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89-01-01 Frye 90-12-05 Frye 92-01-30 93-10-15 94-0


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REVISIONS DESCRIPTION three vendors, 18324, 1FN41, 66579. device types margin test method Update vendor's PIN. Change code indent. 67268. Editorial changes throughout. device type with vendors CAGE 1FN41 CAGE 66579. Added time temperature regression equation unbiased bake. Removed vendor CAGE 66302. Made technical changes table back margin test method step 4.3.1 step table table III. Editorial changes throughout. Added vendor's from XMB/883 either LM/883 appropriate device types. Deleted waveform figure This incorrect this device. Added vendor CAGE 34335 drawing source supply device types through vendor CAGE number 66579 device types through also vendor CAGE number 01295 devices 04XX 05XX. test condition 4.3.2. margin test method vendor CAGE number 34335. Change vendor similar vendor CAGE numbers 1FN41 66579. Change figure margin test method vendor CAGE 01295 change programming waveforms. Change 4.5. Editorial changes throughout. case outline vendor CAGE number 1FN41. Changes accordance with 5962-R130-92. case outline device types Remove vendor 27014 from drawing. Editorial changes throughout. Changes accordance with 5962-R118-94. Updated boilerplate. Added device types 11-21. Removed vendors 1FN41, 18324, 34335, 61394 from drawing. Added vendor 65786 drawing. Removed margin test methods from drawing. DATE(YR-MO-DA) 87-12-17 APPROVED Frye
89-01-01
Frye
90-12-05
Frye
92-01-30 93-10-15 94-02-16 97-06-11
Frye Frye Frye Raymond Monnin
ORIGINAL FIRST PAGE THIS DRAWING BEEN REPLACED. CURRENT CAGE CODE 67268 SHEET SHEET STATUS SHEETS
SHEET
PMIC
PREPARED James Jamison CHECKED Charles Reusing APPROVED Michael Frye DRAWING APPROVAL DATE 87-02-12 REVISION LEVEL
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216
STANDARD MICROCIRCUIT DRAWING
THIS DRAWING AVAILABLE DEPARTMENTS AGENCIES DEPARTMENT DEFENSE
MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 262,144-BIT ERASABLE PROM, MONOLITHIC SILICON
SIZE
SHEET
CAGE CODE
14933
5962-86063
AMSC
DSCC FORM 2233 DISTRIBUTION STATEMENT Approved public release; distribution unlimited.
5962-E112-97
SCOPE Scope. This drawing documents product assurance class levels consisting high reliability (device classes space application (device class choice case outlines lead finishes available reflected Part Identifying Number (PIN). When available, choice Radiation Hardness Assurance (RHA) levels reflected PIN. PIN. shown following examples. device class 5962
86063
Federal stock class designator
designator (see 1.2.1) Drawing number
Device type (see 1.2.2)
Case outline (see 1.2.4)
Lead finish (see 1.2.5)
device classes 5962
86063
Federal stock class designator
designator (see 1.2.1) Drawing number
Device type (see 1.2.2)
Device class designator (see 1.2.3)
Case outline (see 1.2.4)
Lead finish (see 1.2.5)
1.2.1 designator. Device classes marked devices meet MIL-PRF-38535 specified levels marked with appropriate designator. Device class marked devices meet MIL-PRF-38535, appendix specified levels marked with appropriate designator. dash indicates non-RHA device. 1.2.2 Device type(s). device type(s) shall identify circuit function follows: Device type 01,11 02,12 03,13 04,14 05,15 06,16 07,17 08,18 09,19 10,20 Generic number (see 6.6) (see 6.6) (see 6.6) (see 6.6) (see 6.6) (see 6.6) (see 6.6) (see 6.6) (see 6.6) (see 6.6) (see 6.6) Circuit 8-bit EPROM 8-bit EPROM 8-bit EPROM 8-bit EPROM 8-bit EPROM 8-bit EPROM 8-bit EPROM 8-bit EPROM 8-bit EPROM 8-bit EPROM 8-bit EPROM Access time
SIZE STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216
DSCC FORM 2234
REVISION LEVEL
5962-86063
