personal touch passives network integrating resistors capacitors
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network integrating resistors capacitors
personal touch passives
network integrating resistors capacitors
today's applications move toward ever higher processing speeds levels miniaturization, board space becomes more more critical layout design. This means that components need smaller pack more functionality than ever before. Phycomp's integrated network been developed specifically meet this challenge. Integrating four resistors four capacitors 10-pin 1608 surface-mount package, network takes significantly less board space than network based discrete resistors capacitors also less than network based combined discrete arrays (see Fig.1). even small enough placed beneath allowing further savings board space improvements reliability since interconnections then much shorter. What's more, surface-mounting processes Phycomp's network instead discrete components allows significant savings placement costs and, since number solder joints reduced from savings inspection costs after mounting.
Discrete array
Discrete chip RSMD
SUMMARY Integrating four resistors four capacitors 10-pin 1608 surface-mount package, Phycomp's integrated network takes significantly less board space than network based discrete components. Using network, equipment manufacturers able make major savings assembly costs.
array array
network
network
MSD016
Fig.1
Phycomp's network takes significantly less board space than network based discrete resistors network based combined discrete arrays
network mobile phone application
Advantages offered network
Single surface-mount package takes significantly less space than equivalent discrete components Easier component handling, placement inspection Designed with concave terminations offering greater mechanical strength better soldering quality temperature coefficient resistance, stable resistance, noise parasitic inductance ground pins diametrically opposite each other simplifies placement board since means that component placed either round solder pads.
advantages space cost reductions plus high reliability make Phycomp's network ideal many today's applications. These include: notebook/ desktop/handheld computers (e.g. mother board hard disk drive circuitry), monitors, mobile telephones digital consumer equipment (e.g. players, camcorder advanced pagers).
Top: CAPACITOR
ceramic substrate protection coating
Typical applications
Specifications mechanical details
Case size Resistance range Resistance tolerance Capacitance range Capacitance tolerance Resistance Capacitance Number resistors Number capacitors Number terminals Abs. max. dissipation Tamb Operating temperature range Climatic category Basic specification Dissipation factor 1608 +30%/20% ppm/K +20% 1/16 W/element 55/125/56 115-8 3.0%
termination
Bottom: RESISTOR
MSD018
MSD019
MSD020
Fig.4
Damping resistors bypass capacitors\
Fig.5
termination
4.00 2.10 +0.30/-0.10 ±0.20 0.15 0.65 +0.05/-0.10 +0.20/-0.10 Fig.3
0.50 ±0.20 0.45 ±0.20
0.25 ±0.20 0.40 ±0.20
0.50 ±0.20 0.80 ±0.10
USB/B ROUTE PORT USB/B ROUTE PORT
Controller
UAB/A PORT UAB/A PORT
USB/B ROUTE PORT USB/B ROUTE PORT
Controller
Mechanical construction network comprises resistors capacitors 10-pin 1608 surface-mount package with ground connections pins (Fig.2). provision ground pins diametrically opposite each other simplifies placement board since means that component placed either round solder pads.
Case dimensions
component constructed high-grade ceramic body (aluminium oxide). Internal metal electrodes added each connected resistive paste applied surface substrate. Dielectric material applied substrate. composition resistive paste adjusted give approximate resistance value laser trimmed within tolerance. resistive dielectric layers covered with protective coating printed with marking capacitor side. Finally, external terminations added. ease soldering, outer these terminations lead-tin alloy. Figure gives outline dimensions.
UAB/A PORT UAB/A PORT
MSD021
Network Application
Fig.6
network (Universal Serial Bus) applications
MSD017
Fig.2
network comprises resistors capacitors single surface-mount package
Solder precautions Note following precautions when using solder replacement: temperature must exceed seconds. ensure this, solder with power less than solder must come into direct contact with product. Substrate handling precautions Ensure that board flexed excessively after product other components have been soldered. necessary, support prevent excessive flexing board Mount products possible from break line board from line large holes board Ensure that board flexed excessively when other components added. necessary, support prevent flexing break board hand. recommend machine break board. Soldering conditions Surface-mount components tested solderability temperature seconds. Figure shows typical examples soldering cycles that have been found provide reliable joints without damage.
MSC817
Examples available combinations
Catalogue numbers (12NC): 2350 xxxxx. xxxxx please refer examples following table: Other combinations delivered request Resistance Capacitance (pF) 20004 20005 20003 20002 20001
Ordering example Resistance 4000 units reel. Ordering code: 2350 20004
Fig.7
network parallel-port application
Component soldering
Reflow soldering profile Print solder paste thickness rosin-based flux, activated flux (containing, example, more than 0.2% weight chlorine) solder consisting Sn/Pb proportions 63/37 60/40. Solder footprint Figure shows solder footprint. eliminate highfrequency noise, ensure that ground pattern large possible.
More information
more information data contact your local Phycomp sales representative (address back cover) visit site
another component
vacuum nozzle
network
2K/s
support pins
MSD023
Fig.10
Precautions when handling substrate
Fig.9
Soldering conditions
Handling precautions
MSD022
0.45 0.50 0.10 0.80 Fig.8
0.50+ 0.20 0.10 3.20 0.10
3.40 0.30 5.10 0.30
1.20+0.40 0.20
Soldering footprint (dimensions
Soldering precautions Note that this product will easily damaged rapid heating, rapid cooling local heating subject product thermal shock soldering temperatures greater than recommend preheating annealing (gradual cooling) stages during soldering cycle Wave soldering this product recommended since this lead formation solder bridging narrow pitch product.
Storage conditions Note following precautions when storing product: Avoid high-temperature, high-humidity dusty environments atmospheres containing corrosive gases (e.g. hydrogen chloride, sulphuric acid gas, hydrogen sulphide) since these degrade terminal solderability Keep storage temperature less than relative humidity less than and, possible, keep storage longer than months Avoid direct heat sunshine prevent packaging tape from melting sticking product.
Headquarters Sales Europe Phycomp France S.A.S. Carnot B.P. 92156 Suresnes Cedex Paris, France Tel: (0)1 4099 6161 Fax: (0)1 4099 6493
Headquarters Sales Asia Pacific Phycomp Taiwan Ltd. No.223-1, Pao-Chiao Road hsin-Tien, Taipei, Taiwan R.O.C. Tel: +886 (0)2 2917 Fax: +886 (0)2 2917
Headquarters Sales Phycomp Inc. 12375-B Pine Springs Drive Paso 79928 Tel: 3200 Fax: 3205
General Headquarters Phycomp Holding B.V. Bredeweg 6042 Roermond Netherlands Tel: (0)475 Fax: (0)475
Phycomp Holding B.V. rights reserved. Reproduction whole part prohibited without prior written consent copyright owner. information presented this document does form part quotation contract, believed accurate reliable changed without notice. liability will accepted publisher consequence use. Publication thereof does convey imply license under patent- other industrial intellectual property rights.
Printed Netherlands
Document order number: 9398 24011
Date release: 2001
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