(ZnO:Zinc Oxide) series EZJZ series EZJS EZJZ EZJS

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(ZnO:Zinc Oxide) series EZJZ series EZJS EZJZ EZJS

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Multilayer Varistor pulse,Burst pulse
(ZnO:Zinc Oxide)
series EZJZ
series EZJS
EZJZ EZJS
high speed signal line
(Small capacitance) (High capacitance)
(ST:Strontium Titanate)
Power line
Multilayer monolithic construction ceramics Excelent solderability superior heat resistance Large withstanding surge current energy capabilities small size Series EZJZ Multilayer varistor Zinc oxide ceramics. suppresses pulse noise(ESD, burst-noise) protects equipment from transient surge. This Varistor suitable high-speed signal line small capacitance. Series EZJS Multilayer varistor Strontium Titanate ceramics suppresses pulse noise, especially high frequency noise(ESD, burst-noise) protects equipment from transient surge. This Varistor suitable low-frequency signal circuit(power audio signal line) large capacitance.
Features
Construction
Precautions Handling Page Recommended Applications
Applications Examples
mother board CD-ROM Cellular teleptone, Photoelectric sensor Proximity sensor Pressure switch Flowmeter motor Series EZJS
(High capacitance)
Series EZJZ
(Small capacitance)
Recommended Applications
Frequency:DC some tens Power, Relay. Audio signal line High frequency signal line RS232C, etc. Frequency:DC some hunderds Power, Relay. Audio signal line etc.
Dimmension mm(not scale)
(Unit:mm) Size Code Part Numbers 0603 (1608) 0805 (2012) EZJZ1V270G EZJZ1V330G EZJZ2V270G EZJZ2V330G EZJS2VB223Z EZJS2YC822Z EZJS2YD472Z 1.60±0.15 0.80±0.10 0.80±0.10 0.80±0.20 2.00±0.20 1.25±0.20 1.00+0 -0.35 1.25±0.20 0.50±0.25 0.30±0.20
Equivalent Impules suppression
Series EZJZ
Series EZJS
Inpules wave form
Clamped wave form
Typical circuits requiring protection
Protection Motor Electromagnetic surge absorption
EZJZ Series(ZnO) EZJS Series(ST), EZJZ Series(ZnO)
Multilayer Varistor
Series:
EZJZ (ZnO)
Explanation Part Numbers
Ratings Characteristics
Part EZJZ1V270G EZJZ1V330G EZJZ2V270G EZJZ2V330G Maximum Allowable Voltage Varistor Voltage 1mA) Capacitance (Typical) 100pF max. 100pF max. 100pF max. 100pF max. Maximum Peak Current 8/20 Maximum Energy 0.05 0.05 0.10 0.10
Operating Temperature Range:
Typical Characteristics
Voltage Current
EZJZ V330G EZJZ V270G
Multilayer Varistor
Series:
EZJS (ST)
Explanation Part Numbers
Ratings Characteristics
Part EZJS2VB223Z EZJS2YC822Z EZJS2YD472Z Maximum Allowable Voltage Varistor Voltage 0.1mA Capacitance 22000 8200 4700 Maximum Peak Current 8/20 Maximum Energy
Operating Temperature Range:
Typical Characteristics
Voltage Current
EZJS2YD472Z EZJS2YC822Z EZJS2VB223Z
Performance Characteristics Electrical
Characteristics Test Method Unless otherwise specified test measurements shall made temperature relative humidity %RH. results obtained doubted further test should carried temperature relative humidity %RH. maximum voltage that applied continuously specified operating temperature. voltage between terminals with specified measuring current applied called measurement shall made fast possible avoid heat affection. Capacitance shall measured with specified measuring frequency, Vms., bias Maximum current within varistor voltage change when standard impulse current 8/20 applied times with interval minutes. maximum energy within varistor voltage change when single standard impulse current applied. Coefficient indicating dependency characteristics temperature. This shown change ambient operating temperature. This shown maximum capacitance change ambient operating temperature.
EZJZ Series: ±0.1 EZJS Series: ±0.3
Specifications
Standard Test Condition
Maximum allowable Voltage
Varistor voltage
Capacitance
meet specified value.