SHEET
1.2.3 Device class designator. device class designator single letter identifying product assurance level listed below. Since device class designator been added after original issuance this drawing, device class designators will included device types through will marked device. Device class Device requirements documentation Vendor self-certification requirements MIL-STD-883 compliant, non-JAN class level microcircuits accordance with MIL-PRF-38535, appendix Certification qualification MIL-PRF-38535
1.2.4 Case outline(s). case outline(s) shall designated MIL-STD-1835 follows: Outline letter Descriptive designator GDIP1-T28 CDIP2-T28 CQCC1-N32 figure CDIP3-T28 GDIP4-T28 Terminals Package style Dual-in-line Rectangular leadless chip carrier J-lead chip carrier Dual-in-line
1.2.5 Lead finish. lead finish specified MIL-PRF-38535, appendix Absolute maximum ratings. Storage temperature Input voltages with respect ground Output voltages with respect ground supply voltage with respect ground Power dissipation (PD) Lead temperature (soldering, seconds) Thermal resistance, junction-to-case (JC): Case outlines Case outline Junction temperature (TJ) Recommended operating conditions. Case operating temperature (TC) Supply voltage (VCC) Digital logic testing device classes Fault coverage measurement manufacturing logic tests (MIL-STD-883, test method 5012) percent -55C +125C +4.5 +5.5 -65C +150C +6.5 -0.3 +0.3 -0.3 +14.0 -0.6 +500 +300C MIL-STD-1835 13C/W +150C
shall transparent permit ultraviolet light erasure. Must withstand added short circuit test; e.g., IOS. Values will added when they become available.
SIZE STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216
DSCC FORM 2234
REVISION LEVEL
5962-86063
SHEET
APPLICABLE DOCUMENTS Government specification, standards, handbooks. following specification, standards, handbooks form part this drawing extent specified herein. Unless otherwise specified, issues these documents those listed issue Department Defense Index Specifications Standards (DoDISS) supplement thereto, cited solicitation. SPECIFICATION MILITARY MIL-PRF-38535 Integrated Circuits, Manufacturing, General Specification for. STANDARDS MILITARY MIL-STD-883 Test Methods Procedures Microelectronics. MIL-STD-973 Configuration Management. MIL-STD-1835 Microcircuit Case Outlines. HANDBOOKS MILITARY MIL-HDBK-103 List Standard Microcircuit Drawings (SMD's). MIL-HDBK-780 Standard Microcircuit Drawings. (Unless otherwise indicated, copies specification, standards, handbooks available from Standardization Document Order Desk, Robbins Avenue, Building Philadelphia, 19111-5094.) Order precedence. event conflict between text this drawing references cited herein, text this drawing shall take precedence. Nothing this document, however, supersedes applicable laws regulations unless specific exemption been obtained. REQUIREMENTS Item requirements. individual item requirements device classes shall accordance with MIL-PRF-38535 specified herein modified device manufacturer's Quality Management (QM) plan. modification plan shall affect form, fit, function described herein. individual item requirements device class shall accordance with MIL-PRF-38535, appendix non-JAN class level devices specified herein. Design, construction, physical dimensions. design, construction, physical dimensions shall specified MIL-PRF-38535 herein device classes MIL-PRF-38535, appendix herein device class 3.2.1 Terminal connections. terminal connections shall specified figure 3.2.2 Truth table. truth table shall specified figure 3.2.2.1 Unprogrammed erased devices. truth table unprogrammed devices shall specified figure 3.2.2.2 Programmed devices. requirements supplying programmed devices part this drawing.
