Preliminary CMOS SRAM 256Kx16 Super Power Voltage Full CMOS Stati

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Preliminary CMOS SRAM 256Kx16 Super Power Voltage Full CMOS Stati

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K6F4016S6F Family
Preliminary CMOS SRAM
256Kx16 Super Power Voltage Full CMOS Static
Revision History
Revision History
Initial Draft
Draft Date
February 2002
Remark
Preliminary
attached datasheets provided SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve right change specifications products. SAMSUNG Electronics will answer your questions about device. have questions, please contact SAMSUNG branch offices.
Revision February 2002
K6F4016S6F Family
FEATURES
Preliminary CMOS SRAM
GENERAL DESCRIPTION
K6F4016S6F families fabricated SAMSUNGs advanced full CMOS process technology. families support industrial temperature range ball Chip Scale Package user flexibility system design. family also supports data retention voltage battery back-up operation with data retention current.
256K Super Power Voltage Full CMOS Static
Process Technology: Full CMOS Organization: 256K Power Supply Voltage: 2.3~2.7V Data Retention Voltage: 1.5V(Min) Three State Outputs Package Type: 48-TBGA-6.00x7.00
PRODUCT FAMILY
Power Dissipation Product Family Operating Temperature Range Speed Standby (ISB1, Typ.) 0.5µA2) Operating (ICC1, Max) Type
K6F4016S6F-F
Industrial(-40~85°C)
2.3~2.7V
701)/85ns
48-TBGA-6.00x7.00
parameter measured with 30pF test load. Typical values measured VCC=2.5V, TA=25°C 100% tested.
DESCRIPTION
FUNCTIONAL BLOCK DIAGRAM
gen. Precharge circuit.
I/O9
I/O1
Addresses
I/O10
I/O11
I/O2
I/O3
select
Memory Cell Array
I/O12
I/O4
I/O13
I/O5
I/O1~I/O8
Data cont Data cont Data cont
Circuit Column select
I/O15
I/O14
I/O6
I/O7
I/O9~I/O16
I/O16
I/O8 Column Addresses
48-TBGA: View (Ball Down)
Name
Function
Name
Function Power Ground Upper Byte(I/O9~16) Lower Byte(I/O1~8)
Control Logic
CS1, Chip Select Inputs A0~A17 Output Enable Input Write Enable Input Address Inputs
1~I/O16 Data Inputs/Outputs
SAMSUNG ELECTRONICS CO., LTD. reserves right change products specifications without notice.
-2Revision February 2002
K6F4016S6F Family
PRODUCT LIST
Industrial Temperature Products(-40~85°C) Part Name K6F4016S6F-EF70 K6F4016S6F-EF85 Function
Preliminary CMOS SRAM
48-TBGA, 70ns, 2.5V 48-TBGA, 85ns, 2.5V
FUNCTIONAL DESCRIPTION
I/O1~8 High-Z High-Z High-Z High-Z High-Z Dout High-Z Dout High-Z
I/O9~16 High-Z High-Z High-Z High-Z High-Z High-Z Dout Dout High-Z
Mode Deselected Deselected Deselected Output Disabled Output Disabled Lower Byte Read Upper Byte Read Word Read Lower Byte Write Upper Byte Write Word Write
Power Standby Standby Standby Active Active Active Active Active Active Active Active
means dont care. (Must high state)
ABSOLUTE MAXIMUM RATINGS1)
Item Voltage relative Voltage supply relative Power Dissipation Storage temperature Operating Temperature Symbol VIN, VOUT TSTG Ratings -0.5 VCC+0.3V(Max. 3.0V) -0.3 Unit
Stresses greater than those listed under "Absolute Maximum Ratings" cause permanent damage device. Functional operation should restricted recommended operating condition. Exposure absolute maximum rating conditions extended periods affect reliability.
Revision February 2002
K6F4016S6F Family
RECOMMENDED OPERATING CONDITIONS1)
Item Supply voltage Ground Input high voltage Input voltage
Note: Industrial Product: TA=-40 85°C, otherwise specified. Overshoot: Vcc+1.0V case pulse width 20ns. Undershoot: -1.0V case pulse width 20ns. Overshoot undershoot sampled, 100% tested.
Preliminary CMOS SRAM
Symbol
-0.3
Vcc+0.3
Unit
CAPACITANCE1) (f=1MHz, TA=25°C)
Item Input capacitance Input/Output capacitance
Capacitance sampled, 100% tested
Symbol
Test Condition VIN=0V VIO=0V
Unit
OPERATING CHARACTERISTICS
Item Input leakage current Output leakage current
Symbol
