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90-01-17 Frye 01-04-03 Raymond Monnin ORIGINAL FIR
Top Searches for this datasheetREVISIONS DESCRIPTION vendor, CAGE 18324. Inactivate Military drawing part numbers 59628778801FX, 5962-8778801EX, design. paragraph make editorial changes throughout. Changed generic number vendor similar part number. Changes table Remove programming procedures method Deleted programming waveforms table III. Editorial changes throughout. Updated drawing current requirements. Editorial changes throughout. DATE (YR-MO-DA) 88-09-16 APPROVED Frye 90-01-17 Frye 01-04-03 Raymond Monnin ORIGINAL FIRST PAGE THIS DRAWING BEEN REPLACED. SHEET SHEET STATUS SHEETS PMIC SHEET PREPARED Monica Grosel STANDARD MICROCIRCUIT DRAWING THIS DRAWING AVAILABLE DEPARTMENTS AGENCIES DEPARTMENT DEFENSE CHECKED Monnin APPROVED Michael Frye DRAWING APPROVAL DATE 88-03-01 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216 http://www.dscc.dla.mil MICROCIRCUIT, MEMORY, DIGITAL, 4-BIT BIPOLAR PROM, MONOLITHIC SILICON AMSC REVISION LEVEL SIZE SHEET CAGE CODE 67268 5962-87788 DSCC FORM 2233 DISTRIBUTION STATEMENT Approved public release; distribution unlimited. 5962-E287-01 SCOPE Scope. This drawing describes device requirements MIL-STD-883 compliant, non-JAN class level microcircuits accordance with MIL-PRF-38535, appendix Part Identifying Number (PIN). complete shown following example: 5962-87788 Drawing number Device type (see 1.2.1) Case outline (see 1.2.2) Lead finish (see 1.2.3) 1.2.1 Device type(s). device type(s) identify circuit function follows: Device type Generic number 27S21, 82S129 27S21A, 82S129A Circuit function 4-bit bipolar PROM (three-state) 4-bit bipolar PROM (three-state) Access time 1.2.2 Case outline(s). case outline(s) designated MIL-STD-1835 follows: Outline letter Descriptive designator GDIP1-T16 CDIP2-T16 GDFP2-F16 CDFP3-F16 CQCC1-N20 Terminals Package style Dual-in-line Flat package Square leadless chip carrier 1.2.3 Lead finish. lead finish specified MIL-PRF-38535, appendix Absolute maximum ratings. Supply voltage range Input voltage range Storage temperature range. Maximum power dissipation (PD) device Lead temperature (soldering, seconds) Thermal resistance, junction-to-case (JC) Junction temperature (TJ) voltage applied outputs range (except during programming) voltage applied outputs during programming Output current into outputs during programming (maximum duration second) input current range -0.5 +7.0 -0.5 +5.5 -65C +150C +300 MIL-STD-1835 +175C -0.5 +5.5 maximum +5.0 Must withstand added short circuit test, e.g., IOS. Heat sinking recommended reduce junction temperature. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 SIZE REVISION LEVEL 5962-87788 SHEET Recommended operating conditions. Supply voltage range (VCC) Minimum high level input voltage (VIH) Maximum level input voltage (VIL) Case operating temperature range APPLICABLE DOCUMENTS Government specification, standards, handbooks. following specification, standards, handbooks form part this drawing extent specified herein. Unless otherwise specified, issues these documents those listed issue Department Defense Index Specifications Standards (DoDISS) supplement thereto, cited solicitation. SPECIFICATION DEPARTMENT DEFENSE MIL-PRF-38535 Integrated Circuits, Manufacturing, General Specification for. STANDARDS DEPARTMENT DEFENSE MIL-STD-883 MIL-STD-1835 HANDBOOKS DEPARTMENT DEFENSE MIL-HDBK-103 MIL-HDBK-780 List Standard Microcircuit Drawings. Standard Microcircuit Drawings. Test Method Standard Microcircuits. Interface Standard Electronic Component Case Outlines. minimum maximum -55C +125C (Unless otherwise indicated, copies specification, standards, handbooks available from Standardization Document Order Desk, Robbins Avenue, Building Philadelphia, 19111-5094.) Order precedence. event conflict between text this drawing references cited herein, text this drawing takes precedence. Nothing this document, however, supersedes applicable laws regulations unless specific exemption been obtained. REQUIREMENTS Item requirements. individual item requirements shall accordance with MIL-PRF-38535, appendix nonJAN class level devices specified herein. Product built this drawing that produced Qualified Manufacturer Listing (QML) certified qualified manufacturer manufacturer been granted transitional certification MILPRF-38535 processed product accordance with manufacturers approved program plan qualifying activity approval accordance with MIL-PRF-38535. This flow documented Quality Management (QM) plan make modifications requirements herein. These modifications shall affect form, fit, function device. These modifications shall affect described herein. "QML" certification mark accordance with MILPRF-38535 required identify when flow option used STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 SIZE REVISION LEVEL 5962-87788 SHEET Design, construction, physical dimensions. design, construction, physical dimensions shall specified MIL-PRF-38535, appendix herein. 3.2.1 Case outlines. case outlines shall accordance with 1.2.2 herein. 3.2.2 Terminal connections. terminal connections shall specified figure 3.2.2 Truth table. truth table shall specified figure 3.2.2.1 Unprogrammed devices. truth table unprogrammed devices shall specified figure 3.2.2.2 Programmed devices. requirements supplying programmed devices part this drawing. 