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INCH-POUND MIL-M-38510/323D July 2003 SUPERSEDING MIL-M-38510/323C August 1987 MILITARY SPECIFICATION MICROCIRCUITS, DIGITAL, BIPOLAR, LOW-POWER SCHOTTKY TTL, QUADRUPLE BUFFER GATES WITH THREE STATE OUTPUTS, MONOLITHIC SILICON Inactive design after April 1997. This specification approved Departments Agencies Department Defense. SCOPE Scope. This specification covers detail requirements monolithic silicon, low-power Schottky TTL, quadruple buffer gates with three state outputs. product assurance classes choice case outlines lead finishes provided each type reflected complete part number. this product, requirements MIL-M-38510 have been superseded MIL-PRF-38535, (see 6.3). Part number. part number should accordance with MIL-PRF-38535, specified herein. 1.2.1 Device types. device types should follows: Device type Circuit Quadruple buffer gate (inverting control input) Quadruple buffer gate (noninverting control input)
1.2.2 Device class. device class should product assurance level defined MIL-PRF-38535. 1.2.3 Case outlines. case outlines should designated MIL-STD-1835 follows: Outline letter Descriptive designator GDFP5-F14 CDFP6-F14 GDIP1-T14 CDIP2-T14 GDFP1-F14 CDFP2-F14 CQCC1-N20 Terminals Package style Flat pack Dual-in-line Flat pack Square leadless chip carrier
Beneficial comments (recommendations, additions, deletions) pertinent data which improving this document should addressed Commander, Defense Supply Center Columbus, ATTN: DSCC-VAS, 3990, Columbus, 43216-5000, using self addressed Standardization Document Improvement Proposal Form 1426) appearing this document letter.
AMSC DISTRIBUTION STATEMENT Approved public release; distribution unlimited.
5962
MIL-M-38510/323D
Absolute maximum ratings. Supply voltage range -0.5 +7.0 Input voltage range -1.5 +5.5 Storage temperature range -65° +150°C Maximum power dissipation, (PD) Device type Device type Lead temperature (soldering, seconds) +300°C Thermal resistance, junction case (JC): Cases (See MIL-STD-1835) Junction temperature (TJ) +175°C Recommended operating conditions. level output current (IOL) maximum High level output current (IOH) -1.0 maximum Supply voltage (VCC) minimum maximum Minimum high level input voltage (VIH) Maximum level input voltage (VIL) Case operating temperature range (TC) -55° +125°C APPLICABLE DOCUMENTS Government documents. 2.1.1 Specifications Standards. following specifications standards form part this specification extent specified herein. Unless otherwise specified, issues these documents shall those listed issue Departments Defense Index Specifications Standards (DODISS) supplement thereto, cited solicitation. SPECIFICATION DEPARTMENT DEFENSE MIL-PRF-38535 STANDARDS DEPARTMENT DEFENSE MIL-STD-883 MIL-STD-1835 Test Method Standard Microelectronics. Interface Standard Electronic Component Case Outlines Integrated Circuits (Microcircuits) Manufacturing, General Specification for.
(Unless otherwise indicated, copies above specifications standards available from Standardization Document Order Desk, Robbins Avenue, Building Philadelphia, 19111-5094.) Order precedence. event conflict between text this specification references cited herein, text this document takes precedence. Nothing this document, however, supersedes applicable laws regulations unless specific exemption been obtained.
Must withstand added short-circuit test (e.g., IOS). Maximum junction temperature shall exceeded except accordance with allowable short duration burn-in screening condition accordance with MIL-PRF-38535.
