This data sheet provides package information Altera® devices. includes
|
|
|
Top Searches for this datasheet
Altera Device Package Information
This data sheet provides package information Altera® devices. includes these sections:
Device Package Cross Reference (below) Thermal Resistance (starting page Package Outlines (starting page
this data sheet, packages listed order ascending count.
Device Package Cross Reference
Table through show devices available Ball-Grid Array (BGA), Fineline (Fineline BGA®), Ultra Fineline (UBGA), Pin-Grid Array (PGA), Plastic J-Lead Chip Carrier (PLCC), Thin Quad Flat Pack (TQFP), Plastic Quad Flat Pack (PQFP), Ceramic Dual In-Line Package (CerDIP), Hybrid Fineline (HFBGA):
Stratix® series FPGAs Cycloneseries FPGAs MAX® series CPLDs HardCopy® series Structured ASICs APEXseries FPGAs ACEX® FPGAs MercuryFPGAs FLEX® series FPGAs ExcaliburFPGA Enhanced configuration devices
Altera Corporation
DS-PKG-14.2
Altera Device Package Information Data Sheet
Table Stratix Devices Device
EP2S15 Flip Chip FBGA Flip Chip FBGA EP2S30 Flip Chip FBGA Flip Chip FBGA EP2S60 Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA EP2S90 Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA EP2S130 Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA EP2S180 Flip Chip FBGA Flip Chip FBGA
Package
Pins
1,020 1,020 1,508 1,020 1,508 1,020 1,508
Table Stratix Devices Device
EP2SGX30 EP2SGX60 Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA EP2SGX90 Flip Chip FBGA Flip Chip FBGA EP2SGX130 Flip Chip FBGA
Package
Pins
1152 1152 1508 1508
Table Stratix Devices Device
EP1SGX10C EP1SGX10D EP1SGX25C Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA
Package
Pins
Altera Corporation
Altera Device Package Information Data Sheet
Table Stratix Devices (Continued) Device
EP1SGX25D Flip Chip FBGA Flip Chip FBGA EP1SGX25F EP1SGX40D EP1SGX40G Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA
Package
Pins
1,020 1,020 1,020 1,020
Table Stratix Devices Device
EP1S10 Flip Chip FBGA BGA, Wirebond FBGA, Wirebond (Option Flip Chip FBGA EP1S20 Flip Chip FBGA BGA, Wirebond FBGA, Wirebond (Option Flip Chip FBGA EP1S25 BGA, Wirebond FBGA, Wirebond (Option Flip Chip FBGA Flip Chip FBGA EP1S30 Flip Chip FBGA Flip Chip Flip Chip FBGA EP1S40 Flip Chip Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA EP1S60 Flip Chip Flip Chip FBGA Flip Chip FBGA EP1S80 Flip Chip Flip Chip FBGA Flip Chip FBGA
Package
Pins
1,020 1,020 1,020 1,508 1,020 1,508 1,020 1,508
Altera Corporation
Altera Device Package Information Data Sheet
Table Cyclone Devices Device
EP2C5 TQFP, Wirebond PQFP, Wirebond FBGA, Wirebond (Option EP2C8 TQFP, Wirebond PQFP, Wirebond FBGA, Wirebond (Option EP2C20 PQFP, Wirebond FBGA, Wirebond (Option FBGA, Wirebond (Option EP2C35 FBGA, Wirebond (Option UBGA, Wirebond FBGA, Wirebond (Option EP2C50 FBGA, Wirebond (Option UBGA, Wirebond FBGA, Wirebond (Option EP2C70 FBGA, Wirebond (Option FBGA, Wirebond
Package
Pins
Table Cyclone Devices Device
EP1C3 TQFP, Wirebond TQFP, Wirebond EP1C4 FBGA, Wirebond FBGA, Wirebond EP1C6 TQFP, Wirebond PQFP, Wirebond FBGA, Wirebond (Option EP1C12 PQFP, Wirebond FBGA, Wirebond (Option FBGA, Wirebond EP1C20 FBGA, Wirebond FBGA, Wirebond
Package
Pins
Altera Corporation
Altera Device Package Information Data Sheet
Table Series Devices Device Devices
EPM240 EPM570 TQFP, Wirebond TQFP, Wirebond TQFP, Wirebond FBGA, Wirebond (Option EPM1270 TQFP, Wirebond FBGA, Wirebond (Option EPM2210 FBGA, Wirebond (Option FBGA, Wirebond
Package
Pins
9000 Devices
EPM9320 EPM9320A EPM9560 BGA, Wirebond BGA, Wirebond BGA, Wirebond
7000B Devices
EPM7032B PLCC, Wirebond PQFP, Wirebond TQFP, Wirebond UBGA, Wirebond EPM7064B TQFP, Wirebond UBGA, Wirebond FBGA, Wirebond TQFP, Wirebond EPM7128B UBGA, Wirebond TQFP, Wirebond FBGA, Wirebond TQFP, Wirebond UBGA, Wirebond FBGA, Wirebond (Option
Altera Corporation
Altera Device Package Information Data Sheet
Table Series Devices (Continued) Device
EPM7256B TQFP, Wirebond TQFP, Wirebond UBGA, Wirebond PQFP, Wirebond FBGA, Wirebond (Option EPM7512B TQFP, Wirebond UBGA, Wirebond PQFP, Wirebond FBGA, Wirebond (Option BGA, Wirebond (Option
Package
Pins
7000AE Devices
EPM7032AE PLCC, Wirebond TQFP, Wirebond EPM7064AE PLCC, Wirebond TQFP, Wirebond TQFP, Wirebond UBGA, Wirebond FBGA, Wirebond FBGA, Wirebond (Option EPM7128AE PLCC, Wirebond TQFP, Wirebond FBGA, Wirebond UBGA, Wirebond TQFP, Wirebond FBGA, Wirebond (Option EPM7256AE TQFP, Wirebond FBGA, Wirebond TQFP, Wirebond PQFP, Wirebond FBGA, Wirebond (Option
Altera Corporation
Altera Device Package Information Data Sheet
Table Series Devices (Continued) Device
EPM7512AE TQFP, Wirebond PQFP, Wirebond BGA, Wirebond (Option FBGA, Wirebond (Option
Package
Pins
7000A Devices
EPM7032A PLCC, Wirebond TQFP, Wirebond EPM7128A PLCC, Wirebond TQFP, Wirebond FBGA, Wirebond TQFP, Wirebond FBGA, Wirebond (Option EPM7256A TQFP, Wirebond TQFP, Wirebond PQFP, Wirebond FBGA, Wirebond (Option
Table HardCopy Series Devices Device
HC20K400 HC20K600
Package
BGA, Wirebond (Option BGA, Wirebond (Option Flip Chip FBGA
Pins
1020 1,020 1,020
HC220
Flip Chip FPGA Flip Chip FBGA
HC230 HC1S25
Flip Chip FPGA FBGA, Wirebond (Option BGA, Wirebond
HC1S30 HC1S40 HC1S60 HC1S80
Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA
Altera Corporation
Altera Device Package Information Data Sheet
Table APEX Series Devices Device APEX Devices
EP2A15 Flip Chip FBGA Flip Chip EP2A25 Flip Chip FBGA Flip Chip Flip Chip FBGA EP2A40 Flip Chip FBGA Flip Chip Flip Chip FBGA EP2A70 Flip Chip Flip Chip FBGA 1,020 1,020 1,508
Package
Pins
APEX 20KE Devices
EP20K30E TQFP, Wirebond FBGA, Wirebond PQFP, Wirebond FBGA, Wirebond EP20K60E TQFP, Wirebond FBGA, Wirebond PQFP, Wirebond PQFP, Wirebond FBGA, Wirebond BGA, Wirebond EP20K100E TQFP, Wirebond FBGA, Wirebond PQFP, Wirebond PQFP, Wirebond FBGA, Wirebond BGA, Wirebond EP20K160E TQFP, Wirebond PQFP, Wirebond PQFP, Wirebond BGA, Wirebond FBGA, Wirebond (Option
Altera Corporation
Altera Device Package Information Data Sheet
Table APEX Series Devices (Continued) Device
EP20K200E PQFP, Wirebond PQFP, Wirebond BGA, Wirebond FBGA, Wirebond (Option BGA, Wirebond (Option FBGA, Wirebond (Option EP20K300E PQFP, Wirebond BGA, Wirebond (Option FBGA, Wirebond (Option EP20K400E BGA, Wirebond (Option Flip Chip FBGA EP20K600E BGA, Wirebond (Option Flip Chip FBGA Flip Chip FBGA EP20K1000E Flip Chip Flip Chip FBGA Flip Chip FBGA EP20K1500E Flip Chip Flip Chip FBGA
Package
Pins
1,020 1,020 1,020
APEX 20KC Devices
EP20K200C PQFP, Wirebond PQFP, Wirebond BGA, Wirebond FBGA, Wirebond (Option EP20K400C BGA, Wirebond (Option Flip Chip FBGA EP20K600C BGA, Wirebond (Option Flip Chip FBGA Flip Chip FBGA EP20K1000C Flip Chip Flip Chip FBGA Flip Chip FBGA 1,020 1,020
Altera Corporation
Altera Device Package Information Data Sheet
Table APEX Series Devices (Continued) Device APEX Devices
EP20K100 TQFP, Wirebond PQFP, Wirebond PQFP, Wirebond FBGA, Wirebond BGA, Wirebond EP20K160 PQFP, Wirebond TQFP, Wirebond EP20K200 PQFP, Wirebond PQFP, Wirebond BGA, Wirebond FBGA, Wirebond (Option EP20K300 EP20K400 FBGA, Wirebond (Option BGA, Wirebond (Option PGA, Wirebond Flip Chip FBGA
Package
Pins
Table ACEX Devices Device
EP1K10 TQFP, Wirebond TQFP, Wirebond PQFP, Wirebond FBGA, Wirebond (Option EP1K30 TQFP, Wirebond PQFP, Wirebond FBGA, Wirebond (Option EP1K50 TQFP, Wirebond PQFP, Wirebond FBGA, Wirebond (Option FBGA, Wirebond (Option EP1K50S FBGA, Wirebond (Option FBGA, Wirebond (Option
Package
Pins
Altera Corporation
Altera Device Package Information Data Sheet
