256K I2CCMOS Serial EEPROM Device Selection Table Part Numbe
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24AA256/24LC256/24FC256
256K I2CCMOS Serial EEPROM
Device Selection Table
Part Number 24AA256 24LC256 24FC256 Note Range 1.8-5.5V 2.5-5.5V 2.5-5.5V Max. Clock Frequency kHz(1) Temp. Ranges
Description
Microchip Technology Inc. 24AA256/24LC256/ 24FC256 (24XX256*) (256 Kbit) Serial Electrically Erasable PROM, capable operation across broad voltage range (1.8V 5.5V). been developed advanced, low-power applications such personal communications data acquisition. This device also page write capability bytes data. This device capable both random sequential reads 256K boundary. Functional address lines allow eight devices same bus, Mbit address space. This device available standard 8-pin plastic DIP, SOIC, TSSOP, MSOP, 14-lead TSSOP packages.
2.5V.
Features
Low-power CMOS technology Maximum write current 5.5V Maximum read current 5.5V Standby current typical 5.5V 2-wire serial interface bus, I2Ccompatible Cascadable eight devices Self-timed ERASE/WRITE cycle 64-byte Page Write mode available write cycle time Hardware write-protect entire array Output slope control eliminate ground bounce Schmitt Trigger inputs noise suppression 1,000,000 erase/write cycles Electrostatic discharge protection 4000V Data retention years 8-pin PDIP, SOIC, TSSOP, MSOP packages 14-lead TSSOP package Standard Pb-free finishes available Temperature ranges: Industrial (I): -40°C +85°C Automotive (E): -40°C +125°C
Block Diagram
A1A2 Generator
Control Logic
Memory Control Logic
XDEC
EEPROM Array Page Latches
YDEC
Sense Amp. Control
Package Types
PDIP/SOIC TSSOP/MSOP TSSOP
*24XX256 used this document generic part number 24AA256/24LC256/24FC256 devices.
2003 Microchip Technology Inc.
24XX256
NOTE: Pins connects MSOP package only.
24XX256
24XX256
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24XX256
24AA256/24LC256/24FC256
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings
.6.5V inputs outputs w.r.t. -0.6V +1.0V Storage temperature .-65°C +150°C Ambient temperature with power applied .-65°C +125°C protection pins NOTICE: Stresses above those listed under "Absolute Maximum Ratings" cause permanent damage device. This stress rating only functional operation device these other conditions above those indicated operational listings this specification implied. Exposure Absolute Maximum Rating conditions extended periods affect device reliability.
TABLE 1-1:
CHARACTERISTICS
Electrical Characteristics: Industrial (I): +1.8V 5.5V Automotive (E): +2.5V 5.5V 0.05 Units 2.5V 2.5V 2.5V (Note) -40°C +85°C -40°C +125°C Conditions
CHARACTERISTICS Param. VHYS
Characteristic SCL, pins: High-level input voltage Low-level input voltage Hysteresis Schmitt Trigger inputs (SDA, pins) Low-level output voltage Input leakage current Output leakage current capacitance (all inputs/outputs)
CIN, COUT Write ICCS
0.40
4.5V 2.5V VCC, VCC, VOUT 5.0V (Note) 25°C, 5.5V, 5.5V -40°C +85°C 5.5V -40°C +125°C 5.5V
Read Operating current Standby current
Note:
This parameter periodically sampled 100% tested.
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TABLE 1-2: CHARACTERISTICS
Electrical Characteristics: Industrial (I): +1.8V 5.5V Automotive (E): +2.5V 5.5V 4000 4700 1300 4000 4700 4000 4000 4700 1300 1300 4700 1300 1000 1000 3500 Units -40°C +85°C -40°C +125°C Conditions 1.8V 2.5V 2.5V 5.5V 2.5V 5.5V 24FC256 1.8V 2.5V 2.5V 5.5V 2.5V 5.5V 24FC256 1.8V 2.5V 2.5V 5.5V 2.5V 5.5V 24FC256 1.8V 2.5V 2.5V 5.5V 2.5V 5.5V 24FC256 except, 24FC256 2.5V 5.5V 24FC256 1.8V 2.5V 2.5V 5.5V 2.5V 5.5V 24FC256 1.8V 2.5V 2.5V 5.5V 2.5V 5.5V 24FC256 (Note 1.8V 2.5V 2.5V 5.5V 2.5V 5.5V 24FC256 1.8V 2.5V 2.5V 5.5V 2.5V 5.5V 24FC256 1.8V 2.5V 2.5V 5.5V 2.5V 5.5V 24FC256 1.8V 2.5V 2.5V 5.5V 2.5V 5.5V 24FC256 2.5V 5.5V 5.5V 24FC256 1.8V 2.5V 2.5V 5.5V 2.5V 5.5V 24FC256 CHARACTERISTICS Param.