MIL-M-38510/323D
REQUIREMENTS Qualification. Microcircuits furnished under this specification shall products that manufactured manufacturer authorized qualifying activity listing applicable qualified manufacturers list before contract award (see 6.4). Item requirements. individual item requirements shall accordance with MIL-PRF-38535 specified herein modified device manufacturer's Quality Management (QM) plan. modification plan shall affect form, fit, function described herein. Design, construction, physical dimensions. design, construction, physical dimensions shall specified MIL-PRF-38535 herein. 3.3.1 Terminal connections logic diagrams. terminal connections logic diagrams shall specified figure 3.3.2 Truth tables. truth tables shall specified figure 3.3.3 Schematic circuits. schematic circuits shall maintained manufacturer made available qualifying activity preparing activity upon request. 3.3.4 Case outlines. case outlines shall specified 1.2.3. Lead material finish. lead material finish shall accordance with MIL-PRF-38535 (see 6.6). Electrical performance characteristics. electrical performance characteristics specified table apply over full recommended case operating temperature range, unless otherwise specified. Electrical test requirements. electrical test requirements each device class shall subgroups specified table electrical tests each subgroup described table III. Marking. Marking shall accordance with MIL-PRF-38535. Microcircuit group assignment. devices covered this specification shall microcircuit group number (see MIL-PRF-38535, appendix
MIL-M-38510/323D
VERIFICATION Sampling inspection. Sampling inspection procedures shall accordance with MIL-PRF-38535 modified device manufacturer's Quality Management (QM) plan. modification plan shall effect form, fit, function described herein. Screening. Screening shall accordance with MIL-PRF-38535 shall conducted devices prior qualification quality conformance inspection. following additional criteria shall apply: burn-in test duration, test condition, test temperature, approved alternatives shall specified device manufacturer's plan accordance with MIL-PRF-38535. burn-in test circuit shall maintained under document control device manufacturer's Technology Review Board (TRB) accordance with MIL-PRF-38535 shall made available acquiring preparing activity upon request. test circuit shall specify inputs, outputs, biases, power dissipation, applicable, accordance with intent specified test method 1015 MIL-STD-883. Interim final electrical test parameters shall specified table except interim electrical parameters test prior burn-in optional discretion manufacturer. Additional screening space level product shall specified MIL-PRF-38535. Qualification inspection. Qualification inspection shall accordance with MIL-PRF-38535. Technology Conformance Inspection (TCI). Technology conformance inspection shall accordance with MIL-PRF-38535 herein groups inspections (see 4.4.1 through 4.4.4). 4.4.1 Group inspection. Group inspection shall accordance with table MIL-PRF-38535 follows: Tests shall specified table herein. Subgroups shall omitted. 4.4.2 Group inspection. Group inspection shall accordance with table MIL-PRF-38535. 4.4.3 Group inspection. Group inspection shall accordance with table MIL-PRF-38535 follows: End-point electrical parameters shall specified table herein. Subgroups shall added group inspection parameters class devices shall consist tests, conditions, limits specified subgroups group steady-state life test duration, test condition, test temperature, approved alternatives shall specified device manufacturer's plan accordance with MIL-PRF-38535. burn-in test circuit shall maintained under document control device manufacturer's Technology Review Board (TRB) accordance with MIL-PRF-38535 shall made available acquiring preparing activity upon request. test circuit shall specify inputs, outputs, biases, power dissipation, applicable, accordance with intent specified test method 1005 MIL-STD-883. 4.4.4 Group inspection. Group inspection shall accordance with table MIL-PRF-38535. End-point electrical parameters shall specified table herein. Methods inspection. Methods inspection shall specified follows. 4.5.1 Voltage current. voltages given referenced microcircuit ground terminal. Currents given conventional positive when flowing into referenced terminal.
MIL-M-38510/323D TABLE Electrical performance characteristics. Test Input clamp voltage High level output voltage level output voltage Symbol Conditions -55°C +125°C +25°C IIH1 IIH2 IIL1 IIL2 IIL2 Control: Data: IIL3 Control: Data: IIL3 Control Data Control Data -225 -400 -400 -400 Device types Limits -1.5 Unit
state (high impedance state) IO(off)1 output current state (high impedance state) IO(off)2 output current High level input current (all inputs) High level input current (all inputs) level input current control input level input current data input (control high) (circuit only) level input current data input (control low) (circuit only) level input current data input (control low) level input current data input (control high) Supply current Supply current Short circuit output current
footnotes table.
MIL-M-38510/323D TABLE Electrical performance characteristics. Test Propagation delay time (low high level) Propagation delay time (high level) Output enable time high level Output enable time level Output disable time from high level Output disable time from level tPLZ tPHL tPZH tPZL tPHZ Symbol tPLH Conditions Device types Limits Unit
-55°C +125°C
Complete terminal conditions shall specified table III. more than output should shorted time. duration short circuit should exceed seconds.
TABLE Electrical test requirements. Subgroups (see table III) Class Class devices devices
MIL-PRF-38535 test requirements Interim electrical parameters Final electrical test parameters Group test requirements Group electrical test parameters when using method 5005 option Group end-point electrical parameters Additional electrical subgroups group periodic inspections Group end-point electrical parameters
*PDA applies subgroup
MIL-M-38510/323D
Positive logic: Output (disabled) when high.
Positive logic: Output (disabled) when low.
FIGURE Terminal connections logic diagram.
MIL-M-38510/323D
FIGURE Terminal connections logic diagram Continued.
MIL-M-38510/323D
Device type INPUTS
Device type INPUTS
OUTPUT
OUTPUT
high level logic level logic Doesn't matter High impedance (off)
FIGURE Truth tables.
MIL-M-38510/323D
NOTES: ±10% minimum tests. includes scope probe capacitance. Waveform output with internal conditions such that output except when disabled output control. Waveform output with internal conditions such that output high except when disabled output control. examples above, phase relationships between inputs outputs have been chosen arbitrarily. input pulses supplied generators having following characteristics: MHz, ZOUT Vgen between FIGURE Switching time test circuit waveforms.
