TFx23 series, 0.1% TC50 Thin-film chip resistors sizes 1210, 1206

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TFx23 series, 0.1% TC50 Thin-film chip resistors sizes 1210, 1206

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TFx23 series, 0.1% TC50
Thin-film chip resistors sizes 1210, 1206, 0805, 0603 0402
www.phycomp-components.com
Product specification Supersedes data 30th July 2001
2001 Rev.1
Phycomp
Product specification
Thin-film chip resistors sizes 1210, 1206, 0805, 0603 0402
FEATURES High precision High long-term stability temperature coefficient. APPLICATIONS Converters Printer equipment Motherboards Telecom Consumer. DESCRIPTION
TFx23 series, 0.1% TC50
resistive layer covered with protective coating printed with resistance value. Finally, external terminations added. guarantee optimum solderability outer layer consists lead-tin alloy.
resistors constructed high grade ceramic body (aluminium oxide). Internal metal electrodes added each connected resistive paste which applied surface substrate. composition paste adjusted give approximate resistance required value trimmed within tolerance, laser cutting this resistive layer.
QUICK REFERENCE DATA VALUE DESCRIPTION TF523 Size code Resistance range Resistance tolerance series Temperature coefficient Maximum dissipation Tamb Maximum permissible voltage RMS) Climatic category (IEC 60068) Basic specification 0.25 0.125 1210 TF023 1206 TF123 0805 10-6/K 0.125 55/125/56 60115-8 MIL-STD-202F 0.0625 ±0.1%; series TF223 0603 TF323 0402
2001 Rev.1
www.phycomp-components.com
Phycomp
Product specification
Thin-film chip resistors sizes 1210, 1206, 0805, 0603 0402
ORDERING INFORMATION Table TYPE TF523 TF023 TF123 TF223 TF323 Ordering code indicating resistor type packing SIZE CODE 1210 1206 0805 0603 0402 RESISTANCE VALUE Table TOL. ±0.1 ±0.1 ±0.1 ±0.1 ±0.1 Last digit 12NC LAST DIGIT
TFx23 series, 0.1% TC50
PAPER TAPE REEL 5000 5000 5000 5000 10000
12NC ORDERING CODE 2390 4xxxx 2390 4xxxx 2390 4xxxx 2390 4xxxx 2390 4xxxx
Ordering code (12NC) resistors have 12-digit ordering code starting with 2390; Table subsequent digits indicate resistor type packing. remaining digits indicate resistance value: first digits indicate resistance value. last digit indicates resistance decade accordance with Table
ORDERING EXAMPLE ordering code TF023 resistor, value 1000 with 0.1% tolerance, supplied paper tape units reel 2390 41002.
RESISTANCE DECADE 97.6 9.76 97.6 to976k
2001 Rev.1
www.phycomp-components.com
Phycomp
Product specification
Thin-film chip resistors sizes 1210, 1206, 0805, 0603 0402
FUNCTIONAL DESCRIPTION Product characterization Standard values nominal resistance taken from series resistors with tolerance ±0.1%. values series accordance with "IEC publication 60063". Limiting values LIMITING VOLTAGE (note LIMITING POWER 0.25 0.125 0.125 0.0625 Fig.1
TFx23 series, 0.1% TC50
DERATING power that resistor dissipate depends operating temperature; Fig.1.
handbook, halfpage
(%Prated
MLB206
TYPE
TF523 TF023 TF123 TF223 TF323 Note
Tamb
Maximum dissipation (Pmax) percentage rated power function ambient temperature (Tamb).
maximum voltage that continuously applied resistor element, "IEC publication 60115-8".