FCLK
Characteristic Clock frequency
THIGH
Clock high time
TLOW
Clock time
rise time (Note fall time (Note
THD:STA Start condition hold time
TSU:STA Start condition setup time
THD:DAT Data input hold time TSU:DAT Data input setup time
TSU:STO Stop condition setup time
TSU:WP setup time
THD:WP hold time
Output valid from clock (Note free time: Time must free before transmission start
TBUF
Note 100% tested. total capacitance line transmitter, device must provide internal minimum delay time bridge undefined region (minimum falling edge avoid unintended generation Start Stop conditions. combined VHYS specifications Schmitt Trigger inputs, which provide improved noise spike suppression. This eliminates need specification standard operation. This parameter tested ensured characterization. endurance estimates specific application, please consult Total EnduranceModel, which obtained from Microchip's site: www.microchip.com.
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CHARACTERISTICS (Continued) Param. Electrical Characteristics: Industrial (I): +1.8V 5.5V Automotive (E): +2.5V 5.5V 0.1CB 1,000,000 Units -40°C +85°C -40°C +125°C Conditions except, 24FC256 (Note
Characteristic Output fall time from minimum maximum Input filter spike suppression (SDA pins) Write cycle time (byte page) Endurance
except, 24FC256 (Notes
cycles 25°C (Note
Note 100% tested. total capacitance line transmitter, device must provide internal minimum delay time bridge undefined region (minimum falling edge avoid unintended generation Start Stop conditions. combined VHYS specifications Schmitt Trigger inputs, which provide improved noise spike suppression. This eliminates need specification standard operation. This parameter tested ensured characterization. endurance estimates specific application, please consult Total EnduranceModel, which obtained from Microchip's site: www.microchip.com.
FIGURE 1-1:
TIMING DATA
(protected) (unprotected)
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24AA256/24LC256/24FC256
DESCRIPTIONS
descriptions pins listed Table 2-1.
TABLE 2-1:
Name (NC) (NC)
FUNCTION TABLE
8-pin PDIP 8-pin SOIC 8-pin TSSOP 14-pin TSSOP 8-pin MSOP 8-pin Function User Configurable Chip Select User Configurable Chip Select Connected User Configurable Chip Select Ground Serial Data Serial Clock Connected Write-Protect Input +1.8V 5.5V (24AA256) +2.5V 5.5V (24LC256) +2.5V 5.5V (24FC256)
Chip Address Inputs
Serial Clock (SCL)
inputs used 24XX256 multiple device operations. levels these inputs compared with corresponding bits slave address. chip selected compare true. MSOP package only, pins connected. eight devices (two MSOP package) connected same using different Chip Select combinations. these pins left unconnected, inputs will pulled down internally VSS. they tied driven high, internal pull-down circuitry disabled. most applications, chip address inputs hard-wired logic logic `1'. applications which these pins controlled microcontroller other programmable device, chip address pins must driven logic logic before normal device operation proceed.
This input used synchronize data transfer from device.
Write-Protect (WP)
This connected either VSS, left floating. Internal pull-down circuitry this will keep device unprotected state left floating. tied left floating, normal memory operation enabled (read/write entire memory 0000-7FFF). tied VCC, write operations inhibited. Read operations affected.
FUNCTIONAL DESCRIPTION
Serial Data (SDA)
This bidirectional used transfer addresses data into device. open drain terminal. Therefore, requires pull-up resistor (typical kHz, MHz). normal data transfer, allowed change only during low. Changes during high reserved indicating Start Stop conditions.
24XX256 supports bidirectional 2-wire data transmission protocol. device that sends data onto defined transmitter device receiving data receiver. must controlled master device which generates serial clock (SCL), controls access, generates Start Stop conditions while 24XX256 works slave. Both master slave operate transmitter receiver, master device determines which mode activated.
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CHARACTERISTICS
Data Valid
following protocol been defined: Data transfer initiated only when busy. During data transfer, data line must remain stable whenever clock line high. Changes data line, while clock line high, will interpreted Start Stop condition. Accordingly, following conditions have been defined (Figure 4-1). state data line represents valid data when, after Start condition, data line stable duration high period clock signal. data line must changed during period clock signal. There data clock pulse. Each data transfer initiated with Start condition terminated with Stop condition. number data bytes transferred between Start Stop conditions determined master device.