Table ACEX Devices (Continued) Device
EP1K100 PQFP, Wirebond FBGA, Wirebond (Option FBGA, Wirebond (Option
Package
Pins
Table Mercury Devices Device
EP1M120 EP1M350 Flip Chip FBGA Flip Chip FBGA
Package
Pins
Table FLEX Series Devices Device FLEX 10KA Devices
EPF10K10A TQFP, Wirebond TQFP, Wirebond PQFP, Wirebond FBGA, Wirebond (Option EPF10K30A TQFP, Wirebond PQFP, Wirebond PQFP, Wirebond FBGA, Wirebond (Option BGA, Wirebond FBGA, Wirebond (Option EPF10K100A RQFP, Wirebond BGA, Wirebond FBGA, Wirebond (Option BGA, Wirebond EPF10K250A PGA, Wirebond BGA, Wirebond
Package
Pins
Altera Corporation
Altera Device Package Information Data Sheet
Table FLEX Series Devices (Continued) Device FLEX 10KS Devices
EPF10K50S TQFP, Wirebond PQFP, Wirebond PQFP, Wirebond FBGA, Wirebond (Option BGA, Wirebond FBGA, Wirebond (Option EPF10K200S RQFP, Wirebond BGA, Wirebond FBGA, Wirebond (Option BGA, Wirebond FBGA, Wirebond (Option
Package
Pins
FLEX 10KE Devices
EPF10K30E TQFP, Wirebond PQFP, Wirebond FBGA, Wirebond (Option FBGA, Wirebond (Option EPF10K50E TQFP, Wirebond PQFP, Wirebond PQFP, Wirebond FBGA, Wirebond (Option BGA, Wirebond FBGA, Wirebond (Option EPF10K100E PQFP, Wirebond PQFP, Wirebond FBGA, Wirebond (Option BGA, Wirebond FBGA, Wirebond (Option EPF10K130E PQFP, Wirebond BGA, Wirebond FBGA, Wirebond (Option BGA, Wirebond FBGA, Wirebond (Option
Altera Corporation
Altera Device Package Information Data Sheet
Table FLEX Series Devices (Continued) Device
EPF10K200E PGA, Wirebond BGA, Wirebond FBGA, Wirebond (Option
Package
Pins
FLEX Devices
EPF10K10 TQFP, Wirebond PLCC, Wirebond PQFP, Wirebond EPF10K20 TQFP, Wirebond RQFP, Wirebond RQFP, Wirebond EPF10K30 RQFP, Wirebond RQFP, Wirebond BGA, Wirebond EPF10K40 RQFP, Wirebond RQFP, Wirebond EPF10K50 RQFP, Wirebond BGA, Wirebond PGA, Wirebond EPF10K50V RQFP, Wirebond PQFP, Wirebond BGA, Wirebond FBGA, Wirebond EPF10K70 RQFP, Wirebond PGA, Wirebond EPF10K100 EPF10K130V PGA, Wirebond PGA, Wirebond BGA, Wirebond EPF6010A TQFP, Wirebond TQFP, Wirebond PQFP, Wirebond
Altera Corporation
Altera Device Package Information Data Sheet
Table FLEX Series Devices (Continued) Device
EPF6016 TQFP, Wirebond PQFP, Wirebond PQFP, Wirebond BGA, Wirebond (Option EPF6016A TQFP, Wirebond FBGA, Wirebond TQFP, Wirebond PQFP, Wirebond FBGA, Wirebond (Option EPF6024A TQFP, Wirebond PQFP, Wirebond PQFP, Wirebond BGA, Wirebond (Option FBGA, Wirebond (Option EPF8282A PLCC, Wirebond TQFP, Wirebond EPF8452A TQFP, Wirebond PQFP, Wirebond
Package
Pins
Table Excalibur Devices Device
EPXA1 Flip Chip FBGA EPXA4 Flip Chip FBGA Flip Chip FBGA EPXA10 Flip Chip FBGA
Package
FBGA, Wirebond (Option
Pins
1,020 1,020
Altera Corporation
Altera Device Package Information Data Sheet
Table Enhanced Configuration Devices Device
EPC1
Package
PDIP, Wirebond PLCC, Wirebond
Option
Pins
EPC2
PLCC, Wirebond TQFP, Wirebond
EPC4
PLCC, Wirebond TQFP, Wirebond PQFP, Wirebond FPGA, Wirebond
EPC8 EPC16
PQFP, Wirebond (Option UBGA, Wirebond PQFP, Wirebond (Option
Option
Option
EPC32 EPC1441
FPGA, Wirebond PDIP, Wirebond PLCC, Wirebond TQFP, Wirebond
Altera Corporation
Altera Device Package Information Data Sheet
Thermal Resistance
Table through provide (junction-to-ambient thermal resistance) (junction-to-case thermal resistance) values following Altera device families:
Stratix series FPGAs Cyclone series FPGAs series CPLDs HardCopy series Structured ASICs APEX series FPGAs ACEX FPGAs Mercury FPGAs FLEX series FPGAs Excalibur FPGA Classic devices
Altera transitioning industry-standard copper thermally enhanced thermally enhanced Flip Chip FBGA package offerings mentioned Process Change Notice PCN024 available Altera's website: This change affects APEX 20KE, APEX 20KC, APEX Mercury, Excalibur device families. Therefore, thermal resistance specifications provided devices affected this change. older packages identified using aluminum silicon carbide (AlSiC) lid, while newer packages identified using copper (Cu) lid. Thermally enhanced thermally enhanced Flip Chip FBGA packages offered newer Altera families, including Stratix Stratix were introduced using industry-standard lid. Therefore, these device specifications include only single thermal resistance specification.
Table Thermal Resistance Stratix Devices Device
EP2S15
Count
Package
Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA
C/W)
0.36 0.36 0.21 0.21 0.13 0.13 0.13
C/W) Still
13.1 12.2 12.6 11.7 12.3 11.4 10.4
C/W) ft./min.
11.1 10.2 10.6 10.3
C/W) ft./min.
C/W) ft./min.
EP2S30
EP2S60
1,020 Flip Chip FBGA
Altera Corporation
Altera Device Package Information Data Sheet
Table Thermal Resistance Stratix Devices (Continued) Device
EP2S90
Count
Package
Flip Chip HBGA Flip Chip FBGA
C/W)
0.07 0.09 0.10 0.10 0.07 0.07 0.07 0.05 0.05
C/W) Still
12.0 10.80 10.2 10.1
C/W) ft./min.
C/W) ft./min.
C/W) ft./min.
1,020 Flip Chip FBGA 1,508 Flip Chip FBGA EP2S130 Flip Chip FBGA
1,020 Flip Chip FBGA 1,508 Flip Chip FBGA EP2S180 1,020 Flip Chip FBGA 1,508 Flip Chip FBGA
Table Thermal Resistance Stratix Devices Device
EP2SGX30 EP2SGX60
Count
1152
Package
Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA
C/W)
0.24 0.15 0.15 0.11 0.11
C/W) Still
11.1 10.9
C/W) ft./min.
C/W) ft./min.
C/W) ft./min.
EP2SGX90
1152 1508
EP2SGX130
1508
Table Thermal Resistance Stratix Devices Device
EP1SGX10C EP1SGX10D EP1SGX25C EP1SGX25D EP1SGX25D EP1SGX25F EP1SGX40D EP1SGX40G
Count
Package
Flip Chip FBGA Flip Chip FBGA
C/W)
0.39 0.23 0.23 0.16
C/W) Still
11.1 10.8
C/W) ft./min.
C/W) ft./min.
C/W) ft./min.
1020 Flip Chip FBGA 1020 Flip Chip FBGA
Altera Corporation
Altera Device Package Information Data Sheet
Table Thermal Resistance Stratix Devices
Device
EP1S10
Count
Package
Flip Chip FBGA FBGA Flip Chip FBGA Flip Chip FBGA FBGA Flip Chip FBGA FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip Flip Chip FBGA Flip Chip FBGA Flip Chip Flip Chip FBGA Flip Chip FBGA Flip Chip Flip Chip FBGA Flip Chip FBGA Flip Chip Flip Chip FBGA Flip Chip FBGA
C/W)
0.38 0.43 0.30 0.31 0.25 0.25 0.17 0.18 0.17 0.18 0.13 0.13 0.13
C/W) Still
11.9 16.8 17.2 10.9 11.8 15.5 10.7 14.8 15.3 10.5 10.0 10.4 10.4
C/W) ft./min.
13.7 12.4 12.8 11.7
C/W) ft./min.
11.9 12.2 10.7 10.0 10.4
C/W) ft./min.
10.5 10.8
EP1S20
EP1S25
1020
EP1S30
1020
EP1S40
1020 1508
EP1S60
1020 1508
EP1S80
1020 1508
Altera Corporation
Altera Device Package Information Data Sheet
Table Thermal Resistance Cyclone Devices Device
EP2C5
Count
Package
TQFP PQFP FBGA TQFP PQFP FBGA PQFP FBGA FBGA FBGA UBGA FBGA FBGA UBGA FBGA FBGA FBGA
C/W)
C/W) Still
30.4 30.2 29.8 30.2 26.6 24.2 19.4 20.6 18.6 18.4 19.6 17.7 16.9 16.3
C/W) ft./min.
29.3 29.2 26.1 28.3 28.8 15.4 16.6 14.6 14.4 15.6 13.7 11.9
C/W) ft./min.
27.9 27.3 23.6 26.9 26.9 20.5 21.4 17.8 14.8 13.3 14.5 12.6 12.4 13.6 11.8 11.1 10.5
C/W) ft./min.
25.5 22.3 21.7 24.9 21.7 18.5 17.4 13.1 11.7 12.8 11.1 10.9 11.9 10.2
EP2C8
EP2C20
EP2C35
EP2C50
EP2C70
Table Thermal Resistance Cyclone Devices
Device
EP1C3
Count
Package
TQFP TQFP TQFP PQFP FBGA PQFP FBGA FBGA FBGA FBGA
C/W)
11.0 10.0
C/W) Still
37.5 31.1 29.4 27.2 28.7 26.0 24.3 23.0 21.0 20.7
C/W) ft./min.
35.4 29.4 28.0 24.7 24.5 23.4 20.2 19.8 17.7 17.5
C/W) ft./min.
33.4 27.9 26.7 22.1 22.3 20.8 18.1 17.7 15.6 15.5
C/W) ft./min.
29.8 25.5 24.7 17.8 20.5 17.1 16.4 16.1 14.1 13.9
EP1C6
EP1C12
EP1C20
Altera Corporation
Altera Device Package Information Data Sheet
Table Thermal Resistance Devices Device
EPM240 EPM570
Count
Package
TQFP TQFP TQFP FBGA TQFP FBGA FBGA FBGA
C/W)
12.0 11.2 10.5 13.0 10.5 10.4
C/W) Still
39.5 38.7 32.1 37.4 31.4 33.5 30.2 29.8
C/W) ft./min.
