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Infrastructure Processor Division IA Product Line Overview


November 1, 2004 Curt Durrant

Infrastructure Processor Division IA Product Line Overview
November 1, 2004 Curt Durrant
The Intel logo and Intel are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United states and other countries.
Changes from Last Roadmap Update
Product Additions - None Products Removed - None Product Launches - None Schedule Changes - None Major Feature Changes - None Status Changes
· E7520
and E7320 chipsets changed from "In Planning" to "POR"
Other - None
Intel may make changes to specifications, product descriptions, and plans at any time, without notice.
Third-party brands and marks are the property of their respective owners. The Intel logo, Intel, Celeron and Pentium are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United states and other countries.
Field Foil ONLY
Marching Orders
· Embedded
Prepare for upgrades in performance to low power platforms
Drive acceptance of the Intel® 6300ESB into embedded market segments
high end solutions endorse Intel® 6300ESB with the Intel® E7520 chipset · For mid-range solutions advocate Intel® 6300ESB with the Intel® 875P chipset · For low-power solutions recommend Intel® 6300ESB with the Intel® 855GME chipset
Intel may make changes to specifications, product descriptions, and plans at any time, without notice.
Roadmaps, dates, product features and code names are subject to change without notification
The Intel logo, Intel, Xeon, Celeron and Pentium are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United states and other countries.
Infrastructure Processor Division Embedded IA Silicon Roadmap
Embedded IA Roadmap Summary
Performance
Intel® Xeon Processor
Intel® E7520 / Intel® 6300ESB
Performance
Mid-Power
LV Intel® Xeon Processor
Intel® E7501 chipset
Low Voltage Intel® Xeon Processor
Intel® E7520 / Intel® 6300ESB
Intel® Pentium® M Processor
Intel® E7501 chipset
Intel® Pentium® M Processor
Intel® E7520 Chipset
Ultra Dense
LV Intel® Pentium® M
Intel® E7501 chipset
Intel® Pentium® M Processor LV Intel® E7501 chipset Intel® Pentium® 4 Processor
Intel® 915GV
Intel® Pentium® M Processor
Intel® E7320 Chipset
Scalable
Performance Value
Intel® Pentium® 4 Processor 478 mPGA,
Intel® 875P / Intel® 6300ESB
Lakeport-G
Intel® Celeron® D Processor 478 mPGA,
Intel® 875P, 845GV 852GME
Intel® Celeron® D Processor
Intel® 915GV Lakeport-G
Intel® Pentium® M Processor
Intel® 915GM Intel® E7520, Intel® E7320
Performance
Intel® 855GME / Intel® 6300ESB
Low Power
LV Intel® Pentium® M Intel® 855GME / Intel® 6300 ESB
Intel® Pentium® M LV Processor
Intel® 855GME & Intel® 915GM
Intel® Pentium® M LV Processor
Intel® 915GM 400MHz FSB Intel® E7520, Intel® E7320
Value
Mobile Intel® Celeron® Processor Intel® 852GM chipset Intel® Celeron® M Processor
Intel® 855GME / Intel® 6300ESB
Value Dothan Processor
Intel® 855GME, Intel® 915GM Intel® E7320
Micro-power
ULV Intel® Celeron® M Processor
Intel® 855GME / Intel® 6300ESB
ULV Dothan Processor
Intel may make changes to specifications, product descriptions, and plans at any time, without notice.
Embedded IA Performance Roadmap
Shipping
Intel® Xeon Processor
Intel® Xeon Processor 3.2 / 800
LV Intel® Xeon Processor
LV Intel® Xeon Processor 2.8 / 800
FC-mPGA4 (604-pin) Intel® E7520 / 6300ESB
Intel® Pentium® M Processor
Intel® Pentium® M Processor 745
Intel® Pentium® M Processor 760
Intel® E7520 Chipset
LV Intel® Pentium® M Processor
Intel® Pentium® M Processor Low Voltage 738
Intel® E7520 Chipset Intel® E7320 Chipset
Embedded Introduction Date. Processor lifecycles are approximately 5 years from embedded introduction date and are subject to change dependent upon business conditions
The 2.0GHz Intel® Xeon processor is available only in the INT-mPGA package
In planning, not POR
Processor Brand Intel® Pentium® M Processor
Processor Number 760 745
Package BGA / PGA BGA / PGA BGA
Clock Speed 2 GHz 1.8 GHz 1.4 GHz
Front Side Bus 533 MHz 400 MHz 400 MHz
Cache 2MB L2 2MB L2 2MB L2
Intel® Pentium® M Processor LV
Intel may make changes to specifications, product descriptions, and plans at any time, without notice.