Test Conditions VIN=Vss CS1=VIH CS2=VIL OE=VIH WE=VIL LB=UB=VIH, VIO=Vss Cycle time=1µs, 100%duty, IIO=0mA, CS10.2V, LB0.2V or/and UB0.2V, CS2Vcc-0.2V, VIN0.2V VINVCC-0.2V Cycle time=Min, IIO=0mA, 100% duty, CS1=VIL, CS2=VIH, LB=VIL or/and UB=VIL, VIN=VIL 0.5mA -0.5mA Other input =0~Vcc CS1Vcc-0.2V, CS2Vcc-0.2V(CS1 controlled) 0VCS20.2V(CS2 controlled) 85ns 70ns
Unit
ICC1
Average operating current ICC2 Output voltage Output high voltage Standby Current (CMOS) ISB1
Typical values measured VCC=2.5V, TA=25°C 100% tested.
Revision February 2002
K6F4016S6F Family
OPERATING CONDITIONS
TEST CONDITIONS (Test Load Test Input/Output Reference)
Input pulse level: 2.2V Input rising falling time: Input output reference voltage:1.1V Output load (See right): 100pF+1TTL 30pF+1TTL
Preliminary CMOS SRAM
VTM3) R12)
CL1)
R22)
Including scope capacitance R1=3070, =3150 V=2.3V
CHARACTERISTICS TA=-40 85°C, Vcc=2.3~2.7V
Speed Bins Parameter List Symbol Read cycle time Address access time Chip select output Output enable valid output Access Time Read Chip select low-Z output enable low-Z output Output enable low-Z output Chip disable high-Z output disable high-Z output Output disable high-Z output Output hold from address change Write cycle time Chip select write Address set-up time Address valid write Valid Write Write Write pulse width Write recovery time Write output high-Z Data write time overlap Data hold from write time write output low-Z tBLZ tOLZ tBHZ tOHZ tWHZ 70ns 85ns Units
DATA RETENTION CHARACTERISTICS
Item data retention Data retention current Data retention set-up time Recovery time Symbol tSDR tRDR Test Condition CS1Vcc-0.2V VIN0V
0.52)
Unit
Vcc=1.5V, CS1Vcc-0.2V VIN0V data retention waveform
Vcc-0.2V, 2Vcc-0.2V(CS1 controlled) 0CS2 0.2V(CS2 controlled) Typical values measured TA=25°C 100% tested.
Revision February 2002
K6F4016S6F Family
TIMING DIAGRAMS
TIMING WAVEFORM READ CYCLE(1)
Address Data Previous Data Valid
Preliminary CMOS SRAM
(Address Controlled, CS1=OE=VIL CS2=WE=VIH, or/and LB=VIL)
Data Valid
TIMING WAVEFORM READ CYCLE(2)
(WE=VIH)
Address
tBHZ tOLZ tBLZ Data Valid tOHZ
Data
High-Z
NOTES (READ CYCLE) tOHZ defined time which outputs achieve open circuit conditions referenced output voltage levels. given temperature voltage condition, tHZ(Max.) less than tLZ(Min.) both given device from device device interconnection.
Revision February 2002
K6F4016S6F Family
TIMING WAVEFORM WRITE CYCLE(1) Controlled)
Address tCW(2) tWR(4)
Preliminary CMOS SRAM
tWP(1) tAS(3) Data High-Z tWHZ Data Data Undefined Data Valid High-Z
TIMING WAVEFORM WRITE CYCLE(2) (CS1 Controlled)
Address tAS(3) tWP(1) Data Data Valid tCW(2) tWR(4)
Data
High-Z
High-Z
Revision February 2002
K6F4016S6F Family
TIMING WAVEFORM WRITE CYCLE(3) (UB, Controlled)
Address tCW(2) tAS(3) tWP(1) Data Data Valid tWR(4)
Preliminary CMOS SRAM
Data
NOTES (WRITE CYCLE)
High-Z
High-Z
write occurs during overlap(tWP) write begins when goes goes with asserting single byte operation simultaneously asserting double byte operation. write ends earliest transition when goes high goes high. measured from beginning write write. measured from going write. measured from address valid beginning write. measured from write address change. applied case write ends going high.
DATA RETENTION WAVE FORM
controlled
2.3V tSDR Data Retention Mode tRDR
2.0V CS1VCC-0.2V
controlled
2.3V tSDR
Data Retention Mode
tRDR
0.4V CS20.2V
Revision February 2002
K6F4016S6F Family
PACKAGE DIMENSION
TAPE BALL GRID ARRAY(0.75mm ball pitch)
View Bottom View
Preliminary CMOS SRAM
Unit: millimeters
C1/2 Detail 0.35/Typ. 0.55/Typ. Notes. Bump counts: 48(8 column) Bump pitch: (x,y)=(0.75 0.75)(typ.) tolerence +/-0.050 unless otherwise specified. Typ: Typical coplanarity: 0.08(Max)
Side View
5.90 6.90 0.40 0.80 0.30
0.75 6.00 3.75 7.00 5.25 0.45 0.90 0.55 0.35
6.10 7.10 0.50 1.00 0.40 0.08
Revision February 2002

Preliminary CMOS SRAM 256Kx16 Super Power Voltage Full CMOS Stati

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