PCN# 20050304000 Number: 20050304000 Title: Wafer IOTA A07s
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12500 Boulevard, 8640, Dallas, Texas 75243 PCN# 20050304000 Wafer IOTA A07s Final Change Notification Dear Customer: This final announcement change device that currently offered Texas Instruments. details this change following pages. This notice does apply product end-of-life status. Should product affected previously issued product withdrawal/discontinuance notice, this notification does extend life that product change life time offering/discontinuance plan. changes discussed within this will take affect earlier than days from date this notification. This notification period TI's standard process. negotiated alternative change requirements will provided customer's defined process. Customers with previously negotiated, special requirements will handled separately. inquiries should directed your local Field Sales Representative. questions regarding this notice, contact your local Field Sales Representative Manager Sincerely, Team Business Services Phone: (214) 480-6037 Fax: (214) 480-6659
PCN#
20050304000
Number: 20050304000 Title: Wafer IOTA A07s
Customer Contact: Manager (PCN_ww_admin_team@list.ti.com) Phone:
Date:
(214) 480-6037
03/18/2005
Dept:
Quality Services
Proposed Ship Date: Change Type: Assembly Site Design Test Site Wafer Bump Site Wafer Site
05/02/2005
Estimated Sample Availability date:
08/31/2004
Assembly Process Electrical Specification Packing/Shipping/Labeling Wafer Bump Material Wafer Materials
Assembly Materials Mechanical Specification Test Process Wafer Bump Process Wafer Process
Details
Description Change: initial notification (PCN 20040630000) 06/30/2004, Texas Instruments Incorporated (TI), Wireless Terminals Business Units (WTBU), qualified TID-Freising wafer fabrication facility Germany (FFAB) major wafer source IOTA A07s device. TID-Freising wafer-fab process already used production qualified devices Reason Change: improve production capacity allow more flexibility Product Affected: PTWL3025BGGM PTWL3025BZGM TWL3025BGGM TWL3025BZGM PTWL3025BGGMR PTWL3025BZGMR TWL3025BGGMR TWL3025BZGMR PTWL3025BGQW PTWL3025BZQW TWL3025BGQW TWL3025BZQW PTWL3025BGQWR PTWL3025BZQWR TWL3025BGQWR TWL3025BZQWR Anticipate (positive negative) impact Fit, Form, Function Reliability: None. Process already qualified various Wafer-Fab sites
Qualification Data:
This qualification been specifically developed validation this change. qualification data validates that proposed change meets applicable released technical specifications. Qualification Schedule: Start: 04/29/2004 End: 02/25/2005 Qualification Device Construction Details: Device Device Device Device Device: TWL3025BGGM TWL3025BZGM TWL3025BGQW TWL3025BZQW Wafer Fab: FFAB FFAB FFAB FFAB Wafer Technology: 3370A07s 3370A07s 3370A07s 3370A07s Size: Assembly Site: Taiwan Taiwan Taiwan Taiwan Package Type/Code: U*BGA U*BGA U*BGA JUNIOR U*BGA JUNIOR Package Pins: Mold Compound: CEL9200NT KMC284B CEL9500 CEL9500 Hitachi Shinetsu Hitachi Hitachi Mold Compound Supplier: Composition: NiAu Thin NiAu NiAu Attach: 84-3MV 84-3MV 84-3MV 84-3MV Attach Supplier ABLESTIK ABLESTIK ABLESTIK ABLESTIK Moisture Level: LEVEL3-220C LEVEL3-260C LEVEL3-260C LEVEL3-260C Qualification: Plan Test Results
PCN#
20050304000
Reliability Test
Conditions
(HBM) +/-2.0 (CDM) +/-500V CMOS Latch-up +/-200 I/O, 2xVccmax, 25°C Thermal Shock oC/125 200cyc Temperature Cycle oC/125 1000cyc Temperature Humidity Biased* R.H./85 2.8V/5.5V, 1000Hours Storage Bake* 150oC Bake Hours Autoclave oC/2Atm, Hours Device Characterization Test Program versus device specification Life Test 125oC, 4.0V/7.0V/5.5V, 1000 Hours Notes: Test requires Moisture Preconditioning Qualification tests "pass" zero fails each test Changes product identification resulting from this PCN:
Sample Size (PASS/FAIL) 9*/0 15/0 231/0 231/0 77/0 231/0 231/0 70/0 348/0
T3025BGGM T3025BGQW YMLLLL
YEAR MONTH LLLL TRACE CODE ASSEMBLY SITE CODE WAFER CODE R=FFAB)
questions regarding this notice, e-mails sent regional contacts shown below your local Field Sales Representative. Location Europe Asia Pacific Japan E-Mail PCNAmericasContact@list.ti.com PCNEuropeContact@list.ti.com PCNAsiaContact@list.ti.com PCNJapanContact@list.ti.com
PCN#
20050304000
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