Low-inductance CMCs high-speed digital systems Low-inductance CMC

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Low-inductance CMCs high-speed digital systems Low-inductance CMC

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PHILIPS COMPONENTS Application Note
Low-inductance CMCs high-speed digital systems
Low-inductance CMCs high-speed digital systems
SUMMARY Philips Components' range low-inductance CMCs ideal decoupling highspeed digital systems. With terminations longer sides, capacitors exhibit significantly lower parasitic inductance than their conventional counterparts, making them particularly effective suppressing noise ripple highfrequency circuits. capacitors also characterized high series resonant frequency, providing bonus exceptionally broad bandwidth.
Philips Components
Philips Components
Low-inductance CMCs high-speed digital systems
With clock frequencies modern processors nowadays often exceeding MHz, equivalent series inductance (ESL) capacitors essential requirement decoupling bypass circuits. only low-inductance capacitors capable operating over broader bandwidths than conventional versions, they also more effective suppressing noise reducing ripple voltage lines. latter quality, particular, seen from wellknown relation between voltage induced inductor rate change current, i.e. (di/dt). high-speed circuits, where di/dt quite large, large voltage spikes generated power supply lead system abnormalities such shut down even complete failure. magnitude voltage spikes minimized only reducing ESL.
Philips' low-inductance chip capacitors offer answer
Philips Components' range low-inductance CMCs class dielectric offer answer. With terminations longer sides, capacitors exhibit significantly lower parasitic inductance than their conventional counterparts. This clear from Fig.1 which compares parasitic inductances standard 1206, 0603 0805 CMCs with those Philips' 0612 0508 low-inductance series. important note that this reduction exclusively function coupling between terminations related dielectric material capacitance value.
MSD345
Philips' low-inductance series Excellent high-frequency performance Figure shows transmission characteristics bypass circuit highlights crucial importance parasitic inductance bypass capacitors. lower 0612 capacitor results higher resonant frequency than that equivalent 1206 capacitor, enabling 0612 capacitor operate over significantly broader bandwidth. Lower ESL, moreover, results lower impedance which implies superior noise-suppression characteristics.
MSD346
inductance (nH)
1206 0603 0805
attenuation (dB)
1206/22
0612/22
1206/100 0612/100
0508 0612 frequency (MHz)
frequency (Hz)
Fig.1 measurements CMCs
Fig.2 Comparison transmission characteristics standard CMCs Philips' low-inductance CMCs
Philips Components
Benefits Philips' low-inductance CMCs
gives exceptionally broad bandwidths decoupling bypassing applications Superior suppression noise ripple compared with conventional capacitors
Typical applications
outstanding properties Philips' low-inductance series make them ideal decoupling/bypassing functions broad range modern equipment including: Notebook Desktop Hand-held computers Mobile phones Digital consumer equipment (e.g. players, monitors camcorders).
MSD347
Size 0508 0612
1.25 ±0.20 1.60 ±0.20
2.00 ±0.20 3.20 ±0.20
0.85 ±0.10 0.85 ±0.10
L2,L3 0.13 0.46 0.13 0.46
(min) 0.38 0.50
Specifications mechanical details
0508 ±10% V/16 2.5%, 3.5%, 1000 (max.) (typ.) +125 Ni/Sn 0612 ±10% 2.5%
Fig.3 Philips' low-inductance CMCs with terminations longer sides (dimensions
Component soldering
Reflow soldering
Capacitance range Capacitance tolerance Rated voltage (DC) Test voltage (DC) minute Insulation resistance after min. (DC) Temperature coefficient Ageing decade Operating temperature range Terminations
Print solder paste thickness rosin-based flux, activated flux (containing, example, more than 0.2% weight chlorine) solder consisting Sn/Pb proportions 63/37 60/40 Sn/Pb/Ag proportion 62/36/2
Solder footprint
1000 (max.) (typ.) +125 Ni/Sn Fig.4 Solder footprint (dimensions
Philips Components
0508 0.50 2.00 1.00 2.50
0612 0.80 3.20 1.00 2.80
MSD349
Soldering conditions Surface-mount components tested solderability temperature seconds. typical example soldering process that provides reliable joints without damage given Fig.5.
(°C)
MSD348
Substrate handling precautions Ensure that board flexed excessively after product other components have been soldered. necessary, support prevent excessive flexing board Mount products possible from break line board from line large holes board Ensure that board flexed excessively when other components added. necessary, support prevent flexing break board hand. recommend machine break board.
Typical values (solid line) Process limits (dotted line)
another component
vacuum nozzle
board
