Semiconductor MSM6597A-xxx Semiconductor 3-Mbit Serial Voice

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Semiconductor MSM6597A-xxx Semiconductor 3-Mbit Serial Voice

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E2D0040-39-22
Semiconductor MSM6597A-xxx
Semiconductor 3-Mbit Serial Voice
This version: Feb. 1999 MSM6597A-xxx Previous version: May. 1997
GENERAL DESCRIPTION
MSM6597A MSM6597 short process version. MSM6597A serial voice with 1,048,576-word 1-bit 3-bank configuration. MSM6597A built-in internal address-generating circuit. single, external clock input allows continuous, serial read operations. internal addresses automatically incremented read operation. 1024 words direction 1024 words direction addressed inputting external serial addresses. Banks switched with CS1, CS2, CS3. read playback device with predetermined messages easily configured storing voice data into MSM6597A combining with Oki's recording playback with Oki's serial registers. serial register required drive MSM6597A when used with MSM6388 MSM6588. (The MSM6597A does operate without serial register.) major differences between MSM6597A MSM6597 shown below. MSM6597A Characteristics
+85°C Parameter Current Consumption Symbol Condition tRDC +70°C +85°C Min. Typ. Max. Unit
Current Consumption
MSM6597 Characteristics
+85C° Parameter Current Consumption Current Consumption Symbol Condition tRDC Min. Typ. Max. Unit
Typical values 25°C
other detailes, refer individual sections this data sheet.
FEATURES
Configuration Serial access Shorter-TAT processing Power-supply voltage Package options 24-pin plastic (SOP24-P-430-1.27-K) 30-pin plastic SSOP (SSOP30-P-56-0.65-K) 1,048,576 words banks Read cycle time single supply (Product name MSM6597A-xxxGS-K) (Product name MSM6597A-xxxGS-AK)
Semiconductor
MSM6597A-xxx
BLOCK DIAGRAM
SADX
X-ADDRESS COUNTER
X-ADDRESS REGISTER
X-DECODER
Memory Cell Matrix 393216 TEST TESTO1 TESTO2
SASX SADY
Y-DECODER
Y-ADDRESS COUNTER
Y-ADDRESS REGISTER
MULTIPLEXER
MULTIPLEXER DOUT
SASY RDCK
CONTROLLER
CONFIGURATION (TOP VIEW)
SADY SASY SADX SASX connection 24-Pin Plastic connection 30-Pin Plastic SSOP
DOUT TESTO1 RDCK TESTO2 TEST
SADY SASY SADX SASX
DOUT TESTO1 RDCK TESTO2 TEST
Semiconductor
MSM6597A-xxx
DESCRIPTIONS
SSOP Symbol Type
Description Power supply pin. Insert bypass capacitor more between this pin. Ground (SERIAL ADDRESS) This inputs starting address read operation. Addressing units 1024 words possible. 1024-word address data input 10-bit (AX0 AX9) serial data SADX pin. (SERIAL ADDRESS) This inputs starting address read operation. Addressing units 1024 words possible. 1024-word address data input 10-bit (AY0 AY9) serial data SADY pin. (SERIAL ADDRESS STROBE) This clock input which used store serial address data address into device's internal register. (SERIAL ADDRESS STROBE) This clock input which used store serial address data address into device's internal register. (ADDRESS TRANSFER STROBE) This input loading serial address data into internal address counter. addresses stored falling edge TAS. (READ CLOCK) This clock input reading information data register. Internal operation starts falling edge RDCK. information data register output DOUT pin. internal address counter automatically incremented falling edge RDCK. (DATA OUT) data output always kept high-impedance state when CS1, CS2, kept when RDCK kept "H". This reflects level data being read, current data hold until RDCH asserted High. (CHIP SELECT) When either CS1, CS2, "L", bank bank bank selected, respectively. Setting three signals disables input output pins. These pins enable parallel multiple serial voice ROMs connecting data output pins. testing. Apply level. Pins testing. Leave these pins open.
SADX
SADY
SASX SASY
RDCK
DOUT
TEST TESTO1 TESTO2
ABSOLUTE MAXIMUM RATINGS
Parameter Power Supply Voltage Input Voltage Storage Temperature Symbol TSTG Condition 25°C 25°C Rating -0.3 +7.0 -0.3 VDD+0.3 +150 Unit
Semiconductor
MSM6597A-xxx
RECOMMENDED OPERATING CONDITIONS
Parameter Power Supply Voltage Operating Temperature Symbol Condition GND=0V Range Unit
ELECTRICAL CHARACTERISTICS
Characteristics
+85°C Parameter Level Input Voltage Level Input Voltage Level Output Voltage Level Output Voltage Level Input Current Level Input Current Current Consumption Symbol Condition tRDC +70°C +85°C Min. 0.8xVDD VDD-0.3 Typ. Max. 0.45 Unit
Current Consumption
Typical values 25°C
Characteristics