MIL-M-38510/323D
NOTES: Diodes 1N3064 equivalent. ±10% tPLH, tPHL, tPZL tPZH; minimum tPHZ tPLZ. includes probe capacitance. FIGURE Switching time test circuit waveforms Continued.
TABLE III. Group inspection device type Terminal conditions (pins designated high open).
Measured terminal Limits Unit
Subgroup
Symbol
MIL-STD883 method
25°C
-1.5
3006 3007
IO(off)1
MIL-M-38510/323D
IO(off)2
IIH1
IIH2
IIL1
IIL2
3010 3009
Cases Cases Test
footnotes device type
TABLE III. Group inspection device type Continued. Terminal conditions (pins designated high open).
Measured terminal Limits Unit
Subgroup
MIL-STDSymbol method
25°C
-225
25°C
MIL-M-38510/323D
Cases Cases Test IIL3 3009 3005 3011 Same tests, terminal conditions limits subgroup except +125°C tests omitted. Same tests, terminal conditions limits subgroup except -55°C tests omitted. tPHL 3003 tPLH tPZH tPZL tPHZ tPLZ
footnotes device type
TABLE III. Group inspection device type Continued. Terminal conditions (pins designated high open).
Measured terminal Limits Unit
MIL-STDSymbol method
Cases Subgroup Cases Test tPHL 3003 125°C tPLH tPZH tPZL tPHZ tPLZ Same tests, terminal conditions limits subgroup except -55°C.
MIL-M-38510/323D
Pins referenced
circuits conditions shall circuits conditions shall high open.
Minimum maximum test limits IIL1 IIL3 shall follows:
Tests -1.0/-150 -150/-380 -120/-360 -160/-400
IIL1 IIL3
Circuits 0/-200 0/-200
-160/-400 0/-100
-140/-370 -140/-370
Circuit tests through IOS, -30/max -130
TABLE III. Group inspection device type Terminal conditions (pins designated high -150/-380, open).
Measured terminal Limits Unit
Subgroup
Symbol
MIL-STD883 method -1.5
25°C
3006 3007
IO(off)1
MIL-M-38510/323D
IO(off)2
IIH1
IIH2
IIL1
IIL2
3010 3009
Cases Cases Test
footnotes device type
TABLE III. Group inspection device type Continued. Terminal conditions (pins designated high open).
Measured terminal Limits Unit
Subgroup
MIL-STDSymbol method
25°C
-225
25°C
MIL-M-38510/323D
Cases Cases Test IIL3 3009 3005 3011 Same tests, terminal conditions limits subgroup except +125°C tests omitted. Same tests, terminal conditions limits subgroup except -55°C tests omitted. tPHL 3003 tPLH tPZH tPZL tPHZ tPLZ
footnotes device type
TABLE III. Group inspection device type Continued. Terminal conditions (pins designated high open).
Measured terminal Limits Unit
MIL-STDSymbol method
MIL-M-38510/323D
Cases Subgroup Cases Test tPHL 3003 125°C tPLH tPZH tPZL tPHZ tPLZ Same tests, terminal conditions limits subgroup except -55°C.
Pins referenced
circuits conditions shall high open.
Minimum maximum test limits IIL1 IIL3 shall follows:
Tests -150/-380 -150/-380 -120/-360 -160/-400
IIL1 IIL3
Circuits 0/-200 0/-200
-160/-400 0/-100
-140/-370 -140/-370
MIL-M-38510/323D
PACKAGING Packaging requirements. acquisition purposes, packaging requirements shall specified contract order (see 6.2). When actual packaging materiel performed personnel, these personnel need contact responsible packaging activity ascertain requisite packaging requirements. Packaging requirements maintained Inventory Control Point's packaging activity within Military Department Defense Agency, within Military Department's System Command. Packaging data retrieval available from managing Military Department's Defense Agency's automated packaging files, CD-ROM products, contacting responsible packaging activity. NOTES (This section contains information general explanatory nature which helpful, mandatory.) Intended use. Microcircuits conforming this specification intended original equipment design applications logistic support existing equipment. Acquisition requirements. Acquisition documents should specify following: Title, number, date specification. Complete part number (see 1.2). Requirements delivery copy quality conformance inspection data pertinent device inspection supplied with each shipment device manufacturer, applicable. Requirements certificate compliance, applicable. Requirements notification change product process contracting activity addition notification qualifying activity, applicable. Requirements failure analysis (including required test condition method 5003 MIL-STD-883), corrective action, reporting results, applicable. Requirements product assurance options. Requirements special carriers, lead lengths, lead forming, applicable. These requirements should affect part number. Unless otherwise specified, these requirements will apply direct purchase direct shipment Government. Requirements "JAN" marking.
