µPD16877 MONOLITHIC QUAD H-BRIDGE DRIVER CIRCUIT DESCRIPTION

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µPD16877 MONOLITHIC QUAD H-BRIDGE DRIVER CIRCUIT DESCRIPTION

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INTEGRATED CIRCUIT
µPD16877
MONOLITHIC QUAD H-BRIDGE DRIVER CIRCUIT
DESCRIPTION
µPD16877 monolithic quad H-bridge driver which uses power MOSFETs output stages. using process, this driver substantially improved saturation voltage power consumption compared with conventional driver circuits using bipolar transistors. eliminating charge pump circuit, current during power-OFF drastically decreased. addition, low-voltage malfunction prevention circuit also provided that prevents from malfunctioning when supply voltage drops. package, 24-pin plastic TSSOP adopted enable creation compact, slim application sets. This driver drive stepping motor same time, ideal driving stepping motors lens camcorder.
FEATURES
Four bridge circuits employing power MOSFETs current consumption eliminating charge pump current when power-OFF: MAX. current: MAX. Input logic frequency: power supply Minimum operating supply voltage: voltage malfunction prevention circuit 24-pin plastic TSSOP (5.72 (225))
ORDERING INFORMATION
Part Number Package 24-pin plastic TSSOP (5.72 (225))
µPD16877MA-6A5
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Document S13964EJ1V0DS00 (1st edition) Date Published March 2000 CP(K) Printed Japan
2000
µPD16877
ABSOLUTE MAXIMUM RATINGS 25°C)
When mounted glass epoxy board copper foil)
Parameter Control block supply voltage Output block supply voltage Input voltage Output terminal voltage Output current ID(pulse) Power consumption Peak junction temperature Storage temperature range TCH(MAX) Tstg Symbol VOUT ID(DC) Duty Condition Rating -0.5 +6.0 -0.5 +6.0 -0.5 ±0.3 ±0.7 +150 Unit A/ch A/ch
RECOMMENDED OPERATING CONDITIONS
When mounted glass epoxy board copper foil)
Parameter Control block supply voltage Output block supply voltage Output current Operating frequency Operating temperature range Peak junction temperature Symbol ID(DC) TCH(MAX) terminal Condition MIN. -0.2 TYP. MAX. +0.2 Unit
CHARACTERISTICS (Unless otherwise specified, 25°C)
Parameter state current current High level input current level input current Input pull down resistance High level input voltage level input voltage H-bridge resistance Symbol IM(OFF) RIND Upper lower -10°C +85°C -10°C +85°C Condition control terminal: level control terminal: level -1.0 -3.0 VDD+0.3 MIN. TYP. MAX. 0.06 Unit
VDDS1 voltage malfunction prevention circuit operating voltage VDDS2 bridge output turn-on time bridge output turn-off time bridge output rise time bridge output fall time tONH tOFFH
0.65
Figure
Data Sheet S13964EJ1V0DS00
µPD16877
Figure Switching time condition
100% tONH tOFFH 100% -10% -50% -90% -100% -50% -90% -10% current flowing direction from OUT_A OUT_B assumed (+). tONH tOFFH 100%
FUNCTION TABLE
Channel
OUT1A OUT1B
Channel
OUT2A OUT2B
Channel
OUT3A OUT3B
Channel
OUT4A OUT4B
High-level, Low-level, High impedance
Data Sheet S13964EJ1V0DS00
µPD16877
CONNECTION
OUT1A PGND OUT2A OUT3A PGND OUT4A OUT1B PGND OUT2B VM23 OUT3B PGND OUT4B
name OUT1A PGND OUT2A OUT3A PGND OUT4A
function Output block supply voltage input terminal Output terminal Ground terminal Output terminal Output terminal Ground terminal Output terminal Output block supply voltage input terminal Control terminal (channel Enable terminal (channel Control terminal (channel Enable terminal (channel
name OUT4B PGND OUT3B VM23 OUT2B PGND OUT1B
function Control terminal (channel Enable terminal (channel Control terminal (channel Enable terminal (channel Output terminal Ground terminal Output terminal Output block supply voltage input terminal Output terminal Ground terminal Output terminal Control block supply voltage input terminal
Data Sheet S13964EJ1V0DS00
µPD16877
BLOCK DIAGRAM
volatge malfunction prevention circuit Control circuit H-bridge OUT1B PGND VM23 Control circuit H-bridge OUT2B PGND OUT2A
OUT1A
Control circuit H-bridge
OUT3A OUT3B PGND
Control circuit H-bridge
OUT4A OUT4B PGND
Remark Plural terminal (VM, PGND) only terminal connect terminals.
Data Sheet S13964EJ1V0DS00
µPD16877
TYPICAL CHARACTERISTICS
characteristics
state current (OFF)
(OFF) characteristics 25°C control
Total power dissipation
0.7W 178°C/W
Ambient temperature (°C)
Output block supply voltage
characteristics
current
IIH, characteristics 25°C
Input current (µA)
25°C control
Control block supply voltage VIH, characteristics
Control block supply voltage VDDS characteristics
voltage detection voltage VDDS
25°C
Input voltage VIH,
25°C
VIH,
Control block supply voltage
Output block supply voltage
Data Sheet S13964EJ1V0DS00
µPD16877
characteristics
H-bridge resistance
tONH, tOFFH characteristics 25°C tONH
H-bridge Output turn-on time tONH (µs) H-bridge Output turn-off time tOFFH
25°C
tOFFH
Output block supply voltage
Output block supply voltage
characteristics 25°C
H-bridge Output rise time H-bridge Output fall time
Output block supply voltage
Data Sheet S13964EJ1V0DS00
µPD16877
STANDARD CONNECTION EXAMPLE
DC/DC CONVERTER
voltage malfunction prevention circuit
OUT1A H-bridge OUT1B PGND H-bridge OUT2A PGND OUT3A
motor1
OUT2B
control circuit
level shift circuit
H-bridge OUT3B PGND OUT4A
motor2
H-bridge OUT4B PGND
Data Sheet S13964EJ1V0DS00
µPD16877
PACKAGE DIMENSION
24-PIN PLASTIC TSSOP (5.72 (225))
detail lead
NOTE Each lead centerline located within 0.10 true position (T.P.) maximum material condition.
ITEM
