Silicon epitaxial planar type Unit: 0.12+0.05 -0.02 swi
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XP06210 (XP6210)
Silicon epitaxial planar type
Unit:
0.12+0.05 -0.02
switching/digital circuits Features
elements incorporated into package (Transistors with built-in resistor) Reduction mounting area assembly cost half
0.2±0.05
1.25±0.10 2.1±0.1
(0.65) (0.65) 1.3±0.1 2.0±0.1
Basic Part Number
UNR2210 (UN2210)
0.9±0.1
Absolute Maximum Ratings 25°C
Parameter Collector-base voltage (Emitter open) Collector-emitter voltage (Base open) Collector current Total power dissipation Junction temperature Storage temperature Symbol VCBO VCEO Tstg Rating +150 Unit
Emitter (Tr1) Emitter (Tr2) Base (Tr2) EIAJ SC-88
Marking Symbol: Internal Connection
Electrical Characteristics 25°C
Parameter Collector-base voltage (Emitter open) Collector-emitter voltage (Base open) Collector-base cutoff current (Emitter open) Collector-emitter cutoff current (Base open) Emitter-base cutoff current (Collector open) Forward current transfer ratio Collector-emitter saturation voltage Output voltage high-level Output voltage low-level Input resistance Transition frequency Symbol VCBO VCEO ICBO ICEO IEBO VCE(sat) Conditions
0.9+0.2 -0.1
Collector (Tr2) Base (Tr1) Collector (Tr1) SMini6-G1 Package
Unit
0.01 0.25 -30% +30%
Note) Measuring methods based JAPANESE INDUSTRIAL STANDARD 7030 measuring methods transistors.
Note) part number parenthesis shows conventional part number.
Publication date: June 2003 SJJ00205BED
0.2±0.1
XP06210
Collector-emitter saturation voltage VCE(sat)
25°C
VCE(sat)
Total power dissipation (mW)
Collector current (mA)
75°C 25°C -25°C 0.01
Ambient temperature (°C)
Collector-emitter voltage
Collector current (mA)
Collector output capacitance (pF) (Common base, input open circuited)
25°C
25°C
Forward current transfer ratio
75°C 25°C -25°C
Output current (µA)
Collector current (mA)
Collector-base voltage
Input voltage
25°C
Input voltage
0.01
Output current (mA)
SJJ00205BED
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export permit needs obtained from competent authorities Japanese Government products technologies described this material controlled under "Foreign Exchange Foreign Trade Law" exported taken Japan. technical information described this material limited showing representative characteristics applied circuits examples products. neither warrants non-infringement intellectual property right other rights owned company third party, grants license. liable infringement rights owned third party arising product technologies described this material. products described this material intended used standard applications general electronic equipment (such office equipment, communications equipment, measuring instruments household appliances). Consult sales staff advance information following applications: Special applications (such airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems safety devices) which exceptional quality reliability required, failure malfunction products directly jeopardize life harm human body. applications other than standard applications intended. products product specifications described this material subject change without notice modification and/or improvement. final stage your design, purchasing, products, therefore, most up-to-date Product Standards advance make sure that latest specifications satisfy your requirements. When designing your equipment, comply with guaranteed values, particular those maximum rating, range operating power supply voltage, heat radiation characteristics. Otherwise, will liable defect which arise later your equipment. Even when products used within guaranteed values, take into consideration incidence break down failure mode, possible occur semiconductor products. Measures systems such redundant design, arresting spread fire preventing glitch recommended order prevent physical injury, fire, social damages, example, using products. When using products which damp-proof packing required, observe conditions (including shelf life amount time standing unsealed items) agreed upon when specification sheets individually exchanged. This material reprinted reproduced whether wholly partially, without prior written permission Matsushita Electric Industrial Co., Ltd.
2002
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