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Gain Control Amplifier Description CXA3221AN gain control amplifi


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CXA3221AN
Gain Control Amplifier
Description CXA3221AN gain control amplifier suitable CDMA cellular/PCS phone. Features Wide gain control range Linear gain slope Wideband operation (50MHz 300MHz) Very small package SSOP) voltage operation Power save function included Absolute Maximum Ratings Supply voltage Operating temperature Topr +125 Storage temperature Tstg +150 Supply voltage range -0.3 Logic input voltage -0.3 Signal input voltage -0.3 Differential signal input voltage Operating Condition Supply voltage Applications CDMA cellular/PCS phone Structure Bipolar silicon monolithic SSOP (Plastic)
Sony reserves right change products specifications without prior notice. This information does convey license implication otherwise under patents other right. Application circuits shown, any, typical examples illustrating operation devices. Sony cannot assume responsibility problems arising these circuits.
E98910B1X-PS
CXA3221AN
Block Diagram
Input CDMA
CDMA CDMA
OUTX
Output
Gain control
GCTL
Supply Voltage
Bias Driver
Ground
Power Save
Configuration
GCTL
CDMA
CDMA
OUTX
CXA3221AN
Description Symbol voltage
Equivalent circuit Ground.
Description
CDMA
1.15
Differential input pins received CDMA signal.
CDMA
1.15
135k
Power save function pin. High: Active Low: Power save
12.3k
12.3k
Differential output pins received CDMA signal. Open collector output. OUTX
Positive power supply.
GCTL
Gain control pin.
CXA3221AN
Electrical Characteristics Characteristics Parameter Current consumption Current consumption Input current Input current Input current Input current high voltage voltage Symbol ICC1 ICC2 IpsvH IpsvL IgctlH IgctlL VpsH VpsL Conditions Vpsv 3.0V, Vgctl 1.5V, Vpsv Vgctl 1.5V, Vpsv 3.0V Vpsv Vgctl 3.0V Vgctl 0.5V (VCC 3.0V, 27°C) Min. Typ. Max. Unit 10.2
Characteristics Parameter Operating frequency range Gain Gain Gain Gain slope Input level order intercept point Noise Figure Symbol G2.4 G1.5 G0.6 GCLIN IIP3 210.38MHz, Vgctl 2.4V Vgctl 1.5V Vgctl 0.6V Gain Vgctl 2.0V Gain Vgctl 1.0V 40dB1 209.38MHz, 211.38MHz Measure 210.38MHz 40dB1 Measure 210.38MHz Conditions
(VCC 3.0V, 27°C) Min. Typ. Max. Unit dB/V
Adjust GCTL voltage, overall gain 40dB.
CXA3221AN
Measurement Circuit
GCTL 0.01µ 1000p CDMA INPUT 1000p 180n CDMA CDMA
OUTX 1.6k
150n3
150n3
0.01µ
OUTPUT
TOKO, Inc. B5FL 616DS-1135 Coilcraft, Inc. 0805HS-181TKBC Coilcraft, Inc. 0805HS-151TKBC
Application Circuit
0.01µ 1000p CDMA INPUT CDMA 1000p Active Sleep OUTX 0.01µ GCTL 100p
Gain Control Voltage
1000p OUTPUT 1000p
Must adjusting values result best impedance matching between filter this
Application circuits shown typical examples illustrating operation devices. Sony cannot assume responsibility problems arising these circuits infringement third party patent other right same.
CXA3221AN
Design Reference Values Single ended measurement Item Input resistance Input capacitance Output resistance Output capacitance Symbol Rout Cout 210.38MHz, Vgctl 1.5V Conditions (VCC 3.0V, 27°C) Typ. 0.73 Unit
Notes Operation This wideband amplifier with wide gain control range. decouping capacitors between should close possible. resistors connected Pins should close possible. This assumes excellent characteristics when differential input impedance between Pins 500. Refer Measurement Circuit external element settings, etc. attention handling this because electrostatic discharge strength weak.
CXA3221AN
Sensitivity
3.0V
IIP3
3.0V
Power gain [dB]
Vgctl
IIP3 [dBm]
-40°C 27°C 85°C -40°C 27°C 85°C
Power gain [dB]
Noise Figure
3.0V
Gain Error from Room Temp
3.0V
Noise figure [dB]
Gain error [dB]
-40°C 27°C 85°C
-40°C 85°C
Power gain [dB]
Power gain [dB]
CXA3221AN
Package Outline
Unit:
8PIN SSOP (PLASTIC)
1.25
0.65
0.13
(0.22)
0.25 0.05
0.15
DETAIL SOLDER
(0.5)
NOTE: Dimension does include mold protrusion.
DETAIL
PACKAGE STRUCTURE
PACKAGE MATERIAL EPOXY RESIN SOLDER PLATING COPPER ALLOY 0.04g LEAD TREATMENT LEAD MATERIAL PACKAGE MASS
SONY CODE EIAJ CODE JEDEC CODE
SSOP-8P-L01 P-SSOP8-8.4x3.0-0.65
Ass'y
8PIN SSOP (PLASTIC)
1.25
0.65
0.13
(0.22)
0.25 0.05
0.15
DETAIL SOLDER
(0.5)
NOTE: Dimension does include mold protrusion.
DETAIL
PACKAGE STRUCTURE
PACKAGE MATERIAL EPOXY RESIN SOLDER PLATING COPPER ALLOY 0.04g LEAD TREATMENT LEAD MATERIAL PACKAGE MASS
SONY CODE EIAJ CODE JEDEC CODE
SSOP-8P-L01 P-SSOP8-8.4x3.0-0.65
LEAD PLATING SPECIFICATIONS ITEM LEAD MATERIAL SOLDER COMPOSITION PLATING THICKNESS SPEC. COPPER ALLOY Sn-Bi Bi:1-4wt% 5-18µm
(0.15) 0.025 0.17 0.015
0.08 b=0.24 0.07
(0.15) 0.025 0.17 0.015
0.08 b=0.24 0.07
Sony Corporation

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