1206/22nF 0612/22nF Low-inductance MLCCs high-speed digital

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1206/22nF 0612/22nF Low-inductance MLCCs high-speed digital

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attenuation (dB)
1206/22nF
0612/22nF
Low-inductance MLCCs high-speed digital systems
1206/100nF 0612/100nF
frequency (Hz)
personal touch passives
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inductance (nH)
Low-inductance MLCCs high-speed digital systems
With clock frequencies modern processors nowadays often exceeding MHz, equivalent series inductance (ESL) capacitors essential requirement decoupling bypass circuits. only low-inductance capacitors capable operating over broader bandwidths than conventional versions, they also more effective suppressing noise reducing ripple voltage lines. latter quality, particular, seen from wellknown relation between voltage induced inductor rate change current, i.e. (di/dt). high-speed circuits, where di/dt quite large, large voltage spikes generated power supply lead system abnormalities such shut down even complete failure. magnitude voltage spikes minimized only reducing ESL.
MSD345
1206 0603 0805 0508 0612 frequency (MHz)
Fig.1
measurements MLCCs
Phycomp's low-inductance chip capacitors offer answer
SUMMARY Phycomp's low-inductance MLCCs ideal decoupling high-speed digital systems. With terminations longer sides, capacitors exhibit significantly lower parasitic inductance than their conventional counterparts, making them particularly effective suppressing noise ripple high-frequency circuits. capacitors also characterized high series resonant frequency, providing bonus exceptionally broad bandwidth. answer found with Phycomp's range low-inductance MLCCs class dielectric. With terminations longer sides, capacitors exhibit significantly lower parasitic inductance than their conventional counterparts. This clear from Fig.1 which compares parasitic inductances standard 1206, 0603 0805 MLCCs with those Phycomp's 0612 0508 low-inductance MLCC series. important note that this reduction exclusively function coupling between terminations related dielectric material capacitance value.
Excellent high-frequency performance Figure shows transmission characteristics bypass circuit highlights crucial importance parasitic inductance bypass capacitors. lower 0612 capacitor results higher resonant frequency than that equivalent 1206 capacitor, enabling 0612 capacitor operate over significantly broader bandwidth. Lower ESL, moreover, results lower impedance, which implies superior noise-suppression characteristics.
MSD346
attenuation (dB)
1206/22
0612/22
1206/100 0612/100
frequency (Hz)
Phycomp's low-inductance MLCC series
Fig.2
Comparison transmission characteristics standard MLCCs Phycomp's low-inductance MLCCs
Excellent high-frequency performance Figure shows transmission characteristics bypass circuit highlights crucial importance parasitic inductance bypass capacitors. lower 0612 capacitor results higher resonant frequency than that equivalent 1206 capacitor,
Benefits Phycomp's low-inductance MLCCs
gives exceptionally broad bandwidths decoupling bypassing applications Superior suppression noise ripple compared with conventional capacitors
Soldering conditions Surface-mount components tested solderability temperature seconds. typical example soldering process that provides reliable joints without damage given Fig.5.
(°C)
Substrate handling precautions Ensure that board flexed excessively after product other components have been soldered necessary, support prevent excessive flexing board Mount products possible from break line board from line large holes board break board hand. recommend machine break board
MSD348
Typical applications
outstanding properties Phycomp's lowinductance MLCCs make them ideal decoupling/bypassing functions broad range modern equipment including: Notebook Desktop Hand-held computers Mobile phones Digital consumer equipment (e.g. players, monitors camcorders)
0508 0612 Fig.3 1.25 ±0.20 1.60 ±0.20 2.00 ±0.20 3.20 ±0.20 0.85 ±0.10 0.85 ±0.10
MSD347
Typical values (solid line) Process limits (dotted line)
another component
vacuum nozzle
Capacitance range Capacitance tolerance Rated voltage (DC) Test voltage (DC) minute Insulation resistance after min. (DC) Temperature coefficient Ageing decade Operating temperature range Terminations
0508 0612 ±10% V/16 2.5%, 3.5%, 1000 (max.) (typ.) ±10% 2.5%
(min) 0.13 0.38 0.46 0.13 0.50 0.46
Fig.5
Soldering conditions (infrared soldering
board
inductance MLCC
Handling precautions
Phycomp's low-inductance MLCCs with terminations longer sides (dimensions Soldering precautions Note that this product will easily damaged rapid heating, rapid cooling local heating subject product thermal shock soldering temperatures greater than recommend preheating annealing (gradual cooling) stages during soldering cycle Wave soldering this product recommended since this lead formation solder bridging narrow pitch product Solder precautions Solder footprint Note following precautions when using solder replacement: temperature must exceed ensure this, solder with power less than solder must come into direct contact with product Fig.6
support pins
MSD350A
Precautions when handling substrate
Component soldering
Reflow soldering Print solder paste thickness rosin-based flux, activated flux (containing, example, more than 0.2% weight chlorine) solder consisting Sn/Pb proportions 63/37 60/40 Sn/Pb/Ag proportion 62/36/2
Storage conditions Note following precautions when storing product: Avoid high-temperature, high-humidity dusty environments atmospheres containing corrosive gases (e.g. hydrogen chloride, sulphuric acid gas, hydrogen sulphide) since these degrade terminal solderability Keep storage temperature less than relative humidity less than and, possible, keep storage longer than months Avoid direct heat sunshine prevent packaging tape from melting sticking product
1000 (max.) (typ.)
0508 0.50 2.00 1.00 2.50 0612 0.80 3.20 1.00 2.80
+125 +125
Ni/Sn Ni/Sn
More information
more information data contact your local Phycomp sales representative (address back cover) visit site
Specifications mechanical details
Fig.4
MSD349
Solder footprint (dimensions
Headquarters Sales Europe Phycomp France S.A.S. Salvador Allende 92000 Nanterre France Tel: (0)1 (0)1
Headquarters Sales Asia Pacific Phycomp Taiwan Ltd. No.223-1, Pao-Chiao Road Hsin-Tien, Taipei Taiwan, R.O.C. Tel: +886 (0)2 2917 Fax: +886 (0)2 2917
Headquarters Sales Phycomp USA, Inc. 16750 Westgrove Drive suite Addison 75201 Tel: 2020 Fax: 2019
General Headquarters Phycomp Holding B.V. Bredeweg 6042 Roermond Netherlands Tel: (0)475 Fax: (0)475
Phycomp Holding B.V. rights reserved. Reproduction whole part prohibited without prior written consent copyright owner. information presented this document does form part quotation contract, believed accurate reliable changed without notice. liability will accepted publisher consequence use. Publication thereof does convey imply license under patent- other industrial intellectual property rights.
Printed Netherlands
Document order number: 9398 30011
Date release: September 2001
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1206/22nF 0612/22nF Low-inductance MLCCs high-speed digital

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