SIZE STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216
DSCC FORM 2234
REVISION LEVEL
5962-86063
SHEET
3.2.3 Case outlines. case outlines shall accordance with 1.2.2 herein figure Electrical performance characteristics postirradiation parameter limits. Unless otherwise specified herein, electrical performance characteristics postirradiation parameter limits specified table shall apply over full case operating temperature range. Electrical test requirements. electrical test requirements shall subgroups specified table IIA. electrical test each subgroup described table Marking. part shall marked with listed herein. addition, manufacturer's also marked listed MIL-HDBK-103. packages where marking entire number feasible space limitations, manufacturer option marking "5962-" device. product using this option, designator shall still marked. Marking device classes shall accordance with MIL-PRF-38535. Marking device class shall accordance with MIL-PRF-38535, appendix 3.5.1 Certification/compliance mark. certification mark device classes shall "QML" required MIL-PRF-38535. compliance mark device class shall required MIL-PRF-38535, appendix Processing EPROMS. testing requirements quality assurance provisions herein shall satisfied manufacturer prior delivery. 3.6.1 Erasure EPROMS. When specified, devices shall erased accordance with procedures characteristics specified 4.5. 3.6.2 Programmability EPROMS. When specified, devices shall programmed specified pattern using procedures characteristics specified 4.6. 3.6.3 Verification state EPROMS. When specified, devices shall verified either programmed specified pattern erased. minimum, verification shall consist performing functional test (subgroup verify that bits proper state. that does verify proper state shall constitute device failure shall removed from lot. Certificate compliance. device classes certificate compliance shall required from QML-38535 listed manufacturer order supply requirements this drawing (see 6.6.1 herein). device class certificate compliance shall required from manufacturer order listed approved source supply MIL-HDBK-103 (see 6.6.2 herein). certificate compliance submitted DSCC-VA prior listing approved source supply this drawing shall affirm that manufacturer's product meets, device classes requirements MIL-PRF-38535 herein device class requirements MIL-PRF-38535, appendix herein. Certificate conformance. certificate conformance required device classes MIL-PRF-38535 device class MIL-PRF-38535, appendix shall provided with each microcircuits delivered this drawing. Notification change device class device class notification DSCC-VA change product (see herein) involving devices acquired this drawing required change defined MIL-STD-973. 3.10 Verification review device class device class DSCC, DSCC's agent, acquiring activity retain option review manufacturer's facility applicable required documentation. Offshore documentation shall made available onshore option reviewer. 3.11 Microcircuit group assignment device class Device class devices covered this drawing shall microcircuit group number (see MIL-PRF-38535, appendix
SIZE STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216
DSCC FORM 2234
REVISION LEVEL
5962-86063
SHEET
TABLE Electrical performance characteristics. Test
Symbol ICC1 ICC2 ISB1 ISB2 VIL1 VIL2 VIH1 VIH2 Conditions -55C +125C unless otherwise specified VOUT 00-7 tACC maximum Device Group type subgroups 11-20 01-05 01,02, 04,05 07,11-20 08,09 01-05 06,07, 08,09, 11-21 01-07, 08,09, 11-21 01-10 11-21
Limits
-0.1 -0.2 +1.0 -0.2 +0.2
Input load current Output leakage current Operating current inputs
Operating current CMOS inputs
Standby current inputs
Standby current CMOS inputs
read current Input voltage (TTL) (±10 percent supply) Input voltage (CMOS) Input high voltage (TTL) (±10 percent supply) Input high voltage (CMOS)
Unit
footnotes table. SIZE STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216
DSCC FORM 2234
REVISION LEVEL
5962-86063
SHEET
TABLE Electrical performance characteristics Continued. Test
Symbol VPPR tACC Conditions -55C +125C unless otherwise specified -400 Device type 01,11 02,12 03,13 04,14 05,15 06,16 07,17 08,18 09,19 10,20 01,11 02,12 03,13 04,14 05,15 06,16 07,17 08,18 09,19 10,20 11-13 04,05 14,15 06,08,16 07,17 09,18 10,19,21 02,11-13 04,05 14,15 06,08,16 07,17 09,18 10,19 20,21 Group subgroups Limits 0.45 -100 -0.7
Unit
Output voltage Output high voltage Output short circuit current read voltage Address output delay
output delay
output delay
high output float
footnotes table. SIZE STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216
DSCC FORM 2234
REVISION LEVEL
5962-86063
SHEET
TABLE Electrical performance characteristics Continued.
