High-density mounting-type Max. thickness. Small packaging area light
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MC-206
High-density mounting-type Max. thickness. Small packaging area light weight. High heat resistance allows reflow soldering. Excellent shock resistance environmental capability.
Specifications (characteristics)
Item Symbol TSTG TOPR TSOL Max. Typ. Typ. Min. 10-6 year Max. 10-6 year Max. first year 32.768 Specifications 32.000 100.000 +125 Max. Twice under +260 within Remarks
Nominal frequency Temperature range
Storage temperature Operating temperature
Maximum drive level Soldering condition Frequency tolerance (standard) Peak temperature (frequency) Temperature coefficient (frequency) Load capacitance Series resistance Motional capacitance Shunt capacitance Insulation resistance Aging
under +230 within min. 10-6, 10-6 10-6, ±100 10-6 Ta=+25 DL=0.1
-0.04 10-6 Max. 12.5 Max. Max. Please specify below table
Shock resistance
S.R.
10-6 Max.
Three drops hard board from excitation test with 29400 m/s2 sine wave directions
Metal exposed this product. This won't affect quality, reliability electrical spec.
Series resistance
Frequency (kHz)
Series resistance
Max.
65.536 Max.
(Unit:
65.536 Max.
Max.
(Unit:
External dimensions
Max.
Recommended soldering pattern
Internal connection
3.88
Max.
5.08
connect external device.
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