05 0.1±0.05 MAX. 1.0±0.05 6.4±0.1 4.4±0.1 1.0±0.1 0.17±0.025 0.10 0.08 3°+5° 0.25 0.6±0.15 P24MA-50-6A5
Data Sheet S14846EJ1V0DS
µPD168101
RECOMMENDED SOLDERING CONDITIONS
Solder this product under following recommended conditions. soldering methods conditions other than those recommended, consult NEC. details recommended soldering conditions, refer information document "Semiconductor Device Mounting Technology Manual".
Recommended Condition Symbol
Soldering Method
Soldering Conditions Package peak temperature: 235°C; Time: secs. max. (210°C min.); Number times: times max; Number day: none; Flux: Rosin-based flux with little chlorine content (chlorine: 0.2Wt% max.) recommended. Package peak temperature: 215°C; Time: secs. max. (200°C min.); Number times: times max.; Number day: none; Flux: Rosin-based flux with little chlorine content (chlorine: max.) recommended. Package peak temperature: 260°C; Time: secs. max.; Preheating temperature: 120°C max.; Number times: once; Flux: Rosin-based flux with little chlorine content (chlorine: max.) recommended.
Infrared reflow
IR35-00-3
VP15-00-3
Wave soldering
WS60-00-1
Caution more soldering methods combination.
Data Sheet S14846EJ1V0DS
µPD168101
[MEMO]
Data Sheet S14846EJ1V0DS
µPD168101
[MEMO]
Data Sheet S14846EJ1V0DS
µPD168101
NOTES CMOS DEVICES
PRECAUTION AGAINST SEMICONDUCTORS Note: Strong electric field, when exposed device, cause destruction gate oxide ultimately degrade device operation. Steps must taken stop generation static electricity much possible, quickly dissipate once, when occurred. Environmental control must adequate. When dry, humidifier should used. recommended avoid using insulators that easily build static electricity. Semiconductor devices must stored transported anti-static container, static shielding conductive material. test measurement tools including work bench floor should grounded. operator should grounded using wrist strap. Semiconductor devices must touched with bare hands. Similar precautions need taken boards with semiconductor devices HANDLING UNUSED INPUT PINS CMOS Note: connection CMOS device inputs cause malfunction. connection provided input pins, possible that internal input level generated noise, etc., hence causing malfunction. CMOS devices behave differently than Bipolar NMOS devices. Input levels CMOS devices must fixed high using pull-up pull-down circuitry. Each unused should connected with resistor, considered have possibility being output pin. handling related unused pins must judged device device related specifications governing devices. STATUS BEFORE INITIALIZATION DEVICES Note: Power-on does necessarily define initial status device. Production process does define initial operation status device. Immediately after power source turned devices with reset function have been initialized. Hence, power-on does guarantee out-pin levels, settings contents registers. Device initialized until reset signal received. Reset operation must executed immediately after power-on devices having reset function.
Data Sheet S14846EJ1V0DS
µPD168101
Regional Information
Some information contained this document vary from country country. Before using product your application, pIease contact office your country obtain list authorized representatives distributors. They will verify:
Device availability Ordering information Product release schedule Availability related technical literature Development environment specifications (for example, specifications third-party tools components, host computers, power plugs, supply voltages, forth) Network requirements
addition, trademarks, registered trademarks, export restrictions, other legal issues also vary from country country.
Electronics Inc. (U.S.)
Santa Clara, California Tel: 408-588-6000 800-366-9782 Fax: 408-588-6130 800-729-9288
Electronics (Germany) GmbH
Benelux Office Eindhoven, Netherlands Tel: 040-2445845 Fax: 040-2444580
Electronics Hong Kong Ltd.
Hong Kong Tel: 2886-9318 Fax: 2886-9022/9044
Electronics Hong Kong Ltd. Electronics (France) S.A.
Velizy-Villacoublay, France Tel: 01-3067-5800 Fax: 01-3067-5899 Seoul Branch Seoul, Korea Tel: 02-528-0303 Fax: 02-528-4411
Electronics (Germany) GmbH
Duesseldorf, Germany Tel: 0211-65 Fax: 0211-65
Electronics (France) S.A. Electronics (UK) Ltd.
Milton Keynes, Tel: 01908-691-133 Fax: 01908-670-290 Madrid Office Madrid, Spain Tel: 091-504-2787 Fax: 091-504-2860
Electronics Singapore Pte. Ltd.
Novena Square, Singapore Tel: 253-8311 Fax: 250-3583
Electronics Taiwan Ltd. Electronics Italiana s.r.l.
Milano, Italy Tel: 02-66 Fax: 02-66
Electronics (Germany) GmbH
Scandinavia Office Taeby, Sweden Tel: 08-63 Fax: 08-63
Taipei, Taiwan Tel: 02-2719-2377 Fax: 02-2719-5951
Brasil S.A.
Electron Devices Division Guarulhos-SP, Brasil Tel: 11-6462-6810 Fax: 11-6462-6829
J01.2
Data Sheet S14846EJ1V0DS
µPD168101
information this document current March, 2001. information subject change without notice. actual design-in, refer latest publications NEC's data sheets data books, etc., most up-to-date specifications semiconductor products. products and/or types available every country. Please check with sales representative availability additional information. part this document copied reproduced form means without prior written consent NEC. assumes responsibility errors that appear this document. does assume liability infringement patents, copyrights other intellectual property rights third parties arising from semiconductor products listed this document other liability arising from such products. license, express, implied otherwise, granted under patents, copyrights other intellectual property rights others. Descriptions circuits, software other related information this document provided illustrative purposes semiconductor product operation application examples. incorporation these circuits, software information design customer's equipment shall done under full responsibility customer. assumes responsibility losses incurred customers third parties arising from these circuits, software information. While endeavours enhance quality, reliability safety semiconductor products, customers agree acknowledge that possibility defects thereof cannot eliminated entirely. minimize risks damage property injury (including death) persons arising from defects semiconductor products, customers must incorporate sufficient safety measures their design, such redundancy, fire-containment, anti-failure features. semiconductor products classified into following three quality grades: "Standard", "Special" "Specific". "Specific" quality grade applies only semiconductor products developed based customer-designated "quality assurance program" specific application. recommended applications semiconductor product depend quality grade, indicated below. Customers must check quality grade each semiconductor product before using particular application. "Standard": Computers, office equipment, communications equipment, test measurement equipment, audio visual equipment, home electronic appliances, machine tools, personal electronic equipment industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment medical equipment (not specifically designed life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems medical equipment life support, etc. quality grade semiconductor products "Standard" unless otherwise expressly specified NEC's data sheets data books, etc. customers wish semiconductor products applications intended NEC, they must contact sales representative advance determine NEC's willingness support given application. (Note) "NEC" used this statement means Corporation also includes majority-owned subsidiaries. "NEC semiconductor products" means semiconductor product developed manufactured defined above).

µPD168101 MONOLITHIC QUAD H-BRIDGE DRIVER CIRCUIT DESCRIPTIO

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