Maximum peak current
Maximum energy Temperature coefficient Varistor Voltage Temperature coefficient capacitance
EZJZ Series: EZJS Series:
Mechanical requirements
Characteristics Test Method After securing specimen body with tweezers dipping specified soldering flux, specimen shall completely immersed into soldering bath having temperature 230±5 seconds. then specimen shall visually examined. specified soldering flux solder following: Soldering Flux: Ethanal solution rosin about weight Solder: Eutectic solder After preheating specimen according following conditions Table-1, specimen shall completely immersed into soldering bath having temperature 270±5 3±0.5 seconds. then stored room temperature 24±2 hours. Thereafter, change mechanical damage shall examined.
Step Temperature Period
Specifications
Solderability
Approximately terminals shall covered with solder uniformly,
Resistance sldering heat
remarkable mechanical
Performance Characteristics Environmental
Characteristics Test Methods Solder specimen testing shown Fig.1. Condition specimen each temperature from step this order period shown table specifications. Before measurement after test, specimen shall left stand mechanical damage shall examined.
Step Temperature Room Temp. Room Temp. Period min. min. min. min.
Specifications remarkable mechanical damage
Temperature Cycle
Cycles cycles
Lower operating temperature Upper operating temperature Solder specimen testing shown Fig.1. specimen shall applied continuously Maximum Allowable Voltage specified conditions specified period then stored room temperature normal humidity 24±2 hours. Thereafter, change mechanical damage shall examined. Ambient condition :40±2 Period 500+24 hours remarkable mechanical damage
Damp Heat Load
Solder specimen testing shown Fig.1. specimen shall applied continuously Mzximum Allowable Voltage specified conditions specified period High Temperature Load then stored room temperature normal humidity (Dry Heat Load) 24±2hours. Thereafter, change mechanical damage shall examined. Ambient temp. Upper operating temperature EZJZ Series: 125±5 EZJS Series: 85±2 Period 500+24 hours Fig.1
remarkable mechanical damage
(Unit:
Material
Glass epoxy/PC board
Copper foil (0.035 thickness) Solder resist
Size code 0603(1608) 0805(2012)
Packaging Specifications
Standard Packing Quantity Series EZJZ EZJS Size Code 0603 (1608) 0805 (2012) 0805 (2012) Thickness 1.45 max. max. max. max. Paper taping Pitch: 4,000 pcs./reel Pitch: 4,000 pcs./reel Pitch: 5,000 pcs./reel Embossed taping Pitch: 2,000 pcs./reel
Reel
Symbol Dim. (mm)
9.0±0.3
1.3±0.2
f180 f60.0±0.5 13.0±0.5 21.0±0.8 2.0±0.5
Paper Taping
Embossed Taping
(Unit:
Symbol Size Code
0603(1608) ±0.1
(Unit:
Symbol Size Code
±0.1
3.50 1.75 2.00
0805(2012) 1.65 ±0.20 ±0.2
±0.2 ±0.05 ±0.10 ±0.1 ±0.05 ±0.1 +0.1 max. max.
0805(2012) ±0.20 ±0.20 ±0.2 ±0.05 ±0.10 ±0.1 ±0.05 ±0.1 +0.1 max. max.
1.55 2.35 3.50 1.75 2.00
Leader Part Taped Tape
Leader part
Multilayer Varistors (Chip Type) EZJZ (Zinc Oxide) Series: EZJS (Strontium Titanate)
Series:
Precautions Handling Precautions Safety
Multilayer Varistors (hereafter referred fail short circuit mode open-circuit mode, when subjected severe conditions electrical, enviromental and/or mechonical streses beyond specified specified Catalog Specifications, resulting burnout, flaming glowing worst case. Following Precautions shall taken your major consideration. apply product following electronic equipments, have question, please contact Aitificial satellite, cosmic rocket Aircraft Seabed repeater Traffic/transport system(automobil, aircraft, rolling stock, ship, traffic signal control equipment) Electric power plant(nuclear power, thermal power, hydraulic power generation) Medical equipment Information processing system Rotaring machine Military equipment
Operating Conditions Circuit Design
Varistors shall operated beyond specified theCatalog Specifications prevent them from deterioration, breakdown, flaming glowing.