Embedded IA Scalable Roadmap
Shipping
Intel® Pentium® 4 Processor with 1MB cache, 90 nm core
Intel® 915GV / ICH6
Lakeport-G
Intel® Pentium® 4 Processor 550
Pentium® 4 Processor
Pentium® 4 Processor-M
Intel® Celeron® Processor
Intel® Celeron® D Processor 335
Intel® 845GV, 852GME, Intel® 875P Chipset
Intel® Celeron® D Processor 340
Intel® 915GV / ICH6
Lakeport-G
Embedded Introduction Date. Processor lifecycles are approximately 5 years from embedded introduction date and are subject to change dependent upon business conditions
In planning, not POR
Processor Brand Intel® Pentium® 4 Processor Intel® Celeron® D Processor
Processor Number 550 340 335
Processor Generation Prescott 90nm Prescott 90nm Prescott 90nm
Package LGA775 LGA775 mPGA478
Clock Speed 3.4 GHz 2.93 GHz 2.8 GHz
Front Side Bus 800 MHz 533 MHz 533 MHz
Cache 1MB L2 256K L2 256K L2
Intel may make changes to specifications, product descriptions, and plans at any time, without notice.
Embedded IA Low Power Roadmap
Shipping
Intel® Pentium® M Processor
Intel® Pentium® M Processor 745
Intel® Pentium® M Processor 760
Intel 855GME / ICH4 or Intel® 6300ESB
LV Intel® Pentium® M Processor
Intel® Pentium® M Low Voltage Processor 738
Intel 855GME / ICH4
Intel 915GM / ICH6M Intel® E7520, Intel® E7320
Intel® Celeron® M Processor 320
Intel Celeron M Processor 370
Intel® 915GM I ICH6M, Intel® E7520, Intel® E7320
ULV Intel® Celeron® M Processor 600MHz / 400FSB
Intel Celeron M Processor ULV 373
Intel® 855GME, Intel® 915GM Chipset Intel® E7320 chipset
Mobile Intel® Celeron® Processor
Future Mobile Intel® Celeron® Processor
Future Chipset In planning, not POR
Embedded Introduction Date. Processor lifecycles are approximately 5 years from embedded introduction date and are subject to change dependent upon business conditions
Processor Brand
Processor Number 760
Processor Generation Dothan 90nm Dothan 90nm Dothan 90nm Dothan 90nm Dothan 90nm Banias 130nm
Package BGA / PGA BGA / PGA BGA BGA BGA / PGA BGA / PGA
Clock Speed 2 GHz 1.8 GHz 1.4 GHz 1.0 GHz 1.5 GHz 1.3 GHz
Front Side Bus 533 MHz 400 MHz 400 MHz 400 MHz 400 MHz 400 MHz
Cache 2MB L2 2MB L2 2MB L2 1MB L2 1MB L2 512KB L2
Intel® Pentium® M Processor Intel® Pentium® M Processor LV Intel® Celeron® M Processor ULV Intel® Celeron® M Processor Intel® Celeron® M Processor ®
Intel may make changes to specifications, product descriptions, and plans at any time, without notice.
Processor Numbering System for Intel® Embedded Silicon Roadmaps
· IPD is adopting the Intel processor numbering system starting with the following segments of the embedded roadmap
· Scalable Performance & Value · Low Power Performance, Value & MicroPower · Performance Ultra Dense
· High Performance and Mid Power roadmap segments utilizing Intel® Xeon Processors will not utilize processor numbering system near term
· This is subject to future change and will be consistent with EPG processor products
· IPD processor numbering system is identical to products on the DPG and MPG roadmaps. Processor feature sets for each brand processor number will remain identical for products on IPD and DPG / MPG roadmaps. · Pay special attention to processor brand being adopted for embedded support the general processor number deltas are within a product brand family only. No feature comparison of processor numbers across brand families can be inferred.
Processor Numbering System for Intel® Embedded Silicon Roadmaps
· Look and feel of embedded processor roadmaps will change over the coming quarters to incorporate processor numbering · Product features for each processor number adopted for embedded lifecycle support will be captured in Product Line Overviews and other roadmap materials over time. · Future products that are specifically IPD developed may or may not adopt the processor numbering system, but roadmap materials will clearly indicate if processor numbering is anticipated.