Symbol COUT Conditions -55C +125C unless otherwise specified 4.4.1c VOUT 4.4.1c 4.4.1e Group subgroups 7,8A,8B Limits
Test
Device type
Unit
Output hold from addresses (whichever occurred first) Input capacitance
Output capacitance
Functional tests
Connect address inputs measure with output under test connected VOUT. Tests input control pins. Guaranteed tested. diode drop below VCC. connected directly VCC. Also, must applied simultaneously before removed simultaneously after VPP. figures Equivalent test conditions (actual load conditions vary tester): Output load: gate Input rise fall times Input pulse levels: 0.45 Timing measurement reference levels: Inputs Outputs pins being tested grounded. Devices 11-20 operate Maximum, IOUT Mhz. Device operates Maximum, IOUT Mhz. QUALITY ASSURANCE PROVISIONS
Sampling inspection. device classes sampling inspection procedures shall accordance with MILPRF-38535 modified device manufacturer's Quality Management (QM) plan. modification plan shall affect form, fit, function described herein. device class sampling inspection procedures shall accordance with MIL-PRF-38535, appendix Screening. device classes screening shall accordance with MIL-PRF-38535, shall conducted devices prior qualification technology conformance inspection. device class screening shall accordance with method 5004 MIL-STD-883, shall conducted devices prior quality conformance inspection. 4.2.1 Additional criteria device class Burn-in test, method 1015 MIL-STD-883. Test condition test circuit shall maintained manufacturer under document revision level control shall made available preparing acquiring activity upon request. test circuit shall specify inputs, outputs, biases, power dissipation, applicable, accordance with intent specified test method 1015 MIL-STD-883. +125C, minimum.
Interim final electrical test parameters shall specified table herein.
SIZE STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216
DSCC FORM 2234
REVISION LEVEL
5962-86063
SHEET
Case
Inches .006 .010 .017 .021 .025 .026 .032 .035 .045 .050 .073 .103 .140 .167 .300 .390 .430 .445 .465 .485 .490 .495 .530 .545 .565 .585 .595 FIGURE 32-lead, windowed ceramic J-leaded chip carrier (JLCC).
0.15 0.25 0.43 0.53 0.63 0.66 0.81 0.89 1.14 1.27 1.85 2.62 3.56 4.24 7.62 9.90 10.90 11.36 11.83 12.34 12.40 12.67 13.53 13.81 14.46 14.97 15.11
SIZE STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216
DSCC FORM 2234
REVISION LEVEL
5962-86063
SHEET
Device types
Case outlines
Terminal number
01-21 Terminal symbol
connection
FIGURE Terminal connections.
SIZE STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216
DSCC FORM 2234
REVISION LEVEL
5962-86063
SHEET
Mode Read Output disable Standby Program Program verify Program inhibit
Outputs DOUT High High DOUT High
either VIH. 4.6.
FIGURE Truth table.
SIZE STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216
DSCC FORM 2234
REVISION LEVEL
5962-86063
SHEET
FIGURE Output load circuit.
SIZE STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216
DSCC FORM 2234
REVISION LEVEL
5962-86063
SHEET
NOTES: specified from whichever occurs first. delayed tACC after falling edge without impact tACC. FIGURE Switching waveforms.
