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P16E.pdf 05.9.7
Ceramic Resonators (CERALOCKr)
Murata Manufacturing Co., Ltd.
Cat.No.P16E-16
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P16E.pdf 05.9.7
CONTENTS
Part Numbering
CERALOCKr "CERALOCK" this catalog trademarks Murata Manufacturing Co., Ltd.
Chip Type Three Terminals CSTCC/R/E/G/V/W Series Chip Type Terminals CSACV/W Series
Chip Type Notice Chip Type CSTC Series Packaging Chip Type CSAC Series Packaging Lead Type Three Terminals CSTLS Series Lead Type Terminals CSALS Series
Lead Type Notice Lead Type CSTLS Series Packaging Lead Type CSALS Series Packaging Chip Type Terminals CSBFB Series Lead Type Terminals CSBLA Series
Type Notice Type Packaging Application Circuits Utilizing
Recycled Paper
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P16E.pdf 05.9.7
Part Numbering
CERALOCKr (MHz)
(Part Number) qProduct Product wFrequency/Capacitance Code eStructure/Size Code CR/CE/CG Structure/Size Round Lead Type Chip Type Small-cap Chip Type Monolithic Chip Type Small Monolithic Chip Type uPackaging Code rNominal Center Frequency Expressed four-digit alphanumerics. unit hertz (Hz). Decimal point expressed capital letter "M". Packaging Bulk Radial Taping H0=18mm Plastic Taping Plastic Taping Frequency/Capacitance capacitance built-in Built-in Capacitance yIndividual Specification Code Individual Specification Three-digit alphanumerics express "Individual Specification". Ceramic Resonators 16M0 tDesign Code T/Vpp Design Thickness Shear mode Thickness Expander mode Thickness Expander mode (3rd overtone)
indicates initial frequency tolerance load capacity.
With standard products, "yIndividual Specification" omitted, "uPackage" carried
Radial taping applied lead type plastic taping chip type.
CERALOCKr (kHz)
(Part Number) qProduct Product wFrequency/Capacitance Code eStructure/Size Code rNominal Center Frequency Expressed four-digit alphanumerics. unit hertz (Hz). Capital letter following three figures expresses unit "kHz". case 1.0MHz (1000kHz) above, expressed three figures capital letter decimal point. Structure/Size Two-Terminal Lead Type Type Frequency/Capacitance capacitance built-in yIndividual Specification Code Individual Specification Three-digit alphanumerics express "Individual Specification". Ceramic Resonators 500K tDesign Code Design Area Expansion mode Area Expansion mode (Closed Type)
indicates initial frequency tolerance load capacitance.
With standard products, "yIndividual Specification" omitted, "uPackage" carried
uPackaging Code Packaging Bulk Plastic Taping
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P16E.pdf 05.9.7
Ceramic Resonators (CERALOCKr)
Chip Type Three Terminals CSTCC/R/E/G/V/W Series
7.2±0.2
Chip "CERALOCK" with built-in load capacitance extremely small package. MURATA's package technology expertise enabled development Chip "CERALOCK" with built-in load capacitors. High-density mounting realized because small package elimination need external load capacitor.
0.45±0.3
0.3±0.3 max.
0.5±0.05
0.45 (Ref.) 1.2±0.2
0.45 (Ref.) 1.4±0.2
0.45 (Ref.) 1.2±0.2
1.75±0.05 (2.00-2.99MHz) 1.55±0.05 (3.00MHz-)
Features
Oscillation circuits require external load capacitors. series available wide frequency range. resonators extremely small have profile. adjustment necessary oscillation circuits.
CSTCC_G(_A) 2.00-3.99MHz
1.1±0.1 2.5±0.1 2.5±0.1
max. EIAJ code 0.4±0.05 1.15±0.05 EIAJ Monthly Code max. 0.4±0.1 0.70±0.10 1.1max. 2.0±0.1
4.5±0.1 0.3±0.2
0.2±0.2 max.
Applicatons
Clock oscillators microprocessors Electronic control circuits small electronic equipment such hand held video camera Audio-visual applications (Camcorder, Remote Controller, etc.) Office automation equipments (DVD, CD-ROM, HDD, FDD, etc.) Automotive electronics (CSTCC_G_A series, CSTCR_G_B series, CSTCE_G_A series, CSTCE_V_A series, CSTCV_X_Q series) Dual Tone Multi Frequency (DTMF) generator cordless telephones
(ref.) (ref.) (ref.) 0.8±0.1 0.8±0.1 0.8±0.1
CSTCR_G(_B) 4.00-7.99MHz
0.4±0.1 0.75±0.1 1.5±0.1
0.4±0.1 1.5±0.1
0.4±0.1
3.2±0.15 0.10±0.10 1.3±0.15 0.50(ref.) 0.50(ref.) 0.4±0.1 0.4±0.1 0.4±0.1 1.1max. 0.4±0.1
0.1±0.1 3.0max.
0.50(ref.)
CSTCE_G(_A) 8.00-13.99MHz
0.4±0.1 1.2±0.1 1.2±0.1
3.2±0.15 0.10±0.10 1.3±0.15 0.10±0.10 1.1max.
2.0±0.15 1.3±0.15
0.1±0.1 3.0max. 0.9±0.1
0.4±0.1
0.075±0.075 1.85max. 0.85±0.1
0.62(ref.)
0.45(ref.)
0.62(ref.)
0.52(ref.) 0.5±0.1
0.41(ref.) 0.52(ref.) 0.3±0.1 0.5±0.1
0.6±0.10.4±0.1 0.6±0.1
CSTCE_V(_A) 14.00-20.00MHz
0.65±0.1 0.95±0.1 0.95±0.1
CSTCG_V 20.00-33.86MHz (Ultra small)
0.3±0.1
0.7±0.1
0.7±0.1
Continued following page.
3.0±0.2
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P16E.pdf 05.9.7
Continued from preceding page.
3.7±0.2 1.3±0.1 2.5T0.2 2.0T0.2 max.
3.1±0.2
(0.7)
(0.7)
(0.9)
0.05 +0.10 0.05
(0.5)
(0.5)
(0.5)
0.05 +0.10 0.05
0.4±0.2 0.5±0.2 0.4±0.2 Thickness varies with frequency built-in capacitance. EIAJ code 1.6±0.2 1.6±0.2 1.85±0.3
+0.3 +0.3 +0.3 0.5T0.2 0.5T0.2 0.5T0.2 Thickness varies with frequency built-in capacitance. EIAJ code 1.0T0.2 1.0T0.2 1.25T0.2
CSTCV_X_Q 20.01-70.00MHz
CSTCW_X 20.01-70.00MHz
Part Number CSTCC_G CSTCC_G_A CSTCR_G CSTCR_G_B CSTCE_G
Oscillating Frequency (MHz) 2.00 3.99 2.00 3.99 4.00 7.99 4.00 7.99 8.00 13.99
Initial Tolerance ±0.5 ±0.5 ±0.5 ±0.5 ±0.5 ±0.5 ±0.5 ±0.5 ±0.5 ±0.5 ±0.5
Temp. Stability ±0.3 [±0.4%:Built-in Capacitance 47pF type within Freq.2.00 3.49MHz]
Temperature Range (°C)
consumer electronics
±0.4 automotive +125 [-0.6% +0.3%:Built-in Capacitance 47pF type within Freq.2.00 3.49MHz] electronics ±0.2 ±0.15 ±0.2 ±0.2 ±0.3 ±0.3 ±0.3 ±0.3 ±0.2 +125 +125 +125 +125 consumer electronics automotive electronics consumer electronics automotive electronics consumer electronics automotive electronics consumer electronics automotive electronics consumer electronics
CSTCE_G_A 8.00 13.99 CSTCE_V 14.00 20.00
CSTCE_V_A 14.00 20.00 CSTCG_V 20.00 33.86
CSTCV_X_Q 20.01 70.00 CSTCW_X 20.01 70.00
Irregular stop oscillation occur under unmatched circuit conditions. Please check actual conditions prior use.
