Fabricated Honeywell's Radiation Hardened 0.28 Leff RICMOSV Process Ar

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Fabricated Honeywell's Radiation Hardened 0.28 Leff RICMOSV Process Ar

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HIGH PERFORMANCE (SOI) GATE ARRAYS
Fabricated Honeywell's Radiation Hardened 0.28 Leff RICMOSV Process Array Sizes Usable Gates 3.3V 2.5V Core Operation Mixed Voltage Power Supply (2.5V, 3.3V) CMOS, PCI, Schmitt Trigger, LVDS, Single- Multi-Port Gate Array SRAM Single- Multi-Port Custom SRAM Drop-In Capability Supports Chip Level Power Down Cold Sparing On-Chip Analog Phase Locked Loop (PLL) Maximum Clock Rates >250 Total Dose Hardness 3x105 rad(SiO2 1x106 (SiO2 Option Available Soft Error Rate Errors/Bit/Day Latchup Ultra Power 0.14µ W/Gate/MHz (3.3V) 0.08µ W/Gate/MHz (2.5V) Options: Standard Cell ASIC High Density
HX3000
FAMILY
GENERAL DESCRIPTION
HX3000 gate array performance oriented sea-oftransistor array, fabricated Honeywell's Silicon-On-Insulator (SOI) RICMOS process. Very high density achieved using local interconnect 4-layer metal process, providing million usable gates. high density performance characteristics SOI-V process enable device operation beyond over full military temperature range, even after exposure ionizing radiation. Flip-flops have been designed Soft Error Rate (SER) less than 1x10-10 errors/bit/day Adams worst case environment. Each HX3000 design based proven Radiation Insensitive CMOS (RICMOSTM) ASIC library logic elements, configurable cells, selectable pads. gate arrays feature skew clock distribution. This family fully compatible with Honeywell's high reliability screening procedures consistent with Class requirements. Designers choose from wide variety types. Buffer options include multiple drive strengths, three-state capability, IEEE 1149.1 boundary scan pull-up/pulldown resistors. compatible buffers also supported. HX3000 product family supports dual voltage I/O. designer flexibility specify either voltage supply each site. Each HX3000 array features on-chip Phase Locked Loop (PLL) clock deskewing frequency multiplication. requires external components. HX3000 family special feature allow chip level power down mode, which associated buses connected chip remain active. This high impedance off-state buffer feature allows users power down portions their system power savings cold sparing. HX3000 family provides options configurable multiport SRAMs. variety SRAM read write port options available serve wide range applications. Custom drop-in RAMs further increase chip density. ASIC designers need have prior experience radiation hardening. Honeywell's VDSDesign HX3000 libraries provide necessary guidance achieve first pass design success. Design supports industry standard platforms including those offered Mentor
Solid State Electronics Center 12001 State Highway Plymouth, 55441 (800) 323-8295 http://www.ssec.honeywell.com
HX3000
HX3000 Characteristics Total Core Gate Count Usable Gate Count Maximum I/O* Typical Intrinsic Delay-2 Input NAND Selectable Interface Levels Typical Power Dissipation, W/Gate/MHz Operating Voltage Operating Temperature Process Technology Minimum Geometry Soft Error Rate (SER) Total Dose Hardness HX303G 235K 210K HX306G 440K 380K HX311G 925K 790K HX314G 1.2M
3.3V; 2.5V Driver, Receiver, Bi-Directional, Three-State CMOS, Schmitt Trigger, PCI, LVDS, 0.14 3.3V; 0.08@ 2.5V 3.3V 10%; 2.5V
RICMOSV 0.28 Leff 0.35 Drawn
<1E-10 cell upsets/bit-day (Adams environment, orbit, shielding)
>300Krad (SiO (1Mrad Option Available)
Projected. Core logic, activity combinational logic, clocks active. (3). Future enhancements will increase gate count. *Contact Honeywell additional options.
Graphics, Synopsys Cadence. Design options include VHDL Verilog. Honeywell perform design translations HX3000 arrays from other platforms ASIC vendors. synthesis capabilities allow customers familiar tools libraries existing designs Honeywell library components. Floor-planning, timing-driven placement, clock-tree synthesis, placement-based optimization also supported fast design cycles. variety
packaging options including QFP, PGA, KnownGood-Die (KGD) also available. HX3000 family gate arrays right choice your high reliability space applications demanding high density, high speed very power. higher logic density with further power optimization, Honeywell's RICMOSV Standard Cell Library data sheet. learn more about Honeywell's variety space components, call 1-800-323-8295.
learn more about Honeywell Solid State Electronics Center, visit site http://www.ssec.honeywell.com
Honeywell reserves right make changes products technology herein improve reliability, function design. Honeywell does assume liability arising application product circuit described herein; neither does convey license under patent rights rights others.
900211 Rev. 6/00

Fabricated Honeywell's Radiation Hardened 0.28 Leff RICMOSV Process Ar

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