Busy
Acknowledge
Both data clock lines remain high.
Start Data Transfer
high-to-low transition line while clock (SCL) high, determines Start condition. commands must preceded Start condition.
Each receiving device, when addressed, obliged generate Acknowledge signal after reception each byte. master device must generate extra clock pulse which associated with this Acknowledge bit. Note: 24XX256 does generate Acknowledge bits internal programming cycle progress.
Stop Data Transfer
low-to-high transition line, while clock (SCL) high, determines Stop condition. operations must with Stop condition.
device that acknowledges must pull down line during acknowledge clock pulse such that line stable during high period acknowledge related clock pulse. course, setup hold times must taken into account. During reads, master must signal data slave generating Acknowledge last byte that been clocked slave. this case, slave (24XX256) will leave data line high enable master generate Stop condition.
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FIGURE 4-1:
DATA TRANSFER SEQUENCE SERIAL
Start Condition
Address Acknowledge Valid
Data Allowed Change
Stop Condition
FIGURE 4-2:
ACKNOWLEDGE TIMING
Acknowledge
Data from transmitter Transmitter must release line this point, allowing Receiver pull line acknowledge previous eight bits data.
Data from transmitter Receiver must release line this point Transmitter continue sending data.
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DEVICE ADDRESSING
FIGURE 5-1:
control byte first byte received following Start condition from master device (Figure 5-1). control byte consists 4-bit control code. 24XX256, this `1010' binary read write operations. next three bits control byte Chip Select bits (A2, A0). Chip Select bits allow eight 24XX256 devices same used select which device accessed. Chip Select bits control byte must correspond logic levels corresponding pins device respond. These bits are, effect, three Most Significant bits word address. MSOP package, pins connected. During device addressing, Chip Select bits (Figures 5-2) should `0'. Only 24XX256 MSOP packages connected same bus. last control byte defines operation performed. When one, read operation selected. When zero, write operation selected. next bytes received define address first data byte (Figure 5-2). Because only A14.A0 used, upper address bits don't care. upper address bits transferred first, followed less significant bits. Following Start condition, 24XX256 monitors checking device type identifier being transmitted. Upon receiving `1010' code appropriate device select bits, slave device outputs Acknowledge signal line. Depending state bit, 24XX256 will select read write operation.
CONTROL BYTE FORMAT
Read/Write Chip Select Bits
Control Code
Slave Address Start Acknowledge
Contiguous Addressing Across Multiple Devices
Chip Select bits used expand contiguous address space Mbit adding eight 24XX256s same bus. this case, software control byte address A15; address A16; address A17. possible sequentially read across device boundaries. MSOP package, 24XX256 devices added Kbit address space. this case, software control byte address A17. Bits (A15) (A16) control byte must always logic MSOP.
FIGURE 5-2:
ADDRESS SEQUENCE ASSIGNMENTS
ADDRESS HIGH BYTE ADDRESS BYTE
CONTROL BYTE
CONTROL CODE
CHIP SELECT BITS
Don't Care
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WRITE OPERATIONS
Byte Write
Following Start condition from master, control code (four bits), Chip Select (three bits) (which logic low) clocked onto master transmitter. This indicates addressed slave receiver that address high byte will follow after generated Acknowledge during ninth clock cycle. Therefore, next byte transmitted master high-order byte word address will written into address pointer 24XX256. next byte Least Significant Address Byte. After receiving another Acknowledge signal from 24XX256, master device will transmit data word written into addressed memory location. 24XX256 acknowledges again master generates Stop condition. This initiates internal write cycle during this time, 24XX256 will generate Acknowledge signals (Figure 6-1). attempt made write array with held high, device will acknowledge command write cycle will occur, data will written, device will immediately accept command. After byte Write command, internal address counter will point address location following that just written.
pointer bits internally incremented one. master should transmit more than bytes prior generating Stop condition, address counter will roll over previously received data will overwritten. with byte write operation, once Stop condition received, internal write cycle will begin (Figure 6-2). attempt made write array with held high, device will acknowledge command write cycle will occur, data will written device will immediately accept command.