Oscillation Frequency Measuring Circuit
Frequency counter
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P16E.pdf 05.9.7
Standard Land Pattern Dimensions
CSTCC_G(_A) CSTCR_G(_B)
3.8~4.4
Land Pattern Land Pattern
CSTCE_G(_A)
CSTCE_V(_A)
0.65
0.65
1.90 2.10
0.95 Land Pattern
0.95 Land Pattem
CSTCG_V
CSTCV_X_Q
Land Pattem
CSTCW_X
Land Pattern
2.0T0.2
3.1±0.2 Land Pattern
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P16E.pdf 05.9.7
Oscillation Frequency Temperature Stability
CSTCC_G
+0.50
CSTCC_G_A
W0.5 Oscillating Frequency Shift
Oscillating Frequency Shift
W0.25
+0.25
Y0.25 Temperature (°C)
Temperature (°C)
-0.25
Y0.5 -0.50
CSTCR_G(_B)
+0.50 +0.50
CSTCE_G(_A)
Oscillating Frequency Shift
+0.25
Oscillating Frequency Shift
+0.25
Temperature (°C)
Temperature (°C)
-0.25
-0.25
-0.50
-0.50
CSTCE_V(_A)
+0.50 +0.50
CSTCG_V
Oscillating Frequency Shift
Oscillating Frequency Shift
+0.25
+0.25
Temperature (°C) -0.25
Temperature (°C) -0.25
-0.50
-0.50
CSTCV_X_Q
+0.50 W0.50
CSTCW_X
Oscillating Frequency Shift
Oscillating Frequency Shift
+0.25
W0.25
Temperature (°C)
Temperature (°C)
-0.25
Y0.25
-0.50
Y0.50
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P16E.pdf 05.9.7
Ceramic Resonators (CERALOCKr)
Chip Type Terminals CSACV/W Series
3.7±0.2 1.3±0.1
wide range chip "CERALOCK" available. This diverse series owes development MURATA's package technology expertise original mass production techniques. enables high-density mounting further miniaturization electronic equipment.
(0.5)
Terminal interchangeable. Terminal should soldered only resonator onto P.C.B. Terminal should electrically 0.4±0.2 0.5±0.2 0.4±0.2 froating cannot connected anywhere. Thickness varies with frequency. EIAJ Monthly Code 1.6±0.2 1.6±0.2 1.85±0.3
(0.5)
(0.5)
Features
series available wide frequency range. resonators extremely small have profile (CSACW series). adjustment necessary oscillation circuits.
CSACV_X_Q 20.01-70.00MHz
3.1±0.2
2.5T0.2 2.0T0.2
max.
Applications
Clock oscillators microprocessors Electronic control circuits small electronic equipment Automotive electronics (CSACV_X_Q series)
0.05 0.05
+0.10
(0.5)
(0.5)
0.05 0.05
+0.10
+0.3
+0.3
0.5T0.2
0.5T0.2
CSACW_X 20.01-70.00MHz
Thickness varies with frequency. EIAJ code 1.0T0.2 1.0T0.2 1.25T0.2
Part Number
Oscillating Frequency (MHz)
Initial Tolerance ±0.5 ±0.5
Temp. Stability ±0.3 ±0.2
Temperature Range (°C) +125
automotive electronics consumer electronics
CSACV_X_Q 20.01 70.00 CSACW_X 20.01 70.00
Irregular stop oscillation occur under unmatched circuit conditions. Please check actual conditions prior use.
Oscillation Frequency Measuring Circuit
Frequency counter
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P16E.pdf 05.9.7
Standard Land Pattern Dimensions
CSACV_X_Q
CSACW_X
Land Pattern
Land Pattern
Oscillation Frequency Temperature Stability
CSACV_X_Q
+0.50 W0.50
CSACW_X
Oscillating Frequency Shift
Oscillating Frequency Shift
+0.25
W0.25
Temperature (°C)
2.0T0.2
3.1±0.2
Temperature (°C)
-0.25
Y0.25
-0.50
Y0.50
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P16E.pdf 05.9.7
CSTCC Series Notice (Soldering Mounting)
Soldering Conditions Reflow heat stress, shown profile right, applied resonator; then, after being placed natural conditions hour, resonator measured. Pre-heating conditions should +150 +180°C seconds. Ascending time +150°C should longer than seconds. Heating conditions should within seconds +230°C min., peak temperature should Iower than +260°C. Soldering Iron Soldering iron +300±5°C should placed 0.5mm above electrode resonator. Melting solder through soldering iron should applied electrode seconds; then, after being placed natural conditions hours, resonator should measured. Wash Some series withstand washing. Please check list right before use. Cleaning Solvents HCFC, Isopropanol, water, Demineralized water, Cleanthrough750H, Pine alpha 100S, Techno care Temperature Difference dT<=60°C (dT=Component-solvent) case component +90°C immerses into cleaning solvent +60°C, then dT=30°C. Conditions Ultrasonic Wash minute max. above solvent +60°C max. (Frequency 28kHz, Output 20W/L)
Peak (260°C max.) Temperature (°C) Heating (230°C) Pre-heating (150-180°C) Gradual Cooling
sec. min.
60-120 sec.
sec. max.
sec. min.
Series CSTCC (Except 2.00 3.49MHz) CSTCC (Only 2.00 3.49MHz)
automotive types available.
Wash
Available Available
Immersion Wash minutes max. above solvent +60°C max. Shower Rinse Wash minutes max. above solvent +60°C max.
Drying minutes max. blow +80°C max. Others Total washing time should within minutes. component damaged washed with chlorine, petroleum, alkali cleaning solvent. Notice Mounting component recommended with placement machines which employ optical placement capabilities. component might damaged excessive mechanical force. Please make sure evaluate using placement machines before going into mass production. placement machines which utilize mechanical positioning. Please contact Murata details beforehand.
Please insure component thoroughly evaluated your application circuit. Please apply excess mechanical stress component terminals during soldering.
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sales representatives product engineers before ordering. This catalog only typical specifications because there space detailed specifications. Therefore, please approve product specifications transact approval sheet product specifications before ordering. This catalog only typical specifications because there space detailed specifications. Therefore, please approve product specifications transact approval sheet product specifications before ordering.
P16E.pdf 05.9.7
CSTCR/CSTCE_V/CSTCG Series Notice (Soldering Mounting)
Soldering Conditions Reflow heat stress, shown profile right, applied resonator; then, after being placed natural conditions hour, resonator measured. Pre-heating conditions should +150 +180°C seconds. Ascending time +150°C should longer than seconds. Heating conditions should within seconds +230°C min., peak temperature should Iower than +260°C. Soldering Iron Soldering iron +350±5°C should placed 0.5mm above electrode resonator. Melting solder through soldering iron should applied electrode seconds; then, after being placed natural conditions hours, resonator should measured. Wash (Automotive types) Some series withstand washing. Please check list right before use. Cleaning Solvents HCFC, Isopropanol, water, Demineralized water, Cleanthrough750H, Pine alpha 100S, Techno care Temperature Difference dT<=60°C (dT=Component-solvent) case component +90°C immerses into cleaning solvent +60°C, then dT=30°C. Conditions Ultrasonic Wash minute max. above solvent +60°C max. (Frequency 28kHz, Output 20W/L)
Peak (260°C max.) Temperature (°C) Heating (230°C) Pre-heating (150-180°C) Gradual Cooling
sec. min.
60-120 sec.
sec. max.
sec. min.
Series CSTCR CSTCE_V CSTCG
automotive types available.
Wash
Available Available Available
Immersion Wash minutes max. above solvent +60°C max. Shower Rinse Wash minutes max. above solvent +60°C max.
Drying minutes max. blow +80°C max. Others Total washing time should within minutes. component damaged washed with chlorine, petroleum, alkali cleaning solvent. Notice Mounting component recommended with placement machines which employ optical placement capabilities. component might damaged excessive mechanical force. Please make sure evaluate using placement machines before going into mass production. placement machines which utilize mechanical positioning. Please contact Murata details beforehand.