Fig.5 Soldering conditions (infrared soldering)
inductance
support pins
MSD350
Handling precautions
Soldering precautions Note that this product will easily damaged rapid heating, rapid cooling local heating subject product thermal shock soldering temperatures greater than recommend preheating annealing (gradual cooling) stages during soldering cycle Wave soldering this product recommended since this lead formation solder bridging narrow pitch product. Solder precautions Note following precautions when using solder replacement: temperature must exceed ensure this, solder with power less than solder must come into direct contact with product. Fig.9 Precautions when handling substrate Storage conditions Note following precautions when storing product: Avoid high-temperature, high-humidity dusty environments atmospheres containing corrosive gases (e.g. hydrogen chloride, sulfuric acid gas, hydrogen sulfide) since these degrade terminal solderability Keep storage temperature less than relative humidity less than and, possible, keep storage longer than months Avoid direct heat sunshine prevent packaging tape from melting sticking product.
More information
more information data contact your local Philips sales representative (address back cover) visit site www.acm.components.philips.com.
Philips Components
Philips Components worldwide company
Australia: Philips Components Ltd., HOMEBUSH, Tel. 9704 8141, Fax. 9704 8139 Austria: Philips Industrie GmbH, WIEN, Tel. Fax. Belarus: Philips Office Belarus, MINSK, Tel. +375 924/733, Fax. +375 Benelux: Philips Nederland B.V., EINDHOVEN, Tel. 772, Fax. Brazil: Philips Components, PAULO, Tel. 2333, Fax. 1849 Canada: Philips Electronics Ltd., SCARBOROUGH, Tel. 5161, Fax. 6248 China: Philips Company, SHANGHAI, Tel. 6354 1088, Fax. 6354 1060 Denmark: Philips Components A/S, COPENHAGEN Tel. 3329 3333, Fax. 3329 3905 Finland: Philips Components, ESPOO, Tel. +358 800, Fax. +358 80510 France: Philips Composants, SURESNES, Tel. 4099 6161, Fax. 4099 6493 Germany: Philips Components GmbH, HAMBURG, Tel. 2489-0, Fax. 2489 1400 Hong Kong: Philips Hong Kong, KOWLOON, Tel. +852 2784 3000, Fax. +852 2784 3003 India: Philips India Ltd., MUMBAI, Tel. 4930 311, Fax. 4930 966/4950 Indonesia: P.T. Philips Development Corp., JAKARTA, Tel. 0040, Fax. 0080 Ireland: Philips Electronics (Ireland) Ltd., DUBLIN, Tel. +353 7640 203, Fax. +353 7640 Israel: Rapac Electronics Ltd., AVIV, Tel. +972 6450 444, Fax. +972 6491 Italy: Philips Components S.r.l., MILANO, Tel. 6752 2531, Fax. 6752 2557 Japan: Philips Japan Ltd., TOKYO, Tel. 3740 5135, Fax. 3740 5035 Korea (Republic of): Philips Electronics (Korea) Ltd., SEOUL, Tel. 1472, Fax. 1480 Malaysia: Philips Malaysia Berhad, Components Division, PULAU PINANG, Tel. 5213, Fax. 4880 Mexico: Philips Components, PASO, U.S.A., Tel. 4020, Fax. 4332 Zealand: Philips Zealand Ltd., AUCKLAND, Tel. 4000, Fax. 7811 Norway: Norsk Philips, OSLO, Tel. 8000, Fax. 8341 Pakistan: Philips Electrical Industries Pakistan Ltd., KARACHI, Tel. 4641-49, Fax. 035/+92 4546 other countries apply Philips Components, Building BAE-1, P.O. 218, 5600 EINDHOVEN, Netherlands, Fax.
COB31 Philips Electronics N.V. 1999
Philippines: Philips Semiconductors Philippines Inc., METRO MANILA, Tel. 6345, Fax. 3474 Poland: Philips Poland z.o.o., WARSZAWA, Tel. 5710 000, Fax. 5710 Portugal: Philips Portuguesa S.A., Philips Components: LINDA-A-VELHA, Tel. +351 3160/416 3333, Fax. +351 3174/416 3366 Russia: Philips Russia, MOSCOW, Tel. 6918, Fax. 6919 Singapore: Philips Singapore Ltd., SINGAPORE, Tel. 2000, Fax. 1758 South Africa: S.A. Philips Ltd., JOHANNESBURG, Tel. 5911, Fax. 5494 Spain: Philips Components, BARCELONA, Tel. Fax. Sweden: Philips Components STOCKHOLM, Tel. 5985 2000, Fax. 5985 2745 Switzerland: Philips Components Tel. Fax. 7730 Taiwan: Philips Taiwan Ltd., TAIPEI, Tel. +886 2134 2900, Fax. +886 2134 2929 Turkey: Philips Ticaret A.S., UMRANIYE/ISTANBUL, Tel. Fax. United Kingdom: Philips Components Ltd., DORKING, Tel. 1306 000, Fax. 1306 United States: Philips Components, JOSE, Tel. 5600, Fax. 5700 Philips Display Components, ARBOR, Tel. 9400, Fax. 2776 Yugoslavia (Federal Republic of): Philips Components, BELGRADE, Tel. +381 +381 3341 299, Fax. +381
Internet: Advanced Ceramics Modules: www.acm.components.philips.com Display Components: www.philipsdisplay.com
rights reserved. Reproduction whole part prohibited without prior written consent copyright owner. information presented this document does form part quotation contract, believed accurate reliable changed without notice. liability will accepted publisher consequence use. Publication thereof does convey imply license under patent- other industrial intellectual property rights.
Printed Netherlands
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Date release: 11/99

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