2001 Rev.1
www.phycomp-components.com
Phycomp
Product specification
Thin-film chip resistors sizes 1210, 1206, 0805, 0603 0402
MECHANICAL DATA Mass units TYPE TF523 TF023 TF123 TF223 TF323 MASS 1.67 0.55 0.25 0.052
TFx23 series, 0.1% TC50
OUTLINES
protective coat resistor layer inner electrode termination
ceramic substrate protective coat marking
Marking TYPE TF523 TF023 TF123 TF223 TF323 4-DIGIT MARKING values used decimal point. values greater first digits apply resistance value fourth indicates number zeros follow. Example MARKING 10R0 10R2 1001 RESISTANCE 10.2 digits digits digits digits digits digits digits digits EIA-96
1001
CCB633
dimensions Table
marking Table TYPE TF523 (1210) TF023 (1206) TF123 (0805) TF223 (0603) TF323 (0402)
Fig.2 Outlines. Chip resistor type relevant physical dimensions; Fig.2 (mm) ±0.1 ±0.1 ±0.1 ±0.1 ±0.1 (mm) ±0.1 ±0.1 1.25 ±0.1 ±0.1 0.50 ±0.05 (mm) 0.55 ±0.1 0.55 ±0.1 0.50 ±0.1 0.45 ±0.1 0.25 ±0.05 (mm) 0.50 ±0.2 0.45 ±0.2 0.35 ±0.2 0.25 ±0.15 0.20 ±0.1 (mm) ±0.2 ±0.2 0.35 ±0.2 0.25 ±0.15 0.25 ±0.1
2001 Rev.1
www.phycomp-components.com
Phycomp
Product specification
Thin-film chip resistors sizes 1210, 1206, 0805, 0603 0402
3-DIGIT MARKING first digits apply resistance value third indicates number zeros follow. Example MARKING RESISTANCE 3-DIGIT EIA-96 MARKING first digits apply resistance value third character indicates multiplier shown Tables Example MARKING RESISTANCE 12.4 12.4
TFx23 series, 0.1% TC50
MARKING PACKING MATERIAL packing material also marked includes resistance value, tolerance, catalogue number, quantity, production period, batch number source code.
Table
First digits resistance code VALUE Multiplier codes 10-2 10-1 CODE VALUE CODE VALUE CODE VALUE
CODE Table CODE Multiplier
2001 Rev.1
www.phycomp-components.com
Phycomp
Product specification
Thin-film chip resistors sizes 1210, 1206, 0805, 0603 0402
TESTS REQUIREMENTS Essentially tests carried accordance with schedule "IEC publication 60115-8", category 55/125/56 (rated temperature range +125 damp heat, long term, days). testing also covers requirements specified MIL-STD-202F. tests carried accordance with publication 60068, "Recommended basic climatic mechanical robustness testing procedure electronic components" under standard atmospheric conditions accordance with "IEC 60068-1", subclause 5.3.
TFx23 series, 0.1% TC50
Temperature: Relative humidity: pressure: (860 mbar 1060 mbar).
Unless otherwise specified following values apply:
Table tests requirements listed with reference relevant clauses "IEC publications 60115-8, 60068 MIL-STD" short description test procedure also given. some instances deviations from recommendations were necessary method specifying. soldering tests performed with mildly activated flux.
Table
Test procedures requirements 60068-2 TEST METHOD
60115-8 CLAUSE 4.4.1 4.4.2
MIL-STD
TEST
PROCEDURE
REQUIREMENTS
visual examination dimensions (outline) resistance gauge applied voltage (+0/-10%): unmounted chips;
holes; clean surface; damage Table Rnom: max. ±0.1%
4.18
(Tb)
202F method 210C 202F method 208G 202F method
resistance soldering heat
visible damage max.: ±(0.5% +0.05 good tinning (95% covered); damage breakdown flashover
4.17
(Ta)
solderability unmounted chips completely immersed ±0.5 solder bath voltage proof insulation maximum voltage (RMS) during minute, metal block method room temperature; Vrated; (voltage more than Vmax); specimen stabilized room temperature minutes
4.13
MIL-R short time 55342D overload para. 4.7.5
max.: ±(0.5% +0.05
2001 Rev.1
www.phycomp-components.com
Phycomp
Product specification
Thin-film chip resistors sizes 1210, 1206, 0805, 0603 0402
60115-8 CLAUSE 4.33 60068-2 TEST METHOD
TFx23 series, 0.1% TC50
