personal touch passives 8-resistor array surface-mount package

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personal touch passives 8-resistor array surface-mount package

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8-resistor array surface-mount package
personal touch passives
8-resistor array surface-mount package
SUMMARY
case size 1606, Phycomp's surface-mount 8-resistor array takes significantly less board space than network based discrete resistors, whilst offering bonuses inductance excellent high-frequency behaviour. Moreover, using Phycomp's array, equipment manufacturers able save significantly assembly costs.
today's applications move toward ever higher processing speeds levels miniaturization, board space becomes more more critical layout design. This means that components need smaller pack more functionality than ever before. meet these requirements, Phycomp recently introduced surface-mount 16-pin 8-resistor array. case size 1606, Phycomp's array take significantly less board space than network based discrete resistors, whilst offering bonuses inductance excellent high-frequency behaviour. Moreover using array, equipment manufacturers able save significantly assembly costs expensive investment surface-mounting systems.
modern applications including: notebook/desktop/ handheld computers (e.g. mother board hard disk drive circuitry), mobile telephones digital consumer equipment (e.g. players, camcorder advanced pagers).
Specifications mechanical details
Case size Resistance range Resistance tolerance Number resistors Number terminals Temperature coefficient resistance Abs. max. dissipation Tamb= Maximum permissible voltage Operating temperature Stability after: short term overload humidity over life temperature cycle 1606 (4.0 jumper, series ppm/K 1/16 +125 max. max. max.
lead pitch
0402 discrete
Mechanical construction array comprises resistors 1606 case.
22R0
array
MSD030A
Fig.1
Phycomp's array occupies less than half space taken equivalent discrete resistors
MSD031
Advantages resistor arrays
Advantages offered Phycomp's 8-resistor array include: Termination pitch compatible with fine pitch today's ICs, further helping reduce board space improve wiring layout Rugged package with flat terminations reliable surface-mount assembly Integrates discrete resistors into single 1606 package greatly simplifying surface-mounting operations High power dissipation 1/16 equivalent 0603 discrete resistor advantages space cost reductions plus high reliability make Phycomp's resistor array ideal host
Fig.2
array internal details
resistors constructed high-grade ceramic body (aluminium oxide). Internal metal electrodes added each connected resistive paste that applied surface substrate. composition paste adjusted give approximate resistance required value trimmed within tolerance laser cutting this resistive layer. resistive layer covered with protective coating. Finally external terminations added. ease soldering, outer these terminations lead/tin alloy. Figure gives outline dimensions array.
Pull-up
22R0
Lead pitch
Lead pitch
MSD032A
4.00 0.40 0.30 0.30 0.20 0.50 0.40 0.30 ±0.2 ±0.15 ±0.10 ±0.20 ±0.20 ±0.10 ±0.10 ±0.20 ±0.10 Fig.4 Fig.3 Mechanical details array (dimensions
MSD033A
Damping
Basic application example that saves space reduces length interconnects
Typical applications
Figure shows basic application example that saves space reduces interconnect length. Figures show typical applications. Specific examples include: Pull-up/pull-down resistors Damping resistors Offset voltage (current) circuit Digital-to-analog converters
VDDPC10 VDDPC11 VDDCORE0
VDD48MHz VDDCORE1 VDDQREF
VDDAPIC VDDCPU0 VDDCPU1
CK100
CPUCLK1 CPUCLK2 CPUCLK3 PCICLK_F PCICLK_1 PCICLK_2 PCICLK_3 PCICLK_4 PCICLK_5 48MHz_0 APICCLK_0 REF0 REF1 REF2
TPCLK BXHCLK CPUHCLK PXPCLK PCLK1 PCLK2 PCLK3 PCLK4 BXPCLK 48MHz_0 PICCLK3 OSC1 OSC2 OSC3