Please insure component thoroughly evaluated your application circuit. Please apply excess mechanical stress component terminals during soldering.
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sales representatives product engineers before ordering. This catalog only typical specifications because there space detailed specifications. Therefore, please approve product specifications transact approval sheet product specifications before ordering. This catalog only typical specifications because there space detailed specifications. Therefore, please approve product specifications transact approval sheet product specifications before ordering.
P16E.pdf 05.9.7
CSTCE_G Series Notice (Soldering Mounting)
Soldering Conditions Reflow heat stress, shown profile right, applied resonator; then, after being placed natural conditions hour, resonator measured. Pre-heating conditions should +150 +180°C seconds. Ascending time +150°C should longer than seconds. Heating conditions should within seconds +230°C min., peak temperature should Iower than +260°C. Soldering Iron Soldering iron +330±5°C should placed 0.5mm above electrode resonator. Melting solder through soldering iron should applied electrode seconds; then, after being placed natural conditions hours, resonator should measured. Wash (Automotive types) Some series withstand washing. Please check list right before use. Cleaning Solvents HCFC, Isopropanol, water, Demineralized water, Cleanthrough750H, Pine alpha 100S, Techno care Temperature Difference dT<=60°C (dT=Component-solvent) case component +90°C immerses into cleaning solvent +60°C, then dT=30°C. Conditions Ultrasonic Wash minute max. above solvent +60°C max. (Frequency 28kHz, Output 20W/L)
Peak (260°C max.) Temperature (°C) Heating (230°C) Pre-heating (150-180°C) Gradual Cooling
sec. min.
60-120 sec.
sec. max.
sec. min.
Series CSTCE_G
Automotive types available.
Wash
Available
Immersion Wash minutes max. above solvent +60°C max. Shower Rinse Wash minutes max. above solvent +60°C max.
Drying minutes max. blow +80°C max. Others Total washing time should within minutes. component damaged washed with chlorine, petroleum, alkali cleaning solvent. Notice Mounting component recommended with placement machines which employ optical placement capabilities. component might damaged excessive mechanical force. Please make sure evaluate using placement machines before going into mass production. placement machines which utilize mechanical positioning. Please contact Murata details beforehand.
Please insure component thoroughly evaluated your application circuit. Please apply excess mechanical stress component terminals during soldering.
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sales representatives product engineers before ordering. This catalog only typical specifications because there space detailed specifications. Therefore, please approve product specifications transact approval sheet product specifications before ordering. This catalog only typical specifications because there space detailed specifications. Therefore, please approve product specifications transact approval sheet product specifications before ordering.
P16E.pdf 05.9.7
CSTCV/CSACV Series Notice (Soldering Mounting)
Soldering Conditions Reflow heat stress, shown profile right, applied resonator; then, after being placed natural conditions hour, resonator measured. Pre-heating conditions should +150 +180°C seconds. Ascending time +150°C should longer than seconds. Heating conditions should within seconds +230°C min., peak temperature should Iower than +260°C. Soldering Iron Soldering iron +350±5°C should placed 0.5mm above electrode resonator. Melting solder through soldering iron should applied electrode seconds; then, after being placed natural conditions hours, resonator should measured. Wash Cleaning Solvents HCFC, Isopropanol, water, Demineralized water, Cleanthrough750H, Pine alpha 100S, Techno care Temperature Difference dT<=60°C (dT=Component-solvent) case component +90°C immerses into cleaning solvent +60°C, then dT=30°C. Conditions Ultrasonic Wash minute max. above solvent +60°C max. (Frequency 28kHz, Output 20W/L)
Peak (260°C max.) Temperature (°C) Heating (230°C) Pre-heating (150-180°C) Gradual Cooling
sec. min.
60-120 sec.
sec. max.
sec. min.
Immersion Wash minutes max. above solvent +60°C max. Shower Rinse Wash minutes max. above solvent +60°C max.
Drying minutes max. blow +80°C max. Others Total washing time should within minutes. component damaged washed with chlorine, petroleum, alkali cleaning solvent. Notice Mounting component recommended with placement machines which employ optical placement capabilities. some cases, placement machines which utilize mechanical positioning apply excessive mechanical force which might result damage ceramic resonator. Please contact Murata before mounting this product using placement machines which mechanical positioning.
Please insure component thoroughly evaluated your application circuit. Please apply excess mechanical stress component terminals during soldering.
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P16E.pdf 05.9.7
CSTCW/CSACW Series Notice (Soldering Mounting)
Soldering Conditions Reflow heat stress, shown profile right, applied resonator; then, after being placed natural conditions hour, resonator measured. Pre-heating conditions should +150 +180°C seconds. Ascending time +150°C should longer than seconds. Heating conditions should within seconds +230°C min., peak temperature should Iower than +260°C. Soldering Iron Soldering iron +330±5°C should placed 0.5mm above electrode resonator. Melting solder through soldering iron should applied electrode seconds; then, after being placed natural conditions hours, resonator should measured. Wash component cannot withstand washing. Notice Mounting Please insure component thoroughly evaluated your application circuit. Please apply excess mechanical stress component terminals during soldering.
Peak (260°C max.) Temperature (°C) Heating (230°C) Pre-heating (150-180°C) Gradual Cooling
sec. min.
60-120 sec.
sec. max.
sec. min.
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P16E.pdf 05.9.7
Chip Type Notice
Notice (Storage Operating Conditions)
reduced quality, and/or degraded Product Storage Condition solderability storage Please store products room where chemical atmosphere. temperature/humidity stable. avoid Please products directly such places where there large temperature floor without anything under them avoid damp changes. Please store products under places and/or dusty places. following conditions: Please store products places Temperature: degree such damp heated place, place where Humidity: R.H. direct sunlight comes place applying Expire Date Storage vibrations. Expire date (Shelf life) products Please products immediately after months after delivery under conditions package opened, because characteristics sealed unopened package. Please reduced quality, and/or degraded products within months after delivery. solderability storage under poor store products long time (more than condition. months), carefully because products Please drop products avoid cracking degraded solderability and/or rusty. ceramic element. Please confirm solderability characteristics Others products regularly. Conformal coating washing component Notice Product Storage acceptable because hermetically sealed. Please store products chemical Please sure consult with sales representative atmosphere (Acids, Alkali, Bases, Organic gas, engineer whenever prior tousing products. Sulfides on), because characteristics
Notice (Storage Operating Conditions)
Please products directly Product Storage Condition floor without anything under them avoid damp Please store products room where places and/or dusty places. temperature/humidity stable. avoid Please store products places such places where there large temperature such damp heated place, place where changes. Please store products under direct sunlight comes place applying following conditions: vibrations. Temperature: degree Please products immediately after Humidity: R.H. package opened, because characteristics Expire Date Storage reduced quality, and/or degraded Expire date (Shelf life) products solderability storage under poor months after delivery under conditions condition. sealed unopened package. Please Please drop products avoid cracking products within months after delivery. ceramic element. store products long time (more than Others months), carefully because products Conformal coating component acceptable. degraded solderability and/or rusty. However, resin material, curing temperature, Please confirm solderability characteristics other process conditions should evaluated products regularly. confirm that stable electrical characteristics Notice Product Storage maintained. Please store products chemical Please sure consult with sales representative atmosphere (Acids, Alkali, Bases, Organic gas, engineer whenever prior tousing products. Sulfides on), because characteristics reduced quality, and/or degraded solderability storage chemical atmosphere.
Notice (Rating)
component damaged excess mechanical stress applied.
Notice (Handling)
"CERALOCK" stop oscillating oscillate irregularly under improper circuit conditions.
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sales representatives product engineers before ordering. This catalog only typical specifications because there space detailed specifications. Therefore, please approve product specifications transact approval sheet product specifications before ordering. This catalog only typical specifications because there space detailed specifications. Therefore, please approve product specifications transact approval sheet product specifications before ordering.