Write-Protection
allows user write-protect entire array (0000-7FFF) when tied VCC. tied left floating, write-protection disabled. sampled Stop every Write command (Figure 1-1). Toggling after Stop will have effect execution write cycle. Note: Page write operations limited writing bytes within single physical page, regardless number bytes actually being written. Physical page boundaries start addresses that integer multiples page buffer size `page size') addresses that integer multiples [page size Page Write command attempts write across physical page boundary, result that data wraps around beginning current page (overwriting data previously stored there), instead being written next page, might expected. therefore, necessary application software prevent page write operations that would attempt cross page boundary.
Page Write
write control byte, word address first data byte transmitted 24XX256 much same byte write. exception that instead generating Stop condition, master transmits additional bytes, which temporarily stored on-chip page buffer will written into memory once master transmitted Stop condition. Upon receipt each word, lower address
FIGURE 6-1:
BYTE WRITE
CONTROL BYTE ADDRESS HIGH BYTE ADDRESS BYTE
ACTIVITY MASTER LINE ACTIVITY don't care
DATA
FIGURE 6-2:
ACTIVITY MASTER LINE ACTIVITY don't care
PAGE WRITE
CONTROL BYTE ADDRESS HIGH BYTE ADDRESS BYTE
DATA BYTE
DATA BYTE
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ACKNOWLEDGE POLLING
FIGURE 7-1:
Since device will acknowledge during write cycle, this used determine when cycle complete (This feature used maximize throughput.) Once Stop condition Write command been issued from master, device initiates internally timed write cycle. polling initiated immediately. This involves master sending Start condition, followed control byte Write command (R/W device still busy with write cycle, then will returned. returned, Start control byte must resent. cycle complete, then device will return master then proceed with next Read Write command. Figure flow diagram.
ACKNOWLEDGE POLLING FLOW
Send Write Command
Send Stop Condition Initiate Write Cycle
Send Start
Send Control Byte with
Device Acknowledge (ACK Next Operation
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READ OPERATION
Random Read
Read operations initiated much same write operations, with exception that control byte `1'. There three basic types read operations: current address read, random read sequential read. Random read operations allow master access memory location random manner. perform this type read operation, word address must first set. This done sending word address 24XX256 part write operation (R/W `0'). Once word address sent, master generates Start condition following acknowledge. This terminates write operation, before internal address pointer set. master then issues control byte again with one. 24XX256 will then issue acknowledge transmit 8-bit data word. master will acknowledge transfer, though does generate Stop condition, which causes 24XX256 discontinue transmission (Figure 8-2). After random Read command, internal address counter will point address location following that just read.
Current Address Read
24XX256 contains address counter that maintains address last word accessed, internally incremented `1'. Therefore, previous read access address legal address), next current address read operation would access data from address Upon receipt control byte with `1', 24XX256 issues acknowledge transmits 8-bit data word. master will acknowledge transfer does generate Stop condition 24XX256 discontinues transmission (Figure 8-1).
Sequential Read
FIGURE 8-1:
CURRENT ADDRESS READ
CONTROL BYTE DATA BYTE
ACTIVITY MASTER LINE ACTIVITY
Sequential reads initiated same random read except that after 24XX256 transmits first data byte, master issues acknowledge opposed Stop condition used random read. This acknowledge directs 24XX256 transmit next sequentially addressed 8-bit word (Figure 8-3). Following final byte transmitted master, master will generate acknowledge will generate Stop condition. provide sequential reads, 24XX256 contains internal address pointer which incremented completion each operation. This address pointer allows entire memory contents serially read during operation. internal address pointer will automatically roll over from address 7FFF address 0000 master acknowledges byte received from array address 7FFF.
FIGURE 8-2:
ACTIVITY MASTER
RANDOM READ
CONTROL BYTE ADDRESS HIGH BYTE ADDRESS BYTE CONTROL BYTE DATA BYTE
LINE ACTIVITY
AAA0
Don't Care
FIGURE 8-3:
ACTIVITY MASTER LINE
SEQUENTIAL READ
CONTROL BYTE DATA DATA DATA DATA
ACTIVITY
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PACKAGING INFORMATION
Package Marking Information
8-Lead PDIP (300 mil) XXXXXXXX T/XXXNNN YYWW Example: 24AA256 I/P017 0310
8-Lead SOIC (150 mil) XXXXXXXX T/XXYYWW
Example: 24LC256 I/SN0310
8-Lead SOIC (208 mil) XXXXXXXX T/XXXXXX YYWWNNN
Example: 24LC256 I/SM 0310017
8-Lead TSSOP XXXX TYWW
Example: I301
Legend:
XX.X
Customer specific information* Temperature grade Year code (last digit calendar year) Year code (last digits calendar year) Week code (week January week `01') Alphanumeric traceability code
Note:In event full Microchip part number cannot marked line, will carried over next line thus limiting number available characters customer specific information. *Standard device marking consists Microchip part number, year code, week code, traceability code. device marking beyond this, certain price adders apply. Please check with your Microchip Sales Office.
