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Semiconductor MD56V62320 This version: Apr. 1999 MD56V62320
Top Searches for this datasheetE2G1057-29-41 Semiconductor MD56V62320 This version: Apr. 1999 MD56V62320 4-Bank 524,288-Word 32-Bit SYNCHRONOUS DYNAMIC DESCRIPTION MD56V62320 4-bank 524,288-word 32-bit synchronous dynamic RAM, fabricated Oki's CMOS silicon-gate process technology. device operates inputs outputs LVTTL compatible. FEATURES Silicon gate, quadruple polysilicon CMOS, 1-transistor memory cell 4-bank 524,288-word 32-bit configuration power supply, ±0.3 tolerance Input LVTTL compatible Output LVTTL compatible Refresh 4096 cycles/64 Programmable data transfer mode latency Burst length Data scramble (sequential, interleave) auto-refresh, Self-refresh capability Package: 86-pin plastic TSOP (Type (TSOPII86-P-400-0.50-K) (Product MD56V62320-xxTA) indicates speed rank. PRODUCT FAMILY Family MD56V62320-10 Max. Frequency Access Time (Max.) tAC2 tAC3 1/29 Semiconductor CONFIGURATION (TOP VIEW) VCCQ VSSQ VCCQ VSSQ DQM0 DQM2 DQ17 VSSQ DQ18 DQ19 VCCQ DQ20 DQ21 VSSQ DQ22 DQ23 VCCQ DQ24 MD56V62320 DQ16 VSSQ DQ15 DQ14 VCCQ DQ13 DQ12 VSSQ DQ11 DQ10 VCCQ DQM1 DQM3 DQ32 VCCQ DQ31 DQ30 VSSQ DQ29 DQ28 VCCQ DQ27 DQ26 VSSQ DQ25 86-Pin Plastic TSOP (II) Type) Name BA0, Function System Clock Chip Select Clock Enable Address Bank Select Address Address Strobe Column Address Strobe Write Enable Name DQM0 VCCQ VSSQ Function Data Input/Output Mask Data Input/Output Power Supply (3.3 Ground Data Output Power Supply (3.3 Data Output Ground Connection Note: same power supply voltage must provided every VCCQ pin. same voltage level must provided every VSSQ pin. 2/29 MD56V62320 DESCRIPTION Fetches inputs edge. Disables enables device operation asserting deactivating inputs except CLK, CKE, DQM0 Masks system clock deactivate subsequent operation. deactivated, system clock will masked that subsequent operation deactivated. should asserted least cycle prior command. Address column multiplexed. address: RA10 Column address: BA0, DQM0 DQM0 controls DQM1 controls DQM2 controls DQ17 DQM3 controls DQ25 Data inputs/outputs multiplexed same pin. Functionality depends combination. details, function truth table. Bank Access pins. These pins dedicated select banks. 3/29 Semiconductor BLOCK DIAGRAM MD56V62320 CLOCK BUFFER Command Decoding Logic Command Buffers Control Logic BA0, Address Buffers Mode Register Latency Burst controller Column Address Latches Counter Column Decoders Sense Amplifiers DQM0 DQM3 Address Latches Refresh Counter Decoders Word Drivers Memory Cells BANK BANK BANK BANK Input Buffers Input Data Register DQ32 Output Data Register Output Buffers 4/29 MD56V62320 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings Parameter Voltage Relative Supply Voltage Storage Temperature Power Dissipation Short Circuit Current Operating Temperature Symbol VIN, VOUT VCC, VCCQ Tstg Topr Rating -0.5 -0.5 (Voltages referenced VSS) Unit 25°C Recommended Operating Conditions Parameter Power Supply Voltage Input High Voltage Input Voltage Symbol VCC, VCCQ Min. -0.3 Typ. (Voltages referenced Max. Unit Capacitance (VCC ±0.3 25°C, MHz) Parameter Input Capacitance (ADDR) Input Capacitance (CLK, CKE, RAS, CAS, DQM0 Input/Output Capacitance (DQ1 DQ32) Symbol CIN1 CIN2 COUT Min. Max. Unit 5/29 Semiconductor Characteristics Condition Parameter Symbol Others Burst ICC7 Min. Version MD56V62320 Unit Note Max. Output High Voltage Output Voltage Input Leakage Current Output Leakage Current Average Power Supply Current (Operating) Power Supply Current (Stand ICC1 ICC2 Average Power ICC3S Supply Current (Clock Suspension) Average Power Supply Current (Active Stand Power Supply Current (Burst) Power Supply Current (Auto-Refresh) Average Power Supply Current (Self-Refresh) Average Power Supply Current (Power down) ICC3 ICC4 ICC5 ICC6 Notes: Measured with outputs open. address data changed once left unchanged during cycle. address data changed once left unchanged during cycles. 