P16E.pdf 05.9.7
Chip Type CSTC Series Packaging
Minimum Quantity
Part Number Plastic Tape Plastic Tape Bulk Dimensions
CSTCC_G CSTCC_G_A CSTCR_G CSTCR_G_B CSTCE_G CSTCE_G_A CSTCE_V CSTCE_V_A CSTCV_X_Q CSTCW_X CSTCG_V
2,000 2,000 3,000 3,000 3,000 3,000 3,000 3,000 2,000 3,000 3,000
6,000 6,000 9,000 9,000 9,000 9,000 9,000 9,000 6,000 9,000 9,000
(pcs.)
order quantity should integral multiple "Minimum Quantity" shown above.
Dimensions Reel
Trailer 160-190 Empty Components Leader Cover Film Empty min. -1.5 400-560 Trailer 160-190 Empty Components
Leader Cover Film Empty min. 400-560
-1.5
2.0±0.5
2.0±0.5
13.0
+1.0
+1.0
17.0±1.0
13.0±1.0
Dimensions Taping
CSTCC_G(_A) less than 3.00MHz
1.75±0.1 4.0±0.1 2.0±0.05
CSTCC_G(_A) more than 3.00MHz
4.0±0.1 2.0±0.05 1.55±0.05 1.75±0.1 5.5±0.05 1.65±0.05 7.6±0.1 3°max. (2.25 max.) 0.3±0.05 12.0±0.2
5.5±0.05
12.0±0.2
4.0±0.1 +0.3 -0.0 3.3±0.1 Direction Feed
7.6±0.1
(9.5)
4.0±0.1
-0.0 3.3±0.1 (2.45 max.) 0.3±0.05 1.85±0.05
cover film peel strength force 0.7N cover film peel speed 300mm/min. Cover film
3°max.
cover film peel strength force 0.7N cover film peel speed 300mm/min. Cover film
Direction Feed
(9.5)
Continued following page.
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sales representatives product engineers before ordering. This catalog only typical specifications because there space detailed specifications. Therefore, please approve product specifications transact approval sheet product specifications before ordering. This catalog only typical specifications because there space detailed specifications. Therefore, please approve product specifications transact approval sheet product specifications before ordering.
P16E.pdf 05.9.7
Chip Type CSTC Series Packaging
Continued from preceding page.
Dimensions Taping
CSTCR_G(_B)
1.75±0.1 4.0±0.1 2.0±0.05 W0.1 4.0±0.1 2.0±0.05
CSTCE_G(_A)
+0.1 -0.0 1.75±0.1 3.5±0.05
5.5±0.05
4.7±0.1 (9.5)
12.0±0.2
4.0±0.1
(1.85 max.)
0.25±0.05
max.
0.3±0.05
max.
Cover Film
0.90±0.10
cover film peel strength force 0.7N cover film peel speed 300mm/min. Cover Film
(1.30 max.) 12.0±0.2 8.0±0.2
Direction Feed
1.25±0.05
W0.1 2.2±0.1
4.0±0.1 cover film peel strength force 0.7N cover film peel speed 300mm/min.
-0.0 1.50±0.1
+0.2
Direction Feed
CSTCE_V(_A)
1.75±0.1 Dimensions Carrier Tape 4.0±0.1 2.0±0.05 -0.0
+0.1
CSTCV_X_Q
4.0±0.1 2.0±0.1 W0.1 Y0.0 1.75±0.1
3.40±0.1
(5.2)
3.5±0.05
3.45±0.1
(5.2)
(3)(2)(1)
8.0±0.2
(9.5)
(1.40 max.)
0.25±0.05
1.50±0.1 cover film peel strength force 0.7N cover film peel speed 300mm/min. Cover Film
1.10±0.05
Cover Film
max.
max.
Direction Feed Dimensions vary with product thickness CERALOCKr 1.50-1.40 1.65±0.1 max. 1.30-1.20 1.45±0.1 max. 1.10-1.00 1.2±0.1 max.
Direction Feed
Thickness CERALOCKr
CSTCG_V
4.0±0.1 2.0±0.05 1.75±0.1 Dimensions Carrier Tape -0.0
+0.1
CSTCW_X
4.0±0.1 2.0±0.1 +0.1 1.75±0.1
3.5±0.05
8.0±0.2
2.2±0.05
(5.2)
max.
(1.30 max.)
0.25±0.05
1.00±0.05
1.45±0.1 cover film peel strength force 0.7N cover film peel speed 300mm/min. Cover Film
Direction Feed
max.
Dimensions vary with product thickness CERALOCKr Thickness CERALOCKr 1.40-1.20 1.48±0.1 max. 1.15-1.00 1.30±0.1 max. 0.95-0.90 1.12±0.1 max.
Direction Feed
4.0±0.1
+0.1 -0.0
0.2±0.1
cover film peel strength force 0.7N cover film peel speed 300mm/min. Cover Film
4.0±0.1 +0.1 2.3-0.05
2.8±0.1
(5.5)
+0.2
3.5±0.1
4.0±0.1
0.3±0.1
+0.1 -0.0
cover film peel strength force 0.7N cover film peel speed 300mm/min.
4.0±0.1 W0.1 3.35 Y0.05
W0.3 Y0.0
4.1±0.1
5.5±0.1
8.0±0.2
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P16E.pdf 05.9.7
Chip Type CSAC Series Packaging
Minimum Quantity
Part Number Plastic Tape Plastic Tape Bulk Dimensions
CSACV_X_Q CSACW_X
2,000 3,000
6,000 9,000
(pcs.)
order quantity should integral multiple "Minimum Quantity" shown above.
Dimensions Reel
Trailer 160-190 Empty Components -1.5 Leader Cover Film Empty min. -1.5 400-560 Trailer 160-190 Empty Components
Leader Cover Film Empty min. 400-560
2.0±0.5
+1.0
2.0±0.5
13.0
+1.0
17.0±1.0
13.0±1.0
Dimensions Taping
CSACV_X_Q
1.75±0.1 4.0±0.1 2.0±0.1 W0.1 Y0.0
CSACW_X
4.0±0.1 2.0±0.1 +0.1 -0.0 1.75±0.1 3.5±0.1 0.3±0.1 2.8±0.1 +0.2 0.95-0.90 1.12±0.1 max. 8.0±0.2
5.5±0.1
(3)(2)(1)
12.0±0.2
(9.5)
0.3±0.1
cover film peel strength force 0.7N cover film peel speed 300mm/min. Cover Film
max.
4.0±0.1 W0.1 3.35 Y0.05
W0.3 Y0.0
4.1±0.1
(5.5)
cover film peel strength force 0.7N cover film peel speed 300mm/min. Cover Film
4.0±0.1 +0.1 -0.05 max.
Direction Feed Dimensions vary with product thickness CERALOCKr 1.50-1.40 1.65±0.1 max. 1.30-1.20 1.45±0.1 max. 1.10-1.00 1.2±0.1 max.
Direction Feed Dimensions vary with product thickness CERALOCKr Thickness CERALOCKr 1.40-1.20 1.48±0.1 max. 1.15-1.00 1.30±0.1 max.
Thickness CERALOCKr
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P16E.pdf 05.9.7
Ceramic Resonators (CERALOCKr)
Lead Type Three Terminals CSTLS Series
8.0±1.0 3.0±1.0
Features
Oscillation circuits require external load capacitors. series stable over wide temperature range. resonators compact, light weight exhibit superior shock resistance performance. They enable design oscillator circuits requiring adjustment. series inexpensive available stable supply. There some variation built-in capacitance values applicable various
CSTLS_G 3.40-10.00MHz
Weekly Date Code 3.5±1.0 (16.00-32.99MHz) 3.0±1.0 (33.00-70.00MHz) EIAJ Monthly Code
"CERALOCK" with built-in load capacitors. MURATA's ceramic resonator, "CERALOCK", been widely applied most suitable component clock oscillators broad range microprocessors. CSTLS series used design oscillation circuits requiring external load capacitors, enabling both high-density mounting cost reduction.
