(128 (256 (512 (1024 Description AT24C01A/02/04/08A/16A prov

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Two-wire Serial EEPROM
(128 (256 (512 (1024
Description
AT24C01A/02/04/08A/16A provides 1024/2048/4096/8192/16384 bits serial electrically erasable programmable read-only memory (EEPROM) organized 128/256/512/1024/2048 words bits each. device optimized many industrial commercial applications where low-power low-voltage operation essential. AT24C01A/02/04/08A/16A available space-saving 8-lead PDIP, 8-lead JEDEC SOIC, 8-lead MAP, 5-lead SOT23 (AT24C01A/AT24C02/AT24C04), 8lead TSSOP, 8-ball dBGA2 packages accessed Two-wire serial interface. addition, entire family available 2.7V (2.7V 5.5V) 1.8V (1.8V 5.5V) versions. Table Configuration
Name Function Address Inputs Serial Data Serial Clock Input Write Protect Connect Ground Power Supply 8-ball dBGA2
(2048
8-lead TSSOP
8-lead SOIC
AT24C01A AT24C02 AT24C04 AT24C08A AT24C16A
8-lead
Bottom View 8-lead PDIP
Bottom View 5-lead SOT23
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Absolute Maximum Ratings
Operating Temperature.-55°C +125°C Storage Temperature .-65°C +150°C Voltage with Respect Ground -1.0V +7.0V Maximum Operating Voltage 6.25V Output Current. *NOTICE: Stresses beyond those listed under "Absolute Maximum Ratings" cause permanent damage device. This stress rating only functional operation device these other conditions beyond those indicated operational sections this specification implied. Exposure absolute maximum rating conditions extended periods affect device reliability.
Figure Block Diagram
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AT24C01A/02/04/08A/16A
Description
SERIAL CLOCK (SCL): input used positive edge clock data into each EEPROM device negative edge clock data each device. SERIAL DATA (SDA): bidirectional serial data transfer. This open-drain driven wire-ORed with number other open-drain opencollector devices. DEVICE/PAGE ADDRESSES (A2, A0): pins device address inputs that hard wired AT24C01A AT24C02. many eight 1K/2K devices addressed single system (device addressing discussed detail under Device Addressing section). AT24C04 uses inputs hard wire addressing total four devices addressed single system. connect. AT24C08A only uses input hardwire addressing total devices addressed single system. pins connects. AT24C16A does device address pins, which limits number devices single one. pins connects. WRITE PROTECT (WP): AT24C01A/02/04/08A/16A Write Protect that provides hardware data protection. Write Protect allows normal Read/Write operations when connected ground (GND). When Write Protect connected VCC, write protection feature enabled operates shown Table Table Write Protect
Status Part Array Protected 24C01A Full (1K) Array 24C02 Full (2K) Array 24C04 Full (4K) Array 24C08A Full (8K) Array 24C16A Full (16K) Array
Normal Read/Write Operations
Memory Organization
AT24C01A, SERIAL EEPROM: Internally organized with pages bytes each, requires 7-bit data word address random word addressing. AT24C02, SERIAL EEPROM: Internally organized with pages bytes each, requires 8-bit data word address random word addressing. AT24C04, SERIAL EEPROM: Internally organized with pages bytes each, requires 9-bit data word address random word addressing. AT24C08A, SERIAL EEPROM: Internally organized with pages bytes each, requires 10-bit data word address random word addressing. AT24C16A, SERIAL EEPROM: Internally organized with pages bytes each, requires 11-bit data word address random word addressing.
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Table Capacitance(1) Applicable over recommended operating range from 25°C, MHz, +1.8V
Symbol CI/O Note: Test Condition Input/Output Capacitance (SDA) Input Capacitance (A0, SCL) This parameter characterized 100% tested. Units Conditions VI/O
Table Characteristics Applicable over recommended operating range from: -40°C +85°C, +1.8V +5.5V, +1.8V +5.5V (unless otherwise noted)
Symbol VCC1 VCC2 VCC3 ISB1 ISB2 ISB3 ISB4 VOL2 VOL1 Note: Parameter Supply Voltage Supply Voltage Supply Voltage Supply Current 5.0V Supply Current 5.0V Standby Current 1.8V Standby Current 2.5V Standby Current 2.7V Standby Current 5.0V Input Leakage Current Output Leakage Current Input Level(1) Input High Level(1) Output Level 3.0V Output Level 1.8V 0.15 READ WRITE VOUT -0.6 Test Condition 0.10 0.05 18.0 Units
reference only tested.