+85°C Parameter Setup Time SASX, SASY Cycle Time SASX, SASY Precharge Time SASX, SASY Pulse Width Address Setup Time Address Hold Time Setup Time TAS, RDCK Setup Time Pulse Width Read Cycle Time Access Time Output Turn-off Delay Time RDCK Precharge Time RDCK Pulse Width Symbol tCSS tSSC tSAP tSAS tATS tTRS tTAS tRDC tACC tOFF tRDP Min. 1000 2500 1000 1500 Max. 1500 Unit
Serial Address Input Timing
TIMING DIAGRAMS
Semiconductor
SADX SASX tSAS tSAP tCSS tSSC SADY SASY tSAS tSAP tCSS tSSC
tATS tATS
MSM6597A-xxx
tTAS
Read Access Timing
Semiconductor
RDCK
DOUT
tTAS tTRS tRDC tRDP tOFF XnYm XnYm+1 XnYm+2 XnY1023 Xn+1Y0 Xn+1Y1 tACC
MSM6597A-xxx
Semiconductor
MSM6597A-xxx
APPLICATION CIRCUIT
MSM6588 Playback Storage Example
DVDD DVDD' AVDD
MICROCONTROLLER
RWCK DOUT AU/D TEST TEST TEST TEST TEST SADX SASX RDCK
MSM6389
MCUM TEST RSEL1 RSEL2 TEST TEST TEST TEST RESET
DOUT SASY SADY
MSM6588
TEST
MOUT
4.096 DGND
AOUT
AVDD AGND
LOUT AMON FOUT ADIN DGND
SPEAKER AMPLIFIER AGND
Note: When MSM6597A driven MSM6388 MSM6588, serial register required. (The MSM6597A does operate without it.)
3-Mbit SERIAL VOICE MSM6597A-xxx
RWCK DI/O
Semiconductor
MSM6597A-xxx
PACKAGE DIMENSIONS
(Unit
SOP24-P-430-1.27-K
Mirror finish
Package material Lead frame material treatment Solder plate thickness Package weight
Epoxy resin alloy Solder plating more 0.58 TYP.
Notes Mounting Surface Mount Type Package SOP, QFP, TSOP, TQFP, LQFP, SOJ, (PLCC), SHP, surface mount type packages, which very susceptible heat reflow mounting humidity absorbed storage. Therefore, before perform reflow mounting, contact Oki's responsible sales person product name, package name, number, package code desired mounting conditions (reflow method, temperature times).
Semiconductor
MSM6597A-xxx
(Unit
SSOP30-P-56-0.65-K
Mirror finish
Package material Lead frame material treatment Solder plate thickness Package weight
Epoxy resin alloy Solder plating more 0.19 TYP.
Notes Mounting Surface Mount Type Package SOP, QFP, TSOP, TQFP, LQFP, SOJ, (PLCC), SHP, surface mount type packages, which very susceptible heat reflow mounting humidity absorbed storage. Therefore, before perform reflow mounting, contact Oki's responsible sales person product name, package name, number, package code desired mounting conditions (reflow method, temperature times).
E2Y0002-29-11
NOTICE
information contained herein change without notice owing product and/or technical improvements. Before using product, please make sure that information being referred up-to-date. outline action examples application circuits described herein have been chosen explanation standard action performance product. When planning product, please ensure that external conditions reflected actual circuit, assembly, program designs. When designing your product, please product below specified maximum ratings within specified operating ranges including, limited operating voltage, power dissipation, operating temperature. assumes responsibility liability whatsoever failure unusual unexpected operation resulting from misuse, neglect, improper installation, repair, alteration accident, improper handling, unusual physical electrical stress including, limited exposure parameters beyond specified maximum ratings operation outside specified operating range. Neither indemnity against license third party's industrial intellectual property right, etc. granted connection with product and/or information drawings contained herein. responsibility assumed infringement third party's right which result from thereof. products listed this document intended general electronics equipment commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). These products authorized system application that requires special enhanced quality reliability characteristics system application where failure such system application result loss damage property, death injury humans. Such applications include, limited traffic automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, life-support systems. Certain products this document need government approval before they exported particular countries. purchaser assumes responsibility determining legality export these products will take appropriate necessary steps their expense these. part contents cotained herein reprinted reproduced without prior permission. MS-DOS registered trademark Microsoft Corporation.
Copyright 1999 Electric Industry Co., Ltd.
Printed Japan

Semiconductor MSM6597A-xxx Semiconductor 3-Mbit Serial Voice

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