MILLIMETERS 6.65±0.10 6.5±0.1 0.575 (T.P.) 0.22±0.05 0.1±0.05 MAX. 1.0±0.05 6.4±0.1 4.4±0.1 1.0±0.1 0.145±0.025 0.10 0.08 3°+5° 0.25 0.6±0.15 S24MA-50-6A5
Data Sheet S13964EJ1V0DS00
µPD16877
RECOMMENDED SOLDERING CONDITIONS
Solder this product under following recommended conditions. soldering methods conditions other than those recommended, consult NEC. details recommended soldering conditions, refer information document "Semiconductor Device Mounting Technology Manual".
Recommended Condition Symbol
Soldering Method
Soldering Conditions Package peak temperature: 235°C; Time: secs. max. (210°C min.); Number times: times max; Number day: none; Flux: Rosin-based flux with little chlorine content (chlorine: 0.2Wt% max.) recommended. Package peak temperature: 215°C; Time: secs. max. (200°C min.); Number times: times max.; Number day: none; Flux: Rosin-based flux with little chlorine content (chlorine: max.) recommended. Package peak temperature: 260°C; Time: secs. max.; Preheating temperature: 120°C max.; Number times: once; Flux: Rosin-based flux with little chlorine content (chlorine: max.) recommended.
Infrared reflow
IR35-00-3
VP15-00-3
Wave soldering
WS60-00-1
Caution more soldering methods combination.
Data Sheet S13964EJ1V0DS00
µPD16877
NOTES CMOS DEVICES
PRECAUTION AGAINST SEMICONDUCTORS Note: Strong electric field, when exposed device, cause destruction gate oxide ultimately degrade device operation. Steps must taken stop generation static electricity much possible, quickly dissipate once, when occurred. Environmental control must adequate. When dry, humidifier should used. recommended avoid using insulators that easily build static electricity. Semiconductor devices must stored transported anti-static container, static shielding conductive material. test measurement tools including work bench floor should grounded. operator should grounded using wrist strap. Semiconductor devices must touched with bare hands. Similar precautions need taken boards with semiconductor devices HANDLING UNUSED INPUT PINS CMOS Note: connection CMOS device inputs cause malfunction. connection provided input pins, possible that internal input level generated noise, etc., hence causing malfunction. CMOS devices behave differently than Bipolar NMOS devices. Input levels CMOS devices must fixed high using pull-up pull-down circuitry. Each unused should connected with resistor, considered have possibility being output pin. handling related unused pins must judged device device related specifications governing devices. STATUS BEFORE INITIALIZATION DEVICES Note: Power-on does necessarily define initial status device. Production process does define initial operation status device. Immediately after power source turned devices with reset function have been initialized. Hence, power-on does guarantee out-pin levels, settings contents registers. Device initialized until reset signal received. Reset operation must executed immediately after power-on devices having reset function.
Data Sheet S13964EJ1V0DS00
µPD16877
information this document subject change without notice. Before using this document, please confirm that this latest version. part this document copied reproduced form means without prior written consent Corporation. Corporation assumes responsibility errors which appear this document. Corporation does assume liability infringement patents, copyrights other intellectual property rights third parties arising from device described herein other liability arising from such device. license, either express, implied otherwise, granted under patents, copyrights other intellectual property rights Corporation others. Descriptions circuits, software, other related information this document provided illustrative purposes semiconductor product operation application examples. incorporation these circuits, software, information design customer's equipment shall done under full responsibility customer. Corporation assumes responsibility losses incurred customer third parties arising from these circuits, software, information. While Corporation been making continuous effort enhance reliability semiconductor devices, possibility defects cannot eliminated entirely. minimize risks damage injury persons property arising from defect semiconductor device, customers must incorporate sufficient safety measures design, such redundancy, fire-containment, anti-failure features. devices classified into following three quality grades: "Standard", "Special", "Specific". Specific quality grade applies only devices developed based customer designated "quality assurance program" specific application. recommended applications device depend quality grade, indicated below. Customers must check quality grade each device before using particular application. Standard: Computers, office equipment, communications equipment, test measurement equipment, audio visual equipment, home electronic appliances, machine tools, personal electronic equipment industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment medical equipment (not specifically designed life support) Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems medical equipment life support, etc. quality grade devices "Standard" unless otherwise specified NEC's Data Sheets Data Books. customers intend devices applications other than those specified Standard quality grade, they should contact sales representative advance.

µPD16877 MONOLITHIC QUAD H-BRIDGE DRIVER CIRCUIT DESCRIPTION

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