FN4423.2 Transient Voltage Regulator DeCAPitatorThe Intersil DeCA

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FN4423.2 Transient Voltage Regulator DeCAPitatorThe Intersil DeCA

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HIP6200, HIP6201
FN4423.2
Transient Voltage Regulator DeCAPitatorThe Intersil DeCAPitator helps stabilize power system voltage during severe transients. accomplishes this supplying current when voltage more than sinking current when voltage higher than 1.5% from average load voltage. fast transient response DeCAPitator make slow response time many switching DC-DC converters. Although HIP6200 serves simple replacement large output capacitors dynamic load, especially useful stabilizing core voltage portable computer applications, where size efficiency major concerns. DeCAPitator enables power supply designs more powerful microprocessors without increasing converter size decreasing converter efficiency. DeCAPitator acts independently control circuitry. This simplifies converter layout because DeCAPitator load located separately from DC-DC converter. DeCAPitator should located near load optimum performance.
Features
Saves Power System Size Cost Replaces Expensive Bulk Capacitors Small Lead SOIC Package Linear Regulator Response Greater than 5MHz Bandwidth Very Static Power Dissipation Shutdown Current. Power Dissipated Only During Load Transients Over Temperature Shutdown/Signal Simplifies Power Supply Layout Allows Remotely Located DC-DC Converter
Applications
Notebook Computers Pentium®, Pentium Pro, Pentium Power Supplies
Ordering Information
PART NUMBER HIP6200CB HIP6201CB TEMP. RANGE PACKAGE SOIC SOIC PKG. M8.15 M8.15
Pinouts
HIP6200 (SOIC) VIEW
PVCC PGND EN/OT PVCC PGND
HIP6201 (SOIC) VIEW
Pentium® registered trademark Intel Corporation. DeCAPitatoris trademark Intersil Corporation.
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CAUTION: These devices sensitive electrostatic discharge; follow proper Handling Procedures. 1-888-INTERSIL 321-724-7143 Intersil (and design) trademark Intersil Americas Inc. Copyright Intersil Americas Inc. 2002. Rights Reserved
HIP6200, HIP6201 Typical Application Portable Dynamic Regulator
BATTERY POWER EN/OT 0.99 1.015 LOAD PGND HIP6200 PVCC CONTROLLER
Block Diagram
PVCC
RVCC EN/OT (HIP6200) (HIP6201) POWER-ON RESET (POR) THERMAL MONITOR (TMON)
UPPER COMPARATOR
ENABLE
UPPER AMPLIFIER
LOWER AMPLIFIER 101.5% LOWER COMPARATOR PGND ENABLE RGND ROUT
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HIP6200, HIP6201 Functional Description
PVCC (Pin
PVCC power source transistor output device. PVCC connected internally through resistor. Bulk capacitance should placed between this PGND minimize voltage deviations.
(Pin
remote sense output voltage regulated. output voltage increases rapidly greater than 1.5%, lower amplifier responds turning NChannel MOSFET sink current through PGND. output voltage decreases rapidly greater than upper amplifier responds turning transistor source current from PVCC OUT.
PGND (Pin
PGND power ground N-Channel MOSFET output device. this ground plane circuit board.
(Pin
This output this directly voltage regulated.
(Pin
signal ground this ground plane circuit board.
EN/OT (Pin
This only differentiation between HIP6200 HIP6201. HIP6200, this multiplexed. chip enable also overtemperature indicator. When this low, chip disabled. overtemperature occurs, this will pulled internally. EN/OT pull-up resistor drive with open collector signal. HIP6201, this chip enable only. Pulling disables should driven with logic signal.
(Pin
provides bias power chip. should tied system Provide local decoupling this pin.
(Pin
Connect capacitor internal amplifiers' on-time response rapid voltage change pin.