Embedded IA Sustaining Products Roadmap
Sustaining Roadmap
Tjunction (not case) Mobile Intel® Pentium® III processor at 850 / 700 with Intel® SpeedStep technology BGA (Ball Grid Array) FC-PGA (Flip Chip - Pin Grid Array) HL-PBGA (High Thermal, Low-Profile, Plastic Ball Grid Array) PPGA (Plastic Pin Grid Array) SPGA (Ceramic Staggered Pin Grid Array package-in the pricing guide it may also be referred to as CPGA or C-PGA in a different package)
Embedded IA Sustaining Products Roadmap (cont.)
Sustaining Roadmap
Intel® Pentium® proc . with MMX Tech . - Low Power 266 MHz Intel® Pentium® proc . with MMX Tech . - Low Power 266 MHz Intel® Pentium® proc . with MMX Tech . - Low Power 166 MHz Intel® Pentium® proc . with MMX Tech . - Low Power 166 MHz Intel® Pentium® proc . with MMX Tech . - Low Power 166 MHz Intel® Pentium® processor Intel® Pentium® processor Intel® Pentium® processor Intel® Pentium® processor 166 MHz 133 MHz (Voltage Reduction Tech .) 133 MHz 100 MHz
Tjunction (not case) Mobile Intel® Pentium® III processor at 850 / 700 with Intel® SpeedStep technology BGA (Ball Grid Array) FC-PGA (Flip Chip - Pin Grid Array) HL-PBGA (High Thermal, Low-Profile, Plastic Ball Grid Array) PPGA (Plastic Pin Grid Array) SPGA (Ceramic Staggered Pin Grid Array package-in the pricing guide it may also be referred to as CPGA or C-PGA in a different package)
Embedded Chipset Support
IPD recommends that customers qualify additional FWH vendors for maximum supply flexibility 1 Long life support component for the Intel® Pentium® M processor is the Intel® 855GME and not the Intel® 855GM
The Intel logo, Intel, and MMX are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United states and other countries. Product code names are subject to change without notification.
Infrastructure Processor Division Embedded IA Enabling Roadmap
Embedded Intel® Architecture Development Kits
Shipping
Performance
Intel® Xeon and LV Xeon Processors Intel® E7501 / ICH3S
Marble Canyon 3
Nocona Intel® E7520 / 6300ESB
Wallowa
Intel® Pentium® M Processor Intel® E7501 / ICH3S
Marble Canyon 6
Dothan Intel® E7501 / ICH3S
Marble Canyon 6 Upgrade
LV Nocona Intel® E7520 / 6300ESB
Wallowa Upgrade
Scalable
Intel® Pentium® 4 and Celeron® Processors 845GV / ICH4
Cheesequake
Prescott, Northwood, Willamette Intel® 875P / Hance Rapids
Petosky
Intel® Pentium® 4 Processor Intel® 915GV / ICH6
TGRVPCRB2
Intel® Pentium® M Processor Intel® 855GME / ICH4
Dothan / Value Banias Intel® 855GME / ICH4
Halfdome Upgrade
Low Power
Halfdome
Intel® Pentium® III and Celeron® Processors Intel® 815E / ICH2
Glen Canyon
Intel® Pentium® M Processor Intel® 855GME / Hance Rapids
Fort Bragg
Dothan / Value Banias Intel® 855GME / Hance Rapids
Fort Bragg Upgrade
In planning, not POR
Embedded Intel® Architecture Interactive Clients Reference Design Platforms
Applications: ·POS ·Kiosk ·Gaming terminals ·ATMs ·Thin Clients Segments: ·Retail ·Hospitality ·Financial ·Food Service
Darlington
EmbATX
Seven Pines
EmbATX
Horseshoe Falls
EmbATX
DT Intel®Pentium® 4 Processor or Intel® Pentium® Intel Pentium 4 Processor - M 845E Chipset & Cougar3DR DDR200 / 266 MHz SDRAM 551 / 540 LAN
Intel®Pentium® 4 Processor or Intel® Pentium® Intel® Celeron® Processor Intel® Celeron® 852GME DDR200 / 266 MHz SDRAM Multiple LAN
ULV Intel® Celeron® Processor Intel® Celeron® 815E Chipset SDRAMPC100 / 133 551 LAN
Roadmaps, dates, products, and features are subject to change without notification. Other brands and marks are the property of their respective owners.
Embedded Intel® Architecture Communications Proof-of-Concept Platforms
· Intel Code Name Garnet Canyon Hades Bar Board Name
Intel® E7501 Performance Communications
Key Features
Intel Xeon® Processor (DP), Intel E7501 chipset, 3x GbE & 1x 10 / 100 Intel® Pentium® M Processor, Intel E7501 chipset, 2x GbE & 1x 10 / 100
Form Factor
1U x 12" x 14" 9.6" x 9.6"