1.1.1 Varistors shall operated beyond specified Temperature Catalog Specifications. 1.1.2 Varistors shall power 1.1.3 Varistors shall operated exceeding specified Allowable Catalog Specification. 1.1.4 Varistors shall subjected energy levels above their specified energy Catalog Specifications.
Varistors shall operated correctly under following conditions prevent Varistors from causing mechanical damages ruptures protect human from serious injuries;
1.2.1 Varistors shall power 1.2.2 Varistors shall operated exceeding specified Allowable Catalog Specification. 1.2.3 Varistors shall operated exceeding specified Peak Current Catalog Specification.
recommended that Varistors, fused, shall located away from other combustibe components.
Multilayer Varistors Design Printed Circuit Board
When Varistors mounted soldered substrate influences Varistors reliabilities against because difference thermal expension coefficient between them. shall carefully confirmed that actual board applied does deteriorate characteristics Varistors. Fig.3 Component Layout
Selection Printed Circuit Boards
Design Land Pattern
Recommended Dimensions Lands: shown Table Fig.1. Notes: large land requires excess amount solder. Dimmensions shall symetrical
Mounting Density Spaces
Fig.1 Recommended Land Dimensions
Placements narrow spaces between components cause during soldering. minimum space between components shall view positioning tolerances mounting machines dimensional tolerances components Boards. Applications Solder Resist effective prevent solder bridges control amounts solder boards. shown Table
Applications Solder Resist
Table Recommended Land Dimonsions
Size Code (EIA) 0805 0603 Components Land Dimensions Land Dimensions Dimensions Flow Soldering Reflow Soldering 1.25 1.45
Table Application Examples Solder Resist
Recommended Application Examples Narrow Spacing between Chip Components Radial Components directly commected Chip Components Common lands (chassis, etc.) close Chip Components. Examples Solder Bridges
Recommended amount solder Recommended amount solder: shown Fig.2 Excess amount solder gives large mechanical stresses Varistors/components.
Fig.2 Recommended Amount Solder
3.Precautions Assembly
Adhesives Mounting
Selection adhesives viscosity adhesive mountings shall such that adhesive does flow land during curing. adhesive viscosity, mounted components alignment after during soldering. adhesives shall corrosive chemically active mounted components boards.
Component Layout
When placing/mounting Varisrors/components near area which bend grid groove board, advisable have both electrodes subjected uniform stresses, position components electrodes right angles grid groove bending line.
amount adhesive shall such that adhesive does flow alignment. Curing Conditions Adhesives mountings cured ultraviolet infrared radiation. order prevent terminal electrodes Varistors from oxidizing. curing shall done conditions max., minutes max. mounting Varistors/components printed circuit board,/any bending expanding force against them shall kept minimum prevent them from being damaged craked. Following precautions recommendations shall observed carefully process; Maximum stroke vacuum nozzle shall adjusted that pushing force printed circuit board shall limitted static load (100 gf). (See Fig.4) Maximum stroke nozzle shall adjusted that maximum bending printed circuit board does exceed (See Fig.4) Fig.4
Chip Mounting Consideration
3.4.1 Flow Soldering flow soldering process, abnormal large thermal mechanical stresses, caused between mounted Varistors melted solder soldering bath, applied directly Varistors, resulting failures damages Varistors. esscential that soldering process shall controlled following recommended conditions precautions. (See Fig.
Soldering
Fig.6 Recommended Soldering Temperature-Time Profile (Flow soldering)
printed circuit board shall supported means adequate supporting pins shown Fig.5-(b). Fig.5
Improper Proper
Soldering Flux: content halogen soldering flux shall less. Rosin-based non-activated soldering flux recommended. Water soluble type Soldering Flux: case water soluble type soldering flux being applied, flux residue surface P.C. boards have influences reliability components cause deterioration failures them. Solder: eutetic solder (Sn63: Pb37) recommended.