3.2.3 Logic diagram(s). logic diagram(s) shall specified figure 3.2.4 Switching test circuit. switching test circuit shall specified figure 3.2.5 Switching waveforms. switching waveforms shall specified figure Electrical performance characteristics. Unless otherwise specified herein, electrical performance characteristics specified table shall apply over full case operating temperature range. Electrical test requirements. electrical test requirements shall subgroups specified table electrical tests each subgroup described table Marking. Marking shall accordance with MIL-PRF-38535, appendix part shall marked with listed herein. addition, manufacturer's also marked listed MIL-HDBK-103 (see herein). packages where marking entire number feasible space limitations, manufacturer option marking "5962-" device. 3.5.1 Certification/compliance mark. compliance indicator shall marked non-JAN devices built compliance MIL-PRF-38535, appendix compliance indicator shall replaced with "QML" certification mark accordance with MIL-PRF-38535 identify when flow option used. Processing options. Since PROM unprogrammed memory capable being programmed either manufacturer user result wide variety PROM configurations, processing options provided selection contract, using altered item drawing. 3.6.1 Unprogrammed PROM delivered user. testing shall verified through group testing defined 4.3.1. recommended that users perform subgroups after programming verify specific program configuration. 3.6.2 Manufacturer-programmed PROM delivered user. testing requirements quality assurance provisions herein, including requirements altered item drawing shall satisfied manufacturer prior delivery. Certificate compliance. certificate compliance shall required from manufacturer order listed approved source supply MIL-HDBK-103 (see herein). certificate compliance submitted DSCC-VA prior listing approved source supply shall affirm that manufacturer's product meets requirements MIL-PRF38535, appendix requirements herein. Certificate conformance. certificate conformance required MIL-PRF-38535, appendix shall provided with each microcircuits delivered this drawing. Notification change. Notification change DSCC-VA shall required accordance with MIL-PRF-38535, appendix 3.10 Verification review. DSCC, DSCC's agent, acquiring activity retain option review manufacturer's facility applicable required documentation. Offshore documentation shall made available onshore option reviewer. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 SIZE REVISION LEVEL 5962-87788 SHEET TABLE Electrical performance characteristics. Conditions -55C +125C unless otherwise specified Output high voltage Output voltage Input high level current Input level current Power supply current Input clamp voltage High output leakage current IOZL Output short circuit current Functional tests Address access time tAVQV IOZH VOUT 4.3.1d closed figures Enable access time Enable recovery time tGVQV tGVQZ figures figures -1.2 Test Symbol Group subgroups Device type Limits Unit -2.0 0.45 -250 more than output should shorted time duration short circuit condition should exceed second. tGVQV tested with level; open high impedance high tests closed high impedance tests. tGVQZ tested with High high impedance tests made with open output voltage high impedance tests made with closed level. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 SIZE REVISION LEVEL 5962-87788 SHEET Device Types Case Outlines Terminal number Terminal symbol FIGURE Terminal connections. Word Enable Address Data NOTES: applicable. Input high level, level, open circuit. Open circuit (high resistance output). Program readout only accomplished with enable input level. FIGURE Truth table (unprogrammed). STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 SIZE REVISION LEVEL 5962-87788 SHEET FIGURE Logic diagram. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 SIZE REVISION LEVEL 5962-87788 SHEET Output load tests except tGVQZ NOTES: device test loads should located within inches device output pin. open output data high hi-Z hi-Z output data high test. closed other test. Load capacitance includes stray fixture capacitance. FIGURE Switching test circuit equivalent. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 SIZE REVISION LEVEL 5962-87788 SHEET Output load tGVQZ NOTES: device test loads should located within inches device output pin. open output data high hi-Z hi-Z output data high test. closed other test. Load capacitance includes stray fixture capacitance. FIGURE Switching test circuit equivalent Continued. FIGURE Switching waveforms. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 SIZE REVISION LEVEL 5962-87788 SHEET QUALITY ASSURANCE PROVISIONS Sampling inspection. Sampling inspection procedures shall accordance with MIL-PRF-38535, appendix Screening. Screening shall accordance with method 5004 MIL-STD-883, shall conducted devices prior quality conformance inspection. following additional criteria shall apply: Burn-in test, method 1015 MIL-STD-883. Test condition test circuit shall maintained manufacturer under document revision level control shall made available preparing acquiring activity upon request. test circuit shall specify inputs, outputs, biases, power dissipation, applicable, accordance with intent specified test method 1015 MIL-STD-883. +125C, minimum. Interim final electrical test parameters shall specified table herein, except interim electrical parameter tests prior burn-in optional discretion manufacturer. TABLE Electrical test requirements. MIL-STD-883 test requirements Subgroups accordance with MIL-STD-883, method 5005, table Interim electrical parameters (method 5004) Final electrical test parameters (method 5004) Group test requirements (method 5005) Groups end-point electrical parameters (method 5005) 10**, 11** 10**, 11** applies subgroup Subgroups tested shall guaranteed limits specified table Quality conformance inspection. Quality conformance inspection shall accordance with method 5005 MIL-STD883 including groups inspections. following additional criteria shall apply. 