High-density mounting-type thickness. Small packaging area light weigh

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High-density mounting-type thickness. Small packaging area light weigh

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MC-146
High-density mounting-type thickness. Small packaging area light weight. Excellent shock resistance environmental capability. Most suitable small communications devices.
Specifications (characteristics)
Item Symbol Specifications 32.768 75.000 Remarks please contact inquiries about usable frequencies
Nominal frequency Temperature range
TSTG TOPR TSOL
Storage temperature Operating temperature
+125 Max. Operating drive level Max.
Maximum drive level Soldering condition Frequency tolerance(standard) Peak temperature(frequency) Temperature coefficient(frequency) Load capacitance Series resistance Motional capacitance Shunt capacitance Insulation resistance Aging
Twice under +260 within
under +230 within min. 10-6, 10-6 -0.04 10-6/ Max. 12.5 Max. Typ. Typ. Min. 10-6/year Max. Ta=+25 first year Max. Please specify Ta=+25 DL=0.1
Shock resistance
S.R.
10-6 Max.
Three drops hard board from excitation test with 29400 m/s2 sine wave directions
Metal exposed this product. This won't affect quality, reliability electrical spec.
External dimensions
0.55
(Unit:
Recommended soldering pattern
(Unit:
Internal connection
Max.
EA99
Max.
Max.
0.15
0.25
connect external device.

High-density mounting-type thickness. Small packaging area light weigh

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