37.5 36.6 30.3 33.1 29.7 29.3 26.1 25.7
C/W) ft./min.
35.5 34.6 28.7 30.5 28.2 26.8 23.6 23.3
C/W) ft./min.
31.6 30.8 26.1 28.4 25.8 24.7 21.7 21.3
EPM1270
EPM2210
Table Thermal Resistance 9000 Devices Device
EPM9320
Count
Package
PLCC RQFP PLCC RQFP PLCC RQFP RQFP RQFP RQFP RQFP RQFP RQFP RQFP RQFP
C/W)
C/W) Still
29.0 17.0 14.0 14.0 29.0 17.0 12.0 29.0 17.0 14.0 17.0 12.0 17.0 12.0 14.0 12.0 12.0 17.0 11.0 12.0
C/W) ft./min.
27.0 16.0 10.0 12.0 27.0 16.0 11.0 27.0 16.0 12.0 16.0 11.0 16.0 11.0 10.0 11.0 11.0 16.0 10.0 11.0
C/W) ft./min.
25.0 15.0 11.0 26.0 15.0 10.0 25.0 15.0 11.0 15.0 10.0 15.0 10.0 10.0 10.0 15.0 10.0
C/W) ft./min.
23.0 13.0 10.0 23.0 13.0 23.0 13.0 10.0 12.0 12.0 12.0
EPM9320A
EPM9400
EPM9480
EPM9560
EPM9560A
Altera Corporation
Altera Device Package Information Data Sheet
Table Thermal Resistance 7000 Devices Device
EPM7032
Count
Package
PLCC PQFP TQFP
C/W)
10.0 15.0 14.0 10.0 14.0 23.0 10.0 14.0 14.0 14.0 14.0 11.0 13.0 14.0 23.0 12.0 21.0
C/W) Still
33.0 48.0 46.0 33.0 46.0 69.0 33.0 46.0 31.0 45.0 31.0 46.0 31.0 46.0 28.0 39.0 31.0 44.0 29.0 28.0 33.0 31.0 46.0 56.0 39.0 49.0 29.0 28.0 32.0
C/W) ft./min.
31.0 46.0 44.0 31.0 44.0 67.0 31.0 44.0 30.0 44.0 30.0 45.0 30.0 44.0 26.0 37.0 30.0 43.0 28.0 26.0 32.0 30.0 45.0 53.0 37.0 47.0 27.0 26.0 31.0
C/W) ft./min.
30.0 45.0 43.0 30.0 43.0 66.0 30.0 43.0 28.0 42.0 28.0 43.0 28.0 43.0 25.0 35.0 28.0 41.0 26.0 25.0 31.0 28.0 43.0 51.0 35.0 44.0 26.0 24.0 30.0
C/W) ft./min.
27.0 42.0 40.0 27.0 40.0 62.0 27.0 40.0 25.0 39.0 25.0 40.0 25.0 40.0 23.0 32.0 25.0 38.0 23.0 22.0 30.0 25.0 40.0 47.0 31.0 40.0 23.0 22.0 29.0
EPM7032B
PLCC TQFP
EPM7032S
UBGA PLCC TQFP
EPM7032V
PLCC TQFP
EPM7032AE
PLCC TQFP
EPM7064S
PLCC TQFP
EPM7064
PLCC TQFP PLCC TQFP
EPM7064AE EPM7064B
PLCC PLCC PQFP PLCC TQFP
UBGA TQFP FBGA
EPM7096
PLCC PLCC PQFP
Altera Corporation
Altera Device Package Information Data Sheet
Table Thermal Resistance 7000 Devices (Continued) Device
EPM7128A
Count
Package
PLCC TQFP FBGA
C/W)
11.0 18.0 12.0 22.0 11.0 19.0 16.0 13.0 10.0 10.0 12.0 10.0 11.0 12.0 14.0 11.0 14.0 12.0 10.0 10.0 12.0
C/W) Still
28.0 37.0 44.0 31.0 38.0 53.0 38.0 46.0 32.0 44.0 40.0 29.0 32.0 32.0 30.0 38.0 35.0 33.0 30.0 38.0 43.0 33.0 42.0 39.0 29.0 32.0 33.0 35.0 37.0 33.0 32.0 20.0 32.0
C/W) ft./min.
26.0 35.0 42.0 29.0 36.0 50.0 36.0 44.0 30.0 42.0 38.0 28.0 31.0 31.0 28.0 36.0 34.0 32.0 28.0 36.0 40.0 30.0 40.0 37.0 28.0 31.0 32.0 28.0 35.0 32.0 31.0 13.0 31.0
C/W) ft./min.
25.0 33.0 39.0 28.0 34.0 48.0 34.0 41.0 29.0 39.0 36.0 26.0 30.0 30.0 26.0 34.0 33.0 31.0 26.0 34.0 38.0 28.0 38.0 35.0 26.0 30.0 31.0 26.0 33.0 31.0 30.0 10.0 30.0
C/W) ft./min.
22.0 30.0 35.0 25.0 31.0 44.0 31.0 37.0 26.0 35.0 33.0 23.0 29.0 28.0 23.0 30.0 32.0 30.0 23.0 30.0 37.0 26.0 36.0 31.0 23.0 29.0 30.0 23.0 30.0 30.0 29.0 26.0
EPM7128B
TQFP FBGA UBGA TQFP FBGA
EPM7128E EPM7128S
TQFP UBGA FBGA PLCC PQFP PQFP PLCC TQFP PQFP
EPM7128AE
PQFP PLCC TQFP FBGA
EPM7160E EPM7160S EPM7192S EPM7192E
TQFP UBGA FBGA PLCC PQFP PQFP PLCC TQFP PQFP PQFP PQFP
Altera Corporation
Altera Device Package Information Data Sheet
Table Thermal Resistance 7000 Devices (Continued) Device
EPM7256A
Count
Package
TQFP TQFP PQFP FBGA TQFP TQFP UBGA PQFP FBGA PQFP RQFP PQFP RQFP
C/W)
12.0 12.0 13.0 13.0 12.0 10.0 11.0 10.0 12.0 11.0
C/W) Still
36.0 32.0 30.0 34.0 37.0 33.0 40.0 31.0 34.0 20.0 31.0 17.0 30.0 18.0 42.0 37.0 33.0 31.0 34.0 32.0 30.0 14.0 32.0 32.0 35.0 30.0 14.0 32.0
C/W) ft./min.
34.0 27.0 28.0 32.0 35.0 29.0 38.0 29.0 32.0 13.0 30.0 16.0 29.0 17.0 39.0 35.0 29.0 29.0 32.0 27.0 28.0 12.0 30.0 27.0 33.0 28.0 12.0 30.0
C/W) ft./min.
32.0 25.0 26.0 29.0 33.0 27.0 36.0 27.0 30.0 10.0 29.0 15.0 26.0 16.0 37.0 33.0 27.0 27.0 30.0 25.0 25.0 11.0 28.0 25.0 31.0 25.0 11.0 28.0
C/W) ft./min.
30.0 24.0 21.0 28.0 30.0 25.0 34.0 22.0 28.0 25.0 13.0 21.0 15.0 36.0 30.0 25.0 22.0 28.0 23.0 21.0 10.0 22.0 24.0 30.0 21.0 10.0 27.0
EPM7256B
EPM7256E
EPM7256S
EPM7256AE
FBGA TQFP TQFP PQFP FBGA TQFP PQFP FBGA
EPM7512AE
EPM7512B
TQFP UBGA PQFP FBGA
Altera Corporation
Altera Device Package Information Data Sheet
Table Thermal Resistance 3000A Devices
Device
EPM3032A
Count
Package
TQFP PLCC
C/W)
14.0 14.0 12.0 12.0 11.0 11.0
C/W) Still
46.0 31.0 46.0 31.0 39.0 38.0 33.0 33.0 31.0 30.0 32.0
C/W) ft./min.
45.0 30.0 45.0 30.0 37.0 36.0 30.0 29.0 29.0 28.0 30.0
C/W) ft./min.
43.0 28.0 43.0 28.0 35.0 34.0 28.0 27.0 27.0 25.0 28.0
C/W) ft./min.
40.0 25.0 40.0 25.0 31.0 30.0 26.0 25.0 22.0 21.0 22.0
EPM3064A
TQFP PLCC
EPM3128A EPM3256A EPM3512A
TQFP TQFP TQFP TQFP PQFP PQFP FBGA
Table Thermal Resistance HardCopy Series Devices
Device
HC210
Count
Package
Flip Chip FBGA FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA FBGA
C/W)
0.96 0.43 0.43 0.291 0.291
C/W) Still
13.4 24.2 12.1 11.7 10.8 10.6 13.0 19.7 19.3 10.9 10.9 12.22 12.22
C/W) ft./min.
11.2 20.3 10.2 15.8 15.6 8.54 8.54
C/W) ft./min.
18.3 13.9 13.8 7.02 7.02
C/W) ft./min.
16.6 12.4 12.3 5.82 5.82
HC220
HC230 HC240
1020 1020 1508
HC20K400 HC20K600 HC1S25
HC1S30 HC1S40 HC1S60 HC1S80
1020 1020
Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA
Altera Corporation
Altera Device Package Information Data Sheet
Table Thermal Resistance APEX Devices
Device
EP2A15
Count
Package
Flip Chip FBGA lid) Flip Chip FBGA (AlSiC lid)
C/W)
0.22 0.34 0.23 0.35 0.17 0.26 0.17 0.27 0.17 0.27 0.24 0.15 0.19 0.15 0.19 0.10 0.14 0.10 0.14
C/W) C/W) C/W) C/W) Still ft./min. ft./min. ft./min.
10.8 11.6 10.0 10.7 11.5 10.0 10.4 10.0 10.0 10.0
Flip Chip lid) Flip Chip (AlSiC lid)
EP2A25
FBGA lid) Flip Chip FBGA (AlSiC lid)
Flip Chip lid) Flip Chip (AlSiC lid)
1020 Flip Chip FBGA lid) Flip Chip FBGA (AlSiC lid) EP2A40 Flip Chip FBGA lid) Flip Chip FBGA (AlSiC lid) Flip Chip lid) Flip Chip (AlSiC lid) 1,020 Flip Chip FBGA lid) Flip Chip FBGA (AlSiC lid) EP2A70 Flip Chip lid) Flip Chip (AlSiC lid) 1,508 Flip Chip FBGA lid) Flip Chip FBGA (AlSiC lid)
Table Thermal Resistance APEX APEX 20KE Devices
Device
EP20K30E
Count
Package
TQFP PQFP FBGA FBGA
C/W)
14.0
C/W) Still
29.0 30.0 36.0 31.0
C/W) ft./min.