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Table Characteristics Applicable over recommended operating range from -40°C +85°C, +1.8V +5.5V, +2.7V +5.5V, Gate (unless otherwise noted)
1.8-volt Symbol fSCL tLOW tHIGH tBUF tHD.STA tSU.STA tHD.DAT tSU.DAT tSU.STO Endurance(1) Note: Parameter Clock Frequency, Clock Pulse Width Clock Pulse Width High Noise Suppression Time
2.7, 5.0-volt Units Write Cycles
Clock Data Valid Time must free before transmission start(1) Start Hold Time Start Setup Time Data Hold Time Data Setup Time Inputs Rise Time(1) Inputs Fall Time(1) Stop Setup Time Data Hold Time Write Cycle Time 5.0V, 25°C, Byte Mode
This parameter characterized.
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Device Operation
CLOCK DATA TRANSITIONS: normally pulled high with external device. Data change only during time periods (see Figure page Data changes during high periods will indicate start stop condition defined below. START CONDITION: high-to-low transition with high start condition which must precede other command (see Figure page STOP CONDITION: low-to-high transition with high stop condition. After read sequence, stop command will place EEPROM standby power mode (see Figure page ACKNOWLEDGE: addresses data words serially transmitted from EEPROM 8-bit words. EEPROM sends zero acknowledge that received each word. This happens during ninth clock cycle. STANDBY MODE: AT24C01A/02/04/08A/16A features low-power standby mode which enabled: upon power-up after receipt STOP completion internal operations. MEMORY RESET: After interruption protocol, power loss system reset, 2wire part reset following these steps: Clock cycles. Look high each cycle while high. Create start condition.
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Timing
Figure SCL: Serial Clock, SDA: Serial Data
Write Cycle Timing
Figure SCL: Serial Clock, SDA: Serial Data
WORDn
STOP CONDITION
START CONDITION
Note:
write cycle time time from valid stop condition write sequence internal clear/write cycle.
Figure Data Validity
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Figure Start Stop Definition
Figure Output Acknowledge
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Device Addressing
EEPROM devices require 8-bit device address word following start condition enable chip read write operation (refer Figure device address word consists mandatory one, zero sequence first four most significant bits shown. This common EEPROM devices. next bits device address bits 1K/2K EEPROM. These bits must compare their corresponding hard-wired input pins. EEPROM only uses device address bits with third being memory page address bit. device address bits must compare their corresponding hard-wired input pins. connect. EEPROM only uses device address with next bits being memory page addressing. must compare corresponding hard-wired input pin. pins connect. does device address bits instead bits used memory page addressing. These page addressing bits devices should considered most significant bits data word address which follows. pins connect. eighth device address read/write operation select bit. read operation initiated this high write operation initiated this low. Upon compare device address, EEPROM will output zero. compare made, chip will return standby state.
Write Operations
BYTE WRITE: write operation requires 8-bit data word address following device address word acknowledgment. Upon receipt this address, EEPROM will again respond with zero then clock first 8-bit data word. Following receipt 8-bit data word, EEPROM will output zero addressing device, such microcontroller, must terminate write sequence with stop condition. this time EEPROM enters internally timed write cycle, nonvolatile memory. inputs disabled during this write cycle EEPROM will respond until write complete (see Figure page 11). PAGE WRITE: 1K/2K EEPROM capable 8-byte page write, devices capable 16-byte page writes. page write initiated same byte write, microcontroller does send stop condition after first data word clocked Instead, after EEPROM acknowledges receipt first data word, microcontroller transmit seven (1K/2K) fifteen (4K, 16K) more data words. EEPROM will respond with zero after each data word received. microcontroller must terminate page write sequence with stop condition (see Figure page 11). data word address lower three (1K/2K) four (4K, 16K) bits internally incremented following receipt each data word. higher data word address bits incremented, retaining memory page location. When word address, internally generated, reaches page boundary, following byte placed beginning same page. more than eight (1K/2K) sixteen (4K, 16K) data words transmitted EEPROM, data word address will "roll over" previous data will overwritten.