MIL-STD
TEST
PROCEDURE
REQUIREMENTS
bending
resistors mounted glass epoxy resin (FR4); bending: 1210 1206 0805 0603 0402
visual damage max.: ±(0.25% +0.05
+0/-5 hour; MIL-R 55342D temperature loaded with Vrated para. 4.7.4 operation +5/-0 minutes +5/-0 minutes OFF; specimen stabilized room temperature hours after test 4.19 (Na) 202F method 202F method 108A thermal shock endurance minutes minutes UCT; cycles 1000 +48/-0 hours; loaded with Vmax; hours hours off; specimen stabilized room temperature hour min. after test
visible damage max.: ±(0.5% +0.05
visible damage max.: ±(0.5% +0.05 max.: ±(0.5% +0.05
4.25.1
4.8.4.2
202F method 202F method
temperature 25/LCT/25 coefficient 25/UCT/25 insulation resistance after minute, metal block method 1210: (DC) 1206: (DC) 0805: (DC) 0603: (DC) 0402: (DC) unmounted chips; +3/-5% loaded with 0.01 Vmax damp heat cycles. cycle consists steps. Fig.3)
10-6/K
4.6.1.1
Rins min.:
3.13 EIA/IS 202F method
leaching moisture resistance
good tinning; leaching max.: ±(0.5% +0.05
2001 Rev.1
www.phycomp-components.com
Phycomp
Product specification
Thin-film chip resistors sizes 1210, 1206, 0805, 0603 0402
TFx23 series, 0.1% TC50
temperature [°C] initial drying hours
rate change temperature unspecified, however, specimens shall subjected radiant heating from chamber conditioning processes (+18 (-3.6 initial measurements specified circulation conditioning shall minimum cubic rate minute equivalent times volume chamber
final cycle; measurements specified
temperature tolerance (±3.6 unless otherwise specified STEP1 prior first cycle only
HBK073
optional sub-cycle specified (2.3); sub-cycle performed during first cycles; humidity uncontrolled during sub-cycle
voltage applied specified
STEP2
STEP3
STEP4
STEP5
STEP6
STEP7
cycle hours; repeat specified time
Fig.3 Moisture resistance test requirements.
2001 Rev.1
www.phycomp-components.com
Phycomp
Product specification
Thin-film chip resistors sizes 1210, 1206, 0805, 0603 0402
MOUNTING their rectangular shape small dimensional tolerances, surface-mounted resistors suitable handling automatic placement systems. Chip placement ceramic substrates Footprint dimensions
TFx23 series, 0.1% TC50
printed-circuit boards (PCBs). Electrical connection circuit soldering. finishing terminations guarantees reliable contact.
handbook, full pagewidth
solder land solder paste pattern
preferred direction during wave soldering
solder resist pattern
occupied area
tracks
MBG628
available area tracks underneath chip
dimensions Table
Fig.4 Recommended footprint dimensions.
Table TYPE TFx323 TFx223 TFx123 TFx023 TFx523 Table TYPE TFx223 TFx123 TFx023 TFx523
Reflow soldering; dimensions also Fig.4 SIZE CODE 0402 0603 0805 1206 1210 FOOTPRINT DIMENSIONS (mm) PROCESSING REMARKS 0.85 soldering PLACEMENT ACCURACY (mm) ±0.15 ±0.25 ±0.25 ±0.25 ±0.25
Wave soldering; dimensions also Fig.4 SIZE CODE 0603 0805 1206 1210 FOOTPRINT DIMENSIONS (mm) 0.15 0.34 1.25 1.25 PROPOSED NUMBER DIMENSIONS DUMMY TRACKS (mm) (0.15 0.8) (0.3 1.3) (0.25 1.7) (0.25 2.6) PLACEMENT ACCURACY (mm) ±0.25 ±0.25 ±0.25 ±0.25
2001 Rev.1
www.phycomp-components.com
Phycomp
Product specification
Thin-film chip resistors sizes 1210, 1206, 0805, 0603 0402
SOLDERING CONDITIONS robust construction chip resistors allows them completely immersed solder bath minute. Therefore, possible mount surface-mount resistors side other components reverse side (mixed PCBs).
TFx23 series, 0.1% TC50
Surface-mount resistors tested solderability during seconds. test condition leaching seconds. Typical examples soldering processes that provide reliable joints without damage, given Figs
MLA859
(°C)
Typical values (solid line). Process limits (dotted lines).
Fig.5 Infrared soldering.