(Ref.)
(Ref.)
2.5±0.2
2.5±0.2
5.5±1.0
Applications
DTMF generators Clock oscillators microcomputers Remote control units Automated office equipment
Oscillating Frequency (MHz) 3.40 10.00 16.00 70.00 Initial Tolerance ±0.5 ±0.5
CSTLS_X 16.00-70.00MHz
2.5±0.2 2.5±0.2
0.48±0.05
3.5±0.3
6.5±0.5
3.5±0.3
5.5±0.5
Part Number CSTLS_G CSTLS_X
Temp. Stability ±0.2 [-0.4% +0.2%:Built-in Capacitance 47pF type] ±0.2
Temperature Range (°C)
consumer electronics consumer electronics
Irregular stop oscillation occur under unmatched circuit conditions. Please check actual conditions prior use. order quantity should integral multiple "Minimum Quantity" shown packaging page.
Oscillation Frequency Measuring Circuit
Frequency counter
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P16E.pdf 05.9.7
Oscillation Frequency Temperature Stability
CSTLS_G
W0.50
CSTLS_X
Oscillating Frequency Shift Oscillating Frequency Shift W0.25
Temperature (°C) Y0.25
-0.1 -0.2 -0.3
Temperature (°C)
Y0.50
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P16E.pdf 05.9.7
Ceramic Resonators (CERALOCKr)
Lead Type Terminals CSALS Series
5.5±1.0
"CERALOCK" with leaded terminals. CSALS series ceramic resonators their development MURATA's innovative expert technologies application mass production techniques typically utilized manufacture piezoelectric ceramic components. Because their high mechanical consistent high quality, CSALS series ideally suited microprocessor remote control unit applications. addition, MURATA offers special "CERALOCK" version suitable automatic insertion utilizing tape reel other packaging forms. further information, please contact your local MURATA representative office authorized distributor.
5.0±0.3 3.5±1.0 (16.00-32.99MHz) 3.0±1.0 (33.00-70.00MHz) 0.48±0.05
3.5±0.3
6.5±0.5
CSALS_X 16.00-70.00MHz
EIAJ Monthly Code
Features
series stable over wide temperature range with respect long-term aging. series comprises fixed, tuned, solid-state devices. resonators miniature light weight. They exhibit excellent shock resistance performance. Oscillating circuits requiring adjustment designed utilizing these resonators conjunction with transistors appropriate ICs.
Applications
Square-wave sine-wave oscillator Clock generator microprocessors Remote control systems
Oscillating Frequency (MHz) 16.00 70.00 Initial Tolerance ±0.5 Temp. Stability ±0.2 Temperature Range (°C)
Part Number CSALS_X
consumer electronics
Irregular stop oscillation occur under unmatched circuit conditions. Please check actual conditions prior use. order quantity should integral multiple "Minimum Quantity" shown packaging page.
Oscillation Frequency Measuring Circuit
Oscillation Frequency Temperature Stability
Oscillating Frequency Shift
Frequency counter
-0.1 -0.2 -0.3
Temperature (°C)
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P16E.pdf 05.9.7
Lead Type Notice
Notice (Soldering Mounting)
component cannot withstand washing. Please apply excessive mechanical stress component lead terminals during soldering.
Notice (Storage Operating Conditions)
Product Storage Condition Please store products room where temperature/humidity stable. avoid such places where there large temperature changes. Please store products under following conditions: Temperature: degree Humidity: R.H. Expire Date Storage Expire date (Shelf life) products months after delivery under conditions sealed unopened package. Please products within months after delivery. store products long time (more than months), carefully because products degraded solderability and/or rusty. Please confirm solderability characteristics products regularly. Notice Product Storage Please store products chemical atmosphere (Acids, Alkali, Bases, Organic gas, Sulfides on), because characteristics reduced quality, and/or degraded solderability storage chemical atmosphere. Please products directly floor without anything under them avoid damp places and/or dusty places. Please store products places such damp heated place, place where direct sunlight comes place applying vibrations. Please products immediately after package opened, because characteristics reduced quality, and/or degraded solderability storage under poor condition. Please drop products avoid cracking ceramic element. Others Conformal coating washing component acceptable because hermetically sealed. Please sure consult with sales representative engineer whenever prior tousing products.
Notice (Rating)
component damaged excess mechanical stress applied.
Notice (Handling)
"CERALOCK" stop oscillating oscillate irregularly under improper circuit conditions.
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sales representatives product engineers before ordering. This catalog only typical specifications because there space detailed specifications. Therefore, please approve product specifications transact approval sheet product specifications before ordering. This catalog only typical specifications because there space detailed specifications. Therefore, please approve product specifications transact approval sheet product specifications before ordering.
P16E.pdf 05.9.7
Lead Type CSTLS Series Packaging
Minimum Quantity
Part Number Ammo Pack Bulk
CSTLS_G (3.40 10.0MHz) CSTLS_X (16.00 70.00MHz)
2,000 2,000
(pcs.)
order quantity should integral multiple "Minimum Quantity" shown above.
Tape Dimensions CSTLS_G
Direction Feed
Item
Code
Dimensions
Tolerance
Remarks
Width diameter Height resonator Dimensions terminal Lead length under hold down tape Pitch component Pitch sprocket hole Length from sprocket hole center lead Length from sprocket hole center component center Lead spacing Lead spacing (II) Slant forward backward Width carrier tape Width hold down tape Position sprocket hole hold down tape carrier tape Distance between center sprocket hole lead stopper Total height resonator Diameter sprocket hole Total tape thickness Body tilt
min. 12.7 12.7 3.85 6.35 18.0 min. 18.0 23.5
±1.0 ±0.5 ±0.05 ±0.5 ±0.2 ±0.5 ±0.5 ±0.2 ±0.2 ±1.0 ±0.5 ±0.5 W0.5 ±0.5 ±1.0 ±0.2 ±0.2 ±1.0
Continued following page.
Tolerance Pitches 10xP0=127±1
max. Hold down tape does exceed carrier tape.
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P16E.pdf 05.9.7
Lead Type CSTLS Series Packaging
Continued from preceding page.
Tape Dimensions CSTLS_X
Direction Feed
Remarks
Item
Code
Dimensions
Tolerance
Width diameter Height resonator Dimensions terminal Lead length under hold down tape Pitch component Pitch sprocket hole Length from sprocket hole center lead Length from sprocket hole center component center Lead spacing Lead spacing (II) Slant forward backward Width carrier tape Width hold down tape Position sprocket hole hold down tape carrier tape Distance between center sprocket hole lead stopper Total height resonator Diameter sprocket hole Total tape thickness Body tilt
min. 12.7 12.7 3.85 6.35 18.0 min. 18.0 24.5
±1.0 ±0.5 ±0.05 ±0.5 ±0.2 ±0.5 ±0.5 ±0.2 ±0.2 ±1.0 ±0.5 ±0.5
W0.5 Y0.0
Tolerance Pitches 10xP0=127±1
max. Hold down tape doesn't exceed carrier tape.
±0.5 ±0.1 ±0.2 ±0.2 ±1.0
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P16E.pdf 05.9.7
Lead Type CSALS Series Packaging
Minimum Quantity
Part Number Ammo Pack Bulk
CSALS_X (16.00 70.00MHz)
2,000
(pcs.)
order quantity should integral multiple "Minimum Quantity" shown above.
Tape Dimensions CSALS
Direction Feed
Item
Code
Dimensions
Tolerance
Remarks
Width diameter Height resonator Dimensions terminal Lead length under hold down tape Pitch component Pitch sprocket hole Length from sprocket hole center lead Length from sprocket hole center component center Lead spacing Slant forward backward Width carrier tape Width hold down tape Position sprocket hole hold down tape carrier tape Distance between center sprocket hole lead stopper Total height resonator Diameter sprocket hole Total tape thickness Body tilt
min. 12.7 12.7 3.85 6.35 18.0 min. 18.0 24.5
±1.0 ±0.5 ±0.05 ±0.5 ±0.2 ±0.5 ±0.5 ±0.3 ±1.0 ±0.5 ±0.5 +0.5 ±0.5 ±1.0 ±0.2 ±0.2 ±1.0
Tolerance Pitches 10xP0=127±1
max. Hold down tape doesn't exceed carrier tape.
