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8-resistor bussed network
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8-resistor bussed network
more more computer motherboards adopt highspeed CPUs increase their data processing power functionality, board space becomes ever more critical layout design. This particularly true motherboards based latest Pentium series high-speed processors, which require pull-up pull-down networks provide signal matching. meet this requirement, Phycomp recently introduced resistor bussed network 10-pin 1206 case with ground connections. Fig.1 shows, resistor network takes significantly less board space than network based discrete resistors. even small enough placed beneath processor itself, allowing further savings board space improvements reliability since interconnections then much shorter.
PHYCOMP PHYCOMP
cost index 0603 product cost 10P8R network mounting cost board cost saving
MSC813
Fig.2
resistor network give saving total cost
Specifications mechanical details
Table Quick-reference data Resistance range Resistance tolerance Temperature coefficient Number resistors Number terminals Abs. max. dissipation Tamb Operating temperature range Climatic category Basic specification Max. permissible voltage ppm/°C ppm/°C 1/32 1/16 +125 55/125/56 115-8 RMS)
PHYCOMP
SUMMARY Phycomp's 8-resistor bussed network offers important advantages designers computer motherboards, especially boards using latest Pentium processors which require pull-up pulldown networks provide signal matching. 10-pin 1206 case with ground con-nections, resistor network takes significantly less board space than network based discrete resistors. even small enough placed beneath processor itself, allowing further savings board space improvements reliability.
network
Fig.1
addition, surface-mounting processes resistor network instead discrete resistors allows significant savings placement costs and, since number solder joints reduced from savings inspection costs after mounting.
Phycomp's R-Chip takes less space that equivalent discrete resistors
MSD070A
0603
Mechanical construction
network comprises resistors 10-pin 1206 case with ground connections pins (Fig.3). provision ground pins diametrically opposite each other simplifies placement board since means that component placed either round solder pads. resistors constructed high-grade ceramic (aluminium oxide) body. Internal metal electrodes added each connected resistive paste, which applied surface substrate. composition paste adjusted give approximate resistance required value trimmed within tolerance laser cutting this resistive layer.
MSC817
Mount products possible from break line board from line large holes board break board hand. recommend machine break board.
another component vacuum nozzle
MSC814
2K/s
Fig.3
network comprises resistors with ground connections facilitate automatic placement
through hole
Fig.6
Soldering conditions
resistive layer covered with protective coating printed with resistance value, after which external terminations added. ease soldering, outer these terminations leadtin alloy. Figure gives outline dimensions resistor network.
termination resistor layer protective coating marking protective coating
board
network
network
Dimension 0.35 0.05 0.50 0.05 0.40 2.80 0.20 0.80 0.10 0.70 0.05 0.65 0.05 3.20 0.10
MSC818
support pins
MSC819
Fig.8
Precautions when handling substrates
ceramic substrate Dimensions size (mm)
1206 (3216)
damping resistor pull-up resistor more through-holes
MSC816
Fig.7
Soldering footprint (dimensions
Handling precautions
Soldering precautions Note that this product will easily damaged rapid heating, rapid cooling local heating subject product thermal shock soldering temperatures greater than recommend preheating annealing (gradual cooling) stages during soldering cycle Wave soldering this product recommended since this lead formation solder bridging narrow pitch product. Solder precautions Note following precautions when using solder replacement: temperature must exceed ensure this, solder with power less than solder must come into direct contact with product. Substrate handling precautions Ensure that board flexed excessively after product other components have been soldered. necessary, support prevent excessive flexing board
3.30 0.20
1.60 0.15
0.55 0.10
0.50 0.05
0.35 0.05
0.40 0.15
0.64 0.05
0.40 0.15
Fig.5
Phycomp's resistor network pull-up network computer motherboard
Storage conditions Note following precautions when storing product: Avoid high-temperature, high-humidity dusty environments atmospheres containing corrosive gases (e.g. hydrogen chloride, sulphuric acid gas, hydrogen sulphide) since these degrade terminal solderability Keep storage temperature less than relative humidity less than and, possible, keep storage longer than months Avoid direct heat sunshine prevent packaging tape from melting sticking product.
Ordering information
Table Order number: 2350 Resistance decade 9.10 91.0 Last digit
OUTLINE VERSION
REFERENCES JEDEC EIAJ
EUROPEAN PROJECTION
ISSUE DATE 98-07-10
Component soldering
Reflow soldering profile
Print solder paste thickness rosin-based flux, activated flux (containing, example, more than 0.2% weight chlorine) solder consisting Sn/Pb proportions 63/37 60/40.
MSC815A
Fig.4
Mechanical details (dimensions
Typical Applications Figure shows basic application example that saves space, reduces interconnection lengths board provides greatly simplified layout design.
Soldering Conditions
Surface-mount resistors tested solderability temperature seconds. Figure shows typical examples soldering cycles that have been found provide reliable joints without damage.
Complete catalogue number (see Table replacing first dots remaining code first digits resistance value third figure indicating decade.
Resistance value tolerance, 5000 reel; ordering code 2350 10479
Ordering example
More information
more information data contact your local Phycomp sales representative (address back cover) visit site
Headquarters Sales Europe Phycomp France S.A.S. Carnot B.P. 92156 Suresnes Cedex Paris, France Tel: (0)1 4099 6161 Fax: (0)1 4099 6493
Headquarters Sales Asia Pacific Phycomp Taiwan Ltd. No.223-1, Pao-Chiao Road hsin-Tien, Taipei, Taiwan R.O.C. Tel: +886 (0)2 2917 Fax: +886 (0)2 2917
Headquarters Sales Phycomp Inc. 12375-B Pine Springs Drive Paso 79928 Tel: 3200 Fax: 3205
General Headquarters Phycomp Holding B.V. Bredeweg 6042 Roermond Netherlands Tel: (0)475 Fax: (0)475
Phycomp Holding B.V. rights reserved. Reproduction whole part prohibited without prior written consent copyright owner. information presented this document does form part quotation contract, believed accurate reliable changed without notice. liability will accepted publisher consequence use. Publication thereof does convey imply license under patent- other industrial intellectual property rights.
Printed Netherlands
Document order number: 9398 22011
Date release: 2001

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