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24AA256/24LC256/24FC256
Package Marking Information (Continued)
8-Lead MSOP Example:
XXXXXT YWWNNN
4L256I 101017
8-Lead DFN-S XXXXXXX T/XXXXX YYWW
Example: 24LC256 I/MF YYWW
14-Lead TSSOP
Example:
XXXXXXXT YYWW
24LC256I 0110
TSSOP Package Codes Part 24AA256 24LC256 24FC256 Pb-free G4AD G4LD G4FD
MSOP Package Codes 4A256 4L256 4F256 Pb-free G4AD G4LD G4FD
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8-Lead Plastic Dual In-line (PDIP)
Number Pins Pitch Seating Plane Molded Package Thickness Base Seating Plane Shoulder Shoulder Width Molded Package Width Overall Length Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Spacing Mold Draft Angle Mold Draft Angle Bottom Controlling Parameter Significant Characteristic
Units Dimension Limits
INCHES* .100 .155 .130 .313 .250 .373 .130 .012 .058 .018 .370
.140 .115 .015 .300 .240 .360 .125 .008 .045 .014 .310
.170 .145 .325 .260 .385 .135 .015 .070 .022 .430
MILLIMETERS 2.54 3.56 3.94 2.92 3.30 0.38 7.62 7.94 6.10 6.35 9.14 9.46 3.18 3.30 0.20 0.29 1.14 1.46 0.36 0.46 7.87 9.40
4.32 3.68 8.26 6.60 9.78 3.43 0.38 1.78 0.56 10.92
Notes: Dimensions include mold flash protrusions. Mold flash protrusions shall exceed .010" (0.254mm) side. JEDEC Equivalent: MS-001 Drawing C04-018
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8-Lead Plastic Small Outline (SN) Narrow, (SOIC)
Number Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Mold Draft Angle Bottom Controlling Parameter Significant Characteristic
Units Dimension Limits
.053 .052 .004 .228 .146 .189 .010 .019 .008 .013
INCHES* .050 .061 .056 .007 .237 .154 .193 .015 .025 .009 .017
.069 .061 .010 .244 .157 .197 .020 .030 .010 .020
MILLIMETERS 1.27 1.35 1.55 1.32 1.42 0.10 0.18 5.79 6.02 3.71 3.91 4.80 4.90 0.25 0.38 0.48 0.62 0.20 0.23 0.33 0.42
1.75 1.55 0.25 6.20 3.99 5.00 0.51 0.76 0.25 0.51
Notes: Dimensions include mold flash protrusions. Mold flash protrusions shall exceed .010" (0.254mm) side. JEDEC Equivalent: MS-012 Drawing C04-057
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8-Lead Plastic Small Outline (SM) Medium, (SOIC)
Number Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Mold Draft Angle Bottom Controlling Parameter Significant Characteristic
Units Dimension Limits
.070 .069 .002 .300 .201 .202 .020 .008 .014
INCHES* .050 .075 .074 .005 .313 .208 .205 .025 .009 .017
.080 .078 .010 .325 .212 .210 .030 .010 .020
MILLIMETERS 1.27 1.78 1.97 1.75 1.88 0.05 0.13 7.62 7.95 5.11 5.28 5.13 5.21 0.51 0.64 0.20 0.23 0.36 0.43
2.03 1.98 0.25 8.26 5.38 5.33 0.76 0.25 0.51
Notes: Dimensions include mold flash protrusions. Mold flash protrusions shall exceed .010" (0.254mm) side. Drawing C04-056
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8-Lead Plastic Thin Shrink Small Outline (ST) (TSSOP)
Number Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Molded Package Length Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Mold Draft Angle Bottom Controlling Parameter Significant Characteristic
Units Dimension Limits
INCHES .026
.033 .002 .246 .169 .114 .020 .004 .007
.035 .004 .251 .173 .118 .024 .006 .010