28.0 29.0 34.0 29.0
C/W) C/W) ft./min. ft./min.
26.0 27.0 32.0 28.0 25.0 22.0 29.0 25.0
Altera Corporation
Altera Device Package Information Data Sheet
Table Thermal Resistance APEX APEX 20KE Devices (Continued)
Device
EP20K60E
Count
Package
TQFP FBGA PQFP PQFP FBGA TQFP PQFP PQFP FBGA TQFP FBGA PQFP PQFP FBGA TQFP PQFP PQFP FBGA PQFP PQFP FBGA PQFP PQFP FBGA FBGA
C/W)
11.0
C/W) Still
28.0 33.0 30.0 26.0 29.0 12.0 26.0 29.0 25.0 28.0 12.0 26.0 32.0 29.0 25.0 28.0 12.0 25.0 28.0 24.0 12.0 24.0 25.0 21.0 12.0 22.0 25.0 22.0 12.0 23.0 12.0 21.0
C/W) ft./min.
26.0 32.0 28.0 24.0 28.0 11.0 25.0 27.0 23.0 26.0 11.0 25.0 30.0 27.0 23.0 26.0 11.0 24.0 26.0 21.0 11.0 23.0 23.0 19.0 11.0 21.0 23.0 19.0 11.0 22.0 11.0 20.0
C/W) C/W) ft./min. ft./min.
25.0 30.0 26.0 21.0 26.0 10.0 24.0 25.0 20.0 25.0 10.0 24.0 29.0 25.0 20.0 25.0 10.0 23.0 23.0 19.0 10.0 22.0 20.0 17.0 10.0 20.0 20.0 18.0 10.0 21.0 10.0 19.0 24.0 27.0 21.0 17.0 24.0 23.0 20.0 17.0 23.0 23.0 26.0 20.0 17.0 23.0 22.0 19.0 16.0 21.0 17.0 15.0 19.0 17.0 16.0 20.0 18.0
EP20K100
EP20K100E
EP20K160E
EP20K200
EP20K200E
Altera Corporation
Altera Device Package Information Data Sheet
Table Thermal Resistance APEX APEX 20KE Devices (Continued)
Device
EP20K200C
Count
Package
PQFP PQFP FBGA PQFP FBGA FBGA FBGA FBGA lid) FBGA (AlSiC lid)
C/W)
0.36 0.25 0.38 0.18 0.28 0.19 0.29 0.12 0.12 0.12 0.19
C/W) Still
25.0 22.0 12.0 23.0 19.0 12.0 20.0 11.6 10.9 11.7 10.8 11.6 10.4 10.6 11.4 10.2
C/W) ft./min.
23.0 19.0 11.0 22.0 18.0 11.0 19.0
C/W) C/W) ft./min. ft./min.
20.0 18.0 10.0 21.0 16.0 10.0 18.0 17.0 16.0 20.0 15.0 17.0
EP20K300E
EP20K400
EP20K400E EP20K400C
EP20K600E EP20K600C
FBGA FBGA lid) FBGA (AlSiC lid)
1,020
FBGA FBGA lid) FBGA (AlSiC lid)
1,020 EP20K1000E EP20K1000C
FBGA lid) (AlSiC lid)
FBGA FBGA lid) FBGA (AlSiC lid)
1,020
FBGA FBGA lid) FBGA (AlSiC lid)
1,020
FBGA
Altera Corporation
Altera Device Package Information Data Sheet
Table Thermal Resistance APEX APEX 20KE Devices (Continued)
Device
EP20K1500E
Count
Package
lid) (AlSiC lid)
C/W)
0.10 0.15 0.10 0.15
C/W) Still
10.1
C/W) ft./min.
C/W) C/W) ft./min. ft./min.
1,020
FBGA FBGA FBGA lid) FBGA (AlSiC lid)
1,020 Note Table
FBGA
"fin" extra heat sink that customers device. Several vendors make heat sinks, they have different sizes. Altera performed thermal calculations Table using following specifications: width: 0.25 height: pitch: base thickness:
Table Thermal Resistance ACEX Devices
Device
EP1K10
Count
Package
TQFP TQFP PQFP FBGA TQFP PQFP FBGA TQFP PQFP FBGA FBGA PQFP FBGA FBGA
C/W)
11.0 12.0
C/W) Still
37.0 31.0 30.0 37.0 28.0 30.0 31.0 26.0 29.0 30.0 25.0 28.0 28.0 24.0
C/W) ft./min.
35.0 29.0 29.0 35.0 27.0 28.0 29.0 25.0 28.0 28.0 24.0 26.0 26.0 23.0
C/W) ft./min.
33.0 28.0 27.0 33.0 26.0 26.0 28.0 24.0 25.0 27.0 23.0 23.0 25.0 22.0
C/W) ft./min.
29.0 25.0 22.0 30.0 24.0 21.0 25.0 23.0 20.0 24.0 22.0 18.0 23.0 21.0
EP1K30
EP1K50
EP1K100
Altera Corporation
Altera Device Package Information Data Sheet
Table Thermal Resistance Mercury Devices
Device
EP1M120
Count
Package
FBGA lid) FBGA (AlSiC lid) FBGA lid) FBGA (AlSiC lid)
C/W)
0.58 0.87 0.22 0.34
C/W) Still
12.2 13.0 10.5 11.0
C/W) ft./min.
10.1 11.1
C/W) ft./min.
C/W) ft./min.
EP1M350
Table Thermal Resistance FLEX Devices
Device
EPF10K10
Count
Package
PLCC TQFP PQFP TQFP TQFP PQFP FBGA TQFP RQFP RQFP RQFP RQFP TQFP PQFP PQFP FBGA FBGA TQFP PQFP FBGA FBGA
C/W)
10.0
C/W) Still
28.0 26.0 29.0 35.0 29.0 30.0 33.0 24.0 17.0 14.0 17.0 13.0 12.0 25.0 29.0 25.0 28.0 12.0 24.0 28.0 30.0 31.0 26.0
C/W) ft./min.
26.0 25.0 27.0 33.0 28.0 29.0 30.0 23.0 16.0 12.0 16.0 12.0 11.0 24.0 27.0 22.0 26.0 11.0 22.0 27.0 28.0 29.0 25.0
C/W) ft./min.
24.0 24.0 25.0 31.0 26.0 27.0 28.0 22.0 15.0 11.0 15.0 11.0 10.0 23.0 24.0 20.0 24.0 10.0 21.0 26.0 26.0 28.0 24.0
C/W) ft./min.
22.0 23.0 20.0 28.0 25.0 21.0 26.0 21.0 13.0 10.0 12.0 10.0 22.0 19.0 17.0 23.0 20.0 24.0 21.0 25.0 22.0
EPF10K10A
EPF10K20
EPF10K30
EPF10K30A
EPF10K30E
Altera Corporation
Altera Device Package Information Data Sheet
Table Thermal Resistance FLEX Devices (Continued)
Device
EPF10K40
Count
Package
RQFP RQFP RQFP
C/W)
C/W) Still
17.0 13.0 12.0 12.0 12.0 10.0 25.0 13.0 12.0 23.0 26.0 29.0 25.0 29.0 25.0 26.0 29.0 26.0 30.0 12.0 25.0 12.0 13.0 12.0 22.0 10.0
C/W) ft./min.
16.0 12.0 11.0 11.0 10.0 22.0 12.0 11.0 22.0 25.0 27.0 22.0 27.0 24.0 25.0 28.0 23.0 28.0 11.0 24.0 11.0 11.0 11.0 21.0
C/W) ft./min.
15.0 11.0 10.0 10.0 20.0 11.0 10.0 21.0 24.0 24.0 20.0 26.0 23.0 24.0 25.0 20.0 27.0 10.0 23.0 10.0 10.0 10.0 20.0
C/W) ft./min.
12.0 10.0 17.0 10.0 20.0 23.0 19.0 17.0 24.0 21.0 23.0 20.0 17.0 24.0 22.0 18.0
EPF10K50
EPF10K50V
PQFP RQFP FBGA TQFP PQFP PQFP FBGA FBGA TQFP PQFP PQFP FBGA FBGA RQFP
EPF10K50E
EPF10K50S
EPF10K70
EPF10K100
EPF10K100A
RQFP FBGA
Altera Corporation
Altera Device Package Information Data Sheet
Table Thermal Resistance FLEX Devices (Continued)
Device
EPF10K100E
Count
Package
PQFP PQFP FBGA FBGA PQFP FBGA FBGA FBGA RQFP FBGA FBGA
C/W)
C/W) Still
28.0 23.0 28.0 12.0 24.0 10.0 21.0 12.0 23.0 10.0 21.0 10.0 20.0 13.0 12.0 22.0 10.0 21.0 10.0
C/W) ft./min.
26.0 21.0 26.0 11.0 23.0 19.0 11.0 22.0 20.0 19.0 11.0 11.0 21.0 20.0
C/W) ft./min.
23.0 19.0 25.0 10.0 22.0 17.0 10.0 21.0 19.0 18.0 10.0 10.0 20.0 19.0
C/W) ft./min.
18.0 16.0 23.0 21.0 15.0 20.0 18.0 17.0 19.0 18.0
EPF10K130V
EPF10K130E
EPF10K200E
EPF10K200S
EPF10K250A
Notes Table
With attached pin-fin heat sink. With attached motor-driven heat sink.
Altera Corporation
Altera Device Package Information Data Sheet
Table Thermal Resistance FLEX 8000 Devices Device
EPF8282A
Count
Package
PLCC TQFP PLCC TQFP PQFP PLCC PQFP PQFP RQFP TQFP PQFP PQFP RQFP PQFP PQFP RQFP PQFP RQFP RQFP
C/W)
10.0 11.0 10.0 11.0 10.0
C/W) C/W) C/W) C/W) Still ft./min. ft./min. ft./min.