Superseding information. requirements MIL-M-38510 have been superseded take advantage available Qualified Manufacturer Listing (QML) system provided MIL-PRF-38535. Previous references MIL-M38510 this document have been replaced appropriate references MIL-PRF-38535. technical requirements consist this specification MIL-PRF-38535. MIL-M-38510 specification sheet number have been retained avoid adversely impacting existing government logistics systems contractor's parts lists. Qualification. With respect products requiring qualification, awards will made only products which are, time award contract, qualified inclusion Qualified Manufacturers List QML-38535 whether such products have actually been listed that date. attention contractors called these requirements, manufacturers urged arrange have products that they propose offer Federal Government tested qualification order that they eligible awarded contracts purchase orders products covered this specification. Information pertaining qualification products obtained from DSCC-VQ, 3990 Broad Street, Columbus, Ohio 43123-1199.
MIL-M-38510/323D
Abbreviations, symbols, definitions. abbreviations, symbols, definitions used herein defined MIL-PRF-38535, MIL-HDBK-1331, follows: tPHZ Ground zero voltage potential Voltage level input terminal Current flowing into input terminal Output disable time from high level. time between specified reference points input output voltage waveforms with three state output changing from defined high level high impedance (off) state. Output disable time from level. time between specified reference points input output voltage waveforms with three state output changing from defined level high impedance (off) state. Output enable time high level. time between specified reference points input output voltage waveforms with three state output changing from high impedance (off) state defined high level. Output enable time level. time between specified reference points input output voltage waveforms with three state output changing from high impedance (off) state defined level.
tPLZ
tPZH
tPZL
Logistic support. Lead materials finishes (see 3.4) interchangeable. Unless otherwise specified, microcircuits acquired Government logistic support will acquired device class (see 1.2.2), lead material finish (see 3.4). Longer length leads lead forming should affect part number. Substitutability. cross-reference information below presented convenience users. Microcircuits covered this specification will functionally replace listed generic-industry type. Generic-industry microcircuit types have equivalent operational performance characteristics across military temperature ranges reliability factors equivalent MIL-M-38510 device types have slight physical variations relation case size. presence this information should deemed permitting substitution generic-industry types MIL-M-38510 types waiver provisions MIL-PRF-38535. Military device type Generic-industry type 54LS125A 54LS126
Manufacturers' designation. Manufacturers' circuits which form part this specification designated with shown table herein. TABLE Manufacturers' designations. Circuits Signetics National Texas Corp. Semiconductor Instruments Corp.
Device type
Motorola Inc.
Fairchild Semiconductor
MIL-M-38510/323D
Changes from previous issue. Asterisks used this revision identify changes with respect previous issue extensiveness changes.
Custodians: Army Navy Force
Preparing activity: (Project 5962-1970)
Review activities: Army Navy Force
STANDARDIZATION DOCUMENT IMPROVEMENT PROPOSAL
INSTRUCTIONS
preparing activity must complete blocks block both document number revision letter should given. submitter this form must complete blocks send preparing activity. preparing activity must provide reply within days from receipt form. NOTE: This form used request copies documents, request waivers, clarification requirements current contracts. Comments submitted this form constitute imply authorization waive portion referenced document(s) amend contractual requirements.
RECOMMEND CHANGE:
DOCUMENT TITLE
DOCUMENT NUMBER
DOCUMENT DATE (YYYYMMDD)
MIL-M-38510/323D
2003-07-14
MICROCIRCUITS, DIGITAL, BIPOLAR, LOW-POWER SCHOTTKY TTL, QUADRUPLE BUFFER GATES WITH STATE OUTPUTS, MONOLITHIC SILICON
NATURE CHANGE (Identify paragraph number include proposed rewrite, possible. Attach extra sheets needed.)
REASON RECOMMENDATION
SUBMITTER NAME (Last, First Middle Initial) ADDRESS (Include Code)
ORGANIZATION TELEPHONE (Include Area Code) Commercial applicable) TELEPHONE (Include Area Code Commercial 614-692-0536 DATE SUBMITTED (YYYYMMDD)
PREPARING ACTIVITY NAME Defense Supply Center, Columbus ADDRESS (Include Code) DSCC-VA 3990 Columbus, Ohio 43216-5000
850-0536
RECEIVE REPLY WITHIN DAYS, CONTACT: Defense Standardization Program Office (DLSC-LM) 8725 John Kingman Road, Suite 2533 Fort Belvoir, Virginia 22060-6221 Telephone (703)767-6888 427-6888
PREVIOUS EDITIONS OBSOLETE. WHS/DIOR,
Form 1426, 1999 (EG)
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