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ACKNOWLEDGE POLLING: Once internally timed write cycle started EEPROM inputs disabled, acknowledge polling initiated. This involves sending start condition followed device address word. read/write representative operation desired. Only internal write cycle completed will EEPROM respond with zero allowing read write sequence continue.
Read Operations
Read operations initiated same write operations with exception that read/write select device address word one. There three read operations: current address read, random address read sequential read. CURRENT ADDRESS READ: internal data word address counter maintains last address accessed during last read write operation, incremented one. This address stays valid between operations long chip power maintained. address "roll over" during read from last byte last memory page first byte first page. address "roll over" during write from last byte current page first byte same page. Once device address with read/write select clocked acknowledged EEPROM, current address data word serially clocked out. microcontroller does respond with input zero does generate following stop condition (see Figure page 12). RANDOM READ: random read requires "dummy" byte write sequence load data word address. Once device address word data word address clocked acknowledged EEPROM, microcontroller must generate another start condition. microcontroller initiates current address read sending device address with read/write select high. EEPROM acknowledges device address serially clocks data word. microcontroller does respond with zero does generate following stop condition (see Figure page 12). SEQUENTIAL READ: Sequential reads initiated either current address read random address read. After microcontroller receives data word, responds with acknowledge. long EEPROM receives acknowledge, will continue increment data word address serially clock sequential data words. When memory address limit reached, data word address will "roll over" sequential read will continue. sequential read operation terminated when microcontroller does respond with zero does generate following stop condition (see Figure page 12).
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Figure Device Address
Figure Byte Write
Figure Page Write
DON'T CARE
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Figure Current Address Read
Figure Random Read
DON'T CARE Figure Sequential Read
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AT24C01A Ordering Information(1)
Ordering Code AT24C01A-10PI-2.7 AT24C01A-10SI-2.7 AT24C01A-10TI-2.7 AT24C01A-10PI-1.8 AT24C01A-10SI-1.8 AT24C01A-10TI-1.8 AT24C01A-10PU-2.7(2) AT24C01A-10PU-1.8(2) AT24C01A-10SU-2.7(2) AT24C01A-10SU-1.8(2) AT24C01A-10TU-2.7(2) AT24C01A-10TU-1.8(2) AT24C01A-10TSU-1.8(2) AT24C01AU3-10UU-1.8(2) AT24C01AY1-10YU-1.8(2) AT24C01A-W2.7-11(3) AT24C01A-W1.8-11(3) Notes: Package 5TS1 8U31 Sale Sale Operation Range Industrial Temperature (-40°C 85°C) Industrial Temperature (-40°C 85°C)
Lead-free/Halogen-free/ Industrial Temperature (-40°C 85°C)
Industrial Temperature (-40°C 85°C)
2.7V devices used 4.5V 5.5V range, please refer performance values characteristics table. designates Green Package RoHS compliant. Available waffle pack wafer form; order SL719 wafer form. Bumped available upon request. Please contact Serial EEPROM Marketing.
Package Type 5TS1 8U3-1 8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP) 8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC) 8-lead, Body, Plastic Thin Shrink Small Outline Package (TSSOP) 8-lead, 4.90 3.00 Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP) 5-lead, 2.90 1.60 Body, Plastic Thin Shrink Small Outline Package (SOT23) 8-ball, Ball Grid Away Package (dBGA2) Options -2.7 -1.8 Low-voltage (2.7V 5.5V) Low-voltage (1.8V 5.5V)
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AT24C02 Ordering Information(1)
Ordering Code AT24C02-10PI-2.7 AT24C02N-10SI-2.7 AT24C02-10TI-2.7 AT24C02-10PI-1.8 AT24C02N-10SI-1.8 AT24C02-10TI-1.8 AT24C02-10PU-2.7(2) AT24C02-10PU-1.8(2) AT24C02N-10SU-2.7(2) AT24C02N-10SU-1.8(2) AT24C02-10TU-2.7(2) AT24C02-10TU-1.8(2) AT24C02Y1-10YU-1.8(2) AT24C02-10TSU-1.8(2) AT24C02U3-10UU-1.8(2) AT24C02-W2.7-11(3) AT24C02-W1.8-11(3) Notes: Package 5TS1 8U3-1 Sale Sale Operation Range Industrial Temperature (-40°C 85°C) Industrial Temperature (-40°C 85°C)
Lead-free/Halogen-free/ Industrial Temperature (-40°C 85°C)
Industrial Temperature (-40°C 85°C)
2.7V devices used 4.5V 5.5V range, please refer performance values characteristics table. designates Green Package RoHS compliant. Available waffle pack wafer form; order SL719 wafer form. Bumped available upon request. Please contact Serial EEPROM Marketing.