30.0 36.0 30.0 35.0 32.0 20.0 29.0 32.0 16.0 30.0 17.0 26.0 32.0 16.0 29.0 17.0 28.0 28.0 14.0 24.0 14.0 22.0 13.0 14.0 11.0 28.0 34.0 28.0 33.0 31.0 13.0 28.0 31.0 11.0 38.0 16.0 25.0 31.0 11.0 27.0 16.0 19.0 26.0 10.0 21.0 12.0 20.0 12.0 10.0 10.0 26.0 32.0 26.0 31.0 30.0 10.0 26.0 30.0 26.0 15.0 24.0 30.0 25.0 15.0 14.0 24.0 19.0 11.0 19.0 11.0 23.0 29.0 23.0 28.0 28.0 23.0 27.0 20.0 14.0 23.0 27.0 20.0 14.0 11.0 19.0 16.0 10.0 16.0 10.0
EPF8452A
EPF8636A
EPF8820A
EPF81188A
EPF81500A
Altera Corporation
Altera Device Package Information Data Sheet
Table Thermal Resistance FLEX 6000 Devices
Device
EPF6010A
Count
Package
TQFP TQFP TQFP PQFP PQFP TQFP FBGA
C/W)
11.0 10.0 10.0 11.0 14.0 10.0 10.0 10.0
C/W) Still
35.0 28.0 28.0 30.0 26.0 28.0 35.0 36.0 29.0 30.0 32.0 27.0 29.0 26.0 28.0 30.0
C/W) ft./min.
33.0 26.0 26.0 28.0 24.0 22.0 33.0 34.0 28.0 29.0 30.0 26.0 28.0 23.0 22.0 29.0
C/W) C/W) ft./min. ft./min.
31.0 25.0 25.0 26.0 21.0 20.0 31.0 32.0 26.0 26.0 29.0 25.0 26.0 21.0 20.0 27.0 28.0 24.0 24.0 21.0 17.0 19.0 28.0 29.0 24.0 21.0 26.0 24.0 20.0 17.0 19.0 25.0
EPF6016
EPF6016A
EPF6024A
TQFP PQFP FBGA TQFP PQFP PQFP FBGA
Table Thermal Resistance Excalibur Embedded Processor Solutions
Device
EPXA1
Count
FBGA
Package
C/W)
0.52 0.78 0.21 0.31 0.21 0.32 0.11 0.17
C/W) C/W) C/W) C/W) Still ft./min. ft./min. ft./min.
20.0 11.3 12.2 10.8 11.6 10.4 10.0 11.3 18.3 10.2 15.8 13.9
Flip Chip FBGA lid) Flip Chip FBGA (AlSiC lid) Flip Chip FBGA lid) Flip Chip FBGA (AlSiC lid) Flip Chip FBGA lid) Flip Chip FBGA (AlSiC lid) Flip Chip FBGA lid) Flip Chip FBGA (AlSiC lid)
EPXA4
1,020 1,020
EPXA10
1,020 1,020
Altera Corporation
Altera Device Package Information Data Sheet
Table Thermal Resistance Classic Devices Device
EP600I
Count
Package
PDIP CerDIP
C/W)
22.0 18.0 16.0 10.0 18.0 17.0 13.0 18.0 22.0 16.0 23.0 10.0 12.0 23.0 10.0 17.0 29.0 16.0 13.0 12.0 13.0
C/W)
67.0 60.0 64.0 60.0 55.0 77.0 74.0 60.0 67.0 64.0 49.0 58.0 40.0 49.0 58.0 44.0 51.0 55.0 44.0 47.0 44.0 38.0
EP610
PLCC CerDIP PDIP SOIC
EP610I
PLCC CerDIP PDIP
EP900I EP910
PLCC PDIP PLCC CerDIP PDIP
EP910I
PLCC CerDIP PDIP
EP1800I EP1810
PLCC PLCC JLCC PLCC
Package Outlines
package outlines following pages listed order ascending count. Altera package outlines meet requirements JEDEC Publication
Altera Corporation
Altera Device Package Information
8-Pin Plastic Dual In-Line Package (PDIP)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension inches. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level PDIP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte MS-001 Variation: Printed moisture barrier 0.360 0.300 0.240 0.125 0.016 0.008
Package Information Description
Inches Min.
0.015
Nom.
0.130 0.310 0.250 0.018 0.010 0.100
Max.
0.170 0.380 0.325 0.260 0.135 0.020 0.014
Maximum Lead Coplanarity
Altera Corporation
Altera Device Package Information
Package Outline
Altera Corporation
Altera Device Package Information
8-Pin Small Outline Integrated Circuit Package (SOIC)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level SOIC Copper Regular: 85Sn:15Pb (Typ) Pb-free: NiPdAu (Preplated) MS-012 Var. 0.08 Printed moisture barrier
Package Outline Dimension Table Specification Symbol Minimum
Millimeters Nom.
4.90 6.00 3.90 0.40 0.31 0.17 1.04 1.27 0.51 0.25 1.27
Maximum
1.75 0.25 1.65
1.35 0.10 1.25
Maximum Lead Coplanarity
Altera Corporation
Altera Device Package Information
Package Outline
Detail
Detail
0.25mm Gage Plane
Altera Corporation
Altera Device Package Information
16-Pin Small Outline Integrated Circuit Package (SOIC)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level SOIC Copper Pb-free: NiPdAu (Preplated) MS-013 Var. Printed moisture barrier
Package Outline Dimension Table Specification Symbol Minimum
Millimeters Nom.
10.30 10.30 7.50 0.40 0.31 0.20 1.40 1.27 0.51 0.33 1.27
Maximum
2.65 0.30 2.55
2.35 0.10 2.05
Maximum Lead Coplanarity
Altera Corporation
Altera Device Package Information
Package Outline
Detail
Detail
0.25mm Gage Plane
Altera Corporation
Altera Device Package Information
20-Pin Plastic J-Lead Chip Carrier (PLCC)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension inches. generally indicated indentation plastic body, proximity, package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level PLCC Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte MS-018 Variation: Printed moisture barrier 0.385 0.350 0.290 0.385 0.350 0.290 0.013
Package Information Description
Inches Min.
0.165 0.020
Nom.
0.172 0.150 0.390 0.353 0.310 0.390 0.353 0.310 0.010 0.050
Max.
0.180 0.395 0.356 0.330 0.395 0.356 0.330 0.021
Maximum Lead Coplanarity 0.004 inches (0.10mm)
Altera Corporation
Altera Device Package Information
Package Outline
Altera Corporation
Altera Device Package Information
24-Pin Ceramic Dual In-Line Package (CerDIP)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension inches. indicated dot, special feature, proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Leadframe Material Lead Finish JEDEC Outline Reference CerDIP Alloy Regular: 63Sn:37Pb (Typ.) MS-030 Variation:
Package Outline Dimension Table Specification Symbol Min.
0.015 1.240 0.290 0.280 0.125 0.015
Inches Nom.
0.028 1.260 0.305 0.295 0.018 0.100
Max.
0.200 0.041 1.280 0.320 0.310 0.021
Maximum Lead Coplanarity Weight Moisture Sensitivity Level Printed moisture barrier
Altera Corporation
Altera Device Package Information
Package Outline
Altera Corporation
Altera Device Package Information
24-Pin Plastic Dual In-Line Package (PDIP)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension inches. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) PDIP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte 1.245 0.300 0.245 0.125 0.014 0.008
Package Information Description
Inches Min.
0.015
Nom.
0.130 1.250 0.310 0.018 0.010 0.100
Max.
0.170 1.255 0.325 0.270 0.135 0.022 0.014
JEDEC Outline Reference MS-001 Variation: Maximum Lead Coplanarity Weight Moisture Sensitivity Level Printed moisture barrier
Altera Corporation
Altera Device Package Information
Package Outline
Altera Corporation
Altera Device Package Information
24-Pin Small Outline Integrated Circuit Package (SOIC)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level SOIC Copper Regular 85Sn:15Pb (Typ) MS-013 Printed moisture barrier Variation:
Package Outline Dimension Table Specification Symbol Minimum
Millimeters Nom.
15.40 10.30 7.50 0.40 0.31 0.20 1.40 1.27 0.51 0.33 1.27
Maximum
2.65 0.30 2.55
2.35 0.10 2.05
Maximum Lead Coplanarity
Altera Corporation
Altera Device Package Information
Package Outline
Detail
Detail
0.25mm Gage Plane
Altera Corporation
Altera Device Package Information
28-Pin Plastic J-Lead Chip Carrier (PLCC)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension inches. generally indicated indentation plastic body, proximity, package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level PLCC Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte MS-018 Printed moisture barrier Variation: 0.485 0.450 0.382 0.485 0.450 0.382 0.013
Package Information Description
Inches Min.
0.165 0.020
Nom.
0.172 0.150 0.490 0.453 0.410 0.490 0.453 0.410 0.010 0.050
Max.
0.180 0.495 0.456 0.438 0.495 0.456 0.438 0.021
Maximum Lead Coplanarity 0.004 inches (0.10
Altera Corporation
Altera Device Package Information
Package Outline
Altera Corporation
Altera Device Package Information
32-Pin Plastic Thin Quad Flat Pack (TQFP)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) TQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte 0.20 0.30 0.09 0.45
Package Information Description
Millimeters Min.
0.05 0.95
Nom.
1.00 9.00 7.00 9.00 7.00 0.60 1.00 0.37 0.80 3.5°
Max.
1.20 0.15 1.05
JEDEC Outline Reference MS-026 Variation: Maximum Lead Coplanarity 0.004 inches (0.1mm) Weight Moisture Sensitivity Level Printed moisture barrier
0.75 0.45 0.20
Altera Corporation
Altera Device Package Information
Package Outline
Pin32
Detail
DETAIL
Gage Plane 0.25mm
Altera Corporation
Altera Device Package Information
40-Pin Ceramic Dual In-Line Package (CerDIP)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension inches. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish JEDEC Outline Reference Weight Moisture Sensitivity Level CerDIP Alloy Regular: 63Sn:37Pb (Typ.) MS-032 Variation: 12.8 Printed moisture barrier
Package Information Description
Inches Min.
0.015 2.030 0.600 0.510 0.125 0.016 0.008
Nom.
0.025 2.050 0.610 0.550 0.018 0.010 0.100
Max.
0.225 0.035 2.070 0.620 0.590 0.020 0.012
Maximum Lead Coplanarity
Altera Corporation
Altera Device Package Information
Package Outline
Altera Corporation
Altera Device Package Information
40-Pin Plastic Dual In-Line Package (PDIP)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension inches. indicated dot, special feature, proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level PDIP Copper Regular: 85Sn:15Pb (Typ.) MS-011 Variation: Printed moisture barrier
Package Outline Dimension Table Specification Symbol Min.
2.030 0.600 0.520 0.125 0.015 0.008 0.015
Inches Nom.