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P16E.pdf 05.9.7
Ceramic Resonators (CERALOCKr)
Chip Type Terminals CSBFB Series
7.5±0.3 3.3±0.3
reflow soldered mounted automatic placers. MURATA's original package technologies have enabled development band "CERALOCK". series perfect miniature remote control units modules.
max.
8.5±0.3
2.0±0.5
-0.4
+0.1
Features
series withstands reflow soldering. series mountable automatic placers. adjustment necessary oscillation circuits.
CSBFB_J 430-519kHz
5.0±0.2
1.1±0.1 0.9±0.1 0.15 max.
0.15±0.05
EIAJ code
Applications
Clock oscillators microprocessors equipment modules
max. 5.0±0.3 2.3±0.2
6.0±0.3
+0.1 -0.4
2.0±0.5
1.0±0.3
1.0±0.5
0.8±0.2 0.7±0.2 0.15 max. 0.15±0.05 0.10±0.03 EIAJ code
CSBFB_J 700-1250kHz
2.5±0.2
Part Number CSBFB_J
Oscillating Frequency (kHz) 519, 1250
Initial Tolerance ±0.5%
Temp. Stability ±0.3
Temperature Range (°C)
Irregular stop oscillation occur under unmatched circuit conditions. Please check actual conditions prior use.
Oscillation Frequency Measuring Circuit
Oscillation Frequency Temperature Stability
W0.5 Oscillating Frequency Shift
Frequency counter
Temperature (°C)
Y0.5
Continued following page.
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P16E.pdf 05.9.7
Continued from preceding page.
Standard Land Pattern Dimensions
CSBFB_J (430-519kHz) CSBFB_J (700-1250kHz)
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P16E.pdf 05.9.7
Ceramic Resonators (CERALOCKr)
Lead Type Terminals CSBLA Series
7.9±0.3 3.6±0.3
"CERALOCK" with leaded terminals. CSBLA series ceramic resonators their development MURATA's innovative expert technologies application mass production techniques typically utilized manufacture piezoelectric ceramic components. Because their high mechanical consistent high quality, CSBLA series ideally suited microprocessor remote control unit applications.
max.
Features
series stable over wide temperature range with respect long-term aging. series comprises fixed, tuned, solid-state devices. resonators miniature light weight. They exhibit excellent shock resistance performance. Oscillating circuits requiring adjustment designed utilizing these resonators conjunction with transistors appropriate ICs.
5.0±0.2
1.8±0.3
CSBLA_E 375-429kHz
0.1±0.03
0.25±0.1
0.8±0.1 1.1±0.1
4.3±0.5
9.3±0.3
EIAJ code
7.0±0.3
3.5±0.3
max.
1.75±0.5
Applications
Square-wave sine-wave oscillators Clock generator microprocessors Remote control systems
CSBLA_E 430-509kHz
5.0±0.2
0.1±0.03
0.25±0.1
0.8±0.1 1.1±0.1
3.5±0.5
9.0±0.3
EIAJ code
7.0±0.3
3.5±0.3
max.
1.75±0.5
CSBLA_E 510-699kHz
0.1±0.03
0.25±0.1
0.8±0.1 1.1±0.1
3.5±0.5
9.0±0.3
EIAJ code
5.0±0.2
5.0±0.3
2.2±0.2
max.
3.5±.0.5
6.0±0.3
0.8±0.2 0.6±0.2
0.15±0.05 0.1±0.03 EIAJ code
1.1±0.2
CSBLA_J 700-1250kHz
2.5±0.2
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P16E.pdf 05.9.7
Part Number CSBLA_E CSBLA_J
Oscillating Frequency (kHz) 1250
Initial Tolerance ±2kHz ±0.5%
Temp. Stability ±0.3 ±0.3
Temperature Range (°C)
Irregular stop oscillation occur under unmatched circuit conditions. Please check actual conditions prior use. order quantity should integral multiple "Minimum Quantity" shown packaging page.
Oscillation Frequency Measuring Circuit
Oscillation Frequency Temperature Stability
W0.5 Oscillating Frequency Shift
Frequency counter
Temperature (°C)
Y0.5
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sales representatives product engineers before ordering. This catalog only typical specifications because there space detailed specifications. Therefore, please approve product specifications transact approval sheet product specifications before ordering. This catalog only typical specifications because there space detailed specifications. Therefore, please approve product specifications transact approval sheet product specifications before ordering.
P16E.pdf 05.9.7
Type Notice
Notice (Soldering Mounting) CSBFB_J 430-519kHz
Soldering Conditions Reflow heat stress, shown profile right, applied resonator; then, after being placed natural conditions hour, resonator measured. Pre-heating conditions should +140 +160°C seconds. Ascending time +150°C should longer than seconds. Heating conditions should within seconds +225°C min., peak temperature should Iower than +235°C. Soldering Iron Soldering iron +270±5°C should placed 0.5mm above electrode resonator. Melting solder through soldering iron should applied electrode seconds; then, after being placed natural conditions hours, resonator should measured. Wash Cleaning Solvents HCFC, Isopropanol, water, Demineralized water, Cleanthrough750H, Pine alpha 100S, Techno care Temperature Difference dT<=60°C (dT=Component-solvent) case component +90°C immerses into cleaning solvent +60°C, then dT=30°C. Conditions Ultrasonic Wash minute max. above solvent +60°C max. (Frequency 28kHz, Output 20W/L)
Soldering Peak Temperature 235°C max. Temperature (°C) Pre-heating Gradual Cooling air) air)
sec. min.
sec.
sec. max. sec. min.
Immersion Wash minutes max. above solvent +60°C max. Shower Rinse Wash minutes max. above solvent +60°C max.
Drying minutes max. blow +80°C max. Others Total washing time should within minutes. component damaged washed with chlorine, petroleum, alkali cleaning solvent.
Ultrasonic cleaning component acceptable. However, size bath, size thickness should evaluated confirm stable electrical characteristics maintained.
Notice Mounting Please insure component thoroughly evaluated your application circuit. Please apply excess mechanical stress component lead terminals during soldering.
case bulk component, heating treatment (130°C. hours min.) required before reflow soldering. Then, component should soldered within hours after heating treatment.
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sales representatives product engineers before ordering. This catalog only typical specifications because there space detailed specifications. Therefore, please approve product specifications transact approval sheet product specifications before ordering. This catalog only typical specifications because there space detailed specifications. Therefore, please approve product specifications transact approval sheet product specifications before ordering.
P16E.pdf 05.9.7
Type Notice
Notice (Soldering Mounting) CSBFB_J 700-1250kHz
Soldering Condition Reflow heat stress, shown profile right, applied resonator; then, after being placed natural conditions hour, resonator measured. Pre-heating conditions should +140 +160°C seconds. Ascending time +150°C should longer than seconds. Heating conditions should within seconds +215°C min., peak temperature should Iower than +225°C. Soldering Iron Soldering iron +270±5°C should placed 0.5mm above electrode resonator. Melting solder through soldering iron should applied electrode seconds; then, after being placed natural conditions hours, resonator should measured. Wash Cleaning Solvents HCFC, Isopropanol, water, Demineralized water, Cleanthrough750H, Pine alpha 100S, Techno care Temperature Difference dT<=60°C (dT=Component-solvent) case component +90°C immerses into cleaning solvent +60°C, then dT=30°C. Conditions Ultrasonic Wash minute max. above solvent +60°C max. (Frequency 28kHz, Output 20W/L)
Soldering Peak Temperature 225°C max. Temperature (°C) Pre-heating Gradual Cooling air) air)
sec. min.
sec.
sec. max. sec. min.