4.3.1 Group inspection. Tests shall specified table herein. Subgroups table method 5005 MIL-STD-883 shall omitted. Unprogrammed devices shall tested programmability performance compliance requirements group subgroups Either techniques acceptable. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 SIZE REVISION LEVEL 5962-87788 SHEET Testing entire using additional built-in test circuitry which allows manufacturer verify programmability performance without programming user array. this done, resulting test pattern shall verified devices during subgroups group testing accordance with sampling plan specified method 5005 MIL-STD-883. such compliance cannot tested unprogrammed device, sample shall selected satisfy programmability requirements prior performing subgroups Twelve devices shall submitted programming. more than devices fail program, shall rejected. manufacturer's option, sample increased total devices with more than four total device failures allowed. devices from programmability sample shall submitted requirements group subgroups more than total devices fail, shall rejected. manufacturer's option, sample increased total devices with more than four total device failures allowable. Subgroups shall include verification truth table. 4.3.2 Groups inspections. End-point electrical parameters shall specified table herein. Steady-state life test conditions, method 1005 MIL-STD-883. Test condition test circuit shall maintained manufacturer under document revision level control shall made available preparing acquiring activity upon request. test circuit shall specify inputs, outputs, biases, power dissipation, applicable, accordance with intent specified test method 1005 MIL-STD-883. +125C, minimum. Test duration: 1,000 hours, except permitted method 1005 MIL-STD-883. Programming procedures. Programming procedures shall specified device manufacturers. PACKAGING Packaging requirements. requirements packaging shall accordance with MIL-PRF-38535, appendix NOTES Intended use. Microcircuits conforming this drawing intended Government microcircuit applications (original equipment), design applications, logistics purposes. Replaceability. Microcircuits covered this drawing will replace same generic device covered contractorprepared specification drawing. Configuration control SMD's. proposed changes existing SMD's will coordinated with users record individual documents. This coordination will accomplished using Form 1692, Engineering Change Proposal. Record users. Military industrial users shall inform Defense Supply Center Columbus when system application requires configuration control applicable SMD. DSCC will maintain record users this list will used coordination distribution changes drawings. Users drawings covering microelectronics devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544. Comments. Comments this drawing should directed DSCC-VA, Columbus, Ohio 43216-5000, telephone (614) 692-0674. Approved sources supply. Approved sources supply listed MIL-HDBK-103. vendors listed MIL-HDBK-103 have agreed this drawing certificate compliance (see herein) been submitted accepted DSCC-VA. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 SIZE REVISION LEVEL 5962-87788 SHEET STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 01-04-03 Approved sources supply 5962-87788 listed below immediate acquisition information only shall added MIL-HDBK-103 QML-38535 during next revision. MIL-HDBK-103 QML-38535 will revised include addition deletion sources. vendors listed below have agreed this drawing certificate compliance been submitted accepted DSCC-VA. This bulletin superseded next dated revision MIL-HDBK-103 QML-38535. Standard microcircuit drawing 5962-8778801FA Vendor CAGE number 58625 0C7V7 Vendor similar SL82S129/BFA 82S129/BFA AM27S21/BFA AM27S21/B2A SL82S129A/BEA 82S129A/BEA AM27S21A/BEA SL82S129A/BFA 82S129A/BFA AM27S21A/BFA AM27S21A/B2A Reference military specification part numbers MIL-M-38510/20304BFA 5962-87788012A 5962-8778802EA 58625 0C7V7 MIL-M-38510/20304BEA 5962-8778802FA 58625 0C7V7 MIL-M-38510/20304BFA 5962-87788022A lead finish shown each representing hermetic package most readily available from manufacturer listed that part. desired lead finish listed contact vendor determine availability. Caution. this number item acquisition. Items acquired this number satisfy performance requirements this drawing. available from approved source supply. Vendor CAGE number 58625 Vendor name address Lansdale Semiconductor, Inc. 2502 Huntington Drive Tempe, 85282-3134 Qualified Parts Laboratory, Inc. 3605 Kifer Road Santa Clara, 95051 0C7V7 information contained herein disseminated convenience only Government assumes liability whatsoever inaccuracies information bulletin. Other recent searchesST72521xx-Auto - ST72521xx-Auto ST72521xx-Auto Datasheet Si4621DY - Si4621DY Si4621DY Datasheet NJU7044 - NJU7044 NJU7044 Datasheet NJU7044D - NJU7044D NJU7044D Datasheet MAX1536 - MAX1536 MAX1536 Datasheet LR25562 - LR25562 LR25562 Datasheet LD-0019 - LD-0019 LD-0019 Datasheet BU407 - BU407 BU407 Datasheet
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