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power amplification with high forward current transfer ratio 10.0
Top Searches for this datasheet2SD1258 power amplification with high forward current transfer ratio 10.0±0.3 1.5±0.1 8.5±0.2 6.0±0.2 3.4±0.3 1.0±0.1 Parameter Collector-base voltage (Emitter open) Collector-emitter voltage (Base open) Emitter-base voltage (Collector open) Collector current Peak collector current Base current Collector power dissipation 25°C Junction temperature Storage temperature Symbol VCBO VCEO VEBO Tstg Rating +150 Unit (6.5) Base Collector Emitter N-G1 Package Note) Self-supported type package also prepared. Electrical Characteristics 25°C Parameter Collector-emitter voltage (Base open) Collector-base cutoff current (Emitter open) Emitter-base cutoff current (Collector open) Forward current transfer ratio Collector-emitter saturation voltage Transition frequency Symbol VCEO ICBO IEBO VCE(sat) Conditions 0.02 2000 Unit Note) Measuring methods based JAPANESE INDUSTRIAL STANDARD 7030 measuring methods transistors. Rank classification Rank (7.6) (1.5) Absolute Maximum Ratings 25°C 2.0±0.5 High forward current transfer ratio Satisfactory linearity forward current transfer ratio type package enabling direct soldering radiating printed circuit board, etc. small electronic equipment. 4.4±0.5 0.8±0.1 2.54±0.3 1.0±0.1 1.4±0.1 0.4±0.1 5.08±0.5 (8.5) (6.0) 4.4±0.5 14.4±0.5 3.0+0.4 -0.2 1.5+0 -0.4 Features Publication date: September 2003 SJD00174BED 2SD1258 (1)TC=Ta (2)With heat sink (3)Without heat sink (PC=1.3W) TC=25°C IB=400µA 350µA 300µA Collector-emitter saturation voltage VCE(sat) VCE(sat) IC/IB=25 Collector power dissipation TC=100°C Collector current 250µA 200µA 25°C 150µA 100µA -25°C 50µA 0.01 0.01 Ambient temperature (°C) Collector-emitter voltage Collector current VBE(sat) IC/IB=25 VCE=4V TC=100°C 25°C -25°C VCE=4V f=10MHz TC=25°C Base-emitter saturation voltage VBE(sat) Forward current transfer ratio Transition frequency (MHz) TC=100°C 25°C -25°C 0.01 0.01 0.01 0.01 Collector current Collector current Collector current Safe operation area repetitive pulse TC=25°C (1)Without heat sink (2)With heat sink Thermal resistance (°C/W) Collector current t=10ms t=1ms t=300ms 10-1 0.01 1000 10-2 10-4 10-3 10-2 10-1 Collector-emitter voltage Time SJD00174BED Request your special attention precautions using technical information semiconductors described this material export permit needs obtained from competent authorities Japanese Government products technologies described this material controlled under "Foreign Exchange Foreign Trade Law" exported taken Japan. technical information described this material limited showing representative characteristics applied circuits examples products. neither warrants non-infringement intellectual property right other rights owned company third party, grants license. liable infringement rights owned third party arising product technologies described this material. products described this material intended used standard applications general electronic equipment (such office equipment, communications equipment, measuring instruments household appliances). Consult sales staff advance information following applications: Special applications (such airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems safety devices) which exceptional quality reliability required, failure malfunction products directly jeopardize life harm human body. applications other than standard applications intended. products product specifications described this material subject change without notice modification and/or improvement. final stage your design, purchasing, products, therefore, most up-to-date Product Standards advance make sure that latest specifications satisfy your requirements. When designing your equipment, comply with guaranteed values, particular those maximum rating, range operating power supply voltage, heat radiation characteristics. Otherwise, will liable defect which arise later your equipment. Even when products used within guaranteed values, take into consideration incidence break down failure mode, possible occur semiconductor products. Measures systems such redundant design, arresting spread fire preventing glitch recommended order prevent physical injury, fire, social damages, example, using products. When using products which damp-proof packing required, observe conditions (including shelf life amount time standing unsealed items) agreed upon when specification sheets individually exchanged. This material reprinted reproduced whether wholly partially, without prior written permission Matsushita Electric Industrial Co., Ltd. 2002 Other recent searchesXC2734X - XC2734X XC2734X Datasheet XC2000 - XC2000 XC2000 Datasheet PVQN0052KA-A - PVQN0052KA-A PVQN0052KA-A Datasheet NC7SZ373 - NC7SZ373 NC7SZ373 Datasheet HMS87C1808B - HMS87C1808B HMS87C1808B Datasheet HMS87C1708B - HMS87C1708B HMS87C1708B Datasheet HMS87C1608B - HMS87C1608B HMS87C1608B Datasheet HMS87C1508B - HMS87C1508B HMS87C1508B Datasheet HMS87C1404B - HMS87C1404B HMS87C1404B Datasheet EC3A02T - EC3A02T EC3A02T Datasheet DPA423-426 - DPA423-426 DPA423-426 Datasheet BSP171P - BSP171P BSP171P Datasheet AAT4250 - AAT4250 AAT4250 Datasheet 1052360000 - 1052360000 1052360000 Datasheet
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