6/29 MD56V62320 Mode Address Keys Latency Reserved Reserved Reserved Reserved Reserved Reserved Burst Type Sequential Interleave Burst Length Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Note: A10, should stay during mode cycle. POWER SEQUENCE With inputs state, turn power supply start system clock. After voltage reached specified level, pause more with input kept state. Issue precharge bank command. Apply auto-refresh eight more times. Enter mode register setting command. 7/29 Semiconductor Characteristics Parameter Clock Cycles Time Access Time from Clock Clock Pulse Time Clock Pulse Time Input Setup Time Input Hold Time Output Impedance Time from Clock Output High Impedance Time from Clock Output Hold from Clock Cycle Time Precharge Time Active Time Delay Time Write Recovery Time Write Command Input Time from Output Bank Active Delay Time Refresh Time Power-down Exit Set-up Time Input Level Transition Time Delay Time (Min.) Clock Disable Time from Data Output High Impedance Time from Data Input Mask Time from Data Input Time from Write Command Data Output High Impedance Time from Precharge Command Active Command Input Time from Mode Register Command Input (Min.) Symbol tOLZ tOHZ tRAS tRCD lOWD tRRD tREF tPDE lCCD lCKE lDOZ lDOD lDWD lROH lMRD MD56V62320-10 Min. Max. MD56V62320 Note Unit Note Cycle Cycle Cycle Cycle Cycle Cycle Cycle Cycle 8/29 Semiconductor Notes measurements assume that reference level timing input signals Output load. Output MD56V62320 access time defined longer than then reference level timing input signals VIL. 9/29 Semiconductor TIMING WAVEFORM MD56V62320 Read Write Cycle (Same Bank) Latency Burst Length tRCD ADDR tOHZ DQM0 Active Read Command Active Write Command Precharge Command Precharge Command 10/29 MD56V62320 Single Read-Write-Read Cycle (Same Page) Latency Burst Length High lCCD ADDR tOLZ tOHZ lOWD DQM0 Active Write Command Precharge Command Read Command Read Command 11/29 Semiconductor *Notes: MD56V62320 When "High" clock transition from "Low" "High", inputs except CKE, DQM0 invalid. When issuing active, read write command, bank selected BA1. Active, read write Bank Bank Bank Bank auto precharge function enabled disabled input when read write command issued. Operation After burst, bank holds idle status. After burst, bank precharged automatically. After burst, bank holds idle status. After burst, bank precharged automatically. After burst, bank holds idle status. After burst, bank precharged automatically. After burst, bank holds idle status. After burst, bank precharged automatically. When issuing precharge command, bank precharged selected A10, inputs. Operation Bank precharged. Bank precharged. Bank precharged. Bank precharged. banks precharged. input data write command latched same clock (Write latency output forced high impedance tOHZ) after DQM0 entry. 12/29 Semiconductor Page Read Write Cycle (Same Bank) Latency Burst Length MD56V62320 ADDR DQM0 *Notes: High Bank Active lCCD lOWD *Note2 *Note1 Read Command Read Command Write Command Write Command Precharge Command write data before burst read ends, DQM0 should asserted three cycles prior write command, avoid contention. assert precharge before burst write ends, wait after last write data input. Input data during precharge input cycle will masked internally. 13/29 ,,,, Semiconductor MD56V62320 Read Write Cycle with Auto Precharge Burst Length High tRRD ADDR Latency QAa0 QAa1 QAa2 QAa3 DDb0 DDb1 DDb2 DDb3 A-Bank Precharge Start DQM0 Latency QAa0 QAa1 QAa2 QAa3 DDb0 DDb1 DDb2 DDb3 A-Bank Precharge Start DQM0 Active (A-Bank) Bank Read with Auto Precharge Bank Write with Auto Precharge Bank Precharge Start Point Active (D-Bank) 14/29 Bank Interleave Random Read Cycle Latency Burst Length ADDR DQM0 MD56V62320 High tRRD QAa0 QAa1 QAa2 QAa3 QCb0 QCb1 QCb2 QCb3 QAc0 QAc1 QAc2 QAc3 Active (A-Bank) Read Command (A-Bank) Read Command (C-Bank) Read Command (A-Bank) Active (C-Bank) Precharge Command (A-Bank) Precharge Command (C-Bank) Active (A-Bank) 15/29 MD56V62320 Bank