0.150 2.050 0.540 0.018 0.100 2.070 0.625 0.560 0.135 0.022 0.012
Max.
0.190
Maximum Lead Coplanarity
Altera Corporation
Altera Device Package Information
Package Outline
Altera Corporation
Altera Device Package Information
44-Pin Plastic J-Lead Chip Carrier (PLCC)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension inches. generally indicated indentation plastic body, proximity, package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level PLCC Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte MS-018 Printed moisture barrier Variation: 0.685 0.650 0.582 0.685 0.650 0.582 0.013
Package Information Description
Inches Min.
0.165 0.020
Nom.
0.172 0.150 0.690 0.653 0.610 0.690 0.653 0.610 0.010 0.050
Max.
0.180 0.695 0.656 0.638 0.695 0.656 0.638 0.021
Maximum Lead Coplanarity 0.004 inches (0.10
Altera Corporation
Altera Device Package Information
Package Outline
Altera Corporation
Altera Device Package Information
44-Pin Plastic Quad Flat Pack (PQFP)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level PQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte MS-022 Variation: Printed moisture barrier 0.20 0.29 0.11 0.73
Package Information Description
Millimeters Min.
1.80
Nom.
2.00 13.20 10.00 13.20 10.00 0.88 1.60 0.80
Max.
2.45 0.25 2.20
Maximum Lead Coplanarity 0.004 inches (0.10
1.03 0.45 0.23
Altera Corporation
Altera Device Package Information
Package Outline
Detail
DETAIL Gage Plane 0.25mm
Altera Corporation
Altera Device Package Information
44-Pin Plastic Thin Quad Flat Pack (TQFP)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level TQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte MS-026 Variation: Printed moisture barrier 0.20 0.30 0.09 0.45
Package Information Description
Millimeters Min.
0.05 0.95
Nom.
12.00 10.00 12.00 10.00 0.60 1.00 0.37 0.80 3.5°
Max.
1.20 0.15
Maximum Lead Coplanarity 0.004 inches (0.1mm)
0.75 0.45 0.20
Altera Corporation
Altera Device Package Information
Package Outline
Detail
DETAIL
Gage Plane
0.25mm
Altera Corporation
Altera Device Package Information
49-Pin Ultra Fineline BGA® (UBGA)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level UBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MO-216 Variation: BAB-2 Printed moisture barrier
Package Outline Dimension Table Specification Symbol Min.
0.40 0.20
Millimeters Nom.
0.70 7.00 7.00 0.50 0.80 0.60
Max.
1.55 1.35
Maximum Lead Coplanarity 0.005 inches (0.12mm)
Altera Corporation
Altera Device Package Information
Package Outline
VIEW BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
68-Pin Ceramic Pin-Grid Array (PGA)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension inches. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish JEDEC Outline Reference Weight Moisture Sensitivity Level Alloy Gold Over Nickel Plate MO-066 Variation: 10.4 Printed moisture barrier 0.016 0.114 1.100 1.100
Package Information Description
Inches Min.
0.154
Nom.
0.177 0.050 0.127 1.120 1.120 0.130 0.018 0.100
Max.
0.200 0.140 1.140 1.140 0.020
Maximum Lead Coplanarity
Altera Corporation
Altera Device Package Information
Package Outline
VIEW
BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
68-Pin Plastic J-Lead Chip Carrier (PLCC)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension inches. generally indicated indentation plastic body, proximity, package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Lead Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level PLCC Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte MS-018 Printed moisture barrier Variation: 0.985 0.950 0.882 0.985 0.950 0.882 0.013
Package Information Description
Inches Min.
0.165 0.020
Nom.
0.172 0.150 0.990 0.954 0.910 0.990 0.954 0.910 0.008 0.050
Max.
0.180 0.995 0.958 0.938 0.995 0.958 0.938 0.021
Maximum Lead Coplanarity 0.004 inches (0.10
Altera Corporation
Altera Device Package Information
Package Outline
Altera Corporation
Altera Device Package Information
84-Pin Plastic J-Lead Chip Carrier (PLCC)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension inches. generally indicated indentation plastic body, proximity, package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level PLCC Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte MS-018 Variation: Printed moisture barrier 1.185 1.150 1.082 1.185 1.150 1.082 0.013
Package Information Description
Inches Min.
0.165 0.020
Nom.
0.172 0.150 1.190 1.154 1.110 1.190 1.154 1.110 0.008 0.050
Max.
0.180 1.195 1.158 1.138 1.195 1.158 1.138 0.021
Maximum Lead Coplanarity 0.004 inches (0.10mm)
Altera Corporation
Altera Device Package Information
Package Outline
Altera Corporation
Altera Device Package Information
88-Pin Ultra Fineline BGA® (UBGA)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Weight Moisture Sensitivity Level UBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MO-219 Printed moisture barrier 0.40
Package Information Description
Millimeters Min.
0.25 0.80
Nom.
11.00 8.00 0.45 0.80
Max.
1.40
Maximum Lead Coplanarity 0.005 inches (0.12
0.50
Altera Corporation
Altera Device Package Information
Package Outline
VIEW BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
100-Pin Fineline BGA® (FBGA)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder ball composition JEDEC Outline Reference Weight Moisture Sensitivity Level FBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MO-192 Variation: AAC-1 Printed moisture barrier 0.50
Package Information Description
Millimeters Min.
0.30 0.25
Nom.
11.00 11.00 0.60 1.00
Max.
1.70 1.10 0.80
Maximum Lead Coplanarity 0.008 inches (0.20mm)
0.70
Altera Corporation
Altera Device Package Information
Package Outline
VIEW
BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
100-Pin Plastic Quad Flat Pack (PQFP) Option
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Note: This applicable Q100 package products except EPC8 EPC16, which assembled Option package outlines.
Package Information Description
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level PQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte MS-022 Variation: GC-1 Printed moisture barrier
Package Outline Dimension Table Specification Symbol Min.
0.20 0.22 0.11 0.73 0.25 2.50
Millimeters Nom.
2.70 17.20 14.00 23.20 20.00 0.88 1.60 0.65 0.40 0.23 1.03
Max.
3.40 0.50 2.90
Maximum Lead Coplanarity 0.004 inches (0.10mm)
Altera Corporation
Altera Device Package Information
Package Outline
Detail
Detail
Gage Plane 0.25mm
Altera Corporation
Altera Device Package Information
100-Pin Plastic Quad Flat Pack (PQFP) Option
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Note: This applicable Q100 package EPC8 EPC16 only.
Package Information Description
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference PQFP Copper Regular: 85Sn:15Pb (Typ.)
Package Outline Dimension Table Specification Symbol Min.
0.20 0.10 17.90 13.80 23.90 19.80 1.75
Millimeters Nom.
1.95 0.10 1.85 18.30 14.00 24.30 20.00 1.20 2.15 0.30 0.15 0.65 0.40 0.20 18.70 14.20 24.70 20.20
Max.
2.15 0.20
Maximum Lead Coplanarity 0.006 inches (0.15mm) Weight Moisture Sensitivity Level Printed moisture barrier
Altera Corporation
Altera Device Package Information
Package Outline
Detail
Detail
Gage Plane 0.25mm
Altera Corporation
Altera Device Package Information
100-Pin Plastic Thin Quad Flat Pack (TQFP)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level TQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte MS-026 Variation: Printed moisture barrier 0.20 0.17 0.09 0.45
Package Information Description
Millimeters Min.
0.05 0.95
Nom.
1.00 16.00 14.00 16.00 14.00 0.60 1.00 0.22 0.50 3.5°
Max.
1.20 0.15 1.05
Maximum Lead Coplanarity 0.003 inches (0.08mm)
0.75 0.27 0.20
Altera Corporation
Altera Device Package Information
Package Outline
Detail
DETAIL
Gage Plane 0.25mm
Altera Corporation
Altera Device Package Information
144-Pin Fineline BGA® (FBGA)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level FBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MO-192 Variation: AAD-1 Printed moisture barrier 0.50
Package Information Description
Millimeters Min.
0.30 0.25
Nom.
13.00 13.00 0.60 1.00
Max.
1.70 1.10 0.80
Maximum Lead Coplanarity 0.008 inches (0.20mm)
0.70
Altera Corporation
Altera Device Package Information
Package Outline
VIEW BOTTOM VIEW Corner
Altera Corporation
Altera Device Package Information
144-Pin Plastic Thin Quad Flat Pack (TQFP)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Figure Reference Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level TQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte MS-026 Variation: Printed moisture barrier 0.20 0.17 0.09 0.45
Package Information Description
Millimeters Min.
0.05 1.35
Nom.
1.40 22.00 20.00 22.00 20.00 0.60 1.00 0.22 0.50 3.5°
Max.
1.60 0.15 1.45
Maximum Lead Coplanarity 0.003 inches (0.08mm)
0.75 0.27 0.20
Altera Corporation
Altera Device Package Information
Package Outline
Detail
DETAIL Gage Plane 0.25mm
Altera Corporation
Altera Device Package Information
160-Pin Ceramic Pin-Grid Array (PGA)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension inches. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish JEDEC Outline Reference Weight Moisture Sensitivity Level Alloy Gold Over Nickel Plate MO-067 Variation: 19.9 Printed moisture barrier 0.016 0.120 1.540 1.540
Package Information Description
Inches Min.
0.160
Nom.
0.190 0.050 0.140 1.560 1.560 0.130 0.018 0.100
Max.
0.220 0.160 1.580 1.580 0.020
Maximum Lead Coplanarity
Altera Corporation
Altera Device Package Information
Package Outline
VIEW
BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
160-Pin Plastic Quad Flat Pack (PQFP)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level PQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte MS-022 Variation: DD-1 Printed moisture barrier 0.20 0.22 0.09 0.50
Package Information Description
Millimeters Min.
0.25 3.20
Nom.
3.40 31.20 28.00 31.20 28.00 1.60 0.65
Max.
4.10 0.50 3.60
Maximum Lead Coplanarity 0.004 inches (0.10mm)
1.03 0.40 0.23
Altera Corporation
Altera Device Package Information
Package Outline
Detail
DETAIL
Gage Plane
0.25mm
Altera Corporation
Altera Device Package Information
169-Pin Ultra Fineline BGA® (UBGA)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level UBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MO-216 Variation: BAF-1 Printed moisture barrier 0.40
Package Information Description
Millimeters Min.
0.20 0.65
Nom.
0.70 11.00 11.00 0.50 0.80
Max.