Package Type 5TS1 8U3-1 8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP) 8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC) 8-lead, Body, Plastic Thin Shrink Small Outline Package (TSSOP) 8-lead, 4.90 3.00 Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP) 5-lead, 2.90 1.60 Body, Plastic Thin Shrink Small Outline Package (SOT23) 8-ball, Ball Grid Away Package (dBGA2) Options -2.7 -1.8 Low-voltage (2.7V 5.5V) Low-voltage (1.8V 5.5V)
AT24C01A/02/04/08A/16A
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AT24C04 Ordering Information(1)
Ordering Code AT24C04-10PI-2.7 AT24C04N-10SI-2.7 AT24C04-10TI-2.7 AT24C04-10PI-1.8 AT24C04N-10SI-1.8 AT24C04-10TI-1.8 AT24C04-10PU-2.7(2) AT24C04-10PU-1.8(2) AT24C04N-10SU-2.7(2) AT24C04N-10SU-1.8(2) AT24C04-10TU-2.7(2) AT24C04-10TU-1.8(2) AT24C04Y1-10YU-1.8(2) AT24C04-10TSU-1.8(2) AT24C04U3-10UU-1.8(2) AT24C04-W2.7-11(3) AT24C04-W1.8-11(3) Notes: Package 5TS1 8U3-1 Sale Sale Operation Range Industrial Temperature (-40°C 85°C) Industrial Temperature (-40°C 85°C)
Lead-free/Halogen-free/ Industrial Temperature (-40°C 85°C)
Industrial Temperature (-40°C 85°C)
2.7V devices used 4.5V 5.5V range, please refer performance values characteristics table. designates Green Package RoHS compliant. Available waffle pack wafer form; order SL719 wafer form. Bumped available upon request. Please contact Serial EEPROM Marketing.
Package Type 5TS1 8U3-1 8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP) 8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC) 8-lead, Body, Plastic Thin Shrink Small Outline Package (TSSOP) 8-lead, 4.90 3.00 Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP) 5-lead, 2.90 1.60 Body, Plastic Thin Shrink Small Outline Package (SOT23) 8-ball, Ball Grid Away Package (dBGA2) Options -2.7 -1.8 Low-voltage (2.7V 5.5V) Low-voltage (1.8V 5.5V)
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AT24C08A Ordering Information(1)
Ordering Code AT24C08A-10PI-2.7 AT24C08AN-10SI-2.7 AT24C08A-10TI-2.7 AT24C08A-10PI-1.8 AT24C08AN-10SI-1.8 AT24C08A-10TI-1.8 AT24C08A-10PU-2.7(2) AT24C08A-10PU-1.8(2) AT24C08AN-10SU-2.7(2) AT24C08AN-10SU-1.8(2) AT24C08A-10TU-2.7(2) AT24C08A-10TU-1.8(2) AT24C08AY1-10YU-1.8(2) AT24C08AY5-10YU-1.8(2) AT24C08AU2-10UU-1.8(2 AT24C08A-W2.7-11(3) AT24C08A-W1.8-11(3) Notes: Package 8U2-1 Sale Sale Operation Range Industrial Temperature (-40°C 85°C) Industrial Temperature (-40°C 85°C)
Lead-free/Halogen-free/ Industrial Temperature (-40°C 85°C)
Industrial Temperature (-40°C 85°C)
2.7V devices used 4.5V 5.5V range, please refer performance values characteristics table. designates Green Package RoHS compliant. Available waffle pack wafer form; order SL719 wafer form. Bumped available upon request. Please contact Serial EEPROM Marketing.