Interleave Random Write Cycle Latency Burst Length High ADDR DAa0 DAa1 DAa2 DAa3 DBb0 DBb1 DBb2 DBb3 DAc0 DAc1 DQM0 Active (A-Bank) Active (B-Bank) Write Command (A-Bank) Precharge Command (A-Bank) Write Command (B-Bank) Write Command (A-Bank) Active (A-Bank) Precharge Command (A-Bank) Precharge Command (B-Bank) 16/29 Bank Interleave Page Read Cycle Latency Burst Length ADDR DQM0 *Note: MD56V62320 High *Note1 QAa0 QAa1 QAa2 QAa3 QCb0 QCb1 QCb2 QCb3 QAc0 QAc1 QCd0 QCd1 QAe0 QAe1 lROH Active (A-Bank) Active (C-Bank) Read Command (C-Bank) Precharge Command (A-Bank) Read Command (A-Bank) Read Command (C-Bank) Read Command (A-Bank) Read Command (A-Bank) ignored when RAS, high same cycle. 17/29 Semiconductor MD56V62320 Bank Interleave Page Write Cycle Latency Burst Length High ADDR DBa0 DBa1 DBa2 DBa3 DDb0 DDb1 DDb2 DDb3 DBc0 DBc1 DDd0 DQM0 Active (B-Bank) Active (D-Bank) Write Command (D-Bank) Write Command (B-Bank) Write Command (D-Bank) Write Command (B-Bank) Precharge Command (All Banks) 18/29 MD56V62320 Bank Interleave Random Read/Write Cycle Latency Burst Length High ADDR QAa0 QAa1 QAa2 QAa3 DCb0 DCb1 DCb2 DCb3 QAc0 QAc1 QAc2 QAc3 DQM0 Active (A-Bank) Active (C-Bank) Write Command (C-Bank) Read Command (A-Bank) Read Command (A-Bank) Precharge Command (A-Bank) Active (A-Bank) 19/29 Semiconductor Bank Interleave Page Read/Write Cycle Latency Burst Length MD56V62320 High ADDR DQM0 ,,,, CAa0 CDb0 CAc0 QAa0 QAa1 QAa2 QAa3 DDb0 DDb1 DDb2 DDb3 QAc0 QAc1 QAc2 QAc3 Read Command (A-Bank) Write Command (D-Bank) Read Command (A-Bank) 20/29 MD56V62320 Clock Suspension Operation Cycle Latency Burst Length *Note1 *Note1 ADDR *Note4 DQ17 DQ25 *Note4 DQM0 DQM1 DQM2 DQM3 *Notes: *Note3 tOHZ *Note2 Read Active Read Read Command CLOCK Suspension Read Command Write Write CLOCK Command Suspension When deactivated, next clock will ignored. When DQM0 asserted, read data after clock cycles will masked. When DQM0 asserted, write data same clock cycles will masked. When DQM0 High, input/output data will masked. When DQM1 High, input/output data DQ16 will masked. When DQM2 High, input/output data DQ17 DQ24 will masked. When DQM3 High, input/output data DQ25 DQ32 will masked. 21/29 Semiconductor Read Interruption Precharge Command Burst Length MD56V62320 High ADDR Latency *Note1 DQM0 Latency *Note1 DQM0 Active Read Command Precharge Command *Note: precharge asserted before burst read ends, then read data will output after second clock cycle precharge command. 22/29 Semiconductor MD56V62320 Power Down Mode Latency Burst Length *Note1 tPDE *Note2 ADDR DQM0 Active Power-down Entry Power-down Exit Clock Suspention Entry Clock Suspention Exit Read Command Precharge Command *Notes: When banks precharge state, low, then MD56V62320 enters power-down mode maintains mode while low. release circuit from power-down mode, high longer than tPDE (tSI CLK). 23/29 Semiconductor Self Refresh Cycle ADDR DQM0 MD56V62320 Self Refresh Entry Self Refresh Exit Active 24/29 Semiconductor Mode Register Cycle MD56V62320 Auto Refresh Cycle ADDR DQM0 High High lMRD Command Auto Refresh Auto Refresh 25/29 MD56V62320 FUNCTION TRUTH TABLE (Table (1/2) Current State1 Idle Active Read Write Read with Auto Precharge Write with Auto Precharge ADDR Code ILLEGAL ILLEGAL Active Auto-Refresh Self-Refresh Mode Register Write Read Write ILLEGAL Precharge ILLEGAL (Continue Active after Burst ends) (Continue Active after Burst ends) Reserved Term Burst, start Burst Read Term Burst, start Burst Write ILLEGAL Term Burst, execute Precharge ILLEGAL (Continue Active after Burst ends) (Continue Active after Burst ends) Reserved (Term Burst) Active Term Burst, start Burst Read Term Burst, start Burst Write ILLEGAL Term Burst, execute Precharge ILLEGAL (Continue Burst enter Precharge) (Continue Burst enter Precharge) ILLEGAL ILLEGAL ILLEGAL ILLEGAL ILLEGAL (Continue Burst enter Precharge) (Continue Burst enter Precharge) ILLEGAL ILLEGAL ILLEGAL ILLEGAL ILLEGAL Action 26/29 MD56V62320 FUNCTION TRUTH TABLE (Table (2/2) Current