Type Built-in logic element(equivalent 74S04). Transfer-molded hi

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Type Built-in logic element(equivalent 74S04). Transfer-molded hi

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Buffered Delay Lines
Type
Built-in logic element(equivalent 74S04). Transfer-molded high reliability. Surface-mounting. Low-profile design(under 4.9mm high).
TTL74S04 4.9mm
DIMENSIONS
(Unit:mm)
CONNECTIONS
ELECTRICAL CHARACTERISTICS
0.01V, 25±2, values without load
Part Number
JMT020L JMT025L JMT050L JMT075L JMT100L JMT125L JMT150L JMT200L
Delay (ns.)
10±2 15±2.5 20±3 25±3 30±3 40±4
Total Delay (ns.) TPLH
20±2ns. 25±2ns. 50±3ns. 75±4ns. 100±5% 125±5% 150±5% 200±5%
Rise Time (ns.)
GENERAL DATA
Operating Temperature Storage Temperature Temperature Coefficient Minimum passing pulse width
Packing Style Minimum packing quantity
550ppm/(Typ.) Cartridge Taping pcs/Reel pcs/Cartrige
-55125 550ppm(Typ.) TPLH75ns.
Recommended soldering conditions type Environmental Testing
Recommended temperature reflow soldering type
JMT, Q40A, Q10W Type
ENVIRONMENT TESTING
Parameter
Solderability
Reference
MIL-STD-202F Method 208E +230±5°C
Condition
Resistance Solvents
MIL-STD-202F Method 215E
defacing when brushed times after minute immersion trichloroethane isopropyl alcohol
Soldering Heat
MIL-STD-202F Method 210A MIL-STD-202F Method 106E
+260 ±5°C 10±1s. cycles(240H) cycles minute periods lowest highest storage temperatures
Humidity Test
Thermal Shock
MIL-STD-202F Method 107G
Vibration
MIL-STD-202F Method 204D(A)
55-2000Hz(10G) minutes, complete cycles each axes
552000Hz10G30
Shock
MIL-STD-202F Method 213B(F) MIL-STD-202F Method 103B MIL-STD-202F Method 108A MIL-STD-202F Method 211A
1500G applied times each directions
1500G
Humidity(Routine)
90~95% R.H.at +60°C 1000Hrs +85°C 1000Hrs Pulling:2.27kg
Life Test High Temperature
Strength Terminals
*Applied voltage depends product- Buffered delay lines. 5VDC Passive delay lines 50VDC Pulse transformers 100VDC
DC5V DC50V DC100V

Type Built-in logic element(equivalent 74S04). Transfer-molded hi

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