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HIP6200, HIP6201
Absolute Maximum Ratings
Supply Voltage, PVCC +7.0V CAP, OUT, .GND-0.3V PGND -0.5V +0.5V
Thermal Information
Thermal Resistance (Typical, Note
(oC/W)
Operating Conditions
Supply Voltage, Output Device Supply Voltage, PVCC +4.5V +5.5V Output Voltage, +1.3V +2.0V Load Transient Current Ambient Operating Temperature Range 70oC Junction Temperature Range 125oC
SOIC Package 145oC/W Maximum Junction Temperature 150oC Maximum Storage Temperature Range -65oC 150oC Maximum Lead Temperature (Soldering 10s) 300oC (SOIC Lead Tips Only)
CAUTION: Stresses above those listed "Absolute Maximum Ratings" cause permanent damage device. This stress only rating operation device these other conditions above those indicated operational sections this specification implied.
NOTE: measured with component mounted evaluation board free air.
Electrical Specifications
PARAMETER SUPPLY CURRENT Nominal Supply Shutdown Supply PROTECTION CIRCUITRY Threshold Overtemperature (OT) Threshold On-Resistance NMOS POWER-ON RESET (POR) Rising Threshold Falling Threshold Rising Threshold Falling Threshold Turn-Off Delay Falling Turn-On Delay Rising Turn-Off Delay Turn-On Delay after Turn-Off Delay Turn-On Delay after REFERENCE VOLTAGE VSNS VCAP VCAP VSNS AMPLIFIERS Transconductance Response Time (Rising) Response Time (Falling) RESISTOR VALUES Small Time Constant Resistor Large Time Constant Resistor PVCC Resistor Resistor PGND Resistors
Recommended Operating Conditions, Unless Otherwise Noted SYMBOL TEST CONDITIONS UNITS
IVCC IVCC_SD VTH_EN Rds_TFN VTHH_VCC VTHL_VCC TH_CAP
0.95
1.10 1.05
1.20
VCC, Falling VCC, Rising VCC, Falling VCC, Rising VHIGH VLOW Increased Until Amplifier Turns Decreased Until Amplifier Turns
60mV Step OUT, Time IOUT -60mV Step OUT, Time IOUT RVCC ROUT RGND
3000 1000
4000 1500
5500 2100
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HIP6200, HIP6201 Application Information
Theory Operation
HIP6200 used conjunction with switching DC-DC converter provide regulated voltage. output voltage DC-DC converter changes instantly with sudden load changes characteristic today's microprocessors. This change occurs because bulk capacitors imperfect; they have parasitic resistances (ESR) inductances (ESL) which translate into voltage drops load initially supplied bulk capacitance. Also, output inductor, DC-DC converter takes about 10-20µs (typical) before provides load current required CPU. HIP6200 contains high-speed linear regulators which inactive except during converter response time after high di/dt load transients. When active, linear regulators maintain small difference between desired actual output voltage. Typical Application Diagrams below illustrate DeCAPitator functions. left side shows common DCDC converter response fast `low-to-high' load transient. right side shows similar response with HIP6200 circuit employed. HIP6200 allows fewer bulk capacitors handle regulation requirements high edge-rate load transients. response time HIP6200's linear regulators (100ns typical) fast enough help with leading edge spike. Output voltage deviations during converter response time reduced with HIP6200 since helps supply load while inductor current slews.
