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Semiconductor MSM6595A-xxx Semiconductor 1-Mbit Serial Voice


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E2D0038-39-21
Semiconductor MSM6595A-xxx
Semiconductor 1-Mbit Serial Voice
This version: Feb. 1999 MSM6595A-xxx Previous version: May. 1997
GENERAL DESCRIPTION
MSM6595A MSM6595 short process version. MSM6595A serial voice with 1,048,576-word 1-bit configuration. MSM6595A built-in internal address-generating circuit. single, external clock input allows continuous, serial read operations. internal addresses automatically incremented read operation. 1024 words direction 1024 words direction addressed inputting external serial addresses. read playback device with predetermined messages easily configured storing voice data into MSM6595A combining with Oki's recording playback serial register serial register required drive MSM6595A MSM6388 MSM6588. (The MSM6595A does operate without serial register.) major differences between MSM6595A MSM6595 shown below. MSM6595A Characteristics
+85°C Parameter Current consumption Symbol Condition tRDC VDD-0.2 +70°C +85°C Unit
Current consumption
Typical values 25°C.
MSM6595 Characteristics
+85°C Parameter Current consumption Current consumption Symbol Condition tRDC VDD-0.2 Unit
FEATURES
Configuration 1,048,576 words Serial access Read cycle time Shorter-TAT processing Power-supply voltage Package options 18-pin plastic (QFJ18-P-R290-1.27) (Product Name MSM6595A-xxxJS) 24-pin plastic (SOP24-P-430-1.27-K) (Product Name MSM6595A-xxxGS-K) 18-pin plastic (DIP18-P-300-2.54) (Product name MSM6595A-xxxRS) 30-pin plastic SSOP (SSOP30-P-56-0.65-K) (Product name MSM6595A-xxxGS-AK) indicates code number 1/12
Semiconductor
MSM6595A-xxx
BLOCK DIAGRAM
SADX
X-ADDRESS COUNTER
X-DECODER
X-ADDRESS REGISTER
Memory Cell Matrix 131072 TEST TEST TESTO1 TESTO2
SASX SADY
Y-DECODER
MULTIPLEXER
Y-ADDRESS COUNTER
Y-ADDRESS REGISTER
MULTIPLEXER
SASY RDCK
DOUT
CONTROL
2/12
Semiconductor
MSM6595A-xxx
CONFIGURATIONS (TOP VIEW)
DOUT
SADY
SASY
TEST SADX SASX
TESTO1 RDCK
TEST TESTO2
SADY SASY TEST SADX SASX
DOUT TESTO1 RDCK TESTO2 TEST
connection 18-Pin Plastic
connection 24-Pin Plastic
SADY SASY TEST SADX SASX
DOUT TESTO1 RDCK TESTO2 TEST
SADY SASY TEST SADX SASX
DOUT TESTO1 RDCK TESTO2 TEST
connection 18-Pin Plastic
connection 30-Pin Plastic SSOP
3/12
Semiconductor
MSM6595A-xxx
DESCRIPTIONS
SSOP
Symbol Type
Description Power supply pin. Insert bypass capacitor more between this pin. Ground (SERIAL ADDRESS) This inputs starting address read operation. Addressing units 1024 words possible. 1024-word address data input 10-bit (AX0 AX9) serial data SADX pin. (SERIAL ADDRESS) This inputs starting address read operation. Addressing units 1024 words possible. 1024-word address data input 10-bit (AY0 AY9) serial data SADY pin. (SERIAL ADDRESS STROBE) This clock input which used store serial address data address into device's internal register. (SERIAL ADDRESS STROBE) This clock input store serial address data address into device's internal register. (ADDRESS TRANSFER STROBE) This input loading serial address data into internal address counter. addresses stored falling edge TAS. (READ CLOCK) This clock input reading information data register. Internal operation starts falling edge RDCK. information data register output DOUT pin. internal address counter automatically incremented falling edge RDCK. (DATA OUT) data output always kept high-impedance state when RDCK kept "H". This reflects level data being read, current data held until RDCK asserted High. (CHIP SELECT) Setting this disables input output pins. This enables parallel multiple serial voice ROMs connecting data output pins. Pins testing. Apply level TEST level TEST pin. Pins testing. Leave these pins open.
SADX
SADY
SASX SASY
RDCK
DOUT
TEST TEST
TESTO1 TESTO2
ABSOLUTE MAXIMUM RATINGS
Parameter Power Supply Voltage Input Voltage Storage Temperature Symbol TSTG Condition 25°C 25°C Rating -0.3 +7.0 -0.3 VDD+0.3 +150 Unit
4/12
Semiconductor
MSM6595A-xxx
RECOMMENDED OPERATING CONDITIONS
Parameter Power Supply Voltage Operating Temperature Symbol Condition GND=0 Range Unit
ELECTRICAL CHARACTERISTICS
Characteristics
+85°C Parameter Level Input Voltage Level Input Voltage Level Output Voltage Level Output Voltage Level Input Current Level Input Current Current Consumption Symbol Condition tRDC VDD-0.2 +70°C +85°C Min. 0.85xVDD VDD-0.3 Typ. Max. 0.15xVDD 0.45 Unit
Current Consumption
Typical values 25°C.