SIZE STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216
DSCC FORM 2234
REVISION LEVEL
5962-86063
SHEET
TABLE IIA. Electrical test requirements. Line Test requirements Subgroups accordance with MIL-STD883, 5005 Table Device class Subgroups accordance with MIL-PRF-38535, table III) Device class Device class Required Required 4***, 10**, 11**
Interim electrical parameters (see 4.2) Static burn-in (method 1015) Same line Dynamic burn-in (method 1015) Same line Final electrical parameters (see 4.2) Group test requirements (see 4.4) Group end-point electrical parameters (see 4.4) Group end-point electrical parameters (see 4.4) Group end-point electrical parameters (see 4.4)
required Required
required Required
4***, 10**, 11**
4***, 10**, 11**
indicates applies subgroups (**) indicates that subgroups tested, shall guaranteed specified limits table (***) 4.4.1c. subgroups same temperature combined when using multifunction tester. Subgroups shall consist verifying applicable data pattern, 4.4.1d. indicates delta limit (see table IIB) shall required where specified, delta values shall computed with reference previous interim electrical parameters (see line
4.2.2 Additional criteria device classes burn-in test duration, test condition test temperature, approved alternatives shall specified device manufacturer's plan accordance with MIL-PRF-38535. burn-in test circuit shall maintained under document revision level control device manufacturer's Technology Review Board (TRB) accordance with MIL-PRF-38535 shall made available acquiring preparing activity upon request. test circuit shall specify inputs, outputs, biases, power dissipation, applicable, accordance with intent specified test method 1015 MILSTD-883. Interim final electrical test parameters shall specified table herein. Additional screening device class beyond requirements device class shall specified MIL-PRF38535, appendix
Qualification inspection device classes Qualification inspection device classes shall accordance with MIL-PRF-38535. Inspections performed shall those specified MIL-PRF-38535 herein groups inspections (see 4.4.1 through 4.4.4). Conformance inspection. Technology conformance inspection classes shall accordance with MIL-PRF38535 including groups inspections specified herein except where option MIL-PRF-38535 permits alternate in-line control testing. Quality conformance inspection device class shall accordance with MIL-PRF-38535, appendix specified herein. Inspections performed device class shall those specified method 5005 MIL-STD-883 herein groups inspections (see 4.4.1 through 4.4.4).
SIZE STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216
DSCC FORM 2234
REVISION LEVEL
5962-86063
SHEET
4.4.1 Group inspection. Tests shall specified table herein. Subgroups table method 5005 MIL-STD-883 shall omitted. Subgroup (CIN COUT measurement) shall measured only initial test after process design changes which affect capacitance. Sample size devices with failures, input output terminals tested. devices selected testing shall programmed with checkerboard pattern equivalent. After completion testing, devices shall erased verified (except devices submitted groups testing). Subgroups shall include verification pattern specified 4.4.1d.
4.4.2 Group inspection. group inspection end-point electrical parameters shall specified table herein. 4.4.2.1 Additional criteria device class Steady-state life test conditions, method 1005 MIL-STD-883: Test condition test circuit shall maintained manufacturer under document revision level control shall made available preparing acquiring activity upon request. test circuit shall specify inputs, outputs, biases, power dissipation, applicable, accordance with intent specified test method 1005 MILSTD-883. +125C, minimum. Test duration: 1,000 hours, except permitted method 1005 MIL-STD-883. devices selected testing shall programmed with checkerboard pattern equivalent. After completion testing, devices shall erased verified.
4.4.2.2 Additional criteria device classes steady-state life test duration, test condition test temperature, approved alternatives shall specified device manufacturer's plan accordance with MIL-PRF-38535. test circuit shall maintained under document revision level control device manufacturer's accordance with MIL-PRF38535 shall made available acquiring preparing activity upon request. test circuit shall specify inputs, outputs, biases, power dissipation, applicable, accordance with intent specified test method 1005 MIL-STD-883. 4.4.3 Group inspection. group inspection end-point electrical parameters shall specified table herein. 4.4.4 Group inspection. Group inspection required only parts intended marked radiation hardness assured (see herein). End-point electrical parameters shall specified table herein. device classes devices test vehicle shall subjected radiation hardness assured tests specified MIL-PRF-38535 level being tested. device class devices shall subjected radiation hardness assured tests specified MIL-PRF-38535, appendix level being tested. device classes must meet postirradiation end-point electrical parameter limits defined table +25C ±5C, after exposure, subgroups specified table herein. When specified purchase order contract, copy delta limits shall supplied.