Typical Application Diagrams
BATTERY POWER CONTROLLER BATTERY POWER VOUT ICPU CONTROLLER CBULK LOAD CCAP VCAP HIP6201 IOUT ICPU LOAD CBULK VOUT PVCC CPVCC
PGND
CBULK: (11) 220µF, 10V, Tantalums
CBULK: 100µF, 10V, Tantalums CCAP small Ceramic (0805) CVCC: small Ceramic (0805) CPVCC: 100µF, 10V, Tantalum
ICPU
ICPU
VCAP VOUT VOUT
IOUT
CONVERTER RESPONSE TIME (TR)
FIGURE PORTABLE WITHOUT HIP6200, HIP6201
FIGURE PORTABLE WITH HIP6200, HIP6201
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HIP6200, HIP6201 Detailed Functional Description
shown Block Diagram, HIP6200 comparators which compare voltage voltage pin. voltage follows voltage with delay which user programmable also variable depending upon state amplifiers. Normally, resistor parallel with when amplifiers active. small voltage (VCAP) follows voltage (VSNS) closely. During transient, when either amplifier active, switch series with opens alone (with capacitor CAP) sets time constant. Since times larger than RT1, DeCAPitator time source sink current inductor current slews. voltage waveform depicted Typical Application Diagrams. Prior load transient, VCAP follows VOUT (and likewise VSNS) closely. This important many portable applications because DC-DC converter will energy-saving skip-cycle mode light load currents. this mode, output voltage ripple excess could trip HIP6200's comparators VCAP track VSNS. This would turn amplifiers waste power. When fast load transient occurs, VCAP longer follows VOUT DeCAPitator becomes active when VOUT exceeds -1.5% VCAP When DeCAPitator active, either supplies current from PVCC sources current PGND. Because this, high-quality capacitor must placed locally from PVCC GND. system typically good deal bulk capacitance well high frequency decoupling sprinkled across application board. PVCC tied system through on-chip resistor. This resistor helps isolate system from disturbances PVCC HIP6200 power-on reset function which ensures that both some minimum levels before allowing amplifier operation. There also EN(ABLE) pin, allowing users disable HIP6200 desired. overtemperature (OT) shutdown feature ensures that HIP6200 will self-destruct from thermal overload. event will shutdown chip until junction temperature decreases degrees below trip point. DeCAPitator draws very little bias current (300µA typical) when amplifiers inactive. When either amplifier active, chip draws 15-30mA bias current. This current mainly active high-speed amplifier lasts only duration on-time HIP6200. transient specifications. estimated that load transient 0-8A with di/dt 20A/µs, eleven 220µF, tantalum capacitors necessary maintain core voltage regulation specifications. identical conditions with HIP6200 employed, only five 100µF, tantalums required. Similar savings output capacitance achieved with other capacitor dielectrictypes. number capacitors which eliminated output limited either following: Output voltage ripple this increases proportional equivalent bulk output capacitance. This counteracted increasing output inductance. many cases inductor remain same because output ripple will still acceptably small. Leading edge voltage spike this increase with reduced number capacitors. HIP6200 very fast response very effective handling this leading edge spike point. Some additional ceramic decoupling also help.
PVCC Capacitor
100µF, tantalum recommended PVCC application which transients (maximum recommended operation HIP6200). RVCC internal resistor from which decouples PVCC transient from system (VCC
Capacitor
capacitor sets amount time that HIP6200 sink source current response load transient. DeCAPitator on-time should greater than converter response time. When HIP6200's amplifiers active, follows output voltage closely prevent false tripping light loads skip-cycle modes operation. These boundaries addressed with internal HIP6200 must also verified each design. converter response time time interval required inductor current slew output load current. This time dramatically different edges transient event there large differential between input output voltages converter. converter response times approximated L*di/dt:
STEP (EQ.
Component Selection Guidelines
Bulk Output Capacitors
given converter design without HIP6200 target application, number output capacitors determined mainly output voltage regulation 2-446
STEP VOUT
(EQ.
where converter response time low-to-high load transient converter response time high-to-low load transient
HIP6200, HIP6201
LOUT output inductor value ISTEP transient current step amplitude value capacitor should sized that HIP6200 active response transient longer than greater TR2. 1.7V DC-DC converter with inductor maximum transient step size, 2.3µs 14.1µs. Thus, capacitor should chosen worst-case response. Though HIP6200 will active longer than necessary response low-to-high load transient, amount power wasted will minimal. upper amplifier will active, drawing about 15mA, power darlington will pinch after inductor current slews following section details power dissipation further. and:
TIVE Ibias ACTI BIAS -TTR TTRAN (EQ.