State1 Precharge Write Recovery Active Refresh Mode Register Access ABBREVIATIONS Address Column Address Notes: ADDR Idle after Idle after ILLEGAL ILLEGAL ILLEGAL ILLEGAL ILLEGAL ILLEGAL ILLEGAL ILLEGAL ILLEGAL Active after tRCD Active after tRCD ILLEGAL ILLEGAL ILLEGAL ILLEGAL ILLEGAL Idle after Idle after ILLEGAL ILLEGAL ILLEGAL ILLEGAL ILLEGAL ILLEGAL Action Bank Address Auto Precharge OPeration command inputs enabled when high least cycle prior inputs. Illegal bank specified state, legal some cases depending state bank selection. Satisfy timing lCCD prevent contention. bank precharging idle state. Precharges activated bank A10. Illegal bank idle. 27/29 MD56V62320 FUNCTION TRUTH TABLE (Table Current State CKEn-1 Self Refresh Power Down Banks Idle (ABI) CKEn ADDR INVALID Action Exit Self Refresh Exit Self Refresh ILLEGAL ILLEGAL ILLEGAL (Maintain Self Refresh) INVALID Exit Power Down Exit Power Down ILLEGAL ILLEGAL ILLEGAL (Continue power down mode) Refer Table Enter Power Down Enter Power Down ILLEGAL ILLEGAL ILLEGAL Enter Self Refresh ILLEGAL Refer Operations Table Begin Clock Suspend Next Cycle Enable Clock Next Cycle Continue Clock Suspension State Other than Listed Above Note: Power-down self refresh entered only when banks idle state. 28/29 MD56V62320 PACKAGE DIMENSIONS (Unit TSOPII86-P-400-0.50-K Preliminary Mirror finish Package material Lead frame material treatment Solder plate thickness Package weight Epoxy resin alloy Solder plating more TYP. Notes Mounting Surface Mount Type Package SOP, QFP, TSOP, TQFP, LQFP, SOJ, (PLCC), SHP, surface mount type packages, which very susceptible heat reflow mounting humidity absorbed storage. Therefore, before perform reflow mounting, contact Oki's responsible sales person product name, package name, number, package code desired mounting conditions (reflow method, temperature times). 29/29 E2Y0002-29-11 NOTICE information contained herein change without notice owing product and/or technical improvements. Before using product, please make sure that information being referred up-to-date. outline action examples application circuits described herein have been chosen explanation standard action performance product. When planning product, please ensure that external conditions reflected actual circuit, assembly, program designs. When designing your product, please product below specified maximum ratings within specified operating ranges including, limited operating voltage, power dissipation, operating temperature. assumes responsibility liability whatsoever failure unusual unexpected operation resulting from misuse, neglect, improper installation, repair, alteration accident, improper handling, unusual physical electrical stress including, limited exposure parameters beyond specified maximum ratings operation outside specified operating range. Neither indemnity against license third party's industrial intellectual property right, etc. granted connection with product and/or information drawings contained herein. responsibility assumed infringement third party's right which result from thereof. products listed this document intended general electronics equipment commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). These products authorized system application that requires special enhanced quality reliability characteristics system application where failure such system application result loss damage property, death injury humans. Such applications include, limited traffic automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, life-support systems. Certain products this document need government approval before they exported particular countries. purchaser assumes responsibility determining legality export these products will take appropriate necessary steps their expense these. part contents cotained herein reprinted reproduced without prior permission. MS-DOS registered trademark Microsoft Corporation. Copyright 1999 Electric Industry Co., Ltd. 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