1.70
Maximum Lead Coplanarity 0.005 inches (0.12mm)
0.60
Altera Corporation
Altera Device Package Information
Package Outline
VIEW BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
192-Pin Ceramic Pin-Grid Array (PGA)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension inches. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish JEDEC Outline Reference Weight Moisture Sensitivity Level Alloy Gold Over Nickel Plate MO-067 Variation: 21.0 Printed moisture barrier 0.016 0.127 1.740 1.740
Package Information Description
Inches Min.
0.167
Nom.
0.192 0.050 0.142 1.760 1.760 0.130 0.018 0.100
Max.
0.217 0.157 1.780 1.780 0.020
Maximum Lead Coplanarity
Altera Corporation
Altera Device Package Information
Package Outline
VIEW
BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
208-Pin Plastic Quad Flat Pack (PQFP)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Lead Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level PQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte MS-029 Variation: FA-1 Printed moisture barrier
Package Outline Dimension Table Specification Symbol Min.
0.20 0.17 0.09 0.50 0.25 3.20
Millimeters Nom.
3.40 30.60 28.00 30.60 28.00 0.60 1.30 0.50 3.5° 0.27 0.20 0.75
Max.
4.10 0.50 3.60
Maximum Lead Coplanarity 0.003 inches (0.08
Altera Corporation
Altera Device Package Information
Package Outline
Detail
Detail
Gage Plane
0.25mm
Altera Corporation
Altera Device Package Information
208-Pin Power Quad Flat Pack (RQFP)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level RQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte MS-029 Variation: FA-1 10.8 Printed moisture barrier 0.20 0.17 0.09 0.45
Package Information Description
Millimeters Min.
0.25 3.20
Nom.
3.40 30.60 28.00 30.60 28.00 0.60 1.30 0.50 3.5°
Max.
4.10 0.50 3.60
Maximum Lead Coplanarity 0.003 inches (0.08mm)
0.75 0.27 0.20
Altera Corporation
Altera Device Package Information
Package Outline
Detail
DETAIL
Gage Plane 0.25mm
Altera Corporation
Altera Device Package Information
232-Pin Ceramic Pin-Grid Array (PGA)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension inches. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish JEDEC Outline Reference Weight Moisture Sensitivity Level Alloy Gold Over Nickel Plate MO-067 Variation: 25.5 Printed moisture barrier 0.016 0.134 1.740 1.740
Package Information Description
Inches Min.
0.174
Nom.
0.192 0.050 0.142 1.760 1.760 0.130 0.018 0.100
Max.
0.210 0.150 1.780 1.780 0.020
Maximum Lead Coplanarity
Altera Corporation
Altera Device Package Information
Package Outline
VIEW
BOTTOM VIEW Corner
Altera Corporation
Altera Device Package Information
240-Pin Plastic Quad Flat Pack (PQFP)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level PQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte MS-029 Variation: Printed moisture barrier 0.20 0.17 0.09 0.45
Package Information Description
Millimeters Min.
0.25 3.20
Nom.
3.40 34.60 32.00 34.60 32.00 0.60 1.30 0.50 3.5°
Max.
4.10 0.50 3.60
Maximum Lead Coplanarity 0.003 inches (0.08mm)
0.75 0.27 0.20
Altera Corporation
Altera Device Package Information
Package Outline
Detail
DETAIL
Gage Plane 0.25mm
Altera Corporation
Altera Device Package Information
240-Pin Power Quad Flat Pack (RQFP)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level RQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte MS-029 Variation: 15.1 Printed moisture barrier 0.20 0.17 0.09 0.45
Package Information Description
Millimeters Min.
0.25 3.20
Nom.
3.40 34.60 32.00 34.60 32.00 0.60 1.30 0.50 3.5°
Max.
4.10 0.50 3.60
Maximum Lead Coplanarity 0.003 inches (0.08mm)
0.75 0.27 0.20
Altera Corporation
Altera Device Package Information
Package Outline
Detail
DETAIL
Gage Plane 0.25mm
Altera Corporation
Altera Device Package Information
256-Pin FineLine BGA® (FBGA) Option
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Note: This applicable F256 package products except Cyclone which assembled Option package outlines.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level FBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 Printed moisture barrier Variation: AAF-1
Package Outline Dimension Table Specification Min.
0.50 0.30
Millimeters Nom.
0.70 17.00 17.00 0.60 1.00 0.70
Max.
2.20 1.80
Maximum Lead Coplanarity 0.008 inches (0.20
Altera Corporation
Altera Device Package Information
Package Outline
VIEW
BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
256-Pin FineLine BGA® (FBGA) Option
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Note: This applicable F256 package Cyclone product only.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level FBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MO-192 Printed moisture barrier Variation: AAF-1
Package Outline Dimension Table Specification Min.
0.40 0.25
Millimeters Nom.
1.05 17.00 17.00 0.50 1.00 0.55 0.80
Max.
1.55
Maximum Lead Coplanarity 0.008 inches (0.20
Altera Corporation
Altera Device Package Information
Package Outline
VIEW
BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
256-Pin Ball-Grid Array (BGA) Option
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level Tin-lead alloy (63/37) Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MO-192 Variation: BAL-2 Printed moisture barrier 0.60
Package Information Description
Millimeters Min.
0.35 0.25
Nom.
27.00 27.00 0.75 1.27
Max.
1.70 1.10
Maximum Lead Coplanarity 0.008 inches (0.20
0.90
Altera Corporation
Altera Device Package Information
Package Outline
VIEW BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
256-Pin Plastic Ball-Grid Array (BGA) Option
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 Printed moisture barrier Variation: BAL-2 0.60
Package Information Description
Millimeters Min.
0.35
Nom.
27.00 27.00 0.75 1.27
Max.
2.60 2.20 1.80
Maximum Lead Coplanarity 0.008 inches (0.20
0.90
Altera Corporation
Altera Device Package Information
Package Outline
VIEW BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
280-Pin Ceramic Pin-Grid Array (PGA)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension inches. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish JEDEC Outline Reference Weight Moisture Sensitivity Level Alloy Gold Over Nickel Plate MO-067 Variation: 29.5 Printed moisture barrier 0.016 0.125 1.940 1.940
Package Information Description
Inches Min.
0.165
Nom.
0.185 0.050 0.135 1.960 1.960 0.130 0.018 0.100
Max.
0.205 0.145 1.980 1.980 0.020
Maximum Lead Coplanarity
Altera Corporation
Altera Device Package Information
Package Outline
VIEW
BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
304-Pin Power Quad Flat Pack (RQFP)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level RQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte MS-029 Variation: 26.3 Printed moisture barrier 0.20 0.17 0.09 0.45
Package Information Description
Millimeters Min.
0.25 3.55
Nom.
3.80 42.60 40.00 42.60 40.00 0.60 1.30 0.50 3.5°
Max.
4.50 0.50 4.05
Maximum Lead Coplanarity 0.003 inches (0.08mm)
0.75 0.27 0.20
Altera Corporation
Altera Device Package Information
Package Outline
Detail
DETAIL
Gage Plane
0.25mm
Altera Corporation
Altera Device Package Information
324-Pin Fineline BGA® (FBGA)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level FBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 Variation: AAG-1 Printed moisture barrier 0.50
Package Information Description
Millimeters Min.
0.30
Nom.
0.70 19.00 19.00 0.60 1.00
Max.
2.20 1.80
Maximum Lead Coplanarity 0.008 inches (0.20mm)
0.70
Altera Corporation
Altera Device Package Information
Package Outline
VIEW BOTTOM VIEW Corner
Altera Corporation
Altera Device Package Information
356-Pin Ball-Grid Array (BGA)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level tape Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MO-192 Variation: BAR-2 Printed moisture barrier 0.60
Package Information Description
Millimeters Min.
0.35 0.25
Nom.
35.00 35.00 0.75 1.27
Max.
1.70 1.10
Maximum Lead Coplanarity 0.008 inches (0.20mm)
0.90
Altera Corporation
Altera Device Package Information
Package Outline
VIEW BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
400-Pin Fineline BGA® (FBGA)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level FBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 Variation: AAH-1 Printed moisture barrier 0.50
Package Information Description
Millimeters Min.
0.30
Nom.
0.70 21.00 21.00 0.60 1.00
Max.
2.20 1.80
Maximum Lead Coplanarity 0.008 inches (0.20mm)
0.70
Altera Corporation
Altera Device Package Information
Package Outline
VIEW BOTTOM VIEW Corner
Altera Corporation
Altera Device Package Information
403-Pin Ceramic Pin-Grid Array (PGA)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension inches. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish JEDEC Outline Reference Weight Moisture Sensitivity Level Alloy Gold Over Nickel Plate MO-128 Variation: 47.7 Printed moisture barrier 0.016 0.117 1.940 1.940
Package Information Description
Inches Min.
0.157
Nom.
0.180 0.050 0.130 1.960 1.960 0.130 0.018 0.100
Max.
0.203 0.143 1.980 1.980 0.020
Maximum Lead Coplanarity
Altera Corporation
Altera Device Package Information
Package Outline
VIEW
BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
484-Pin FineLine BGA® (FBGA) Flip Chip
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level FBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 Variation: AAJ-1 Printed moisture barrier 0.50
Package Information Description
Millimeters Min.
0.30 0.25
Nom.
23.00 23.00 0.60 1.00
Max.
3.50 3.00 2.50
Maximum Lead Coplanarity 0.008 inches (0.20
0.70
Altera Corporation
Altera Device Package Information
Package Outline
VIEW
BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
484-Pin FineLine BGA® (FBGA) Option
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level FBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 Printed moisture barrier Variation: AAJ-1
Package Outline Dimension Table Specification Symbol Min.
0.50 0.30
Millimeters Nom.
23.00 23.00 0.60 1.00 0.70
Max.
2.60 2.20 1.80
Maximum Lead Coplanarity 0.008 inches (0.20
Altera Corporation
Altera Device Package Information
Package Outline
VIEW BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
484-Pin FineLine BGA® (FBGA) Option
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level FBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 Printed moisture barrier Variation: AAJ-1
Package Outline Dimension Table Specification Symbol Min.
0.50 0.30
Millimeters Nom.
23.00 23.00 0.60 1.00 0.70
Max.
2.60 2.20 1.80
Maximum Lead Coplanarity 0.008 inches (0.20
Altera Corporation
Altera Device Package Information
Package Outline
VIEW BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
484-Pin Hybrid FineLine BGA® (HBGA) Flip Chip
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level HBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 Variation: AAL-1 Printed moisture barrier 0.50
Package Information Description
Millimeters Min.
