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Gain Control Amplifier Description CXA3222AN gain control amplifi
Top Searches for this datasheetCXA3222AN Gain Control Amplifier Description CXA3222AN gain control amplifier suitable CDMA cellular/PCS phone. Features Wide gain control range Linear gain slope Wideband operation MHz) Very small package SSOP) voltage operation High output Power save function included Absolute Maximum Ratings Supply voltage SSOP (Plastic) Operating temperature Topr +125 Storage temperature Tstg +150 Supply voltage range -0.3 Logic input voltage -0.3 Signal input voltage -0.3 Differential signal input voltage Operating Condition Supply voltage Applications CDMA cellular/PCS phone Structure Bipolar silicon monolithic Sony reserves right change products specifications without prior notice. This information does convey license implication otherwise under patents other right. Application circuits shown, any, typical examples illustrating operation devices. Sony cannot assume responsibility problems arising these circuits. E98823C21-PS CXA3222AN Block Diagram Input CDMA CDMA OUTX Output Gain control GCTL Supply Voltage Bias Driver Ground Power Save Configuration CDMA GCTL CDMA OUTX CXA3222AN Description Symbol voltage Equivalent circuit Description CDMA Differential input pins CDMA transmit signal. CDMA Ground. 135k Power save function pin. High: Active Low: Power save 12.25k OUTX 12.25k Differential output pins transmit signal. Open collector output. Positive power supply. GCTL Gain control pin. CXA3222AN Electrical Characteristics Characteristics Parameter Current consumption Current consumption Input current Input current Input current Input current high voltage voltage Symbol ICC1 ICC2 IpsvH IpsvL IgctlH IgctlL VpsH VpsL Conditions Vpsv=3.0 Vgctl=1.5 Vpsv=0 Vgctl=1.5 Vpsv=3.0 Vpsv=0 Vgctl=3.0 Vgctl=0.5 Min. (VCC=3.0 Ta=27 Typ. 15.7 Max. 21.5 Unit Characteristics Parameter Operating frequency range Gain Gain Gain Gain Gain slope Input level order intercept point Noise Figure Symbol G2.3 G1.5 G1.0 G0.7 GCLIN IIP3 f=130.38 MHz, level=-22.5 dBm, Vgctl=2.3 Vgctl=1.5 Vgctl=1.0 Vgctl=0.7 Gain Vgctl=2.0 Gain Vgctl=1.0 G=15 f1=129.38 MHz, f2=131.38 Measure 130.38 G=15 Measure 130.38 Conditions Min. -8.5 (VCC=3.0 Ta=27 Typ. Max. -4.5 Unit dB/V Adjust GCTL voltage, overall gain CXA3222AN Measurement Circuit 1000p CDMA INPUT 1000p CDMA GCTL 0.01µ CDMA 820n3 2.4k 820n3 0.01µ OUTPUT OUTX TOKO, Inc. B5FL 616DS-1135 Coilcraft, Inc. 1008HS-102TKBC Coilcraft, Inc. 1008HS-821TKBC Application Circuit 0.01µ 1000p CDMA INPUT CDMA 1000p Active Sleep OUTX 1000p 0.01µ 1000p OUTPUT GCTL 100p Gain Control Voltage Must adjusting values result best impedance matching between filter this Application circuits shown typical examples illustrating operation devices. Sony cannot assume responsibility problems arising these circuits infringement third party patent other right same. CXA3222AN Design Reference Values Single ended measurement Item Input resistance Input capacitance Output resistance Output capacitance Symbol Rout Cout Conditions (VCC=3.0 Ta=27 Typ. 0.92 Unit f=130.38 MHz, Vgctl=1.5 Notes Operation This wideband amplifier with wide gain control range. decouping capacitors between should close possible. resistors connected Pins should close possible. This assumes excellent characteristics when differential input impedance between Pins 500. Refer Measurement Circuit external element settings, etc. attention handling this because electrostatic discharge strength weak. CXA3222AN Sensitivity 3.0V IIP3 3.0V Power gain [dB] -100 Vgctl IIP3 [dBm] -40°C 27°C 85°C -40°C 27°C 85°C Power gain [dB] Noise Figure 3.0V Gain Error from Room Temp 3.0V Noise figure [dB] Gain error [dB] -40°C 27°C 85°C -40°C 85°C Power gain [dB] Power gain [dB] CXA3222AN Package Outline Unit 8PIN SSOP (PLASTIC) 1.25 0.65 0.13 (0.22) 0.25 0.05 0.15 DETAIL SOLDER (0.5) NOTE: Dimension does include mold protrusion. DETAIL PACKAGE STRUCTURE PACKAGE MATERIAL EPOXY RESIN SOLDER PLATING COPPER ALLOY 0.04g LEAD TREATMENT LEAD MATERIAL PACKAGE MASS SONY CODE EIAJ CODE JEDEC CODE SSOP-8P-L01 P-SSOP8-8.4x3.0-0.65 Ass'y 8PIN SSOP (PLASTIC) 1.25 0.65 0.13 (0.22) 0.25 0.05 0.15 DETAIL SOLDER (0.5) NOTE: Dimension does include mold protrusion. DETAIL PACKAGE STRUCTURE PACKAGE MATERIAL EPOXY RESIN SOLDER PLATING COPPER ALLOY 0.04g LEAD TREATMENT LEAD MATERIAL PACKAGE MASS SONY CODE EIAJ CODE JEDEC CODE SSOP-8P-L01 P-SSOP8-8.4x3.0-0.65 LEAD PLATING SPECIFICATIONS ITEM LEAD MATERIAL SOLDER COMPOSITION PLATING THICKNESS SPEC. COPPER ALLOY Sn-Bi Bi:1-4wt% 5-18µm (0.15) 0.025 0.17 0.015 0.08 b=0.24 0.07 (0.15) 0.025 0.17 0.015 0.08 b=0.24 0.07 Sony Corporation Other recent searchesZXCT1081 - ZXCT1081 ZXCT1081 Datasheet WT317 - WT317 WT317 Datasheet SVM7850C - SVM7850C SVM7850C Datasheet S25A10FR - S25A10FR S25A10FR Datasheet MC68328UMAD - MC68328UMAD MC68328UMAD Datasheet IXSH10N120AU1 - IXSH10N120AU1 IXSH10N120AU1 Datasheet HA5023 - HA5023 HA5023 Datasheet FN3393 - FN3393 FN3393 Datasheet CS5124 - CS5124 CS5124 Datasheet AK100-25 - AK100-25 AK100-25 Datasheet
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