.043 .037 .006 .256 .177 .122 .028 .008 .012
MILLIMETERS* 0.65 1.10 0.85 0.90 0.95 0.05 0.10 0.15 6.25 6.38 6.50 4.30 4.40 4.50 2.90 3.00 3.10 0.50 0.60 0.70 0.09 0.15 0.20 0.19 0.25 0.30
Notes: Dimensions include mold flash protrusions. Mold flash protrusions shall exceed .005" (0.127mm) side. JEDEC Equivalent: MO-153 Drawing C04-086
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14-Lead Plastic Thin Shrink Small Outline (ST) (TSSOP)
Number Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Molded Package Length Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Mold Draft Angle Bottom Controlling Parameter Significant Characteristic
Units Dimension Limits
INCHES .026 .035 .004 .251 .173 .197 .024 .006 .010
.033 .002 .246 .169 .193 .020 .004 .007
.043 .037 .006 .256 .177 .201 .028 .008 .012
MILLIMETERS* 0.65 1.10 0.85 0.90 0.95 0.05 0.10 0.15 6.25 6.38 6.50 4.30 4.40 4.50 4.90 5.00 5.10 0.50 0.60 0.70 0.09 0.15 0.20 0.19 0.25 0.30
Notes: Dimensions include mold flash protrusions. Mold flash protrusions shall exceed .005" (0.127mm) side. JEDEC Equivalent: MO-153 Drawing C04-087
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24AA256/24LC256/24FC256
8-Lead Plastic Micro Small Outline Package (MS) (MSOP)
Number Pins Pitch .026 .043 Overall Height Molded Package Thickness .030 .033 .037 .000 .006 Standoff Overall Width .193 TYP. .118 Molded Package Width .118 Overall Length .016 .024 .031 Foot Length Footprint (Reference) .037 Foot Angle .003 .006 .009 Lead Thickness .009 .012 .016 Lead Width Mold Draft Angle Mold Draft Angle Bottom *Controlling Parameter Notes: Dimensions include mold flash protrusions. Mold flash protrusions shall exceed .010" (0.254mm) side.
Units Dimension Limits
INCHES
MILLIMETERS* 0.65 0.75 0.85 0.00 4.90 3.00 3.00 0.40 0.60 0.95 0.08 0.22
1.10 0.95 0.15
0.80 0.23 0.40
JEDEC Equivalent: MO-187
Drawing C04-111
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24AA256/24LC256/24FC256
8-Lead Plastic Dual Flat Lead Package (MF) Body (DFN-S)
VIEW
EXPOSED METAL PADS BOTTOM VIEW
Units Dimension Limits Number Pins Pitch Overall Height Molded Package Thickness Standoff Base Thickness Overall Length Molded Package Length Exposed Length Overall Width Molded Package Width Exposed Width Lead Width Lead Length Width Mold Draft Angle *Controlling Parameter .085 .014 .020 .152 .000
INCHES .050 .033 .026 .0004 .008 REF. .194 .184 .158 .236 .226 .091 .016 .024 .014 .097 .019 .030 .163 .039 .031 .002
MILLIMETERS* 1.27 0.85 0.65 0.00 0.01 0.20 REF. 4.92 4.67 3.85 4.00 5.99 5.74 2.16 0.35 0.50 2.31 0.40 0.60 .356 2.46 0.47 0.75 4.15 1.00 0.80 0.05
Notes: Dimensions include mold flash protrusions. Mold flash protrusions shall exceed .010" (0.254mm) side. JEDEC equivalent: pending Drawing C04-113
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APPENDIX
Revision Corrections Section 1.0, Electrical Characteristics.
REVISION HISTORY
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NOTES:
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PRODUCT IDENTIFICATION SYSTEM
order obtain information, e.g., pricing delivery, refer factory listed sales office.
