Chip Bead Array EXC28B Features Space saving Compatible

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Chip Bead Array EXC28B Features Space saving Compatible

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Chip Bead Array
Chip Bead Array
EXC28B
Features
Space saving Compatible line pitch with SSOP package(0.5 pitch) Small size light weight Type: EXC28BB Suitable high speed signal (over MHz) Excellent cross talk characteristics (100 MHz:<-25 Type: EXC28BA Help stop reduction wave form Excellent cross talk characteristics (100 MHz:<-30
Recommended Applications
Small digital equipment such Personal computers, Printer, HDD, DVD-ROM, CD-ROM, LCD. Digital audio Video equipment such DSC, DVC, Player, Player, Player. Electric musical instrument, other small digital equipment.
Explanation Part Numbers
Construction
Dimensions (not scale)
Type
(mm)
EXC28B 1.00±0.15 2.0±0.2
0.5±0.1 0.20±0.15 0.5±0.1 0.25±0.10
Chip Bead Array
Ratings
Type Part EXC28BA121U EXC28BA221U EXC28BB121U EXC28BB221U Impedance tol.(%) Rated Current Resistance Max.
Impedance Characteristics (Reference Data)
EXC28BA121 (2010)
Measured HP4291A
EXC28BB121 (2010)
EXC28BA221 (2010)
EXC28BB221 (2010)
Impedance
Resistance
Reactance
Chip Bead Array
Circuit Configuration
Packaging Methods
Standard Quantity Part Number EXC28B1111U Embossed Taping 4000 pcs./reel Weight (mg/pcs.) Reference Data
Standard Reel Dimensions
Embossed Carrier Dimensions (not scale)
Standard Reel Dimensions (mm) Part Number EXC28B1111U 180.0
60.0±1.0
13.0±0.5
21.0±0.8
2.0±0.5
9.0±0.3
11.4±1.5
1.2±0.2
Embossed Carrier Dimensions (mm) Part Number EXC28B1111U 1.20±0.15 2.25±0.15 8.0±0.2 3.5±0.1 1.75±0.10 4.0±0.1 2.0±0.1 4.0±0.1 1.5±0.1 0.20±0.05 0.9±0.1
Chip Bead Array
Recommended Land Pattern Design
Dimension (mm) 1.75 0.25 0.25
Soldering Conditions
Precaution recommendations described below. Please inquire when different conditions. Please measure temperature terminations study solderability every type board, before actual use. <Recommended reflow soldering temperature>
Reflow soldering shall within times
<Repair with hand soldering> soldering iron with temperature less. Solder seconds less each termination.
Cautions Safety
Flux: rosin type non-halogen type flux. Cleaning agent: alcohol type. Inquire other type cleaning agent. Excessive mechanical stress damage components. Take care handling. Store under temperature relative humidity Avoid rapid changes temperature humidity. components within year after date inspection shipment. This catalog shows quality performance unit component. quality assurance, exchange delivery specification with Before adoption, sure evaluate verify product mounting your product.

Chip Bead Array EXC28B Features Space saving Compatible

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