Soldering Flux Solder
Application Flux: soldering flux (3.3) shall applied mounted Varistors thinly uniformly forming method. Preheating: mounted Varistors/Components shall preheated sufficiently that between Varistors/components melted solder shall below. Immersion Soldering Bath: Varistors shall immersed into soldering bath seconds. Cooling: Varistors shall cooled gradually room ambient temperature with cooling temperature rates max. from max. from Flux Cleaning: When immersed into cleaning solvent, shall confirmed that surface temparatures devices exceed (See 3.5) 3.4.2 Reflow Soldering reflow soldering process, mounted Varistors/compomenents generally heated soldered thermal conduction system such radiation blast soldering Phase Soldering System Large temperature gradients such rapid heating cooling process cause electrical failures mechanical damages devices. esscential that soldering procces shall controlled following recommended conditions precautions. (See Fig.7)
Fig.7 Recommended Soldering Temperature-Time Profile (Reflow soldering)
3.4.3 Hand Soldering
hand soldering Varistors, large temperature gradient between precheated Varistors soldering iron cause electrical failures mechanical damages such crakings breakings devices. soldering shall carefully controlled carried that temperature gradient kept minimum with following recommended conditions hand soldering.
Preheating mounted Varistors/components shall preheated sufficiently, seconds that surface temperatures them Preheating After mounted Varistors/ components shall heated elevated temperatures seconds. Soldering: Fig.8 Fig.8 Recommended Soldering MaximumTemperature
Recommended Soldering Condition (With preheating: Fig.9) Solder: Thread euetic solder (Sn63: Pb37) with soldering flux] core. Rosin-based, non-activated flux recommended. Preheating: Varistors shall preheated that between devices soldering iron below. Soldering Iron: Rated Power max. with soldering diamter. Temperature soldering iron tip: max. (The required amount solder shall melted advance soldering tip.) Cooling: After soldering. Varistors shall cooled gradually room ambient temperature. Fig.9 Recommended Soldering Hand Soldering
Cooling: After soldering, mounted Varistors/components shall granually cooled room ambient temperature preventing mechanical damages such crakings devices. Flux Cleaning: When mounted Varistors/components immersed into cleaning solvent, shall comfirmed surface temperatures them exceeding (See, Post Soldering Cleaning) Note: mounted Varistors/components partially heated soldering process, devices separated from printed circuit board surface tension partially melted solder, stand like
Recommended Soldering Condition (Without preheating) Solder iron shall directry toouch ceramic dielectrics. Solder iron shall fully preheated before soldering while soldering iron external electrode Varistors. Modifying Solder iron possible range below. Conditions Chip size Temperature Wattage Shap iron Time while touch
less less over less
less less Within
Residues corrosive soldering fluxes board after cleaning greately have influences electrical characteristics reliability (such humidity resistance) Varistors which have been mounted board, shall confirmed that characteristics reliability devices affected applied cleaning conditions. Solubility alternative cleaning solvent such alcohol etc, inferior that freon cleaning solvent flux cleaning. case alternative cleaning solvents applied, fresh cleaning solvent always shall used, sufficient rinsing drying shall carried out. When ultrasonic cleaning applied mounted Varistors boards, following conditions recommended preventing failures damages devices large vibration energy resonance caused ultrasonic waves Frequency max. Radiated Power W/liter max. Period minuets max. When mounted printed circuits inspected with measuring terminal pins, abnomal excess mechanical stresses shall applied board mounted components, prevent failures damages devices. mounted boards shall suported some adequate supporting pins prevent their bendings. shall confirmed that measuring pins have right shape, equal height right positions.
Post Soldering Cleaning
Protective Coating
When surface printed board which Varistors been mounted coated with resin protect against moisture dust, shall confirmed that protective coat does have influences reliability Varistors actual equipment. Coating materials, such being corrosive chemically active, shall applied Varistors other components. Coating materials with large expansivity shall applied Varistors preventing failures damages (such crakings) devices curing process. Abnormal excessive mechanical stresses, such bending expanding force, components printed circuit board, shall kept minimum dividing/breaking. Dividing/Breaking boards shall done carefully moderate speed using apparatus prevent Varistors boards from mechanical damages. Varistors shall stored under severe conditions high temperatures high humidities. Store them indoors under max. max. them within months check solderability before use.
Dividing/Breaking Boards
Long Term Storage
Process Inspection

(ZnO:Zinc Oxide) series EZJZ series EZJS EZJZ EZJS

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