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µPA1701 DESCRIPTION This product N-Channel Field Effect Tran
Top Searches for this datasheetField Effect Power Transistors µPA1701 DESCRIPTION This product N-Channel Field Effect Transistor designed power management applications note book computers, Li-ion battery applications. 1,2,3 Source Gate 5,6,7,8 Drain PACKAGE DIMENSIONS millimeter) FEATURES Gate Drive On-Resistance RDS(on)1 Max. (VGS RDS(on)2 Max. (VGS Ciss Ciss 1200 Typ. 5.37 Built-in Protection Diode (Power SOP8) 1.44 Small Surface Mount Package 0.15 _0.05 +0.10 0.05 1.27 0.78 0.12 0.10 +0.10 0.40 _0.05 ABSOLUTE MAXIMUM RATINGS terminals connected) Drain Source Voltage Gate Source Voltage Drain Current (DC) Drain Current (pulse)* Total Power Dissipation °C)** Channel Temperature Storage Temperature Duty Cycle Mounted ceramic substrate 1200 diode connected between gate source transistor serves protector against ESD. When this device actually used, additional protection circuit externally required voltage exceeding rated voltage applied this device. VDSS VGSS ID(DC) ID(pulse) Tstg ±7.0 +150 Gate Protection Diode Source Gate Body Diode Drain information this document subject change without notice. Document G10929EJ2V0DS00 (2nd edition) Date Published April 1996 Printed Japan 1995 ELECTRICAL CHARACTERISTICS terminals connected) CHARACTERISTICS Drain Source On-state Resistance Gate Source Cutoff Voltage Forward Transfer Admittance Drain Leakage Current Gate Source Leakage Current Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Total Gate Charge Gate Source Charge Gate Drain Charge Body Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge SYMBOL RDS(on)1 RDS(on)2 VGS(off) IDSS IGSS Ciss Coss Crss td(on) td(off) VF(S-D) TEST CONDITIONS VGS(on) di/dt A/µs 1200 MIN. TYP. MAX. UNIT Test Circuit Switching Time Test Circuit Gate Charge D.U.T. Wave Form (on) D.U.T. Wave Form (on) (off) Duty Cycle toff DERATING FACTOR FORWARD BIAS SAFE OPERATING AREA Percentage Rated Power TOTAL POWER DISSIPATION AMBIENT TEMPERATURE Total Power Dissipation Mounted ceramic substrate 1200 Ambient Temperature Ambient Temperature DRAIN CURRENT DRAIN SOURCE VOLTAGE Drain Current FORWARD BIAS SAFE OPERATING AREA ID(pulse) Drain Current ID(DC) Mounted ceramic substrate 1200 Pulsed 25°C Single Pulse Drain Source Voltage Drain Source Voltage FORWARD TRANSFER CHARACTERISTICS Pulsed Drain Current 125°C 25°C -25°C Gate Source Voltage TRANSIENT THERMAL RESISTANCE PULSE WIDTH rth(t) Transient Thermal Resistance -°C/W Rth(ch-a) 62.5 °C/W 0.01 0.001 Pulse Width RDS(on) Drain Source On-State Resistance Mounted ceramic substrate 1200 Single Pulse FORWARD TRANSFER ADMITTANCE DRAIN CURRENT Forward Transfer Admittance Pulsed DRAIN SOURCE ON-STATE RESISTANCE GATE SOURCE VOLTAGE Pulsed Drain Current RDS(on) Drain Source On-State Resistance DRAIN SOURCE ON-STATE RESISTANCE DRAIN CURRENT Gate Source Voltage GATE SOURCE CUTOFF VOLTAGE CHANNEL TEMPERATURE VGS(off) Gate Source Cutoff Voltage Pulsed Drain Current Channel Temperature RDS(on) Drain Source On-State Resistance DRAIN SOURCE ON-STATE RESISTANCE CHANNEL TEMPERATURE Diode Forward Current SOURCE DRAIN DIODE FORWARD VOLTAGE Pulsed Channel Temperature Source Drain Voltage CAPACITANCE DRAIN SOURCE VOLTAGE SWITCHING CHARACTERISTICS td(on), td(off), Switching Time td(off) td(on) Ciss, Coss, Crss Capacitance Ciss Coss Crss Drain Source Voltage VGS(on) Drain Current REVERSE RECOVERY TIME DRAIN CURRENT 1000 Reverse Recovery Time Drain Source Voltage Drain Current Gate Charge Gate Source Voltage di/dt DYNAMIC INPUT/OUTPUT CHARACTERISTICS REFERENCE Document Name semiconductor device reliability/quality control system Quality grade semiconductor devices Semiconductor device mounting technology manual Semiconductor device package manual Guide quality assurance semiconductor devices Semiconductor selection guide Power features application switching power supply Application circuits using Power Safe operating area Power Document TEI-1202 IEI-1209 C10535E C10943X MEI-1202 X10679E TEA-1034 TEA-1035 TEA-1037 [MEMO] part this document copied reproduced form means without prior written consent Corporation. Corporation assumes responsibility errors which appear this document. Corporation does assume liability infringement patents, copyrights other intellectual property rights third parties arising from device described herein other liability arising from such device. license, either express, implied otherwise, granted under patents, copyrights other intellectual property rights Corporation others. While Corporation been making continuous effort enhance reliability semiconductor devices, possibility defects cannot eliminated entirely. minimize risks damage injury persons property arising from defect semiconductor device, customer must incorporate sufficient safety measures design, such redundancy, fire-containment, anti-failure features. devices classified into following three quality grades: "Standard", "Special", "Specific". Specific quality grade applies only devices developed based customer designated "quality assurance program" specific application. recommended applications device depend quality grade, indicated below. Customers must check quality grade each device before using particular application. Standard: Computers, office equipment, communications equipment, test measurement equipment, audio visual equipment, home electronic appliances, machine tools, personal electronic equipment industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment medical equipment (not specifically designed life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems medical equipment life support, etc. quality grade devices "Standard" unless otherwise specified NEC's Data Sheets Data Books. customers intend devices applications other than those specified Standard quality grade, they should contact Sales Representative advance. 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