0.30 0.25
Nom.
27.00 27.00 0.60 1.00
Max.
3.50 3.00 2.50
Maximum Lead Coplanarity 0.008 inches (0.20mm)
0.70
Altera Corporation
Altera Device Package Information
Package Outline
VIEW
BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
484-Pin Ultra FineLine BGA® (UBGA)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level UBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MO-216 Variation: BAP-2 Printed moisture barrier 0.40
Package Information Description
Millimeters Min.
0.20 0.65
Nom.
0.80 19.00 19.00 0.50 0.80
Max.
2.20
Maximum Lead Coplanarity 0.005 inches (0.12mm)
0.60
Altera Corporation
Altera Device Package Information
Package Outline
VIEW
BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
503-Pin Ceramic Pin-Grid Array (PGA)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension inches. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification
Alloy Gold Over Nickel Plate MO-128 59.0 Printed moisture barrier Variation: 0.016 2.245 2.245
Package Information Description
Ordering Code Reference Package Acronym Leadframe Material Lead Finish JEDEC Outline Reference Weight Moisture Sensitivity Level
Inches Min.
Nom.
0.050 2.260 2.260 0.130 0.018 0.100
Max.
0.205 0.145 2.275 2.275 0.020
Maximum Lead Coplanarity
Altera Corporation
Altera Device Package Information
Package Outline
VIEW
BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
599-Pin Ceramic Pin-Grid Array (PGA)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension inches. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish JEDEC Outline Reference Weight Moisture Sensitivity Level Alloy Gold Over Nickel Plate MO-128 Variation: 69.0 Printed moisture barrier 0.016 2.445 2.445
Package Information Description
Inches Min.
Nom.
0.050 2.460 2.460 0.130 0.018 0.100
Max.
0.205 0.145 2.475 2.475 0.020
Maximum Lead Coplanarity
Altera Corporation
Altera Device Package Information
Package Outline
VIEW BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
600-Pin Ball-Grid Array (BGA)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level tape Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MO-192 Variation: BAW-1 12.0 Printed moisture barrier 0.60
Package Information Description
Millimeters Min.
0.35 0.25
Nom.
45.00 45.00 0.75 1.27
Max.
2.00 1.10
Maximum Lead Coplanarity 0.008 inches (0.20mm)
0.90
Altera Corporation
Altera Device Package Information
Package Outline
VIEW
BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
652-Pin Ball-Grid Array (BGA) Flip Chip Option
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 16.1 Printed moisture barrier Variation: BAW-1
Package Outline Dimension Table Specification Symbol Min.
0.60 0.30 0.25
Millimeters Nom.
45.00 45.00 0.75 1.27 0.90
Max.
3.50 3.00 2.50
Maximum Lead Coplanarity 0.008 inches (0.20
Altera Corporation
Altera Device Package Information
Package Outline
VIEW
BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
652-Pin Plastic Ball-Grid Array (BGA) Option
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 Printed moisture barrier Variation: BAW-1
Package Outline Dimension Table Specification Symbol Min.
0.60 0.35
Millimeters Nom.
45.00 45.00 0.75 1.27 0.90
Max.
3.20 2.80 2.40
Maximum Lead Coplanarity 0.008 inches (0.20
Altera Corporation
Altera Device Package Information
Package Outline
VIEW
BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
652-Pin Plastic Ball-Grid Array (BGA) Option
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level tape Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MO-192 Variation: BAW-1 14.9 Printed moisture barrier
Package Outline Dimension Table Specification Symbol Min.
0.60 0.35 0.25
Millimeters Nom.
45.00 45.00 0.75 1.27 0.90
Max.
2.00 1.10
Maximum Lead Coplanarity 0.008 inches (0.20
Altera Corporation
Altera Device Package Information
Package Outline
VIEW
BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
655-Pin Ceramic Pin-Grid Array (PGA)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension inches. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish JEDEC Outline Reference Weight Moisture Sensitivity Level Alloy Gold Over Nickel Plate MO-128 Variation: 74.9 Printed moisture barrier 0.016 2.445 2.445
Package Information Description
Inches Min.
Nom.
0.050 2.460 2.460 0.130 0.018 0.100
Max.
0.205 0.145 2.475 2.475 0.020
Maximum Lead Coplanarity
Altera Corporation
Altera Device Package Information
Package Outline
VIEW
BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
672-Pin Platic Ball-Grid Array (BGA)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 Printed moisture barrier Variation: BAR-2
Package Outline Dimension Table Specification Symbol Min.
0.60 0.35
Millimeters Nom.
35.00 35.00 0.75 1.27 0.90
Max.
2.60 2.20 1.80
Maximum Lead Coplanarity 0.008 inches (0.20
Altera Corporation
Altera Device Package Information
Package Outline
VIEW BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
672-Pin Fineline BGA® (FBGA) Flip Chip
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level FBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 Printed moisture barrier Variation: AAL-1 0.50
Package Information Description
Millimeters Min.
0.30 0.25
Nom.
27.00 27.00 0.60 1.00
Max.
3.50 3.00 2.50
Maximum Lead Coplanarity 0.008 inches (0.20
0.70
Altera Corporation
Altera Device Package Information
Package Outline
VIEW
BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
672-Pin Fineline BGA® (FBGA) Option
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level FBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 Printed moisture barrier Variation: AAL-1
Package Outline Dimension Table Specification Symbol Min.
0.50 0.30
Millimeters Nom.
27.00 27.00 0.60 1.00 0.70
Max.
2.60 2.20 1.80
Maximum Lead Coplanarity 0.008 inches (0.20
Altera Corporation
Altera Device Package Information
Package Outline
VIEW BOTTOM VIEW Corner
Altera Corporation
Altera Device Package Information
672-Pin Fineline BGA® (FBGA) Option
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level FBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 Printed moisture barrier Variation: AAL-1
Package Outline Dimension Table Specification Symbol Min.
0.50 0.30
Millimeters Nom.
27.00 27.00 0.60 1.00 0.70
Max.
2.60 2.20 1.80
Maximum Lead Coplanarity 0.008 inches (0.20
Altera Corporation
Altera Device Package Information
Package Outline
VIEW BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
724-Pin Ball-Grid Array (BGA) Flip Chip
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 12.4 Printed moisture barrier Variation: BAR-1
Package Outline Dimension Table Specification Symbol Min.
0.60 0.30 0.25
Millimeters Nom.
35.00 35.00 0.75 1.27 0.90
Max.
3.50 3.00 2.50
Maximum Lead Coplanarity 0.008 inches (0.20
Altera Corporation
Altera Device Package Information
Package Outline
VIEW
BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
780-Pin FineLine BGA® (FBGA) Flip Chip
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level FBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 Printed moisture barrier Variation: AAM-1
Package Outline Dimension Table Specification Symbol Min.
0.50 0.30 0.25
Millimeters Nom.
29.00 29.00 0.60 1.00 0.70
Max.
3.50 3.00 2.50
Maximum Lead Coplanarity 0.008 inches (0.20
Altera Corporation
Altera Device Package Information
Package Outline
VIEW
BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
896-Pin FineLine BGA® (FBGA)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level FBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 11.5 Printed moisture barrier Variation: AAN-1
Package Outline Dimension Table Specification Symbol Min.
0.50 0.30
Millimeters Nom.
31.00 31.00 0.60 1.00 0.70
Max.
2.60 2.20 1.80
Maximum Lead Coplanarity 0.008 inches (0.20
Altera Corporation
Altera Device Package Information
Package Outline
VIEW BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
956-Pin Ball Grid Array (BGA) Flip Chip
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Maximum Lead Coplanarity Weight Moisture Sensitivity Level Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 14.6 Printed moisture barrier Variation: BAU-1
Package Outline Dimension Table Specification Symbol Min.
0.60 0.30 0.25
Millimeters Nom.
40.00 40.00 0.75 1.27 0.90
Max.
3.50 3.00 2.50
0.008 inches (0.20
Altera Corporation
Altera Device Package Information
Package Outline
VIEW
BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
1020-Pin Fineline BGA® (FBGA) Flip Chip
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level FBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 11.5 Printed moisture barrier Variation: AAP-1
Package Outline Dimension Table Specification Symbol Min.
0.50 0.30 0.25
Millimeters Nom.
33.00 33.00 0.60 1.00 0.70
Max.
3.50 3.00 2.50
Maximum Lead Coplanarity 0.008 inches (0.20
Altera Corporation
Altera Device Package Information
Package Outline
VIEW
BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
1152-Pin Fineline BGA® (FBGA) Flip Chip
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level FBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 12.0 Printed moisture barrier Variation: AAR-1
Package Outline Dimension Table Specification Symbol Min.
0.50 0.30 0.25
Millimeters Nom.
35.00 35.00 0.60 1.00 0.70
Max.
3.50 3.00 2.50
Maximum Lead Coplanarity 0.008 inches (0.20
Altera Corporation
Altera Device Package Information
Package Outline
VIEW
BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
1508-Pin Fineline BGA® (FBGA) Flip Chip
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level FBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 14.6 Printed moisture barrier Variation: AAU-1
Package Outline Dimension Table Specification Symbol Min.
0.50 0.30 0.25
Millimeters Nom.
40.00 40.00 0.60 1.00 0.70
Max.
3.50 3.00 2.50
Maximum Lead Coplanarity 0.008 inches (0.20
Altera Corporation
Altera Device Package Information
Package Outline
VIEW
BOTTOM VIEW
Corner
Altera Corporation
Innovation Drive Jose, 95134 (408) 544-7000 http://www.altera.com
Copyright 2005 Altera Corporation. rights reserved. Altera, Programmable Solutions Company, stylized Altera logo, specific device designations, other words logos that identified trademarks and/or service marks are, unless noted otherwise, trademarks service marks Altera Corporation U.S. other countries. other product service names property their respective holders. Altera products protected under numerous U.S. foreign patents pending applications, maskwork rights, copyrights. Altera warrants performance semiconductor products current specifications accordance with Altera's standard warranty, reserves right make changes products services time without notice. Altera assumes responsibility liability arising application information, product, service described herein except expressly agreed writing Altera Corporation. Altera customers advised obtain latest version device specifications before relying published information before placing orders products services.
Other recent searches
MB86276 - MB86276 MB86276 Datasheet
LTC3616 - LTC3616 LTC3616 Datasheet
BUH150G - BUH150G BUH150G Datasheet
BFW92A - BFW92A BFW92A Datasheet
Privacy Policy | Disclaimer
© 2012 Datasheet Archive