SIZE STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216
DSCC FORM 2234
REVISION LEVEL
5962-86063
SHEET
TABLE IIB. Delta limits +25C. Parameter ISB2 Device types
above parameter shall recorded before after required burn-in life tests determine delta. Erasing procedure. recommended erasure procedure device exposure shortwave ultraviolet light which wavelength 2537 Angstroms integrated dose (i.e., intensity exposure time) erasure should minimum Ws/cm2. erasure time with this dosage approximately minutes using ultraviolet lamp with 12000 µW/cm2 power rating. device should placed within inch lamp tubes during erasure. maximum integrated dose device exposed without damage 7258 Ws/cm2 week 12000 µW/cm2). Exposure EPROMS high intensity light long periods cause permanent damage. Programming procedures. programming procedures shall specified device manufacturer. PACKAGING Packaging requirements. requirements packaging shall accordance with MIL-PRF-38535, appendix NOTES Intended use. Microcircuits conforming this drawing intended Government microcircuit applications (original equipment), design applications, logistics purposes. 6.1.1 Replaceability. Microcircuits covered this drawing will replace same generic device covered contractor-prepared specification drawing. Configuration control SMD's. proposed changes existing SMD's will coordinated with users record individual documents. This coordination will accomplished accordance with MIL-STD-973 using Form 1692, Engineering Change Proposal. Record users. Military industrial users should inform Defense Supply CenterColumbus when system application requires configuration control which SMD's applicable that system. DSCC will maintain record users this list will used coordination distribution changes drawings. Users drawings covering microelectronic devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0525. Comments. Comments this drawing should directed DSCC-VA Columbus, Ohio 43216-5000, telephone (614) 692-0674. Abbreviations, symbols, definitions. abbreviations, symbols, definitions used herein defined MIL-PRF38535 MIL-HDBK-1331. Sources supply. 6.6.1 Sources supply device classes Sources supply device classes listed QML-38535. vendors listed QML-38535 have submitted certificate compliance (see herein) DSCC-VA have agreed this drawing. 6.6.2 Approved sources supply device class Approved sources supply class listed MIL-HDBK-103. vendors listed MIL-HDBK-103 have agreed this drawing certificate compliance (see herein) been submitted accepted DSCC-VA. SIZE STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216
DSCC FORM 2234
REVISION LEVEL
5962-86063
SHEET
STANDARDIZED MILITARY DRAWING SOURCE APPROVAL BULLETIN DATE: 97-06-11 Approved sources supply 5962-86063 listed below immediate acquisition only shall added MIL-HDBK-103 QML-38535 during next revision. MIL-HDBK-103 QML-38535 will revised include addition deletion sources. vendors listed below have agreed this drawing certificate compliance been submitted accepted DSCC-VA. This bulletin superseded next dated revision MIL-HDBK-103 QML-38535.
Vendor CAGE number 34649 01295 34649 34649 01295 34649 01295 34649 01295 34649 66579 34649 01295 66579 34649 66579 66579 66579
Standardized military drawing 5962-8606301XA 5962-8606301YA 5962-8606301ZX 5962-8606301UX 5962-8606302XA 5962-8606302YA 5962-8606302ZX 5962-8606303XA 5962-8606303YX 5962-8606303ZX 5962-8606304XA 5962-8606304YA 5962-8606304ZX 5962-8606304UX 5962-8606305XA
Vendor similar MD27C256-20/B SMJ27C256-20JM MR27C256-20/B AT27C256R-20KM/883 WS27C256L-20TMB MD27C256-25/B SMJ27C256-25JM MR27C256-25/B AT27C256R-25KM/883 SMJ27C256-30JM AT27C256R-30LM/883 AT27C256R-30KM/883 MD27C256-17/B SMJ27C256-17JM MR27C256-17/B AT27C256R-17KM/883 WS27C256L-17TMB WS27C256L-15DMB MD27C256-15/B SMJ27C256-15JM WS27C256L-15CMB MD27C256-15/
5962-8606305YC 5962-8606305ZX 5962-8606305UA 5962-8606306XA 5962-8606306YC 5962-8606306ZX 5962-8606307XX 5962-8606307YX 5962-8606307ZX
WS27C256L-15TMB WS27C256L-12DMB WS27C256L-12CMB AT27C256R-12KM/883 AT27C256R-90DM/883 AT27C256R-90LM/883 AT27C256R-90KM/883
footnote table.
