32M-BIT Mask organization (byte mode) (word mode) Fast access tim

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32M-BIT Mask organization (byte mode) (word mode) Fast access tim

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MX23L3210
32M-BIT Mask
organization (byte mode) (word mode) Fast access time Random access:70ns (max.) 3.0V~3.6V 90ns (max.) 2.7V~3.6V Current Operating:40mA Standby:15uA Supply voltage 2.7V~3.6V Package (500mil) TSOP (12mm 20mm) TSOP (Type
ORDER INFORMATION
Part MX23L3210MC-10 MX23L3210MC-12 MX23L3210MC-15 MX23L3210TC-70 MX23L3210TC-90 MX23L3210TC-10 MX23L3210TC-12 MX23L3210TC-15 MX23L3210RC-70 MX23L3210RC-90 MX23L3210RC-10 MX23L3210RC-12 MX23L3210RC-15 Access Time 100ns 120ns 150ns 70ns 90ns 100ns 120ns 150ns 70ns 90ns 100ns 120ns 150ns 100ns 120ns Package TSOP TSOP TSOP TSOP TSOP TSOP (Reverse type) TSOP (Reverse type) TSOP (Reverse type) TSOP (Reverse type) TSOP (Reverse type) TSOP TSOP
CONFIGURATION
SOP/ TSOP
BYTE D15/A-1
MX23L3210YC-10 MX23L3210YC-12
DESCRIPTION
Symbol A0~A20 D0~D14 D15/A-1 Byte Function Address Inputs Data Outputs (Word Mode)/ Address (Byte Mode) Chip Enable Input Output Enable Input Word/ Byte Mode Selection Power Supply Ground Connection
MODE SELECTION
P/N:PM0370
MX23L3210
Byte
D15/A-1 Output Input
D0~D7 High High D0~D7 D0~D7
D8~D15 High High D8~D15 High
Mode Word Byte
Power Stand-by Active Active Active
REV. 3.1, 2004
MX23L3210
TSOP (Normal Type)
BYTE
MX23L3210 (Normal Type)
D15/A-1
TSOP (Reverse Type)
D15/A-1
MX23L3210 (Reverse Tpye)
BYTE
P/N:PM0370
REV. 3.1, 2004
MX23L3210
BLOCK DIAGRAM
A0/(A-1) BYTE
Address Buffer
Memory Array
Sense Amplifier
Word/ Byte
Output Buffer
D15/(D7)
ABSOLUTE MAXIMUM RATINGS
Item Voltage Relative Ambient Operating Temperature Storage Temperature Symbol Topr Tstg Ratings -0.3V 3.9V -65° 125°
CHARACTERISTICS 2.7V~3.6V)
Item Output High Voltage Output Voltage Input High Voltage Input Voltage Input Leakage Current Output Leakage Current Operating Current Standby Current (TTL) Standby Current (CMOS) Input Capacitance Output Capacitance Symbol ICC1 ISTB1 ISTB2 COUT MIN. 2.3V 2.1V -0.3V MAX. 0.4V VCC+0.3V 0.2xVCC 40mA 15uA 10pF 10pF Conditions -0.4mA 1.6mA
120ns, output open CE>VCC-0.2V 1MHZ 1MHZ
P/N:PM0370
REV. 3.1, 2004
MX23L3210
CHARACTERISTICS 3.0V~3.6V)
Item Symbol 23L3210-70 MIN. MAX. Read Cycle Time 70ns Address Access Time 70ns Chip Enable Access Time tACE 70ns Output Enable Time 35ns Output Hold After Address Output High Delay 20ns 23L3210-90 MIN. MAX. 90ns 90ns 90ns 45ns 20ns 23L3210-10 MIN. MAX. 100ns 100ns 100ns 50ns 20ns 23L3210-12 MIN. MAX. 120ns 120ns 120ns 60ns 20ns 23L3210-15 MIN. MAX. 150ns 150ns 150ns 70ns 20ns
Note:Output high-impedance delay (tHZ) measured from going high, this parameter guaranteed design over full voltage temperature operating range tested.
Test Conditions
Input Pulse Levels Input Rise Fall Times Input Timing Level Output Timing Level Output Load 0.4V~2.4V 10ns 1.4V Figure
(load)=-0.4mA DOUT (load)=1.6mA
C<100pF
Note:No output loading present tester load board. Active loading used under software programming control. Output loading capacitance includes load board's stray capacitance.
TIMING DIAGRAM
RANDOM READ
tACE
DATA
VALID
VALID
VALID
P/N:PM0370
REV. 3.1, 2004
MX23L3210
PACKAGE INFORMATION
P/N:PM0370
REV. 3.1, 2004
MX23L3210
P/N:PM0370
REV. 3.1, 2004
MX23L3210
P/N:PM0370
REV. 3.1, 2004
MX23L3210
P/N:PM0370
REV. 3.1, 2004
MX23L3210
REVISION HISTORY
REVISION DESCRIPTION CHARACTERISTICS 10ns->0ns 120ns (max.) 3.0V~3.6V 150ns(max.) 2.7V~3.6V characteristics Standby current (ISTB2):5uA->15uA characteristics 120ns 3.0V~3.6V Added access time:100ns Modify Package Information Added 44-pin TSOP(II) Added access time:70ns 90ns Modify Package Information Change 2.7~3.6V 150ns->2.7~3.6V 90ns PAGE P1,3 P1,4 P5,6 P1,7 P1,4 P5~8 DATE JAN/29/1999 Dec/24/1999
JUN/28/2001 JUL/17/2001 MAY/14/2002 NOV/21/2002 MAY/19/2004
P/N:PM0370
REV. 3.1, 2004
MX23L3210
MACRONIX INTERNATIONAL CO., LTD.
Headquarters:
TEL:+886-3-578-6688 FAX:+886-3-563-2888
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http //www.macronix.com
MACRONIX INTERNATIONAL CO., LTD. reserves right change product specifications without notice.

32M-BIT Mask organization (byte mode) (word mode) Fast access tim

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