IIDLE nominal supply current when HIP6200 powered amplifiers active (300µA typical) IbiasUP upper amplifier bias current when active (15mA typical) IbiasDWN lower amplifier bias current when active (30mA typical) tACTIVE time amplifiers active. This time capacitor should least long TR2. bias power very small percentage total chip power dissipation, included completeness. Based these equations, figures below show power dissipation varies with transient frequency (1/TTRAN), step load change (ISTEP), converter response time (TR1, TR2). Both figures assume VOUT 1.7V. Figure assumes output inductor varies step size well transient frequency). mentioned previous section, these conditions give 2.3µs 14.1µs ISTEP Figure holds ISTEP constant varies response time. converter response time often differs from ideal (Equations substantially therefore should verified experimentally.
Thermal Considerations
HIP6200 Power Dissipation
power dissipated DeCAPitator function many variables. load transient step size (ISTEP), frequency transient events (1/TTRAN converter response time (TR1, TR2) have largest influence. Figure displays these terms.
TTRAN
ICPU
ISTEP
IOUT POWER DISSIPATION ISTEP ISTEP ISTEP
FIGURE IDEALIZED WAVEFORMS DeCAPitator OPERATION
Based some simplifying assumptions, DeCAPitator power dissipation approximated follows:
PDWN (EQ.
where:
TRANSIENT FREQUENCY (Hz)
ISTEP VOUT TRAN
(EQ.
FIGURE ESTIMATED HIP6200, HIP6201 POWER DISSIPATION ISTEP
BIAS BIAS
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ISTEP TTRAN
(EQ.
(EQ.
Figures show relationships between DeCAPitator power dissipation load transient frequency, load transient step size converter response time. power dissipation linear with transient frequency shown scale emphasize fact that HIP6200/1 power minimal frequencies below hundred Hertz.
HIP6200, HIP6201
actual systems, load transient will most likely varying frequency step size. power dissipation HIP6200/1 becomes even more difficult estimate analytically. Example: HIP6200/1 Junction Temperature Calculation TAMBIENT 70oC PDISS 0.2W 100oC/W
15µs, 40µs POWER DISSIPATION 10µs, 30µs 5µs, 20µs 2µs, 10µs
THIP6200 70oC (0.2 100) 90oC similar fashion, could estimate maximum allowable power dissipation given maximum ambient transient loading determine boundary maximum transient frequency. Example Maximum Transient Frequency Calculation TAMBIENT 70oC
THIP6200 110oC 80oC/W (this number dependent upon airflow amount board trace connected HIP6200 PDISS (110oC 70oC)/ (80oC/W) 0.5W From Figures estimated maximum transient frequency obtained seven cases shown. instance, from Figure maximum transient frequency about 4kHz transient step conditions stipulated.
TRANSIENT FREQUENCY (Hz)
FIGURE ESTIMATED HIP6200, HIP6201 POWER DISSIPATION CONVERTER RESPONSE TIME
HIP6200 Temperature Rise
HIP6200/1 junction temperature estimated simply
HIP6200 AMBI DISS (EQ.
where: thermal resistance from junction ambient.
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HIP6200, HIP6201 Layout Considerations
100µ PVCC
FROM CORE VOUT OUTPUT DC-DC (OUTPUT INDUCTOR) BULK OUTPUT CAPACITANCE DC-DC CONVERTER C19-23 100µ C24-26
HIP6201 PGND 8200p
0.1µ
CERAMIC DECOUPLING HIGH di/dt LOAD (MAY REQUIRED)
FIGURE TYPICAL SCHEMATIC
Example Layout
HIP6200 located near bulk output capacitance (not shown microprocessor load itself best performance, HIP6200 bulk output capacitance should located close (+5V bulk cap) located near HIP6200 Solid ground VOUT planes with numerous interconnects
SILK SCREEN COMPONENT SIDE SOLDER SIDE
INTERNAL
NOTE: Internal layers shown negatives (white copper): connection copper plane connection
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FN4423.2 Transient Voltage Regulator DeCAPitatorThe Intersil DeCA

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