Characteristics
+85°C Parameter Setup Time SASX, SASY Cycle Time SASX, SASY Precharge Time SASX, SASY Pulse Width Address Setup Time Address Hold Time Setup Time TAS, RDCK Setup Time Pulse Width Read Cycle Time Access Time Output Turn-off Delay Time RDCK Precharge Time RDCK Pulse Width Symbol tCSS tSSC tSAP tSAS tATS tTRS tTAS tRDC tACC tOFF tRDP Min. 1000 2500 1000 1500 Max. 1500 Unit
5/12
Serial Address Input Timing
TIMING DIAGRAMS
Semiconductor
SADX SASX tSAS tSAP tCSS tSSC SADY SASY tSAS tSAP tCSS tSSC
tATS tATS tTAS
MSM6595A-xxx
6/12
Read Access Timing
Semiconductor
RDCK
DOUT
tTAS tTRS tRDC tRDP tOFF XnYm XnYm+1 XnYm+2 XnY1023 Xn+1Y0 Xn+1Y1 tACC
MSM6595A-xxx
7/12
Semiconductor
MSM6595A-xxx
APPLICATION CIRCUIT
MSM6588 Playback Storage Example
DVDD DVDD' AVDD MICROCONTROLLER MCUM TEST RSEL1 RSEL2 TEST TEST TEST TEST RESET RWCK DI/O RWCK DOUT AU/D TEST TEST TEST TEST TEST
SADX SASX RDCK DOUT SASY SADY
1-Mbit SERIAL VOICE MSM6595A-xxx
1-Mbit SERIAL REGISTER MSM6389
MSM6389
MSM6588
TEST TEST
MOUT
4.096 DGND
AVDD LOUT AMON FOUT ADIN DGND AOUT Speaker amplifier
AGND
AGND
Note: When MSM6595A driven MSM6388 MSM6588, serial register required. (The MSM6595A does operate without it.) MSM6389 being used serial register above example.
8/12
Semiconductor
MSM6595A-xxx
PACKAGE DIMENSIONS
(Unit
QFJ18-P-R290-1.27
Spherical surface
Package material Lead frame material treatment Solder plate thickness Package weight
Epoxy resin alloy Solder plating more 0.50 TYP.
Notes Mounting Surface Mount Type Package SOP, QFP, TSOP, TQFP, LQFP, SOJ, (PLCC), SHP, surface mount type packages, which very susceptible heat reflow mounting humidity absorbed storage. Therefore, before perform reflow mounting, contact Oki's responsible sales person product name, package name, number, package code desired mounting conditions (reflow method, temperature times).
9/12
Semiconductor
MSM6595A-xxx
(Unit
SOP24-P-430-1.27-K
Mirror finish
Package material Lead frame material treatment Solder plate thickness Package weight
Epoxy resin alloy Solder plating more 0.58 TYP.
Notes Mounting Surface Mount Type Package SOP, QFP, TSOP, TQFP, LQFP, SOJ, (PLCC), SHP, surface mount type packages, which very susceptible heat reflow mounting humidity absorbed storage. Therefore, before perform reflow mounting, contact Oki's responsible sales person product name, package name, number, package code desired mounting conditions (reflow method, temperature times).
10/12
Semiconductor
MSM6595A-xxx
(Unit
DIP18-P-300-2.54
Package material Lead frame material treatment Solder plate thickness Package weight
Epoxy resin alloy Solder plating more 1.30 TYP.
11/12
Semiconductor
MSM6595A-xxx
(Unit
SSOP30-P-56-0.65-K
Mirror finish
Package material Lead frame material treatment Solder plate thickness Package weight
Epoxy resin alloy Solder plating more 0.19 TYP.
Notes Mounting Surface Mount Type Package SOP, QFP, TSOP, TQFP, LQFP, SOJ, (PLCC), SHP, surface mount type packages, which very susceptible heat reflow mounting humidity absorbed storage. Therefore, before perform reflow mounting, contact Oki's responsible sales person product name, package name, number, package code desired mounting conditions (reflow method, temperature times).
12/12
E2Y0002-29-11
NOTICE
information contained herein change without notice owing product and/or technical improvements. Before using product, please make sure that information being referred up-to-date. outline action examples application circuits described herein have been chosen explanation standard action performance product. When planning product, please ensure that external conditions reflected actual circuit, assembly, program designs. When designing your product, please product below specified maximum ratings within specified operating ranges including, limited operating voltage, power dissipation, operating temperature. assumes responsibility liability whatsoever failure unusual unexpected operation resulting from misuse, neglect, improper installation, repair, alteration accident, improper handling, unusual physical electrical stress including, limited exposure parameters beyond specified maximum ratings operation outside specified operating range. Neither indemnity against license third party's industrial intellectual property right, etc. granted connection with product and/or information drawings contained herein. responsibility assumed infringement third party's right which result from thereof. products listed this document intended general electronics equipment commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). These products authorized system application that requires special enhanced quality reliability characteristics system application where failure such system application result loss damage property, death injury humans. Such applications include, limited traffic automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, life-support systems. Certain products this document need government approval before they exported particular countries. purchaser assumes responsibility determining legality export these products will take appropriate necessary steps their expense these. part contents cotained herein reprinted reproduced without prior permission. MS-DOS registered trademark Microsoft Corporation.
Copyright 1999 Electric Industry Co., Ltd.
Printed Japan

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