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personal touch passives Feedthrough capacitor arrays applications


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Feedthrough capacitor arrays applications
personal touch passives
Feedthrough capacitor arrays applications
Continuous progress semiconductor technology leading ever high processing frequencies. Today, processor clock frequencies speeds high fast becoming norm personal computers. year 2000, direct RAMs with frequencies high envisaged. such high-speed operating environments, clock pulses, switches switched-mode power supplies potential sources noise. Even small traces PC-board transmission lines parasitic inductances induced, these interfere with other electronic systems noise induced allowed propagate either direct conduction radiation. Such interference, commonly called (Electro Magnetic Interference) cause operating errors. minimize effect, especially digital equipment, circuit designers filters reduce noise shielding suppress noise.
MSD238A
attenuation (dB) normal MLCC MHz, attenuation MHz, attenuation frequency (Hz)
Fig. Transmission characteristic feedthrough capacitor compared with that conventional MLCC
Principal benefits Phycomp's feedthrough capacitor arrays
Integrated component design. miniature integrated component, feedthrough capacitor array easily place beneath significantly reducing board usage improving layout. feedthrough capacitor array occupies only board space required network based conventional two-terminal discrete capacitors (Fig.2) Cost saving. Integrated component design only saves space simplifies PC-board layout, also improves circuit reliability offering benefits surface-mount assembly-line efficiency: specifically cost saving pick-and-place operation, higher manufacturing efficiency, easier component management storage lower inspection costs Better electrical performance. Feedthrough capacitor arrays feature parallel parasitic inductance. This means they offer excellent high-frequency bypass capability high di/dt circuits suppress noise digital circuits several gigahertz.
SUMMARY Phycomp recently introduced range feedthrough capacitor arrays noise suppression high-speed busses. case size 0612, arrays comprise four 3-terminal feedthrough capacitors that offer significantly higher attenuation noise than possible using solutions based conventional ceramic multilayer capacitors.
Since suppression digital systems depends heavily grounding circuit board layout, choice suppression components used system busses quite critical. particular, provide optimum suppression today's systems, such components should feature very stray inductance should, moreover, help simplify board layout possible minimize number vias needed.
Phycomp feedthrough capacitor arrays
meet these demanding requirement, Phycomp recently introduced range feedthrough capacitor arrays noise suppression high-speed busses. case size 0612, arrays comprise four 3-terminal feedthrough capacitors that offer significantly higher attenuation noise than possible using solutions based conventional multilayer ceramic capacitors. demonstrate intrinsic advantages offered dedicated feedthrough capacitor, Fig.1 compares transmission characteristics 220pF feedthrough capacitor with those conventional size 1206 220pF MLCC. feedthrough capacitor's series resonant frequency (SRF) MHz, higher than conventional MLCC. Moreover, attenuation also much better than attenuation conventional MLCC. Although with conventional MLCCs, possible increase selecting smaller capacitance values, this also reduces attenuation effectiveness noise suppression.
0.20 0.15
0.63 0.10
0.30 0.15
Solder footprint
0.35 0.05 0.63 0.10
0.30 0.20
discrete capacitor
0.36 0.10 0.27 0.10 3.20 0.20 1.60 0.20
3.00 0.20 0.75 0.10 1.00 0.50
0.80 0.10
2.50 0.20
4.25
capacitor array
0.50 0.25
MSD298
Fig. Solder footprint (dimensions
MSD294
Fig. feedthrough capacitor array (bottom) occupies only board space occupied network based conventional twoterminal discrete capacitors
in/out
Soldering conditions Surface-mount components tested solderability temperature seconds. Figure shows typical examples soldering cycles that have been found provide reliable joints without damage.
feedthrough capacitor array
MSD297
MSD245
Specifications mechanical details
in/out
MSD295
Capacitance range Capacitance tolerance ±10%, ±20% ±5%, ±10% Rated voltage (DC) Test voltage (DC) minute 250_10-4 10_10-4 resistance max. Insulation resistance after min. (dc) Temperature (0±30) ppm/oC coefficient Ageing decade typically Operating +125 temperature range Terminations Ni/Sn
Fig. Mechanical construction Phycomp's feedthrough capacitor array 0612 package (dimensions
Fig. Bypass function noise suppression bus. Compared with alternatives, solution using feedthrough capacitor array saves space, simplifies board layout reduces number vias needed
Typical values (solid line) Process limits (dotted line)
Typical applications
Fig.4 shows, Phycomp feedthrough capacitor arrays suppress noise several gigahertz. They also offer broadband, high-attenuation filtering thanks their parasitic inductance ground patterns. They therefore ideal suppressing noise manner digital equipment including computers, notebook PCs, automotive equipment, transceivers/cellular telephones drivers.
attenuation (dB)
MSD296
Component soldering
Reflow soldering Print solder paste thickness rosin-based flux, activated flux (containing, example, more than 0.2% weight chlorine) solder consisting Sn/Pb proportions 63/37 60/40 Sn/Pb/Ag proportions 62/36/2.
Fig. Soldering conditions (infrared soldering)
Handling precautions
Soldering precautions Note that this product will easily damaged rapid heating, rapid cooling local heating subject product thermal shock soldering temperatures greater than recommend preheating annealing (gradual cooling) stages during soldering cycle. Solder precautions Note following precautions when using solder replacement: temperature must exceed ensure this, solder with power less than solder must come into direct contact with product.
frequency (Hz)
1010
Fig. Transmission characteristics Phycomp's feedthrough capacitor arrays
Substrate handling precautions Ensure that board flexed excessively after product other components have been soldered. necessary, support prevent excessive flexing board Mount products possible from break line board from line large holes board Ensure that board flexed excessively when other components added. necessary, support prevent flexing break board hand. recommend machine break board.
another component vacuum nozzle
feedthrough capacitor array
support pins
MSD299
Fig. Precautions when handling substrate Storage conditions Note following precautions when storing product: Avoid high-temperature, high-humidity dusty environments atmospheres containing corrosive gases (e.g. hydrogen chloride, sulphuric acid gas, hydrogen sulphide) since these degrade terminal solderability Keep storage temperature less than relative humidity less than and, possible, keep storage longer than months Avoid direct heat sunshine prevent packaging tape from melting sticking product.
More information
more information data contact your local Phycomp sales rep-resent-ative (address back cover) visit site
Headquarters Sales Europe Phycomp France S.A.S. Carnot B.P. 92156 Suresnes Cedex Paris, France Tel: (0)1 4099 6161 Fax: (0)1 4099 6493
Headquarters Sales Asia Pacific Phycomp Taiwan Ltd. No.223-1, Pao-Chiao Road hsin-Tien, Taipei, Taiwan R.O.C. Tel: +886 (0)2 2917 Fax: +886 (0)2 2917
Headquarters Sales Phycomp Inc. 12375-B Pine Springs Drive Paso 79928 Tel: 3200 Fax: 3205
General Headquarters Phycomp Holding B.V. Bredeweg 6042 Roermond Netherlands Tel: (0)475 Fax: (0)475
Phycomp Holding B.V. rights reserved. Reproduction whole part prohibited without prior written consent copyright owner. information presented this document does form part quotation contract, believed accurate reliable changed without notice. liability will accepted publisher consequence use. Publication thereof does convey imply license under patent- other industrial intellectual property rights.
Printed Netherlands
Document order number: 9398 21011
Date release: 2001

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