SDD8 SDD9 SDD10 SDD11 SDD12 SDD13 SDD14 SDD15
MSD034A
Fig.5
BRSTDRV#1 PDD7 PDD6 PDD5 PDD4 PDD3 PDD2 PDD1 PDD0 PDDREQ# PDIOW# PDIOR# PDACK# PDA1 PDDA0 PCS1# BRSTDRV#2 SDD7 SDD6 SDD5 SDD4 SDD3 SDD2 SDD1 SDD0 SDDREQ# SDIOW# SDIOR# SDACK# SDA1 SDDA0 SCS1#
Application clock synthesizer
PDD8 PDD9 PDD10 PDD11 PDD12 PDD13 PDD14 PDD15
MSD035A
PRIMARY CONNECTOR
SECONDARY CONNECTOR
Fig.6
Application connectors
MSC817
VDDIIC SDRAM0 SDRAM1 SDRAM2 SDRAM3 SDRAM4 SDRAM5 SDRAM10 SDRAM11 SDRAM12 SDRAM13 SDRAM14 SDRAM15 SDRAM16 DCLK9 DCLK8 DCLK5 DCLK4 DCLK0 DCLK1 DCLK11 DCLK10 DCLK7 DCLK6 DCLK3 DCLK2 DCLKREF
2K/s
CKBF
Fig.9
Soldering conditions
Handling precautions
MSD131A
Fig.7
Application SDRAM interface
Component soldering
Reflow soldering profile Print solder paste thickness rosin-based flux, activated flux (containing, example, more than 0.2% weight chlorine) solder consisting Sn/Pb proportions 63/37 60/40. Solder footprint
Soldering precautions Note that this product will easily damaged rapid heating, rapid cooling local heating subject product thermal shock soldering temperatures greater than recommend preheating annealing (gradual cooling) stages during soldering cycle Wave soldering this product recommended since this lead formation solder bridging narrow pitch product. Solder precautions Note following precautions when using solder replacement: temperature must exceed ensure this, solder with power less than solder must come into direct contact with product. Substrate handling precautions Ensure that board flexed excessively after product other components have been soldered. necessary, support prevent excessive flexing board Mount products possible from break line board from line large holes board Ensure that board flexed excessively when other components added. necessary, support prevent flexing. break board hand. recommend machine break board.
MSD036
1.00+0.10 0.20 0.28+0.00 0.05 3.20+0.40 0.50 3.85+0.20 0.05
Fig.8
Soldering footprint (dimensions
Soldering conditions Surface-mount resistors tested solderability temperature seconds. Figure shows typical examples soldering cycles that have been found provide reliable joints without damage.
another component
vacuum nozzle
board
array
support pins
MSD037
Fig.10 Precautions when handling substrate Storage conditions Note following precautions when storing product: Avoid high-temperature, high-humidity dusty environments atmospheres containing corrosive gases (e.g. hydrogen chloride, sulphuric acid gas, hydrogen sulphide) since these degrade terminal solderability Keep storage temperature less than relative humidity less than and, possible, keep storage longer than months Avoid direct heat sunshine prevent packaging tape from melting sticking product.
More information
more information data contact your local Phycomp sales representative (address back cover) visit site
Headquarters Sales Europe Phycomp France S.A.S. Carnot B.P. 92156 Suresnes Cedex Paris, France Tel: (0)1 4099 6161 Fax: (0)1 4099 6493
Headquarters Sales Asia Pacific Phycomp Taiwan Ltd. No.223-1, Pao-Chiao Road hsin-Tien, Taipei, Taiwan R.O.C. Tel: +886 (0)2 2917 Fax: +886 (0)2 2917
Headquarters Sales Phycomp Inc. 12375-B Pine Springs Drive Paso 79928 Tel: 3200 Fax: 3205
General Headquarters Phycomp Holding B.V. Bredeweg 6042 Roermond Netherlands Tel: (0)475 Fax: (0)475
Phycomp Holding B.V. rights reserved. Reproduction whole part prohibited without prior written consent copyright owner. information presented this document does form part quotation contract, believed accurate reliable changed without notice. liability will accepted publisher consequence use. Publication thereof does convey imply license under patent- other industrial intellectual property rights.
Printed Netherlands
Document order number: 9398 23011
Date release: 2001

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