Immersion Wash minutes max. above solvent +60°C max. Shower Rinse Wash minutes max. above solvent +60°C max.
Drying minutes max. blow +80°C max. Others Total washing time should within minutes. component damaged washed with chlorine, petroleum, alkali cleaning solvent.
Ultrasonic cleaning component acceptable. However, size bath, size thickness should evaluated confirm stable electrical characteristics maintained.
Notice Mounting Please insure component thoroughly evaluated your application circuit. Please apply excess mechanical stress component lead terminals during soldering.
case bulk component, heating treatment (130°C. hours min.) required before reflow soldering. Then, component should soldered within hours after heating treatment.
!Note This catalog downloadedand !CAUTION (forMurata Manufacturing co., ltd. Therefore, it's specifications subject change products discontinued without advance notice. Please check with !Note Please read rating from website storage, operating, rating, soldering, mounting handling) this catalog prevent smoking and/or burning, etc.
sales representatives product engineers before ordering. This catalog only typical specifications because there space detailed specifications. Therefore, please approve product specifications transact approval sheet product specifications before ordering. This catalog only typical specifications because there space detailed specifications. Therefore, please approve product specifications transact approval sheet product specifications before ordering.
P16E.pdf 05.9.7
Type Notice
Notice (Soldering Mounting)
CSBLA_E component cannot withstand washing. Please apply excessive mechanical stress component lead terminals during soldering.
Notice (Soldering Mounting)
CSBLA_J Cleaning Solvents HCFC, Isopropanol, water, Demineralized water, Cleanthrough 750H, Pine alpha 100S, Techno care FRW. Temperature Difference: dT<=30 degree (dT=Component-solvent) case component degree immerses into cleaning solvent degree then dT=30 degree Conditions Ultrasonic Wash minute max. above solvent degree max. (Frequency: 28kHz, Output: 20W/L) Immersion Wash minutes max. above solvent degree max. Shower Rinse Wash minutes max. above solvent degree max. Drying minutes max. blow degree max. Others Total washing time should within minutes. Please insure component thoroughly evaluated your application circuit. component damaged washed with alkali cleaning solvent. Please apply excess mechanical stress component lead terminals during soldering. Ultrasonic cleaning component acceptable. However, size bath, size thickness should evaluated confirm stable electrical characteristics maintained.
!Note This catalog downloadedand !CAUTION (forMurata Manufacturing co., ltd. Therefore, it's specifications subject change products discontinued without advance notice. Please check with !Note Please read rating from website storage, operating, rating, soldering, mounting handling) this catalog prevent smoking and/or burning, etc.
sales representatives product engineers before ordering. This catalog only typical specifications because there space detailed specifications. Therefore, please approve product specifications transact approval sheet product specifications before ordering. This catalog only typical specifications because there space detailed specifications. Therefore, please approve product specifications transact approval sheet product specifications before ordering.
P16E.pdf 05.9.7
Type Notice
Notice (Storage Operating Condition)
CSBFB_J/CSBLA_J Product Storage Condition Please store products room where temperature/humidity stable. avoid such places where there large temperature changes. Please store products under following conditions: Temperature: degree Humidity: R.H. Expire Date Storage Expire date (Shelf life) products months after delivery under conditions sealed unopened package. Please products within months after delivery. store products long time (more than months), carefully because products degraded solderability and/or rusty. Please confirm solderability characteristics products regularly. Notice Product Storage Please store products chemical atmosphere (Acids, Alkali, Bases, Organic gas, Sulfides on), because characteristics reduced quality, and/or degraded solderability storage chemical atmosphere. Please products directly floor without anything under them avoid damp places and/or dusty places. Please store products places such damp heated place, place where direct sunlight comes place applying vibrations. Please products immediately after package opened, because characteristics reduced quality, and/or degraded solderability storage under poor condition. Please drop products avoid cracking ceramic element. Others Conformal coating component acceptable. However, resin material, curing temperature, other process conditions should evaluated confirm that stable electrical characteristics maintained. Please sure consult with sales representative engineer whenever prior tousing products.
Notice (Storage Operating Condition)
CSBLA_E Product Storage Condition Please store products room where temperature/humidity stable. avoid such places where there large temperature changes. Please store products under following conditions: Temperature: degree Humidity: R.H. Expire Date Storage Expire date (Shelf life) products months after delivery under conditions sealed unopened package. Please products within months after delivery. store products long time (more than months), carefully because products degraded solderability and/or rusty. Please confirm solderability characteristics products regularly. Notice Product Storage Please store products chemical atmosphere (Acids, Alkali, Bases, Organic gas, Sulfides on), because characteristics
reduced quality, and/or degraded solderability storage chemical atmosphere. Please products directly floor without anything under them avoid damp places and/or dusty places. Please store products places such damp heated place, place where direct sunlight comes place applying vibrations. Please products immediately after package opened, because characteristics reduced quality, and/or degraded solderability storage under poor condition. Please drop products avoid cracking ceramic element. Others Conformal coating washing component acceptable because hermetically sealed. Please sure consult with sales representative engineer whenever prior tousing products.
Notice (Rating)
component damaged excess mechanical stress applied.
Notice (Handling)
"CERALOCK" stop oscillating oscillate irregularly under improper circuit conditions.
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sales representatives product engineers before ordering. This catalog only typical specifications because there space detailed specifications. Therefore, please approve product specifications transact approval sheet product specifications before ordering. This catalog only typical specifications because there space detailed specifications. Therefore, please approve product specifications transact approval sheet product specifications before ordering.
P16E.pdf 05.9.7
Type Packaging
CSBFB Series Minimum Quantity
Part Number Plastic Tape Bulk
CSBFB_J (430 519kHz) CSBFB_J (700 1250kHz)
1,500 3,000
1,000
(pcs.)
order quantity should integral multiple "Minimum Quantity" shown above.
Dimensions Reel
17.5±0.5 21.5±1.0
2.0±0.5
Dimensions Taping
CSBFB_J 430-519kHz
1.75±0.1 4.0±0.1 2.0±0.1 4.0±0.1 2.0±0.1
CSBFB_J 700-1250kHz
1.75±0.15 7.5±0.1
7.5±0.1
16.0±0.3
13.3±0.1
12.0±0.1 (4.6max.) 3.5±0.1 cover film peel strength force 0.7N cover film peel speed 300mm/min. Cover Film 8.05±0.1 max. t0.3 cover film peel strength force 0.7N cover film peel speed 300mm/min. Cover Film
8.8±0.1
16.0±0.15
13.3±0.1
11.4±0.1
8.0±0.1 2.7±0.1 5.45±0.1 max. t0.3 (3.07max.)
Direction Feed
Direction Feed
CSBLA Series Minimum Quantity
Part Number Magazine Bulk
CSBLA_E CSBLA_J
1,000
(pcs.)
order quantity should integral multiple "Minimum Quantity" shown above.
!Note This catalog downloadedand !CAUTION (forMurata Manufacturing co., ltd. Therefore, it's specifications subject change products discontinued without advance notice. Please check with !Note Please read rating from website storage, operating, rating, soldering, mounting handling) this catalog prevent smoking and/or burning, etc.
sales representatives product engineers before ordering. This catalog only typical specifications because there space detailed specifications. Therefore, please approve product specifications transact approval sheet product specifications before ordering. This catalog only typical specifications because there space detailed specifications. Therefore, please approve product specifications transact approval sheet product specifications before ordering.
P16E.pdf 05.9.7
Application Circuits Utilizing
TMP86CH46AN(TOSHIBA)
8-bit Microcomputer
VDD=5V VDD=5V
MC68HC908JB8(MOTOROLA)
8-bit Microcomputer
TMP86CH46AN CSTCE8M00G52-R0 C1=10pF C2=10pF C1=39pF C2=39pF CSTCR6M00G55-R0 MC68HC908JB8
µPD78F0102H(NEC)
8-bit Microcomputer
VDD=5V
HD64F3337(RENESAS)
8-bit Microcomputer
VCC=5V
µPD78F0102H CSTCE8M00G55-R0 C1=33pF C2=33pF CSTLS8M00G56-B0 C1=47pF C2=47pF 4,7,8,9,47,55 1,12,38,56,73 HD64F3337
ML66517(OKI)
8-bit Microcomputer
VDD=5V
M3826AMFA-XXXFP(RENESAS)
8-bit Microcomputer
VCC=5V
ML66517
M3826AMFA-XXXFP
CSTLS8M00G56-B0
CSTCE8M00G52-R0 C1=47pF C2=47pF C1=10pF C2=10pF
9,65 10,35,55,75,76
Continued following page.