2001 Rev.1
www.phycomp-components.com
Phycomp
Product specification
Thin-film chip resistors sizes 1210, 1206, 0805, 0603 0402
TFx23 series, 0.1% TC50
MLA861
(°C) second wave
first wave
forced cooling
Typical values (solid line). Process limits (dotted lines). resistors soldered twice accordance with this method desired.
Fig.6 Double wave soldering.
2001 Rev.1
www.phycomp-components.com
Phycomp
Product specification
Thin-film chip resistors sizes 1210, 1206, 0805, 0603 0402
PACKING Tape reel specifications tape reel specifications accordance with "IEC 60286-3". Basic dimensions given Figs Tables Peel-off force
TFx23 series, 0.1% TC50
Peel-off forces both paper blister tapes accordance with "IEC 60286-3" that peel-off speed mm/minute, tape. peel-off angle should between 165° 180°.
Paper tape specification
handbook, full pagewidth
cover tape
MBG251
Cumulative tolerance over holes: ±0.2 Bottom fixing tape thickness: fixing tape thickness: dimensions Table
Fig.7 Paper tape. Table Dimensions paper tape relevant chip size; Fig.7 TYPE SIZE CODE SYMBOL TF323 (0402) SIZE 0.65 1.15 1.75 3.50 0.53 TOL. ±0.1 ±0.1 ±0.2 ±0.1 ±0.05 +0.1/-0 ±0.1 ±0.05 ±0.05 ±0.1 TF223 (0603) SIZE 1.10 1.90 1.75 3.50 TOL. ±0.1 ±0.1 ±0.2 ±0.1 ±0.05 +0.1/-0 ±0.1 ±0.05 ±0.05 ±0.1 TF123 (0805) SIZE 1.65 2.40 1.75 3.50 1.50 0.85 TOL. ±0.1 ±0.1 ±0.2 ±0.1 ±0.05 +0.1/-0 ±0.1 ±0.05 ±0.05 ±0.1 TF023 (1206) SIZE 1.90 3.50 1.75 3.50 0.85 TOL. ±0.1 ±0.1 ±0.2 ±0.1 ±0.05 +0.1/-0 ±0.1 ±0.05 ±0.05 ±0.1 TF523 (1210) SIZE 2.80 3.50 1.75 3.50 0.85 TOL. ±0.1 ±0.1 ±0.2 ±0.1 ±0.05 +0.1/-0 ±0.1 ±0.05 ±0.05 ±0.1 UNIT
2001 Rev.1
www.phycomp-components.com
Phycomp
Product specification
Thin-film chip resistors sizes 1210, 1206, 0805, 0603 0402
Tape leader/trailer specification
TFx23 series, 0.1% TC50
leader trailer
empty compartments with cover tape (min. cover tape only
trailer (max.
leader
CCB325
Fig.8 Leader/trailer tape.
Taping requirements Resistance side facing Component free sticking and/or bottom tape. Component should easy remove from carrier tape chip cavity should have mechanical damage.
2001 Rev.1
www.phycomp-components.com
Phycomp
Product specification
Thin-film chip resistors sizes 1210, 1206, 0805, 0603 0402
Reel specification
TFx23 series, 0.1% TC50
HBK039
Dimensions reel dimensions Table
Fig.9 Reel. Table Reel dimensions; Fig.9 TYPE TF323 TF223 TF123 TF023 TF523 SIZE CODE 0402 0603 0508 1206 1210 UNITS REEL 10000 5000 5000 5000 5000 +0/-3 +1/-0 13.0 ±0.2 ±0.3 11.4 TAPE WIDTH (mm) (mm) (mm) (mm) (mm) MAX. (mm)
2001 Rev.1
www.phycomp-components.com
Phycomp
Product specification
Thin-film chip resistors sizes 1210, 1206, 0805, 0603 0402
REVISION HISTORY Revision Rev.0 Rev.1 Date 2001 2001 Change Notification EBR-324001177 Description First issue this specification
TFx23 series, 0.1% TC50
range expanded with 0.25 size 1210 resistors MIL-STD test procedures added
2001 Rev.1
www.phycomp-components.com

TFx23 series, 0.1% TC50 Thin-film chip resistors sizes 1210, 1206

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