Package Type 8U2-1 8-pin, 0.300" Wide, Plastic Dual Inline Package (PDIP) 8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC) 8-lead, Body, Plastic Thin Shrink Small Outline Package (TSSOP) 8-lead, 4.90 3.00 Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP) 8-lead, 2.00 3.00 Body, Dual Footprint, Non-Leaded, Miniature Array Package (MAP) 8-ball, Ball Grid Array Package (dBGA2) Options -2.7 -1.8 Voltage (2.7V 5.5V) Voltage (1.8V 5.5V)
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AT24C16A Ordering Information(1)
Ordering Code AT24C16A-10PI-2.7 AT24C16AN-10SI-2.7 AT24C16A-10TI-2.7 AT24C16A-10PI-1.8 AT24C16AN-10SI-1.8 AT24C16A-10TI-1.8 AT24C16A-10PU-2.7(2) AT24C16A-10PU-1.8(2) AT24C16AN-10SU-2.7(2) AT24C16AN-10SU-1.8(2) AT24C16A-10TU-2.7(2) AT24C16A-10TU-1.8(2) AT24C16AY1-10YU-1.8(2) AT24C16AY5-10YU-1.8(2) AT24C16AU2-10UU-1.8(2) AT24C16A-W2.7-11(3) AT24C16A-W1.8-11(3) Notes: Package 8U2-1 Sale Sale Operation Range Industrial Temperature (-40°C 85°C) Industrial Temperature (-40°C 85°C)
Lead-free/Halogen-free/ Industrial Temperature (-40°C 85°C)
Industrial Temperature (-40°C 85°C)
2.7V devices used 4.5V 5.5V range, please refer performance values characteristics table. designates Green Package RoHS compliant. Available waffle pack wafer form; order SL719 wafer form. Bumped available upon request. Please contact Serial EEPROM Marketing.
Package Type 8U2-1 8-pin, 0.300" Wide, Plastic Dual Inline Package (PDIP) 8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC) 8-lead, 0.170" Wide, Thin Shrink Small Outline Package (TSSOP) 8-lead, 4.90 3.00 Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP) 8-lead, 2.00 3.00 Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP) 8-ball, Ball Grid Array Package (dBGA2) Options -2.7 -1.8 Voltage (2.7V 5.5V) Voltage (1.8V 5.5V)
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Packaging Information
PDIP
View
View
SYMBOL
COMMON DIMENSIONS (Unit Measure inches) NOTE
0.210 0.195 0.022 0.070 0.045 0.014 0.400
0.115 0.014 0.045 0.030 0.008 0.355 0.005 0.300 0.240
0.130 0.018 0.060 0.039 0.010 0.365
PLCS
0.310 0.250 0.100 0.300
0.325 0.280
Side View
0.150
0.115
0.130
Notes:
This drawing general information only; refer JEDEC Drawing MS-001, Variation additional information. Dimensions measured with package seated JEDEC seating plane Gauge GS-3. dimensions include mold Flash protrusions. Mold Flash protrusions shall exceed 0.010 inch. measured with leads constrained perpendicular datum. Pointed rounded lead tips preferred ease insertion. maximum dimensions include Dambar protrusions. Dambar protrusions shall exceed 0.010 (0.25 mm).
01/09/02 2325 Orchard Parkway Jose, 95131 TITLE 8P3, 8-lead, 0.300" Wide Body, Plastic Dual In-line Package (PDIP) DRAWING REV.
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JEDEC SOIC
View View
SYMBOL COMMON DIMENSIONS (Unit Measure 1.35 0.10 0.31 0.17 4.80 3.81 5.79 1.27 0.40 1.27 1.75 0.25 0.51 0.25 5.00 3.99 6.20 NOTE
Side View
Note: These drawings general information only. Refer JEDEC Drawing MS-012, Variation proper dimensions, tolerances, datums, etc.
10/7/03 1150 Cheyenne Mtn. Blvd. Colorado Springs, 80906 TITLE 8S1, 8-lead (0.150" Wide Body), Plastic Gull Wing Small Outline (JEDEC SOIC) DRAWING REV.