!Note This catalog downloadedand !CAUTION (forMurata Manufacturing co., ltd. Therefore, it's specifications subject change products discontinued without advance notice. Please check with !Note Please read rating from website storage, operating, rating, soldering, mounting handling) this catalog prevent smoking and/or burning, etc.
sales representatives product engineers before ordering. This catalog only typical specifications because there space detailed specifications. Therefore, please approve product specifications transact approval sheet product specifications before ordering. This catalog only typical specifications because there space detailed specifications. Therefore, please approve product specifications transact approval sheet product specifications before ordering.
P16E.pdf 05.9.7
Application Circuits Utilizing
Continued from preceding page.
M34552M8-XXXFP(RENESAS)
Remote Control Unit
VDD=5V
µPD67B(NEC)
Remote Control Unit
VDD=3.3V
M34552M8-XXXFP CSTCR4M00G53-R0 C1=15pF C2=15pF
µPD67B CSTLS3M64G56-B0 C1=47pF C2=47pF 11~14
R5F21114FP(RENESAS)
16-bit Microcomputer
VCC=5V
LC87F5JC8A(SANYO)
8-bit Microcomputer
VDD=5V
R5F21114FP CSTCE20M0V53-R0 C1=15pF C2=15pF CSTCE8M00G52-R0 0.1µF
110pF
LC87F5JC8A
C1=10pF C2=10pF 22~24,
LC7367JM(SANYO)
Tone/Pulse Dialer
VDD=5V
ML7005MB(OKI)
Tone/Pulse Dialer
VDD=5V
LC7367JM
ML7005MB
CSTLS3M58GD6267-B0
CSTLS3M58GD3104-B0
C1=47pF C2=47pF H=11 L=5,6,7,8,12 C1=15pF C2=15pF
Continued following page.
!Note This catalog downloadedand !CAUTION (forMurata Manufacturing co., ltd. Therefore, it's specifications subject change products discontinued without advance notice. Please check with !Note Please read rating from website storage, operating, rating, soldering, mounting handling) this catalog prevent smoking and/or burning, etc.
sales representatives product engineers before ordering. This catalog only typical specifications because there space detailed specifications. Therefore, please approve product specifications transact approval sheet product specifications before ordering. This catalog only typical specifications because there space detailed specifications. Therefore, please approve product specifications transact approval sheet product specifications before ordering.
P16E.pdf 05.9.7
Application Circuits Utilizing
Continued from preceding page.
µPD70F3107GJ(NEC)
32-bit Microcomputer
VDD=3.3V
CXD3068Q(SONY)
Digital Signal Processing
VDD=5V
µPD70F3107GJ C1=39pF C2=39pF 112, 124, 1~7, 10~17, 19~26, 29~36, 39~45, 49~56, 65~70, 83~85, 87~89, 91~97, 100~111, 114~123, 126~133, 136~144 73~80, 113, 125,
CXD3068Q
CSTCR5M00G55-R0
C1=15pF C2=15pF Rd=220 1,28,47,56,61 18,35,45,51,70
CSTCE16M9V53-R0
LC895299(SANYO)
Error Correction CD-ROM
VDD1=5V VDD2=3.3V
TMP91FY27U(TOSHIBA)
16-bit Microcomputer
VCC=3.3V
LC895299
TMP91FY27U CSTCE8M00G55-R0
CSTCW33M8X53-R0 21,39,52,65,86,88,94,112, 154,163,176 22,44,66,110,116,132,165 1,23,24,40,45,51,58,67,73,89, 91,109,111,125,133,139,155,164
C1=33pF C2=33pF
TA8690AN (TOSHIBA)
Horizontal/Compatible with Synthesizer Circuit
VCC=9V 0.022µF
LA3410 (SANYO)
Stereo
CSBLA456KE2ZF11-B0
47µF
3.3µF
10µF
STOP
TA8690AN
0.47µF
350k
CERALOCK®
LA3410
510k
Vcont.
0.047µF (1/32fosc.) VCC=12V
750pF INPUT
750pF
CERALOCK® CSBLA503KEZZF46-B0
Continued following page.
!Note This catalog downloadedand !CAUTION (forMurata Manufacturing co., ltd. Therefore, it's specifications subject change products discontinued without advance notice. Please check with !Note Please read rating from website storage, operating, rating, soldering, mounting handling) this catalog prevent smoking and/or burning, etc.
sales representatives product engineers before ordering. This catalog only typical specifications because there space detailed specifications. Therefore, please approve product specifications transact approval sheet product specifications before ordering. This catalog only typical specifications because there space detailed specifications. Therefore, please approve product specifications transact approval sheet product specifications before ordering.
P16E.pdf 05.9.7
Application Circuits Utilizing
Continued from preceding page.
TEA2130 (THOMSON)
Horizontal/Compatible with Synthesizer Circuit
VCC=12V Hout 0.01µF 100µF 47nF Flyback
LA7687 (SANYO)
Horizontal/Compatible with Synthesizer Circuit
VCC=7.8V 0.01µF LA7687 CERALOCK® 330k 22µF Hout (fosc./32) CERALOCK® CSBLA503KEZZF12-B0 0.033µF CERALOCK® CSBLA503KEZZF12-B0 Rs=470 1.8k Vcont. 3.3µF HVcc 13mA 100µF
TEA2130
CERALOCK®
Vcont. 2.2µF 3.9k 3.32k
2.7k
Oscillation Circuit Incorporationg Transistor
-10V
CERALOCK®
0.005µF
100nF
33nF
Output
0.001µF
Recommendable Value CERALOCK® CSBLA455KEC8-B0
!Note This catalog downloaded from website Murata Manufacturing co., ltd. Therefore, it's specifications subject change products discontinued without advance notice. Please check with
sales representatives product engineers before ordering. This catalog only typical specifications because there space detailed specifications. Therefore, please approve product specifications transact approval sheet product specifications before ordering.
P16E.pdf 05.9.7
Note:
Export Control customers outside Japan Murata products should used sold development, production, stockpiling utilization conventional weapons mass-destructive weapons (nuclear weapons, chemical biological weapons, missiles), other weapons. customers Japan products which controlled items subject "Foreign Exchange Foreign Trade Law" Japan, export license specified required export.
Please contact sales representatives product engineers before using products this catalog applications listed below, which require especially high reliability prevention defects which might directly damage third party's life, body property, when products intended applications other than those specified this catalog. Aircraft equipment Aerospace equipment Undersea equipment Power plant equipment Medical equipment Transportation equipment (vehicles, trains, ships, etc.) Traffic signal equipment Disaster prevention crime prevention equipment Data-processing equipment Application similar complexity and/or reliability requirements applications listed above Product specifications this catalog July 2005. They subject change products discontinued without advance notice. Please check with sales representatives product engineers before ordering. there questions, please contact sales representatives product engineers. Please read rating CAUTION (for storage, operating, rating, soldering, mounting handling) this catalog prevent smoking and/or burning, etc. This catalog only typical specifications because there space detailed specifications. Therefore, please approve product specifications transact approval sheet product specifications before ordering. Please note that unless otherwise specified, shall assume responsibility whatsoever conflict dispute that occur connection with effect and/or third party's intellectual property rights other related rights consideration your products and/or information described contained catalogs. this connection, representation shall made effect that third parties authorized rights mentioned above under licenses without consent. ozone depleting substances (ODS) under Montreal Protocol used manufacturing process.
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