STANDARDIZED MILITARY DRAWING SOURCE APPROVAL BULLETIN Continued.
Standardized military drawing 5962-8606308XA 5962-8606308YC 5962-8606308ZX 5962-8606309XA 5962-8606309YA 5962-8606309UA 5962-8606310XA 5962-8606310YA 5962-8606310UA 5962-8606311QXA 5962-8606311QYA 5962-8606312QXA 5962-8606312QYA 5962-8606313QXA 5962-8606313QYA 5962-8606314QXA 5962-8606314QYA 5962-8606315QXA 5962-8606315QYA 5962-8606316QXA 5962-8606316QYA 5962-8606317QXA 5962-8606317QYA 5962-8606318QXA 5962-8606318QYA 5962-8606319QXA 5962-8606319QYA 5962-8606320QXA 5962-8606320QYA 5962-8606321QXA 5962-8606321QYA
Vendor CAGE number 66579 66579 66579 66579 66579 66579 66579 66579 65786 65786 65786 65786 65786 65786 65786 65786 65786 65786 65786 65786 65786 65786 65786 65786 65786 65786 65786 65786 65786 65786
Vendor similar WS57C256F-70DMB WS57C256F-70CMB AT27C256R-70KM/883 WS57C256F-55DMB WS57C256F-55CMB WS57C256F-55TMB WS57C256F-45DMB WS57C256F-45CMB WS57C256F-45TMB CY27C256A-200WMB CY27C256A-200QMB CY27C256A-250WMB CY27C256A-250QMB CY27C256A-300WMB CY27C256A-300QMB CY27C256A-170WMB CY27C256A-170QMB CY27C256A-150WMB CY27C256A-150QMB CY27C256A-120WMB CY27C256A-120QMB CY27C256A-90WMB CY27C256A-90QMB CY27C256A-70WMB CY27C256A-70QMB CY27C256A-55WMB CY27C256A-55QMB CY27C256A-45WMB CY27C256A-45QMB CY27H256A-35WMB CY27H256A-35QM
lead finish shown each representing hermetic package most readily available from manufacturer listed that part. device manufacturers listed herein authorized supply alternate lead finishes "A", "B", their discretion. Contact listed approved source supply further information. longer available from approved source supply. Caution: this number item acquisition. Items acquired this number satisfy performance requirements this drawing. Vendor announced end-of-life these devices. Please refer latest revision MIL-HDBK-103 details.
STANDARDIZED MILITARY DRAWING SOURCE APPROVAL BULLETIN Continued.
Vendor CAGE number 01295
Vendor name address Texas Instruments, Incorporated 13500 North Central Expressway P.O. 655303 Dallas, 75265 Point contact: I-20 1788 Midland 79711-0448
34649
Intel Corporation 3065 Bowers Avenue Santa Clara, 95051 Point contact: 5000 West Chandler Boulevard Chandler, 85226-3699
65786
Cypress Semiconductor 3901 North First Street Jose, 95134
66579
Waferscale Integration, Incorporated 47280 Kato Road Fremont, 94538
information contained herein disseminated convenience only Government assumes liability whatsoever inaccuracies this information bulletin.

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