PART Device Temperature Range Package Lead Finish
Examples: 24AA256-I/P: Industrial Temp., 1.8V, PDIP package. 24AA256T-I/SN: Tape Reel, Industrial Temp., 1.8V, SOIC package. 24AA256-I/ST: Industrial Temp., 1.8V, TSSOP package. 24AA256-I/MS: Industrial Temp., 1.8V, MSOP package. 24LC256-E/P: Extended Temp., 2.5V, PDIP package. 24LC256-I/SN: Industrial Temp., 2.5V, SOIC package. 24LC256T-I/SN: Tape Reel, Industrial Temp., 2.5V, SOIC package. 24LC256-I/MS: Industrial Temp, 2.5V, MSOP package. 24FC256-I/P: Industrial Temp, 2.5V, High Speed, PDIP package. 24FC256-I/SN: Industrial Temp, 2.5V, High Speed, SOIC package. 24FC256T-I/SN: Tape Reel, Industrial Temp, 2.5V, High Speed, SOIC package 24LC256T-I/STG: Industrial Temp, 2.5V, TSSOP package, Tape Reel, Pb-free
Device:
24AA256: 24AA256T: 24LC256: 24LC256T: 24FC256: 24FC256T:
Kbit 1.8V Serial EEPROM Kbit 1.8V Serial EEPROM Tape Reel) Kbit 2.5V Serial EEPROM Kbit 2.5V Serial EEPROM Tape Reel) Kbit Serial EEPROM Kbit Serial EEPROM Tape Reel)
Temperature Range: Package:
-40°C +85°C -40°C +125°C
ST14
Plastic (300 body), 8-lead Plastic SOIC (150 body), 8-lead Plastic SOIC (208 body), 8-lead Plastic TSSOP (4.4 mm), 8-lead Plastic TSSOP (4.4 mm), 14-lead Dual, Flat, Lead (DFN)(6x5 body), 8-lead Plastic Micro Small Outline (MSOP), 8-lead
Lead Finish
Blank= Standard 63%/37% Sn/Pb Pb-free (Pure Matte
24LC256-I/PG: Industrial Temp, 2.5V, PDIP package, Pb-free
Sales Support
Data Sheets Products supported preliminary Data Sheet have errata sheet describing minor operational differences recommended workarounds. determine errata sheet exists particular device, please contact following: Your local Microchip sales office Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision silicon Data Sheet (include Literature using. Customer Notification System Register site (www.microchip.com/cn) receive most current information products.
2003 Microchip Technology Inc.
DS21203L-page
24AA256/24LC256/24FC256
NOTES:
DS21203L-page
2003 Microchip Technology Inc.
Note following details code protection feature Microchip devices: Microchip products meet specification contained their particular Microchip Data Sheet. Microchip believes that family products most secure families kind market today, when used intended manner under normal conditions. There dishonest possibly illegal methods used breach code protection feature. these methods, knowledge, require using Microchip products manner outside operating specifications contained Microchip's Data Sheets. Most likely, person doing engaged theft intellectual property. Microchip willing work with customer concerned about integrity their code. Neither Microchip other semiconductor manufacturer guarantee security their code. Code protection does mean that guaranteeing product "unbreakable."
Code protection constantly evolving. Microchip committed continuously improving code protection features products. Attempts break microchip's code protection feature violation Digital Millennium Copyright Act. such acts allow unauthorized access your software other copyrighted work, have right relief under that Act.
Information contained this publication regarding device applications like intended through suggestion only superseded updates. your responsibility ensure that your application meets with your specifications. representation warranty given liability assumed Microchip Technology Incorporated with respect accuracy such information, infringement patents other intellectual property rights arising from such otherwise. Microchip's products critical components life support systems authorized except with express written approval Microchip. licenses conveyed, implicitly otherwise, under intellectual property rights.
Trademarks Microchip name logo, Microchip logo, Accuron, dsPIC, KEELOQ, MPLAB, PIC, PICmicro, PICSTART, MATE PowerSmart registered trademarks Microchip Technology Incorporated U.S.A. other countries. AmpLab, FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL Embedded Control Solutions Company registered trademarks Microchip Technology Incorporated U.S.A. Application Maestro, dsPICDEM, dsPICDEM.net, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPIC, Select Mode, SmartSensor, SmartShunt, SmartTel Total Endurance trademarks Microchip Technology Incorporated U.S.A. other countries. Serialized Quick Turn Programming (SQTP) service mark Microchip Technology Incorporated U.S.A. other trademarks mentioned herein property their respective companies. 2003, Microchip Technology Incorporated, Printed U.S.A., Rights Reserved. Printed recycled paper.
Microchip received QS-9000 quality system certification worldwide headquarters, design wafer fabrication facilities Chandler Tempe, Arizona July 1999 Mountain View, California March 2002. Company's quality system processes procedures QS-9000 compliant PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory analog products. addition, Microchip's quality system design manufacture development systems 9001 certified.