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TSSOP
indicator this corner
View
View
COMMON DIMENSIONS (Unit Measure SYMBOL 2.90 3.00 6.40 4.30 0.80 0.19 4.40 1.00 0.65 0.45 0.60 1.00 0.75 4.50 1.20 1.05 0.30 3.10 NOTE
Side View
Notes: This drawing general information only. Refer JEDEC Drawing MO-153, Variation proper dimensions, tolerances, datums, etc. Dimension does include mold Flash, protrusions gate burrs. Mold Flash, protrusions gate burrs shall exceed 0.15 (0.006 side. Dimension does include inter-lead Flash protrusions. Inter-lead Flash protrusions shall exceed 0.25 (0.010 side. Dimension does include Dambar protrusion. Allowable Dambar protrusion shall 0.08 total excess dimension maximum material condition. Dambar cannot located lower radius foot. Minimum space between protrusion adjacent lead 0.07 Dimension determined Datum Plane 5/30/02
2325 Orchard Parkway Jose, 95131
TITLE 8A2, 8-lead, Body, Plastic Thin Shrink Small Outline Package (TSSOP)
DRAWING
REV.
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INDEX AREA
INDEX AREA
View
View
Bottom View
COMMON DIMENSIONS (Unit Measure
SYMBOL
0.00 4.70 2.80 0.85 0.85 0.25
4.90 3.00 1.00 1.00 0.30 0.65
0.90 0.05 5.10 3.20 1.15 1.15 0.35
NOTE
Side View
0.50
0.60
0.70
2/28/03 2325 Orchard Parkway Jose, 95131 TITLE 8Y1, 8-lead (4.90 3.00 Body) MSOP Array Package (MAP) DRAWING REV.
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5TS1 SOT23
View
View
Seating Plane
Side View
NOTES: This drawing general information only. Refer JEDEC Drawing MO-193, Variation additional information. Dimension does include mold flash, protrusions, gate burrs. Mold flash, protrusions, gate burrs shall exceed 0.15 end. Dimension does include interlead flash protrusion. Interlead flash protrusion shall exceed 0.15 side. package smaller than package bottom. Dimensions determined outermost extremes plastic body exclusive mold flash, burrs, gate burrs, interlead flash, including mismatch between bottom plastic body. These dimensions apply flat section lead between 0.08 0.15 from lead tip. Dimension does include Dambar protrusion. Allowable Dambar protrusion shall 0.08 total excess dimension maximum material condition. Dambar cannot located lower radius foot. Minimum space between protrusion adjacent lead shall less than 0.07 SYMBOL
COMMON DIMENSIONS (Unit Measure 0.00 0.70 0.08 0.90 2.90 2.80 1.60 0.60 0.95 1.90 0.30 0.50 1.10 0.10 1.00 0.20 NOTE
6/25/03 1150 Cheyenne Mtn. Blvd. Colorado Springs, 80906 TITLE 5TS1, 5-lead, 1.60 Body, Plastic Thin Shrink Small Outline Package (SHRINK SOT) DRAWING PO5TS1 REV.
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8U3-1 dBGA2
BALL CORNER
View
BALL CORNER
Side View
(d1)
COMMON DIMENSIONS (Unit Measure (e1) SYMBOL 0.71 0.10 0.40 0.20 0.81 0.15 0.45 0.25 1.50 2.00 0.50 0.25 1.00 0.25 0.91 0.20 0.50 0.30 NOTE
Bottom View
SOLDER BALLS
Dimension measured maximum solder ball diameter. This drawing general information only.
6/24/03 1150 Cheyenne Mtn. Blvd. Colorado Springs, 80906 TITLE 8U3-1, 8-ball, 1.50 2.00 Body, 0.50 pitch, Small Ball Grid Array Package (dBGA2) DRAWING PO8U3-1 REV.
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Atmel Corporation
2325 Orchard Parkway Jose, 95131, Tel: 1(408) 441-0311 Fax: 1(408) 487-2600
Atmel Operations
Memory
2325 Orchard Parkway Jose, 95131, Tel: 1(408) 441-0311 Fax: 1(408) 436-4314
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Theresienstrasse Postfach 3535 74025 Heilbronn, Germany Tel: (49) 71-31-67-0 Fax: (49) 71-31-67-2340 1150 East Cheyenne Mtn. Blvd. Colorado Springs, 80906, Tel: 1(719) 576-3300 Fax: 1(719) 540-1759
Regional Headquarters
Europe
Atmel Sarl Route Arsenaux Case Postale CH-1705 Fribourg Switzerland Tel: (41) 26-426-5555 Fax: (41) 26-426-5500
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0180V-SEEPR-8/05

(128 (256 (512 (1024 Description AT24C01A/02/04/08A/16A prov

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