2003 Microchip Technology Inc.
DS21203L-page
WORLDWIDE SALES SERVICE
AMERICAS
Corporate Office
2355 West Chandler Blvd. Chandler, 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: 480-792-7627 Address: http://www.microchip.com
ASIA/PACIFIC
Australia
Suite Rawson Street Epping 2121, Australia Tel: 61-2-9868-6733 Fax: 61-2-9868-6755
Korea
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Singapore
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China Beijing
Unit Bldg. Chaoyangmen Beidajie Beijing, 100027, China Tel: 86-10-85282100 Fax: 86-10-85282104
Atlanta
3780 Mansell Road, Suite Alpharetta, 30022 Tel: 770-640-0034 Fax: 770-640-0307
Taiwan
Kaohsiung Branch Chuan Road Kaohsiung 806, Taiwan Tel: 886-7-536-4818 Fax: 886-7-536-4803
Boston
Drive, Suite Westford, 01886 Tel: 978-692-3848 Fax: 978-692-3821
China Chengdu
2401-2402, 24th Floor, Ming Xing Financial Tower TIDU Street Chengdu 610016, China Tel: 86-28-86766200 Fax: 86-28-86766599
Taiwan
Taiwan Branch 11F-3, Tung North Road Taipei, 105, Taiwan Tel: 886-2-2717-7175 Fax: 886-2-2545-0139
Chicago
Pierce Road, Suite Itasca, 60143 Tel: 630-285-0071 Fax: 630-285-0075
China Fuzhou
Unit 28F, World Trade Plaza Wusi Road Fuzhou 350001, China Tel: 86-591-7503506 Fax: 86-591-7503521
Dallas
4570 Westgrove Drive, Suite Addison, 75001 Tel: 972-818-7423 Fax: 972-818-2924
EUROPE
Austria
Durisolstrasse A-4600 Wels Austria Tel: 43-7242-2244-399 Fax: 43-7242-2244-393
China Hong Kong
Unit 901-6, Tower Metroplaza Hing Fong Road Kwai Fong, N.T., Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431
Detroit
Tri-Atria Office Building 32255 Northwestern Highway, Suite Farmington Hills, 48334 Tel: 248-538-2250 Fax: 248-538-2260
Denmark
Regus Business Centre Lautrup Ballerup DK-2750 Denmark Tel: 45-4420-9895 Fax: 45-4420-9910
China Shanghai
Room 701, Bldg. East International Plaza Xian Road Shanghai, 200051 Tel: 86-21-6275-5700 Fax: 86-21-6275-5060
Kokomo
2767 Albright Road Kokomo, 46902 Tel: 765-864-8360 Fax: 765-864-8387
France
Parc d'Activite Moulin Massy Saule Trapu Batiment Etage 91300 Massy, France Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79
Angeles
18201 Karman, Suite 1090 Irvine, 92612 Tel: 949-263-1888 Fax: 949-263-1338
China Shenzhen
1812, 18/F, Building United Plaza 5022 Binhe Road, Futian District Shenzhen 518033, China Tel: 86-755-82901380 Fax: 86-755-8295-1393
Germany
Steinheilstrasse D-85737 Ismaning, Germany Tel: 49-89-627-144-0 Fax: 49-89-627-144-44
Phoenix
2355 West Chandler Blvd. Chandler, 85224-6199 Tel: 480-792-7966 Fax: 480-792-4338
China Shunde
Room 401, Hongjian Building Fengxiangnan Road, Ronggui Town Shunde City, Guangdong 528303, China Tel: 86-765-8395507 Fax: 86-765-8395571
Italy
Quasimodo, 20025 Legnano (MI) Milan, Italy Tel: 39-0331-742611 Fax: 39-0331-466781
Jose
2107 North First Street, Suite Jose, 95131 Tel: 408-436-7950 Fax: 408-436-7955
China Qingdao
B505A, Fullhope Plaza, Hong Kong Central Qingdao 266071, China Tel: 86-532-5027355 Fax: 86-532-5027205
Netherlands
Biesbosch NL-5152 Drunen, Netherlands Tel: 31-416-690399 Fax: 31-416-690340
Toronto
6285 Northam Drive, Suite Mississauga, Ontario 1X5, Canada Tel: 905-673-0699 Fax: 905-673-6509
India
Divyasree Chambers Floor, Wing (A3/A4) O'Shaugnessey Road Bangalore, 025, India Tel: 91-80-2290061 Fax: 91-80-2290062
United Kingdom
Eskdale Road Winnersh Triangle Wokingham Berkshire, England RG41 Tel: 44-118-921-5869 Fax: 44-118-921-5820
07/28/03
Japan
Benex 3-18-20, Shinyokohama Kohoku-Ku, Yokohama-shi Kanagawa, 222-0033, Japan Tel: 81-45-471- 6166 Fax: 81-45-471-6122
DS21203L-page
2003 Microchip Technology Inc.
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